STMicroelectronics-DLPF-GP-01D3

DLPF-GP-01D3  

Dual differential filter with integrated matching for  

GreenPeak transceiver  

Datasheet

–

production data  

Description  

RF2N  

The DLPF-GP-01D3 is an ultra miniature dual  

differential filter tailored for GreenPeak  

Zigbee/RF4CE RF transceivers.  

ANT2N  

ANT2P  

GND2  

The DLPF-GP-01D3 integrates also matching  

network and replaces 16 SMD components.  

Matching impedance has been customized for  

RF2P  

GreenPeak Zigbee/RF4CE RF transceivers. It is  

using STMicroelectronics IPD technology on non-  

conductive Glass substrate which optimize RF  

VCM  

performances.  

(a)  

Figure 1. Reference schematic  

RF1N  

ANT1N  

ANT1P  

GND1  

RF1P  

Bump view  

*3ꢀꢁꢂꢃ  

Features  

•

•

•

•

•

•

•

Nominal Input / conjugate match to GreenPeak  

Low loss dual-channel differential filter  

Low loss dual-channel common-mode filter  

Small footprint < 1.2 x 3.4 mm²  

Very low profile (< 560 µm after reflow)  

High RF performance  

RF BOM and area reduction  

Applications  

•

2.45 GHz impedance matched dual-differential  

filter  

•

Optimized for GreenPeak GP540 and GP561  

circuits  

a. Courtesy

 

of GreenPeak.  

October 2014  

DocID026812 Rev 1  

1/9  

This is information on a product in full production.  

Absolute maximum ratings  

DLPF-GP-01D3  

1

Absolute maximum ratings  

Table 1. Absolute maximum ratings (limiting value)  

Value  

Symbol  

Parameter  

Unit  

Min. Typ. Max.  

P

Input Power RFIN  

20  

dBm  

V

IN  

ESD Ratings MIL STD883C (HBM:C=100 p

F

,

R

=1.5 k

Ω

, Air  

discharge)  

800  

V

ESD  

ESD ratings machine model (MM: C=200 p

F

,

R

=25

Ω,  

L=500 nH)  

550  

-40  

V

T

Operating temperature  

+80  

ºC  

OP  

2/9  

DocID026812 Rev 1  

DLPF-GP-01D3  

Electrical characteristics  

2

Electrical characteristics  

Table 2. Impedances  

Parameter  

Value  

Unit  

Symbol  

Min.  

Typ.  

Max.  

Conjugate  

match to  

GreenPeak IC  

Z

Nominal differential output impedance  

Nominal differential input impedance  

–

–

–

–

Ω

Ω

OUT  

Z

100  

IN  

Table 3. RF performance  

Test condition  

Value  

Symbol  

Parameter  

Unit  

Min.  

Typ. Max.  

T

Operating temperature  

Frequency range (bandwidth)  

Insertion loss in bandwidth  

Return loss in bandwidth  

Return loss in bandwidth  

2f0 attenuation  

–

–

-40  

+80  

2500  

°C  

MHz  

dB  

OP  

f

2400  

I

-1.45 -1.7  

L

R

-16  

-15  

-41  

-34  

-11  

-10.5  

-37  

dB  

L_ANT  

R

T = 25 °C  

dB  

L_IC  

j

2f0  

dB  

3f0  

3f0 attenuation  

-28  

dB  

DocID026812 Rev 1  

3/9  

9

Electrical characteristics  

DLPF-GP-01D3  

2.1  

RF measurements (on board)  

Figure 2. Differential transmission  

Figure 3. DIFF mode insertion loss (dB)  

Figure 4. DIFF mode – 2f0 second harmonic (dB)

 

Figure 5. DIFF mode – 3f0 third harmonic (dB)  

Figure 6. Return loss on ANT side (dB)  

Figure 7. Return loss on IC side (dB)  

4/9  

DocID026812 Rev 1  

DLPF-GP-01D3  

Package mechanical data  

3

Package mechanical data  

In order to meet environmental requirements, ST offers these devices in different grades of  

®

®

ECOPACK packages,

 

depending on their level of environmental compliance. ECOPACK  

specifications, grade definitions and product status are available at:

.  

®

ECOPACK is

 

an ST trademark.  

Figure 8. Mechanical specifications (bump view)  

5)ꢉ1  

$17ꢉ1  

*1’ꢉ  

$17ꢉ3  

ꢄꢉꢀꢂ  

ꢊꢀꢂ  

ꢆ

$17ꢄ3ꢃ ꢅ

ꢃ

ꢆ

ꢇ

ꢂꢂꢃꢈꢃ  

ꢆ

$17ꢄ1ꢃ ꢅ

ꢃ

ꢆ

ꢇ

ꢂꢂꢃꢈꢃ  

5)ꢉ3  

ꢈꢃ  

ꢊꢀꢂ  

$17ꢉ3ꢃ ꢅ

ꢃ

ꢆ

ꢇ

ꢂꢂꢃ  

$17ꢉ1ꢃ ꢅ

ꢃ

ꢆ

ꢇ

ꢂꢂꢃꢈꢃ  

5)ꢄ3ꢃ ꢅꢃꢃꢃꢃꢇꢂꢂ

ꢃ

ꢈ

ꢃ  

ꢄꢉꢀꢂ  

ꢆ

ꢄ

ꢀꢂꢂ  

9&0  

ꢅꢃꢃꢃꢃꢃꢃꢃꢂꢃꢈꢃꢆ  

ꢄꢂꢂꢂ  

*1’ꢄꢃ  

ꢂꢃꢈꢃꢂ  

ꢆ

5)ꢄ1ꢃ ꢅꢃꢃꢃꢃꢇꢂꢂ

 

