STMicroelectronics-STB20NM60D

Part #STMicroelectronics-STB20NM60D
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STMicroelectronics-STB20NM60D
STB20NM60D  
N-channel 600V – 0.26
Ω
– 20A – D

2

P
A
K  
FDmesh™ Power MOSFET  
General features  
Type  
V

DSS  

R

DS(on)  

I

D  

Pw  
STB20NM60D  
600V  
<0.29
Ω
20A 45W  
■
High dv/dt and avalanche capabilities  
■
100% Avalanche tested  
3
1
■
Low input capacitance and gate charge  
■
Low gate input resistance  
D²
P
A
K  
■
Tight process control and high manufacturing  
yields  
Description  
Internal schematic diagram  
The FDmesh™ associates all advantages of  
reduced on-resistance and fast switching with an  
intrinsic fast-recovery body diode. It is therefore  
strongly recommended for bridge topologies, in  
particular ZVS phase-shift converters.  
Applications  
■
Switching application  
Order codes  
Part number  
Marking  
Package  
Packaging  
STB20NM60D  
B20NM60D  
D²
P
A
K  
T
a
pe & reel  
June 2006  
Rev 1  
1/13  
13  

STB20NM60D  
Electrical ratings  
1
Electrical ratings  
Table 1.  
Symbol  
Absolute maximum ratings  
Parameter  
Value  
Unit  
V

DS  

Drain-source voltage (V

GS

= 0)  
600  
600  
30  
V
V
V

DGR

Drain-gate voltage (R

GS

= 20 k
Ω
)  
V

GS  

I

D  

Gate- source voltage  
V
Drain current (continuous) at T

C

= 25°C  
Drain current (continuous) at T

C

= 100°C  
Drain current (pulsed)  
20  
A
I

D  

12.6  
80  
A
(1)  
I

DM  

P

TOT  

A
T
o
tal dissipation at T

C

= 25°C  
Derating factor  
192  
1.20  
20  
W
W/°C  
V/ns  
°C  
dv/dt

(2)

Peak diode recovery voltage slope  
T

j  

Operating junction temperature  
Storage temperature  
– 65 to 150  
T

stg  

°C  
1. Pulse
 
width limited by safe operating area  
2. I

SD

< 20A, di/dt < 400A/µs, V

DD

= 80%V

(BR)DSS  

Table 2.  
Symbol  
Thermal resistance  
Parameter  
Value  
Unit  
Rthj-case Thermal
 
resistance junction-case Max  
Rthj-amb Thermal
 
resistance junction-ambient Max  
0.65  
62.5  
°C/W  
°C/W  
Maximum lead temperature for soldering  
purpose  
T

l  

300  
°C  
Table 3.  
Symbol  
Avalanche data  
Parameter  
Value  
Unit  
Avalanche current, repetitive or not-repetitive  
(pulse width limited by T

j

max)  
I

AR  

10  
A
Single pulse avalanche energy  
E

AS  

700  
mJ  
(starting T

j

= 25 °C, I

D

= I

AR

, V

DD

= 35 V)  
3/13  

Electrical characteristics  
STB20NM60D  
2
Electrical characteristics  
(T  
=25°C unless otherwise specified)  
CASE  
Table 4.  
Symbol  
On/off states  
Parameter  
Test condictions  
Min Typ Max
 
Unit  
Drain-source breakdown  
voltage  
V

(BR)DSS  

I

D

= 250µA, V

GS

= 0  
600  
V
Zero gate voltage  
V

DS

= Max rating  
1
µA  
µA  
I

DSS  

drain current (V

GS

= 0)  
V

DS

= Max rating, T

C

= 125 °C  
10  
Gate-body leakage  
current (V

DS

= 0)  
10  
0
I

GSS  

V

GS

= 30V  
µA  
V
V

GS(th)  

R

DS(on)  

Gate threshold voltage  
V

DS

= V

GS

, I

D

= 250µA  
V

GS

= 10
V
,
I

D

= 10A  
3
4
5
Static drain-source on  
resistance  
0.26 0.29  
Ω
Table 5.  
Symbol  
Dynamic  
Parameter  
Test condictions  
Min Typ Max
 
Unit  
V

DS

> I

D(on)

x R

DS(on)max,  

I

D

= 10A  
(1)  
g

fs  

Forward transconductance  
9
S
C

iss  

C

oss  

C

rss  

Input capacitance  
1300  
500  
35  
pF  
pF  
pF  
Output capacitance  
V

DS

= 25
V
, f = 1
M
Hz, V

GS

= 0  
Reverse transfer capacitance  
(2)  
C

oss eq.  

Equivalent output capacitance
 
V

GS

= 0
V
,
V

DS

= 0V to 480V  
f=1 MHz Gate DC Bias = 0  
190  
pF  
R

G  

Gate input resistance  
T
e
st signal level = 20mV  
open drain  
2.7  
Ω
Q

g  

Q

gs  

Q

gd  

T
o
tal gate charge  
Gate-source charge  
Gate-drain charge  
V

DD

= 480
V
,
I

D

= 20A,  
V

GS

= 10V  
37  
10  
17  
52  
nC  
nC  
nC  
1. Pulsed:
 
Pulse duration = 300 µs, duty cycle 1.5 %  
2. C

oss eq.

is defined as a constant equivalent capacitance giving the same charging time as C

oss

when V

DS  

increases from 0 to 80%  
4/13  

STB20NM60D  
Electrical characteristics  
Min. Typ.
 
