STMicroelectronics-FERD20M60SR
| Part # | STMicroelectronics-FERD20M60SR |
| Download | STMicroelectronics-FERD20M60SR |
FERD20M60
Field effect rectifier
Datasheet
–
production data
Description
$
$
This single rectifier is based on a proprietary
technology, enabling to achieve the best in class
.
.
V /I
trade-off for a given silicon surface.
F R
.
Packaged in TO-220AB and I²PAK, this device is
intended to be used in rectification and
freewheeling operations in switch-mode power
supplies.
$
$
.
.
$
Table 1. Device summary
$
,ð3$.
72ꢀꢁꢁꢂ$%
Symbol
Value
I
20 A
60 V
F(AV)
V
RRM
Features
T (max)
+175 °C
0.30 V
j
•
•
•
•
ST proprietary process
V (typ)
F
Stable leakage current over reverse voltage
Low forward voltage drop
High frequency operation
June 2015
DocID027193 Rev 2
1/8
This is information on a product in full production.
Characteristics
FERD20M60
1
Characteristics
Table 2. Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)
Symbol
Parameter
Repetitive peak reverse voltage
Value
Unit
V
RRM
I
F(RMS)
I
F(AV)
60
60
20
V
A
A
Forward rms current
Average forward current,
δ
= 0.5
T
c
= 150 °C
t
p
= 10 ms
sinusoidal
I
FSM
Surge non repetitive forward current
275
A
T
stg
Storage temperature range
-65 to + 175
175
°C
°C
(1)
T
j
1.
Maximum operating junction temperature
dPtot
1
–
–
————-
————————-
<
Rth
(
j
–
a
)
condition to avoid thermal runaway for a diode on its own heatsink.
dTj
Table 3. Thermal resistance
Parameter
Symbol
Value (max)
Unit
R
th(j-c)
Junction to case
1.6
°C/W
Table 4. Static electrical characteristics (per diode)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
T
j
= 25 °C
125
20
µA
mA
µA
V
R
= 45 V
T
j
= 125 °C
T
j
= 25 °C
T
j
= 125 °C
T
j
= 25 °C
T
j
= 125 °C
T
j
= 25 °C
T
j
= 125 °C
T
j
= 25 °C
T
j
= 125 °C
10
(1)
I
R
Reverse leakage current
230
