STMicroelectronics-STA680MTR
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STA680M
Automotive HD Radio™ baseband receiver – MRC enabled
Data brief
IIS serial audio interface with programmable
sample rate converter
Primary and secondary serial interfaces for
host micro communication based on industry
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standard IIC and SPI
TFBGA289
LFBGA168
Several General purpose IOs
One Internal clock oscillator and two internal
PLLs
Features
External clock input
AEC-Q100 qualified
1.2 V core supply; 3.3 V I/O supply
IBOC (in-band on-channel) digital audio
broadcast signal decoding for AM/FM hybrid
and all-digital modes
Description
The STA680M is an HD-radio base-band
processor for car-radio applications. The
STA680M functionality includes audio
decompression and data processing, while
multiple interfaces ensure flexible integration into
the system.
Dual-channel HD 1.5 for background scanning
and data services or FM Maximum Ratio
Combining (MRC) Diversity algorithm
HD codec (HDC) audio decompression
Metadata support for HD Radio reception
MPS (main program service), SPS
(supplemental program service) and PAD
(program associated data) data decoding
The STA680M takes full advantage of HD 1.5
Radio benefits including CD-like audio quality
from HD Radio FM broadcasts and FM-like audio
quality using HD Radio AM, while program
associated data or traffic information is received
from the second channel or, alternatively, it
features FM Maximum Ratio Combining Diversity
for superior reception performance.
Advanced HD Radio feature support:
– Apple
ID3 tag
– Multicasting
– Electronic
program guide (EPG)
– Real-time
traffic
STA680M supports FM/AM analog/digital AAA
algorithm by mean of specific FW.
Automatic Audio Alignment (AAA) algorithm
support
Table 1. Device summary
Variable input base-band data-rate I2S-like
interface supporting 650, 675, 744.1875,
912 kS/s data rates
Order code
Package
(1)
Packing
STA680M
STA680MTR
STA680MD
Tray
LFBGA 168 balls
(12x12x1.4 mm)
Secondary RF base-band interface for dual
T
a
pe & Reel
Tray
tuner applications
Glueless interface to Synchronous SDRAM
addressing up to 512 Mbit of SDRAM in x16
configuration
TFBGA 289 balls
(15x15x1.2 mm)
STA680MDTR
T
a
pe & Reel
1. ECOPACK
®
compliant.
Optional Serial Flash memory SPI interface for
application code storage
February 2019
DB3855 Rev 2
For further information contact your local STMicroelectronics sales office.
Block diagram and pin description
STA680M
1
Block diagram and pin description
1.1
Block diagram
Figure 1. Functional block diagram
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1.2
Ball-out description
The STA680M is available in two different packages. It comes in a 12×12 mm LFBGA with
168 balls with 0.8 mm pitch and in 15×15 mm TFBGA with 289 balls with 0.8 mm pitch.
TFBGA289 package option offers ball-to-ball compatibility with STA660 DAB/DRM digital
decoder.
DB3855 Rev 2
STA680M
Electrical specifications
2
Electrical specifications
2.1
Absolute maximum ratings
Table 2. Absolute maximum ratings
Symbol
VDD
Parameter
Test condition
Min
Typ
Max
Units
Core supply voltage
–
–
–
–
–
–
–
–
–
–
–
1.47
3.6
3.6
3.6
1.95
2.75
1.47
1.47
–
–
V
V
V
V
V
V
V
V
V
V
VDD_GEN_IO Generic
IO supply voltage
VDD_FSH_IO Flash
IO supply voltage
VDD_RAM_IO SDRAM
IO supply voltage
VDD_OSC Osc
1V8 supply voltage
–
–
–
–
–
–
–
–
VDD_PLL_ANA
PLL analog supply voltage
VDD_PLL_DIG PLL
digital supply voltage
–
–
–
–
VDD_SAF
SAF core supply voltage
Voltage on input pin
–
–
V
i
-0.5
-0.5
VDDIO+0.5
VDDIO+0.5
V
o
Voltage on output pin
–
R = 1.5 k
Ω
; C = 1.5 pF
Human Body Model,
LFBGA package
>|±1000|
>|±500|
ESD absolute minimum
withstand voltage
V
ESD
V
Charged device mode,
LFBGA package
2.2
Thermal data
Table 3. Thermal data
Symbol
Parameter
Test condition
Value
Unit
BGA package,
R
th j-amb
Thermal resistance junction-to-ambient
44
°C/W
JEDEC 2s2p PCB, free air
T
stg
T
amb
Storage temperature
–
–
–
-55 to 150
-40 to 85
125
°C
°C
°C
Operating ambient temperature
Maximum junction temperature
T
j, max
DB3855 Rev 2
8
Package information
STA680M
3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages,
depending on their level of environmental compliance. ECOPACK
®
ECOPACK is
an ST trademark.
3.1
LFBGA168 (12x12x1.4 mm) package information
Figure 2. LFBGA168 (12x12x1.4 mm) package outline
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DB3855 Rev 2
STA680M
Package information
Table 4. LFBGA168 (12x12x1.4 mm) package mechanical data
Dimensions
Ref
Millimeters
Typ.
Inches
(1)
Typ.
Min.
Max.
Min.
Max.
A
A1
A2
A4
b
–
–
–
1.400
–
–
0.0551
0.210
–
0.0083
–
–
–
0.200
–
–
0.800
0.450
12.150
–
–
0.0078
–
–
–
–
0.0315
0.0177
0.4783
–
0.350
0.400
12.000
10.400
12.000
10.400
0.800
0.800
–
0.0138
0.0157
0.4724
0.4094
0.4724
0.4094
0.0315
0.0315
–
D
11.850
0.4665
D1
E
–
–
11.850
12.150
–
0.4665
0.4783
–
E1
e
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Z
–
–
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0.100
0.150
0.080
0.0039
0.0059
0.0031
–
–
–
–
1. Values
in inches are converted from mm and rounded to 4 decimal digits.
DB3855 Rev 2
8
Package information
STA680M
3.2
TFBGA289 (15x15x1.2 mm) package information
Figure 3. TFBGA289 (15x15x1.2 mm) package outline
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DB3855 Rev 2
STA680M
Package information
Table 5. TFBGA289 (15x15x1.2 mm) package mechanical data
Dimensions
Ref
Millimeters
Typ.
Inches
(1)
Typ.
Min.
Max.
Min.
Max.
A
A1
A2
A4
b
–
–
–
1.200
–
–
0.0472
0.210
–
0.0083
–
–
–
0.200
–
–
0.620
0.480
15.150
–
–
0.0079
–
–
–
–
0.0244
0.0189
0.5965
–
0.350
0.400
15.000
12.800
15.000
12.800
0.800
1.100
–
0.0138
0.0157
0.5906
0.5039
0.5906
0.5039
0.0315
0.0433
–
D
14.850
0.5846
D1
E
–
–
14.850
15.150
–
0.5846
0.5965
–
E1
e
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Z
–
–
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eee
fff
0.100
0.150
0.080
0.0039
0.0059
0.0031
–
–
–
–
1. Values
in inches are converted from mm and rounded to 4 decimal digits.
DB3855 Rev 2
8
STA680M
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© 2019 STMicroelectronics – All rights reserved
DB3855 Rev 2
9
