STMicroelectronics-BTB24-800BWRG
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BTA24, BTB24, BTA25
BTA26, BTB26, T25
25 A standard and Snubberless™ triacs
Features
A2
■
High current triac
G
■
Low thermal resistance with clip bonding
A1
■
High commutation (4 quadrant) or very high
A2
commutation (3 quadrant) capability
■
BTA series UL1557 certified (File ref: 81734)
■
Packages are RoHS (2002/95/EC) compliant
A1
A2
A1
A2
G
G
TO-220AB Insulated
(BTA24)
TO-220AB
(BTB24)
Applications
Applications include the ON/OFF function in
applications such as static relays, heating
regulation, induction motor starting circuits, etc.,
or for phase control operation in light dimmers,
motor speed controllers, and silmilar.
A1
G
A2
A1
A2
G
The snubberless versions (B
T
A
/BTB…W and T25
series) are especially recommended for use on
inductive loads, due to their high commutation
performances. The B
T
A
s
eries provides an
insulated tab (rated at 2500 V
RMS
).
RD91
(B
T
A25)
TOP3 Insulated
(BTA26)
A2
A2
A1
A2
G
Description
A1
A2
G
Available either in through-hole or surface-mount
packages, the
B
T
A24, BTB24, BTA25, BTA26,
BTB26
and
T25
triac series is suitable for general
purpose mains power AC switching.
D
2
P
A
K
(T25)
TOP3
(BTB26)
Table 1.
Symbol
Device summary
Parameter
T25
Unit
RMS on-state
current
I
T(RMS)
25
25
25
25
25
600
–
25
A
Repetitive peak
off-state voltage
V
DRM
/V
RRM
600 / 800
600 / 800
600 / 800
600
(2)
/ 800
600 / 800
V
T
r
iggering gate
current
I
GT
(Snubberless)
35 / 50
–
35 / 50
50
50
50
35 / 50
50
35
–
mA
mA
T
r
iggering gate
current
I
GT
(Standard)
50
1. Insulated
packages
2. 600
V version available only with I
GT
= 50 mA (Snubberless and Standard)
TM: Snubberless is a trademark of STMicroelectronics
July 2007
Rev 10
1/12
12
Characteristics
BTA24, BTB24, BTA25, BTA26, BTB26, T25
1
Characteristics
Table 2.
Symbol
Absolute maximum ratings
Parameter
Value
Unit
TOP3
T
c
= 105° C
T
c
= 100° C
D
2
P
A
K /
TO-220AB
I
T(RMS)
RMS on-state current (full sine wave)
25
A
RD91 Ins/
TOP3 Ins.
T
c
= 100° C
TO-220AB Ins.
F = 50 Hz
T
c
= 75° C
t = 20 ms
250
260
340
Non repetitive surge peak on-state
current (full
cycle, T
j
initial = 25° C)
I
TSM
A
F = 60 Hz
t = 16.7 ms
²
²
²
I t
I t Value for fusing
t
p
= 10 ms
A s
Critical rate of rise of on-state current
dI/dt
F = 120 Hz
T
j
= 125° C
T
j
= 25° C
50
A/µs
V
I
G
= 2 x I
GT
, t
r
≤
100 ns
Non repetitive surge peak off-state
voltage
V
DRM
/V
RRM
+ 100
V
DSM
/V
RSM
t
p
= 10 ms
t
p
= 20 µs
I
GM
Peak gate current
T
j
= 125° C
T
j
= 125° C
4
1
A
P
G(AV)
Average gate power dissipation
W
T
stg
T
j
Storage junction temperature range
Operating junction temperature range
– 40 to + 150
– 40 to + 125
° C
Table 3.
Symbol
Electrical characteristics (T = 25° C, unless otherwise specified), Snubberless and
logic level (3 quadrants) T25, B
T
A
/BTB24…W, BTA25…W, BTA26…W
j
T25
BTA/BTB
Test Conditions
Quadrant
Unit
T2535
CW
BW
(1)
I
GT
I – II – III
I – II – III
MAX.
MAX.