Max. Unit  
Table 6.  
Switching times  
Parameter  
Symbol  
Test condictions  
V

DD

= 300
V
,
I

D

= 10A  
R

G

= 4.7
Ω
V

GS

= 10V  
t

d(on)  

t

r  

T
u
rn-on delay time  
Rise time  
25  
12  
ns  
ns  
t

r(Voff)  

Off-voltage rise time  
Fall time  
8
ns  
ns  
ns  
V

DD

= 480
V
,
I

D

= 20A,  
R

G

= 4.7
Ω
,
V

GS

= 10V  
t

f  

22  
30  
t

c  

Cross-over time  
Table 7.  
Symbol  
Source drain diode  
Parameter  
Test condictions  
Min Typ. Max
 
Unit  
I

SD  

Source-drain current  
20  
80  
A
A
(1)  
I

SDM  

Source-drain current (pulsed)  
(2)  
V

SD  

Forward on voltage  
I

SD

= 20 A, V

GS

= 0  
1.5  
V
t

rr  

Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
I

SD

= 20 A, T

j

= 25°C  
di/dt =100A/µs,V

DD

=60V  
240  
1800  
16  
ns  
nC  
A
Q

rr  

I

RRM  

t

rr  

Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
I

SD

= 20 A, T

j

= 150°C  
di/dt =100A/µs,V

DD

=60V  
396  
2960  
20  
ns  
nC  
A
Q

rr  

I

RRM  

1. Pulse
 
width limited by safe operating area  
2. Pulsed:
 
Pulse duration = 300 µs, duty cycle 1.5 %.  
5/13  

Electrical characteristics  
STB20NM60D  
2.1  
Electrical characteristics (curves)  
Figure 1.
 
Safe operating area  
Figure 2.
 
Thermal impedance  
Figure 3.
 
Output characterisics  
Figure 4.
 
Transfer characteristics  
Figure 5.
 
Transconductance  
Figure 6.
 
Static drain-source on resistance  
6/13  

STB20NM60D  
Electrical characteristics  
Figure 7.
 
Gate charge vs gate-source voltage
 
Figure 8.
 
Capacitance variations  
Figure 9.
 
Normalized gate threshold voltage
 
Figure 10.
 
Normalized on resistance vs  
vs temperature  
temperature  
Figure 11.
 
Source-drain diode forward  
characteristics  
7/13  

Test circuit  
STB20NM60D  
3
Test circuit  
Figure 12.
 
Switching times test circuit for  
resistive load  
Figure 13.
 
Gate charge test circuit  
Figure 14.
 
Test circuit for inductive load  
switching and diode recovery times  
Figure 15.
 
Unclamped inductive load test  
circuit  
Figure 16.
 
Unclamped inductive waveform  
Figure 17.
 
Switching time waveform  
8/13  

STB20NM60D  
Package mechanical data  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in ECO
P
A
CK®  
packages. These packages have a Lead-free second level interconnect . The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECO
P
ACK is an ST trademark.  
ECO
P
ACK specifications are available at:

9/13  

Package mechanical data  
STB20NM60D  
D

2

PAK MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
4.4  
TYP  
MAX.  
4.6  
MIN.  
0.173  
0.098  
0.001  
0.027  
0.044  
0.017  
0.048  
0.352  
MAX.  
0.181  
0.106  
0.009  
0.036  
0.067  
0.023  
0.053  
0.368  
A
A1  
A2  
B
2.49  
0.03  
0.7  
2.69  
0.23  
0.93  
1.7  
B2  
C
1.14  
0.45  
1.23  
8.95  
0.6  
C2  
D
1.36  
9.35  
D1  
E
8
0.315  
0.334  
10  
10.4  
0.393  
E1  
G
8.5  
4.88  
15  
5.28  
15.85  
1.4  
0.192  
0.590  
0.050  
0.055  
0.094  
0.208  
0.625  
0.055  
0.068  
0.126  
L
L2  
L3  
M
1.27  
1.4  
1.75  
3.2  
2.4  
R
0.4  
0.015  
V2  
0º  
4º  
3
1
10/13  

STB20NM60D  
Packaging mechanical data  
5
Packaging mechanical data  
2
D PAK FOOTPRINT  
TAPE AND REEL SHIPMENT  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
24.4  
100  
0.059  
13.2 0.504
 
0.520  
0795  
26.4 0.960
 
1.039  
3.937  
30.4  
1.197  
BASE QTY  
BULK QTY  
1000  
TAPE MECHANICAL DATA  
1000  
mm  
inch  
DIM.  
MIN. MAX. MIN. MAX.  
10.5 10.7
 
0.413 0.421  
15.7 15.9
 
0.618 0.626  
A0  
B0  
D
1.5  
1.6 0.059
 
0.063  
D1  
E
1.59 1.61
 
0.062 0.063  
1.65 1.85
 
0.065 0.073  
F
11.4  
4.8  
3.9  
11.9  
1.9  
50  
11.6 0.449
 
0.456  
5.0 0.189
 
0.197  
4.1 0.153
 
0.161  
12.1 0.468
 
0.476  
2.1 0.075
 
0.082  
1.574  
K0  
P0  
P1  
P2  
R
T
0.25 0.35
 
0.0098 0.0137  
23.7 24.3
 
0.933 0.956  
W
* on sales type  
11/13  

Revision history  
STB20NM60D  
6
Revision history  
Table 8.  
Date  
08-Jun-2006  
Revision history  
Revision  
Changes  
1
First release  
12/13  

STB20NM60D  
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13/13