30
V
R
= V
RRM
15
mA
0.36
0.30
0.42
0.39
0.51
0.51
I
F
= 5 A
I
F
= 10A
I
F
= 20 A
0.35
0.47
0.44
0.56
0.56
(2)
V
F
Forward voltage drop
V
1. Pulse
test: t
p
= 5 ms,
δ
< 2%
2. Pulse
test: t
p
= 380 µs,
δ
< 2%
To
e
valuate the conduction losses use the following equation:
2
P = 0.32 x I
F(AV)
+ 0.012 I
F
(RMS
2/8
DocID027193 Rev 2
FERD20M60
Characteristics
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (
δ
= 0.5)
3
)
ꢊ$9
ꢋ
ꢊ:ꢋꢇ
,
)
ꢊ$9
ꢋ
ꢊ$ꢋꢇ
ꢆꢄ
ꢆꢃ
ꢆꢁ
ꢆꢂ
ꢅ
ꢉꢂ
ꢃꢂ
ꢍꢂ
ꢁꢂ
ꢆꢂ
ꢂ
įꢇ ꢇꢆ
5
ꢇ ꢇ5
ꢇ
įꢇ ꢇꢂꢈꢁ
įꢇ ꢇꢂꢈꢉ
įꢇ ꢇꢂꢈꢆ
įꢇ ꢇꢂꢈꢂꢉ
WKꢊMꢀDꢋ
WKꢊMꢀFꢋ
ꢄ
7
7
ꢃ
ꢁ
,
ꢊ$ꢋ
į ꢇWSꢌ7
WS
)
ꢊ$9ꢋ
7
ꢊ&ꢋ
į ꢇWSꢌ7
ꢁꢉ
WS
DPE
ꢆꢁꢉ
ꢂ
ꢂ
ꢁ
ꢃ
ꢄ
ꢅ
ꢆꢂ
ꢆꢁ
ꢆꢃ
ꢆꢄ
ꢆꢅ
ꢁꢂ
ꢁꢁ
ꢁꢃ
ꢁꢄ
ꢂ
ꢉꢂ
ꢎꢉ
ꢆꢂꢂ
ꢆꢉꢂ
ꢆꢎꢉ
)
Figure 3. Relative variation of thermal
impedance junction to case versus pulse
duration
Figure 4. Reverse leakage current versus
reverse voltage applied (typical values)
=
ꢆꢈꢂ
ꢌ5
ꢇ
,
ꢊ$ꢋ
ꢇ
WKꢊMꢀFꢋ
WKꢊMꢀFꢋ
5
ꢆꢈ(ꢐꢂꢁ
ꢆꢈ(ꢐꢂꢆ
ꢆꢈ(ꢐꢂꢂ
ꢆꢈ(ꢀꢂꢆ
ꢆꢈ(ꢀꢂꢁ
ꢂꢈꢏ
ꢂꢈꢅ
ꢂꢈꢎ
ꢂꢈꢄ
ꢂꢈꢉ
ꢂꢈꢃ
ꢂꢈꢍ
ꢂꢈꢁ
ꢂꢈꢆ
ꢂꢈꢂ
7
ꢇ ꢇꢆꢁꢉꢇ&
M
7
ꢇ ꢇꢆꢂꢂꢇ&
M
7
ꢇ ꢇꢎꢉꢇ&
M
7
ꢇ ꢇꢉꢂꢇ&
M
6LQJOHꢇSXOVH
7
ꢇ ꢇꢁꢉꢇ&
M
W
ꢊVꢋ
3
9
ꢊ9ꢋ
5
ꢆꢈ(ꢀꢂꢃ
ꢆꢈ(ꢀꢂꢍ
ꢆꢈ(ꢀꢂꢁ
ꢆꢈ(ꢀꢂꢆ
ꢆꢈ(ꢐꢂꢂ
ꢂ
ꢉ
ꢆꢂ
ꢆꢉ
ꢁꢂ
ꢁꢉ
ꢍꢂ
ꢍꢉ
ꢃꢂ
ꢃꢉ
ꢉꢂ
ꢉꢉ
ꢄꢂ
Figure 5. Junction capacitance versus reverse
Figure 6. Forward voltage drop versus forward
voltage applied (typical values)
current (typical values)
,
ꢊ$ꢋ
ꢇ
&ꢊS)ꢋꢇ
)
ꢆꢂꢂꢂꢂ
ꢆꢂꢂꢂ
ꢆꢂꢂ
ꢆꢂꢂꢈꢂ
ꢆꢂꢈꢂ
ꢆꢈꢂ
)ꢇ ꢇꢆꢇ0+]
ꢇ ꢇꢍꢂꢇP9
9
26&
506
7
ꢇ ꢇꢁꢉꢇ&
M
7
ꢇ ꢇꢎꢉꢇ&
M
7
ꢇ ꢇꢆꢁꢉꢇ&
M
7
ꢇ ꢇꢁꢉꢇ&
M
9
ꢊ9ꢋ
9
ꢊ9ꢋ
5
)
ꢂꢈꢆ
ꢂꢈꢂꢂ
ꢂꢈꢂꢉ
ꢂꢈꢆꢂ
ꢂꢈꢆꢉ
ꢂꢈꢁꢂ
ꢂꢈꢁꢉ
ꢂꢈꢍꢂ
ꢂꢈꢍꢉ
ꢂꢈꢃꢂ
ꢂꢈꢃꢉ
ꢂꢈꢉꢂ
ꢂꢈꢉꢉ
ꢆ
ꢆꢂ
ꢆꢂꢂ
DocID027193 Rev 2
3/8
8
Package information
FERD20M60
2
Package information
•
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 N·m
Maximum torque value: 0.7 N.m
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages,
depending on their level of environmental compliance. ECOPACK
®
ECOPACK is
an ST trademark.
