STMicroelectronics-STB20NM60D
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STB20NM60D
N-channel 600V – 0.26
Ω
– 20A – D
2
P
A
K
FDmesh™ Power MOSFET
General features
Type
V
DSS
R
DS(on)
I
D
Pw
STB20NM60D
600V
<0.29
Ω
20A 45W
■
High dv/dt and avalanche capabilities
■
100% Avalanche tested
3
1
■
Low input capacitance and gate charge
■
Low gate input resistance
D²
P
A
K
■
Tight process control and high manufacturing
yields
Description
Internal schematic diagram
The FDmesh™ associates all advantages of
reduced on-resistance and fast switching with an
intrinsic fast-recovery body diode. It is therefore
strongly recommended for bridge topologies, in
particular ZVS phase-shift converters.
Applications
■
Switching application
Order codes
Part number
Marking
Package
Packaging
STB20NM60D
B20NM60D
D²
P
A
K
T
a
pe & reel
June 2006
Rev 1
1/13
13
Contents
STB20NM60D
Contents
Electrical ratings
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test circuit
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2/13
STB20NM60D
Electrical ratings
1
Electrical ratings
Table 1.
Symbol
Absolute maximum ratings
Parameter
Value
Unit
V
DS
Drain-source voltage (V
GS
= 0)
600
600
30
V
V
V
DGR
Drain-gate voltage (R
GS
= 20 k
Ω
)
V
GS
I
D
Gate- source voltage
V
Drain current (continuous) at T
C
= 25°C
Drain current (continuous) at T
C
= 100°C
Drain current (pulsed)
20
A
I
D
12.6
80
A
(1)
I
DM
P
TOT
A
T
o
tal dissipation at T
C
= 25°C
Derating factor
192
1.20
20
W
W/°C
V/ns
°C
dv/dt
(2)
Peak diode recovery voltage slope
T
j
Operating junction temperature
Storage temperature
– 65 to 150
T
stg
°C
1. Pulse
width limited by safe operating area
2. I
SD
< 20A, di/dt < 400A/µs, V
DD
= 80%V
(BR)DSS
Table 2.
Symbol
Thermal resistance
Parameter
Value
Unit
Rthj-case Thermal
resistance junction-case Max
Rthj-amb Thermal
resistance junction-ambient Max
0.65
62.5
°C/W
°C/W
Maximum lead temperature for soldering
purpose
T
l
300
°C
Table 3.
Symbol
Avalanche data
Parameter
Value
Unit
Avalanche current, repetitive or not-repetitive
(pulse width limited by T
j
max)
I
AR
10
A
Single pulse avalanche energy
E
AS
700
mJ
(starting T
j
= 25 °C, I
D
= I
AR
, V
DD
= 35 V)
3/13
Electrical characteristics
STB20NM60D
2
Electrical characteristics
(T
=25°C unless otherwise specified)
CASE
Table 4.
Symbol
On/off states
Parameter
Test condictions
Min Typ Max
Unit
Drain-source breakdown
voltage
V
(BR)DSS
I
D
= 250µA, V
GS
= 0
600
V
Zero gate voltage
V
DS
= Max rating
1
µA
µA
I
DSS
drain current (V
GS
= 0)
V
DS
= Max rating, T
C
= 125 °C
10
Gate-body leakage
current (V
DS
= 0)
10
0
I
GSS
V
GS
= 30V
µA
V
V
GS(th)
R
DS(on)
Gate threshold voltage
V
DS
= V
GS
, I
D
= 250µA
V
GS
= 10
V
,
I
D
= 10A
3
4
5
Static drain-source on
resistance
0.26 0.29
Ω
Table 5.
Symbol
Dynamic
Parameter
Test condictions
Min Typ Max
Unit
V
DS
> I
D(on)
x R
DS(on)max,
I
D
= 10A
(1)
g
fs
Forward transconductance
9
S
C
iss
C
oss
C
rss
Input capacitance
1300
500
35
pF
pF
pF
Output capacitance
V
DS
= 25
V
, f = 1
M
Hz, V
GS
= 0
Reverse transfer capacitance
(2)
C
oss eq.
Equivalent output capacitance
V
GS
= 0
V
,
V
DS
= 0V to 480V
f=1 MHz Gate DC Bias = 0
190
pF
R
G
Gate input resistance
T
e
st signal level = 20mV
open drain
2.7
Ω
Q
g
Q
gs
Q
gd
T
o
tal gate charge
Gate-source charge
Gate-drain charge
V
DD
= 480
V
,
I
D
= 20A,
V
GS
= 10V
37
10
17
52
nC
nC
nC
1. Pulsed:
Pulse duration = 300 µs, duty cycle 1.5 %
2. C
oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C
oss
when V
DS
increases from 0 to 80%
4/13
STB20NM60D
Electrical characteristics
Min. Typ.