35
35
50
mA
V
V
D
= 12 V
R
L
= 33
Ω
V
GT
V
GD
1.3
V
D
= V
DRM
R
L
= 3.3 k
Ω
T
j
= 125° C
I – II – III
MIN.
0.2
V
(2)
I
H
I
T
= 500 mA
MAX.
50
70
50
70
75
80
mA
I – III
II
I
L
I
G
= 1.2 I
GT
MAX.
mA
80
80
100
1000
22
V
D
= 67
%V
DRM
gate open
T
j
= 125° C
T
j
= 125° C
MIN.
MIN.
500
13
500
13
V/µs
A/ms
1. minimum
I
GT
is guaranted at 5% of I
GT
max.
2. for
both polarities of A2 referenced to A1.
2/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Characteristics
Table 4.
Symbol
Electrical characteristics (T
= 25° C, unless otherwise specified),
standard (4 quadrants), BTB24…B, B
T
A
25…B, BTA26…B, BTB26…B
j
Test Conditions
Quadrant
Value
Unit
I – II – III
IV
50
100
1.3
0.2
80
(1)
I
GT
MAX.
mA
V
D
= 12 V
R
L
= 33
Ω
V
GT
ALL
MAX.
MIN.
V
V
V
GD
V
D
= V
DRM
R
L
= 3.3 k
Ω
T
j
= 125° C
ALL
(2)
I
H
)
I
T
= 500 mA
MAX.
mA
I – III – IV
II
70
I
L
I
G
= 1.2 I
GT
MAX.
mA
160
500
10
V
D
= 67
%V
DRM
gate open
T
j
= 125° C
T
j
= 125° C
MIN.
MIN.
V/µs
V/µs
1. minimum
I
GT
is guaranted at 5% of I
GT
max.
2. for
both polarities of A2 referenced to A1.
Table 5.
Symbol
Static characteristics
Test Conditions
T
j
= 25° C
Value
Unit
(1)
V
TM
V
t0
I
TM
= 35 A
t
p
= 380 µs
MAX.
1.55
0.85
16
5
V
V
Threshold voltage
T
j
= 125° C
T
j
= 125° C
T
j
= 25° C
T
j
= 125° C
MAX.
MAX.
R
d
I
DRM
I
RRM
Dynamic resistance
m
Ω
µA
mA
V
DRM
= V
RRM
MAX.
3
1. for
both polarities of A2 referenced to A1.
Table 6.
Symbol
Thermal resistance
Parameter
TOP 3
D
2
P
A
K / TO-220AB
Value
Unit
0.6
0.8
0.9
1.7
45
R
th(j-c)
Junction to case (AC)
Junction to ambient
° C/W
RD91 Insulated / TOP3 Insulated
TO-220AB Insulated
²
(1)
S = 1 cm
D
2
P
A
K
R
th(j-a)
TOP3 / TOP3 Insulated
TO-220AB / TO-220AB Insulated
50
° C/W
60
1. S
= Copper surface under tab.
3/12
Characteristics
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Figure 1.
Maximum power dissipation versus
Figure 2.
RMS on-state current (full cycle)
RMS on-state current versus case
temperature (full cycle)
I
(A)
T(RMS)
P(W)
30
25
20
15
10
5
30
BTB26
25
20
15
10
5
B
T
A
24
BTB24 / T25xx /
B
T
A
25 / B
T
A
26
T (°C)
C
I (A)
T(RMS)
0
0
0
0
25
50
75
100
125
5
10
15
20
25
2
Figure 3.
D
P
A
K
RMS on-state current versus
Figure 4.
ambient temperature (printed
circuit board FR4, copper
Relative variation of thermal
impedance versus pulse
duration
thickness: 35µm) (full cycle)
I (A)
T(RMS)
K=[Z /R
]
th th
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1E+0
1E-1
1E-2
1E-3
D
2
P
A
K
Z
th(j-c)
(S=1cm
2
)
Z
th(j-a)
B
T
A /
B
TB24 / T25
Z
th(j-a)
B
T
A
26
t (s)
p
T (°C)
amb
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
0
25
50
75
100
125
Figure 5.
On-state characteristics
(maximum values)
Figure 6.
