STMicroelectronics-SD2943W
| Part # | STMicroelectronics-SD2943W |
Download  | STMicroelectronics-SD2943W |
SD2943
HF/VHF/UHF RF power N-channel MOSFET
Datasheet – production data
Features
High power capability
P
OUT
= 350 W min. with 22 dB gain@30 MHz
P
SAT
= 450 W
Low R
DS(on)
Thermally enhanced packing for lower
junction temperatures
Gold metallization
Excellent thermal stability
Common source configuration
Figure 1: Pin connection
Description
The SD2943 is a gold metallized N-channel MOS
field-effect RF power transistor. It is used for 50 V
DC large signal applications up to 150 MHz. The
SD2943 offers a 20% higher power saturation
than the SD2933, and is ideal for ISM
applications where reliability and ruggedness are
critical factors.
Table 1: Device summary
Order code
SD2943W
Marking
Package
Packing
Plastic tray
M177
Notes:
December 2016
DocID11584 Rev 5
1/13
This is information on a product in full production.
Contents
SD2943
Contents
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SD2943
Electrical data
1
Electrical data
1.1
Maximum ratings
T
CASE
= 25 °C
Table 2: Absolute maximum ratings
Parameter
Symbol
Value
130
130
±40
40
Unit
V
V
DGR
V
GS
Drain source voltage
Drain-gate voltage (R
GS
= 1 MΩ)
V
Gate-source voltage
Drain current
V
I
D
A
P
DISS
T
J
Power dissipation
648
+200
W
°C
Max. operating junction temperature
Avalanche energy, single pulse (ID = 53 A, 800
μH coil)
E
AS
1100
mJ
°C
T
STG
Storage temperature
-65 to +150
Notes:
(1)
T
J
= 150 °C
1.2
Thermal data
Table 3: Thermal data
Parameter
Junction-to-case thermal resistance
Symbol
Value
Unit
R
thJC
0.27
°C/W
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Electrical characteristics
SD2943
2
Electrical characteristics
T
CASE
= 25 °C
Table 4: Static
Test conditions
Symbol
Min. Typ. Max. Unit
I
DSS
V
GS
= 0 V
V
GS
= 0 V
V
GS
= 20 V
V
DS
= 10 V
V
GS
= 10 V
V
DS
= 10 V
V
GS
= 0 V
V
GS
= 0 V
V
GS
= 0 V
I
DS
= 200 mA
V
DS
= 50 V
V
DS
= 0 V
130
V
µA
nA
V
200
500
4
I
GSS
V
GS(Q)
V
DS(ON)
G
FS
I
D
= 250 mA
I
D
= 20 A
2
2
V
I
D
= 10 A
10
mho
pF
pF
pF
C
ISS
V
DS
= 50 V
V
DS
= 50 V
V
DS
= 50 V
f = 1 MHz
f = 1 MHz
f = 1 MHz
830
470
35
C
OSS
C
RSS
Notes:
(1)
T
J
= 150 °C
Table 5: Dynamic
Test conditions
V
DD
= 50 V
I
DQ
= 250 mA
Symbol
Min.
Typ.
Max.
Unit
P
OUT
450
25
f = 30 MHz
350
22
W
V
DD
= 50 V
I
DQ
= 250 mA
P
OUT
= 350 W
f = 30 MHz
G
PS
dB
V
DD
= 50 V
I
DQ
= 250 mA
P
OUT
= 350 W
f = 30 MHz
η
D
60
65
%
V
DD
= 50 V
I
DQ
= 250 mA
P
OUT
= 350 W
f = 30 MHz
Load
mismatch
VSWR
3:1
All phase angles
Table 6: G
FS
sorts
Symbol
Value
A
B
C
D
E
F
10 to 10.99
11 to 11.99
12 to 12.99
13 to 13.99
14 to 14.99
15 to 15.99
16 to 16.99
17 to 18
G
H
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SD2943
Impedance data
3
Impedance data
Figure 2: Impedance data
Table 7: Impedance data
f
Z
IN
(Ω)
Z
DL
(Ω)
30 MHz
108 MHz
175 MHz
1.3 – j 2.9
1.4 – j 2.4
1.4 – j 2.2
3.1 + j 2.3
1.9 + j 1.4
1.7 + j 1.6
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Typical performance
SD2943
4
Typical performance
Figure 4: Drain current vs. gate voltage
Figure 3: Capacitance vs. drain voltage
Figure 5: Gate-source voltage vs. case temperature
Figure 6: Maximum thermal resistance vs. case
temperature
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SD2943
Figure 7: Output power vs. input power
Typical performance
Figure 8: Output power vs. input power (at different
temperature)
Figure 9: Power gain vs. output power
Figure 10: Efficiency vs. output power
Figure 11: Output power vs. supply voltage
Figure 12: Output power vs. gate voltage
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Test circuit
(175 MHz)
SD2943
5
Test circuit (175 MHz)
Figure 13: 30 MHz test circuit schematic
Dimensions at component symbols are references for component placement. Gap
between ground and transmission files are 0.056[1.42] (typ.). Transmission line is
not 1:1 scale. Input and
output transmission line are 50 Ω.