ꢀꢂꢂ  

ꢈꢃ  

ꢈꢃ  

ꢂ

ꢀꢂꢂ  

ꢄꢂꢂꢂ  

ꢅꢃꢃꢃꢃꢇꢂꢂ  

9&0ꢃ  

5)ꢉ3ꢃ ꢅꢃꢃꢃꢃꢇꢂꢂꢈꢃ  

*1’ꢉꢃ ꢅꢃꢃꢃꢃꢃꢃꢃꢃꢂꢈꢃ  

5)ꢄ1  

$17ꢄ1  

$17ꢄ3  

5)ꢉ1ꢃ ꢅꢃꢃꢃꢃꢇꢂꢂꢈꢃ

 

ꢄꢀꢂꢂ  

*1’ꢄ  

5)ꢄ3  

ꢁꢍꢂꢃ—P  

ꢄꢋꢄꢌꢃPP  

DocID026812 Rev 1  

5/9  

9

Package mechanical data  

DLPF-GP-01D3  

Figure 9. Layout recommendations  

No extra components required thanks to DLPF-GP-01D3.  

Dimensions (distances) from center pad to center pad (filter GP chip) shall be respected as  

much as possible in order to avoid any deviation in performances.  

Figure 10. Footprint – non solder mask

 

Figure 11. Footprint – solder mask defined  

defined  

Copper pad diameter:  

Solder mask opening  

220 µm recommended  

180 µm minimum  

:

220 µm recommended  

180 µm minimum  

260 µm maximum  

260 µm maximum  

Solder mask opening:  

320 µm recommended  

300 µm minimum  

Copper pad diameter

 

:  

320 µm recommended  

300 µm minimum  

340 µm maximum  

Solder stencil opening:  

220 µm recommended  

Solder stencil opening :  

220 µm recommended  

Line to connect copper pad on solder mask opening  

shopuld be smaller than copper pad diameter  

6/9  

DocID026812 Rev 1  

DLPF-GP-01D3  

Package mechanical data  

Figure 12. Marking specification  

Figure 13. Footprint coordinates  

5)ꢄ3  

$17ꢄ3  

$17ꢄ1  

*1’ꢄ  

$17ꢄ3ꢃ  

$17ꢄ1ꢃ  

$17ꢉ3ꢃ  

$17ꢉ1ꢃ  

5)ꢄ3ꢃ  

*1’ꢄꢃ  

5)ꢄ1ꢃ  

9&0ꢃ  

ꢅꢃꢆ ꢇꢂꢂꢃꢈꢃꢎꢄꢉꢀꢂ  

ꢇꢂꢂꢃꢈꢃꢎꢊꢀꢂ  

ꢅꢃꢆ ꢇꢂꢂꢃꢈ

ꢃ

ꢆ

ꢊ

ꢀꢂ  

ꢅꢃꢆ ꢇꢂꢂꢃꢈꢃ ꢆꢄꢉꢀꢂ  

ꢅꢃꢆ  

5)ꢄ1  

ꢎꢄꢀꢂꢂ  

ꢅꢃꢃꢃꢃꢃꢃꢃꢂꢃꢈꢃꢎꢄꢂꢂꢂ  

ꢅꢃꢃꢃꢇꢂꢂꢃꢈꢃꢎꢀꢂꢂ  

ꢅꢃꢃꢃꢇꢂꢂꢃꢈꢃ  

9&0  

ꢂꢃꢈꢃꢂ  

ꢈꢃ  

ꢈꢃ  

ꢅꢃꢃꢃꢇꢂꢂꢃ  

ꢅꢃꢃꢃꢇꢂꢂꢃ  

ꢂ

ꢆ

5)ꢉ3ꢃ  

*1’ꢉꢃ  

5)ꢉ1ꢃ  

ꢀꢂꢂ  

X Z Z  

Y W W  

5)ꢉ3  

ꢅꢃꢃꢃꢃꢃꢃꢃꢂꢃꢈꢃ ꢆꢄꢂꢂꢂ  

ꢄꢀꢂꢂ  

$17ꢉ3  

$17ꢉ1  

ꢅꢃꢃꢃꢇꢂꢂꢃꢈꢃ ꢆ  

*1’ꢉ  

5)ꢉ1  

Figure 14. Tape and reel specification  

Note:  

The dimensions shown on this proposed drawing are for illustrative purpose. Dimensions  

from actual carrier may vary slightly  

More information is available in the application notes AN2348: “Flip Chip: Package  

description and recommendations for use”.  

DocID026812 Rev 1  

7/9  

9

Ordering information  

DLPF-GP-01D3  

4

Ordering information  

T

a

ble 4. Ordering information  

Part number  

Marking  

Weight  

Base qty  

Delivery mode  

DLPF-GP-01D3  

SW  

4.43 mg  

5000  

T

a

pe and reel  

5

Revision history  

Table 5. Document revision history  

Revision Changes  

Date  

10-Oct-2014  

1

Initial release.  

8/9  

DocID026812 Rev 1  

DLPF-GP-01D3  

IMPORTANT NOTICE – PLEASE READ CAREFUL

L

Y  

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A

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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  

© 2014 STMicroelectronics – All rights reserved  

DocID026812 Rev 1  

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