Max. Unit
Table 6.
Switching times
Parameter
Symbol
Test condictions
V
DD
= 300
V
,
I
D
= 10A
R
G
= 4.7
Ω
V
GS
= 10V
t
d(on)
t
r
T
u
rn-on delay time
Rise time
25
12
ns
ns
t
r(Voff)
Off-voltage rise time
Fall time
8
ns
ns
ns
V
DD
= 480
V
,
I
D
= 20A,
R
G
= 4.7
Ω
,
V
GS
= 10V
t
f
22
30
t
c
Cross-over time
Table 7.
Symbol
Source drain diode
Parameter
Test condictions
Min Typ. Max
Unit
I
SD
Source-drain current
20
80
A
A
(1)
I
SDM
Source-drain current (pulsed)
(2)
V
SD
Forward on voltage
I
SD
= 20 A, V
GS
= 0
1.5
V
t
rr
Reverse recovery time
Reverse recovery charge
Reverse recovery current
I
SD
= 20 A, T
j
= 25°C
di/dt =100A/µs,V
DD
=60V
240
1800
16
ns
nC
A
Q
rr
I
RRM
t
rr
Reverse recovery time
Reverse recovery charge
Reverse recovery current
I
SD
= 20 A, T
j
= 150°C
di/dt =100A/µs,V
DD
=60V
396
2960
20
ns
nC
A
Q
rr
I
RRM
1. Pulse
width limited by safe operating area
2. Pulsed:
Pulse duration = 300 µs, duty cycle 1.5 %.
5/13
Electrical characteristics
STB20NM60D
2.1
Electrical characteristics (curves)
Figure 1.
Safe operating area
Figure 2.
Thermal impedance
Figure 3.
Output characterisics
Figure 4.
Transfer characteristics
Figure 5.
Transconductance
Figure 6.
Static drain-source on resistance
6/13
STB20NM60D
Electrical characteristics
Figure 7.
Gate charge vs gate-source voltage
Figure 8.
Capacitance variations
Figure 9.
Normalized gate threshold voltage
Figure 10.
Normalized on resistance vs
vs temperature
temperature
Figure 11.
Source-drain diode forward
characteristics
7/13
Test circuit
STB20NM60D
3
Test circuit
Figure 12.
Switching times test circuit for
resistive load
Figure 13.
Gate charge test circuit
Figure 14.
Test circuit for inductive load
switching and diode recovery times
Figure 15.
Unclamped inductive load test
circuit
Figure 16.
Unclamped inductive waveform
Figure 17.
Switching time waveform
8/13
STB20NM60D
Package mechanical data
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECO
P
A
CK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECO
P
ACK is an ST trademark.
9/13
Package mechanical data
STB20NM60D
D
2
PAK MECHANICAL DATA
mm.
inch
TYP.
DIM.
MIN.
4.4
TYP
MAX.
4.6
MIN.
0.173
0.098
0.001
0.027
0.044
0.017
0.048
0.352
MAX.
0.181
0.106
0.009
0.036
0.067
0.023
0.053
0.368
A
A1
A2
B
2.49
0.03
0.7
2.69
0.23
0.93
1.7
B2
C
1.14
0.45
1.23
8.95
0.6
C2
D
1.36
9.35
D1
E
8
0.315
0.334
10
10.4
0.393
E1
G
8.5
4.88
15
5.28
15.85
1.4
0.192
0.590
0.050
0.055
0.094
0.208
0.625
0.055
0.068
0.126
L
L2
L3
M
1.27
1.4
1.75
3.2
2.4
R
0.4
0.015
V2
0º
4º
3
1
10/13
STB20NM60D
Packaging mechanical data
5
Packaging mechanical data
2
D PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
mm
MIN. MAX. MIN. MAX.
330 12.992
inch
DIM.
A
B
C
D
G
N
T
1.5
12.8
20.2
24.4
100
0.059
13.2 0.504
0.520
0795
26.4 0.960
1.039
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
TAPE MECHANICAL DATA
1000
mm
inch
DIM.
MIN. MAX. MIN. MAX.
10.5 10.7
0.413 0.421
15.7 15.9
0.618 0.626
A0
B0
D
1.5
1.6 0.059
0.063
D1
E
1.59 1.61
0.062 0.063
1.65 1.85
0.065 0.073
F
11.4
4.8
3.9
11.9
1.9
50
11.6 0.449
0.456
5.0 0.189
0.197
4.1 0.153
0.161
12.1 0.468
0.476
2.1 0.075
0.082
1.574
K0
P0
P1
P2
R
T
0.25 0.35
0.0098 0.0137
23.7 24.3
0.933 0.956
W
* on sales type
11/13
Revision history
STB20NM60D
6
Revision history
Table 8.
Date
08-Jun-2006
Revision history
Revision
Changes
1
First release
12/13
STB20NM60D
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13/13
