STMicroelectronics-STB30NF20
| Part # | STMicroelectronics-STB30NF20 |
| Download | STMicroelectronics-STB30NF20 |
STP30NF20 – STB30NF20
STW30NF20
N-channel 200V – 0.065
Ω
– 30A – TO-220/TO-247/D
2
P
A
K
Low gate charge S
T
r
ipFET™ Power MOSFET
Features
Type
V
DSS
R
DS(on)
I
D
P
TOT
STP30NF20
STW30NF20
STB30NF20
200V
200V
200V
0.075
Ω
0.075
Ω
0.075
Ω
30A
30A
30A
125W
125W
125W
3
3
2
2
1
1
TO-247
3
TO-220
■
Gate charge minimized
■
100% avalanche tested
1
D²
P
A
K
■
Excellent figure of merit (R
*Q )
DS
g
■
Very good manufactuing repeability
■
Very low intrinsic capacitances
Application
Figure 1.
Internal schematic diagram
■
Switching applications
Description
This Power MOSFET series realized with
STMicroelectronics unique S
T
r
ipFET process has
specifically been designed to minimize input
capacitance and gate charge. It is therefore
suitable as primary switch in advanced high-
efficiency isolated DC-DC converters.
Table 1.
Device summary
Order codes
Marking
Package
TO-220
Packaging
STP30NF20
STW30NF20
STB30NF20
30NF20
30NF20
30NF20
T
u
be
T
u
be
TO-247
D²
P
A
K
T
a
pe & reel
October 2007
Rev 2
1/16
16
Contents
STP30NF20 – STW30NF20 – STB30NF20
Contents
Electrical ratings
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test circuit
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2/16
STP30NF20 – STW30NF20 – STB30NF20
Electrical ratings
1
Electrical ratings
Table 2.
Symbol
Absolute maximum ratings
Parameter
Value
Unit
V
DS
V
GS
I
D
Drain-source voltage (V
GS
= 0)
Gate-source voltage
200
20
V
V
Drain current (continuous) at T
C
= 25°C
Drain current (continuous) at T
C
=100°C
Drain current (pulsed)
30
A
I
D
19
A
(1)
I
DM
120
125
1
A
P
TOT
T
o
tal dissipation at T
C
= 25°C
Derating factor
W
W/°C
V/ns
dv/dt
(2)
Peak diode recovery voltage slope
10
T
J
Operating junction temperature
Storage temperature
-55 to 150
300
°C
°C
T
stg
Maximum lead temperature for soldering
purpose
T
l
1. Pulse
width limited by safe operating area
2.
I
SD
≤
30A, di/dt
≤
200A/µs, V
DD
= 80%
V
(BR)DSS
Table 3.
Symbol
Thermal data
TO-220/
D²
P
A
K
Parameter
TO-247
Unit
R
thJC
R
thJA
Thermal resistance junction-case max
Thermal resistance junction-ambient max
1
°C/W
°C/W
62.5
50
Table 4.
Symbol
Avalanche data
Parameter
Value
Unit
Avalanche current, repetitive or not
repetitive (pulse width limited by Tjmax)
I
AR
30
A
Single pulse avalanche energy (starting
Tj=25°C, I
D
=I
AR
, V
DD
=50V)
E
AS
140
mJ
3/16
Electrical characteristics
STP30NF20 – STW30NF20 – STB30NF20
2
Electrical characteristics
(T
=25°C unless otherwise specified)
CASE
Table 5.
Symbol
On/off states
Parameter
Test conditions
I
D
= 1mA, V
GS
= 0
Min. Typ. Max. Unit
Drain-source breakdown
voltage
V
(BR)DSS
200
V
V
DS
= Max rating,
1
µA
µA
Zero gate voltage drain
current (V
GS
= 0)
I
DSS
V
DS
= Max rating,Tc=125°C
10
Gate body leakage current
(V
DS
= 0)
I
GSS
V
GS
= 20V
±
100
nA
V
GS(th)
R
DS(on)
V
DS
= V
GS
, I
D
= 250µA
V
GS
= 10
V
,
I
D
= 15A
Gate threshold voltage
2
3
4
V
Static drain-source on
resistance
0.065 0.075
Ω
Table 6.
Symbol
Dynamic
Parameter
Test conditions
Min. Typ. Max. Unit
(1)
V
DS
=15
V
,
I
D
= 15A
Forward transconductance
20
S
g
fs
Input capacitance
C
iss
C
oss
C
rss
1597
320
43
pF
pF
pF
Output capacitance
V
DS
=25
V
,
f
=1 MHz, V
GS
=0
Reverse transfer
capacitance
Q
g
Q
gs
Q
gd
V
DD
=160
V
,
I
D
= 30A
V
GS
=10V
T
o
tal gate charge
Gate-source charge
Gate-drain charge
38
8
nC
nC
nC
18
1. Pulsed:
pulse duration=300µs, duty cycle 1.5%
4/16
STP30NF20 – STW30NF20 – STB30NF20
Electrical characteristics
Min. Typ. Max.
Unit
Table 7.
Symbol
Switching times
Parameter
Test conditions
V
DD
=100
V
,
I
D
=15A,
R
G
=4.7
Ω
,
V
GS
=10V
t
d(on)
t
r
T
u
rn-on delay time
Rise time
35
ns
ns
15.7
V
DD
=100
V
,
I
D
=15A,
t
d(off)
t
f
T
u
rn-off delay time
Fall time
38
ns
ns
R
G
=4.7
Ω
,
V
GS
=10V
8.8
Table 8.
Symbol
Source drain diode
Parameter
Test conditions
Min. Typ.