2.1
TO-220AB package information
Figure 7. TO-220AB package outline
$
(
3
)
5HVLQꢇJDWH
ꢂꢈꢉꢇPPꢇPD[ꢈ
ꢊꢆꢋ
SURWUXVLRQ
4
+ꢆ
‘
‘ꢆ
/ꢍꢂ
/ꢁꢂ
-ꢆ
Eꢆ
/ꢆ
/
E
H
5HVLQꢇJDWH
F
ꢂꢈꢉꢇPPꢇPD[ꢈ
ꢊꢆꢋ
SURWUXVLRQ
Hꢆ
ꢊꢆꢋꢇ5HVLQꢇJDWHꢇSRVLWLRQꢇDFFHSWHGꢇLQꢇHDFKꢇRIꢇWKHꢇWZR
SRVLWLRQꢇVKRZQꢇDVꢇZHOOꢇDVꢇWKHꢇVPPHWULFDOꢇRSSRVLWHV
4/8
DocID027193 Rev 2
FERD20M60
Package information
Table 5. TO-220AB package mechanical data
Dimensions
Ref.
Millimeters
Inches
Max.
Min.
Max.
Min.
A
b
4.40
0.61
1.14
0.48
15.25
4.60
0.88
1.70
0.70
15.75
0.17
0.024
0.045
0.019
0.60
0.18
0.035
b1
c
0.067
0.027
D
0.62
D1
E
1.27 typ.
0.05 typ.
0.41
10
10.40
2.70
5.15
1.32
6.60
2.72
14
0.39
0.094
0.19
e
2.40
4.95
1.23
6.20
2.40
13
0.106
e1
F
0.20
0.048
0.24
0.052
H1
J1
L
0.26
0.094
0.51
0.107
0.55
L1
L20
L30
∅
P
Q
3.50
3.93
0.137
0.154
16.40 typ.
28.90 typ.
0.64 typ.
1.13 typ.
0.151
3.75
2.65
3.85
2.95
0.147
0.104
0.116
DocID027193 Rev 2
5/8
8
Package information
FERD20M60
2.2
I²PAK package information
2
Figure 8. I
P
AK package outline
$
(
Fꢁ
/ꢁ
‘
/ꢆ
$ꢆ
Eꢆ
E
/
F
H
Hꢆ
D
2
T
a
ble 6. I
P
AK package mechanical data
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
A1
b
4.40
2.40
0.61
1.14
0.49
1.23
8.95
2.40
4.95
10
4.60
2.72
0.88
1.70
0.70
1.32
9.35
2.70
5.15
10.40
14
0.173
0.094
0.024
0.044
0.019
0.048
0.352
0.094
0.195
0.394
0.512
0.138
0.050
0.181
0.107
0.035
0.067
0.028
0.052
0.368
0.106
0.203
0.409
0.551
0.155
0.055
b1
c
c2
D
e
e1
E
L
13
L1
L2
3.50
1.27
3.93
1.40
6/8
DocID027193 Rev 2
FERD20M60
Ordering information
3
Ordering information
T
a
ble 7. Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
FERD20M60ST
FERD20M60SR
FERD20M60ST
FERD20M60SR
TO-220AB
I²PAK
1.9 g
1.4 g
50
50
Tube
Tube
4
Revision history
Table 8. Document revision history
Date
Revision
Changes
20-Nov-2014
17-Jun-2015
1
2
Initial release.
Added I²PAK package information.
DocID027193 Rev 2
7/8
8
FERD20M60
IMPORTANT NOTICE – PLEASE READ CAREFUL
L
Y
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of S
T
.
A
ll other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2015 STMicroelectronics – All rights reserved
8/8
DocID027193 Rev 2