Surge peak on-state current
versus number of cycles
I
(A)
TM
I
(A)
TSM
300
100
300
250
200
150
100
50
T
j
max.
V
to
= 0.85V
R
d
= 16 m
Ω
T
j
= T
j
max.
t=20ms
One cycle
Non repetitive
T
j
initial=25°C
Repetitive
T
C
=75°C
10
T
j
= 25°C.
Number of cycles
V
(V)
TM
0
1
1
10
100
1000
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
4/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Characteristics
Figure 7.
Non-repetitive surge peak on-state
Figure 8.
current for a sinusoidal pulse with
Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
width t
< 10 ms and corresponding
p
2
value of I t
I
,I ,I [T
] / I
,I ,I [T
=25°C]
GT
H
L
j
GT
H
L
j
I
(A), I
2
t (A
2
s)
TSM
2.5
2.0
1.5
1.0
0.5
0.0
3000
1000
T
j
initial=25°C
dI/dt limitation:
50A/µs
I
GT
I
TSM
I
H
& I
L
I
2
t
T (°C)
j
t (ms)
p
100
-40
-20
0
20
40
60
80
100
120
140
0.01
0.10
1.00
10.00
Figure 9.
Relative variation of critical rate of
Figure 10.
Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
decrease of main current versus T
j
(dI/dt)c [T ] / (dI/dt)c [T
specified]
j
j
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
6
5
4
3
2
1
0
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
T2535/CW/BW
B
(dV/dt)c (V/µs)
T (°C)
j
0.1
1.0
10.0
100.0
0
25
50
75
100
125
2
Figure 11.
D
P
A
K
thermal resistance junction to
ambient versus copper surface under
tab (printed circuit board FR4, copper
thickness: 35 µm)
R
(°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
D
2
P
A
K
S(cm²)
0
4
8
12
16
20
24
28
32
36
40
5/12
Ordering information scheme
BTA24, BTB24, BTA25, BTA26, BTB26, T25
2
Ordering information scheme
Figure 12.
BTA and BTB series
BT
A 24
– 600
BW RG
Triac series
Insulation
A = insulated
B = non insulated
Current
24 = 25 A in TO-220AB
25 = 25 A in RD91
26 = 25 A in TOP3
Voltage
600 = 600 V
800 = 800 V
Sensitivity and type
B = 50 mA Standard
BW = 50 mA Snubberless
CW = 35 mA Snubberless
Packing mode
RG =
T
u
be
Figure 13.
T25 series
T
25 35
– 600
G (-TR)
Triac series
Current
25 = 25 A
Sensitivity
35 = 35 mA
Voltage
600 = 600 V
800 = 800 V
Package
G = D
2
P
A
K
Packing mode
Blank =
T
u
be
-TR =
T
a
pe and Reel
6/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Package information
3
Package information
●
●
●
●
Epoxy meets UL94,V0
Cooling method: C
Recommended torque value: 0.4 – 0.5 Nm (TO-220AB), 0.9 – 1.2 Nm (TOP3 and RD91)
Maximum torque value for BTB24 is 0.5 Nm
2
Table 7.
D
P
A
K
dimensions
DIMENSIONS
Millimeters
Min. Typ. Max. Min. Typ. Max.
RE
F
.
Inches
A
A1
A2
B
4.30
2.49
4.60 0.169
2.69 0.098
0.23 0.001
0.93 0.027
0.181
0.106
0.009
0.037
A
E
C2
L2
0.03
0.70
D
L
B2
C
1.25 1.40
0.45
0.048 0.055
L3
0.60 0.017
1.36 0.047
9.35 0.352
10.28 0.393
5.28 0.192
15.85 0.590
1.40 0.050
1.75 0.055
0.024
0.054
0.368
0.405
0.208
0.624
0.055
0.069
A1
B2
B
C2
D
1.21
R
C
8.95
G
E
10.00
4.88
A2
2mm min.
FLAT ZONE
G
L
15.00
1.27
V2
L2
L3
R
1.40
0.40
0.016
V2
0°
8°
0°
8°
2
Figure 14.
D
P
A
K
footprint dimensions (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
7/12
Package information
Table 8.