Table 8: 30 MHz test circuit part list
Component
Description
C1, C9
C2, C3
C4
0.01 μF / 500 V surface mount ceramic chip capacitor
750 pF ATC 700B surface mount ceramic chip capacitor
300 pF ATC 700B surface mount ceramic chip capacitor
C5, C10, C11,
C14, C16
10000 pF ATC 200B surface mount ceramic chip capacitor
C6
510 pF ATC 700B surface mount ceramic chip capacitor
300 pF ATC 700B surface mount ceramic chip capacitor
175-680 pF type 46 standard trimmer capacitor
47 μF / 63 V aluminum electrolytic radial lead capacitor
1200 pF ATC 700B surface mount ceramic chip capacitor
100 μF / 63 V aluminum electrolytic radial lead capacitor
1 kΩ 1 W surface mount chip resistor
C7
C8
C12
C13
C15
R1, R3
R2
560 Ω 2 W
wire-wound axil lead resistor
T1
HF 2-30 MHz surface mount 9:1 transformer
RG –
142B/U 50 Ω coaxial cable OD = 0.165[4.18] L 15”[381.00] covered
with 15”[381.00] tinned copper tubular brand 13/65” [5.1] width
T2
L1
1 3/4 turn air-wound 16 AWG ID = 0.219 [5.56] poly-coated magnet wire
1 3/4 turn air-wound 12 AWG ID = 0.250 [6.34] bus bar wire
3 turns 14 AWG wire through fair rite toroid
L2
RFC1, RFC2
FB1
Surface mount shield bead
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SD2943
Test circuit
(175 MHz)
Component
FB2
PCB
Description
Toroid
ULTRALAM 2000. 0.030” THK, εr = 2.55, 2 Oz ED CU
both sides
Figure 14: 30 MHz test circuit
Both the SD2933 and the SD2943 device use the same PCB.
Figure 15: 30 MHz test circuit photomaster
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Marking,
packing and shipping specifications
SD2943
6
Marking, packing and shipping specifications
Table 9: Packing and shipping specifications
Pieces
per tray
Dry pack
humidity
Order code
Packing
G
FS
code
Lot code
Not mixed
SD2943W
Plastic tray
25
< 10%
Not mixed
Figure 16: SD2943 marking layout
Table 10: Marking specifications
Description
Symbol
W
Wafer process code
G
FS
sort
X
Assembly plant
CZ
xxx
VY
MAR
CZ
y
Last 3 digits of diffusion lot
Diffusion plant
Country of origin
Test and finishing plant
Assembly year
Assembly week
yy
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SD2943
Package information
7
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
ECOPACK
®
is an ST trademark.
7.1
M177 (.550 DIA 4L NHERM WFLG) package information
Figure 17: M177 (.550 DIA 4L N/HERM W/FLG) package outline
Table 11: M177 (.550 DIA 4L N/HERM W/FLG) package mechanical data
mm
Dim.
Min.
5.72
Typ.
Max.
A
B
C
D
E
F
G
H
I
5.97
6.96
6.73
21.84
22.10
28.70
13.84
28.96
14.10
0.08
2.49
3.81
0.18
2.74
4.32
7.11
J
27.43
15.88
28.45
16.13
K
DocID11584 Rev 5
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Revision history
SD2943
8
Revision history
Table 12: Document revision history
Date
Revision Changes
18-Oct-2005
04-Jan-2006
1
2
First issue.
Complete version.
Inserted
Chapter 7: Marking, packing and shipping
specifications
.
24-Aug-2011
3
Minor text changes.
Updated
Table 2.: Absolute maximum rating
. Minor text
changes.
10-Aug-2015
02-Dec-2016
4
5
Minor text changes.
12/13
DocID11584 Rev 5
SD2943
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–
All rights reserved
DocID11584 Rev 5
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