BTA24, BTB24, BTA25, BTA26, BTB26, T25
DIMENSIONS
RD91 dimensions
RE
F
.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
A1
A2
B
40.00
30.30
22.00
27.00
16.50
24.00
14.00
3.50
1.575
1.193
0.867
1.063
0.650
0.945
0.551
0.138
0.118
0.035
0.177
0.535
0.138
0.075
43°
A2
L2
L1
29.90
1.177
B2
B1
C
B1
B2
C
13.50
0.531
C2
C1
N1
A1
C1
C2
E3
F
N2
1.95
0.70
4.00
11.20
3.10
1.70
33°
3.00
0.077
0.027
0.157
0.441
0.122
0.067
33°
B
F
0.90
E3
4.50
I
A
I
13.60
3.50
L1
L2
N1
N2
1.90
43°
28°
38°
28°
38°
8/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Package information
Table 9.
TOP3 (insulated and non_insulated) dimensions
DIMENSIONS
Millimeters
Min. Typ. Max. Min. Typ. Max.
RE
F
.
Inches
H
A
A
B
4.4
1.45
14.35
0.5
4.6 0.173
1.55 0.057
15.60 0.565
0.7 0.020
2.9 0.106
16.5 0.622
21.1 0.815
15.5 0.594
5.65 0.213
3.65 0.134
4.17 0.161
1.40 0.047
0.181
0.061
0.614
0.028
0.114
0.650
0.831
0.610
0.222
0.144
0.164
0.055
R
B
ØL
C
D
E
K
G
C
F
2.7
F
15.8
20.4
15.1
5.4
G
H
J
P
D
J
J
E
K
3.4
ØL
P
4.08
1.20
R
4.60
0.181
9/12
Package information
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Table 10.
TO-220AB (insulated and non-insulated) dimensions
DIMENSIONS
RE
F
.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A
a1
a2
B
15.20
15.90 0.598
0.625
3.75
0.147
C
B
13.00
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.75
14.00 0.511
10.40 0.393
0.88 0.024
1.32 0.048
4.60 0.173
0.70 0.019
2.72 0.094
2.70 0.094
6.60 0.244
3.85 0.147
0.551
0.409
0.034
0.051
0.181
0.027
0.107
0.106
0.259
0.151
Ø I
b2
L
F
b1
b2
C
A
I4
l3
c2
a1
c1
c2
e
l2
a2
M
c1
F
b1
e
ØI
I4
L
15.80 16.40 16.80 0.622 0.646 0.661
2.65
1.14
1.14
2.95 0.104
1.70 0.044
1.70 0.044
0.116
0.066
0.066
l2
l3
M
2.60
0.102
In order to meet environmental requirements, ST offers these devices in ECO
P
A
CK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECO
P
ACK is an ST trademark.
10/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Ordering information
4
Ordering information
Table 11.
Ordering information
Ordering type
Marking
Package
Weight Base
qty Delivery
mode
B
T
A
/BTB24-xxxyzRG
B
T
A
25-xxxyz
B
T
A
/BTB24 xxxyz
B
T
A
25xxxyz
B
T
A
26xxxyz
BTB26600B
T2535 xxxG
T2535 xxxG
TO-220AB
RD91
2.3 g
20 g
50
25
T
u
be
Bulk
B
T
A
26-xxxyRG
BTB26-600BRG
T2535-xxxG
TOP3 Ins.
TOP3
4.5 g
4.5 g
30
T
u
be
30
T
u
be
50
T
u
be
D
2
P
A
K
1.5 g
T2535-xxxG-TR
1000
T
a
pe and reel
Note:
xxx = voltage, y = sensitivity,
z = type
5
Revision history
Table 12.
Revision history
Date
Revision
Description of changes
Oct-2002
6A
Previous update.
TO-220AB delivery mode changed from bulk to tube.
ECO
P
ACK statement added.
13-Feb-2006
7
31-May-2006
31-Jul-2006
8
9
Reformatted to current standard. T
c
in figure 3 changed to
T
amb
T
y
ping error corrected on page 1 (BTB124 instead of BTB24)
Ordering information scheme on page 6
to simplify product selection.
05-Jul-2007
10
11/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25
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12/12