Max. Unit
Source-drain current
I
SD
30
A
A
Source-drain current
(pulsed)
(1)
120
I
SDM
(2)
I
SD
=30A, V
GS
=0
Forward on voltage
1.5
V
V
SD
t
rr
Reverse recovery time
Reverse recovery charge
Reverse recovery current
155
0.96
12.4
ns
µC
A
I
SD
=30A, di/dt = 100A/µs,
V
DD
=100
V
,
T
j=25°C
Q
rr
I
RRM
t
rr
Reverse recovery time
Reverse recovery charge
Reverse recovery current
194
1.42
14.6
ns
µC
A
I
SD
=30A, di/dt = 100A/µs,
V
DD
=100
V
,
T
j=150°C
Q
rr
I
RRM
1. Pulse
width limited by safe operating area
2. Pulsed:
pulse duration=300µs, duty cycle 1.5%
5/16
Electrical characteristics
STP30NF20 – STW30NF20 – STB30NF20
Figure 3.
Thermal impedance for TO-247
2.1
Electrical characteristics (curves)
Figure 2.
Safe operating area for TO-247
Figure 4.
Safe operating area for TO-220/
D²
P
A
K
Figure 5.
Thermal impedance for TO-220/
D²
P
A
K
Figure 6.
Output characteristics
Figure 7.
Transfer characteristics
6/16
STP30NF20 – STW30NF20 – STB30NF20
Electrical characteristics
Figure 8.
Normalized B
vs temperature
Figure 9.
Static drain-source on resistance
VDSS
Figure 10.
Gate charge vs gate-source voltage
Figure 11.
Capacitance variations
Figure 12.
Normalized gate threshold voltage
Figure 13.
Normalized on resistance vs
vs temperature
temperature
7/16
Electrical characteristics
STP30NF20 – STW30NF20 – STB30NF20
Figure 14.
Source-drain diode forward
characteristics
Figure 15.
Maximum avalanche energy vs
temperature
8/16
STP30NF20 – STW30NF20 – STB30NF20
Test circuit
3
Test circuit
Figure 16.
Switching times test circuit for
resistive load
Figure 17.
Gate charge test circuit
Figure 18.
Test circuit for inductive load
switching and diode recovery times
Figure 19.
Unclamped inductive load test
circuit
Figure 20.
Unclamped inductive waveform
Figure 21.
Switching time waveform
9/16
Package mechanical data
STP30NF20 – STW30NF20 – STB30NF20
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECO
P
A
CK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECO
P
ACK is an ST trademark.
10/16
STP30NF20 – STW30NF20 – STB30NF20
Package mechanical data
TO-247 MECHANICAL DATA
mm.
inch
DIM.
MIN.
TYP
MAX.
5.15
MIN.
0.19
TYP.
MAX.
0.20
A
A1
b
4.85
2.20
1.0
2.60
0.086
0.039
0.079
0.118
0.015
0.781
0.608
0.102
0.055
0.094
0.134
0.03
1.40
b1
b2
c
2.0
2.40
3.0
3.40
0.40
19.85
15.45
0.80
D
20.15
15.75
0.793
0.620
E
e
5.45
18.50
5.50
0.214
0.728
0.216
L
14.20
3.70
14.80
4.30
0.560
0.14
0.582
0.17
L1
L2
øP
øR
S
3.55
4.50
3.65
5.50
0.140
0.177
0.143
0.216
11/16
Package mechanical data
STP30NF20 – STW30NF20 – STB30NF20
TO-220 MECHANICAL DATA
mm.
TYP
inch
TYP.
DIM.
MIN.
4.40
0.61
1.15
0.49
15.25
10
MAX.
4.60
0.88
1.70
0.70
15.75
10.40
2.70
5.15
1.32
6.60
2.72
14
MIN.
0.173
0.024
0.045
0.019
0.60
MAX.
0.181
0.034
0.066
0.027
0.620
0.409
0.106
0.202
0.052
0.256
0.107
0.551
0.154
A
b
b1
c
D
E
0.393
0.094
0.194
0.048
0.244
0.094
0.511
0.137
e
2.40
4.95
1.23
6.20
2.40
13
e1
F
H1
J1
L
L1
L20
L30
øP
Q
3.50
3.93
16.40
28.90
0.645
1.137
3.75
2.65
3.85
2.95
0.147
0.104
0.151
0.116
12/16
STP30NF20 – STW30NF20 – STB30NF20
Package mechanical data
D²
P
A
K mechanical data
mm
inch
Dim
Min
Typ
Max
Min
Typ
Max
A
A1
A2
B
4.4
4.6
2.6
9
0.2
3
0.
93
1.7
0.17
3
0.0
98
0.001
0.027
0.044
0.017
0.04
8
0.
3
52
0.1
8
1
0.106
0.00
9
0.0
3
6
0.067
0.02
3
0.05
3
0.
3
6
8
2.4
9
0.0
3
0.7
B2
C
1.14
0.45
1.2
3
8
.
9
5
0.6
C2
D
1.
3
6
9
.
3
5
D1
E
8
0.
3
15
0.
33
4
10
10.4
0.
393
0.40
9
E1
G
8
.5
4.
88
15
5.2
8
15.
8
5
1.4
0.1
9
2
0.5
9
0
0.50
0.20
8
0.625
0.55
L
L2
L
3
M
1.27
1.4
1.75
3
.2
0.055
0.0
9
4
0.6
8
2.4
0.126
R
0.4
0.015
V2
0°
4°
13/16
Packaging mechanical data
STP30NF20 – STW30NF20 – STB30NF20
5
Packaging mechanical data
2
D PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
mm
MIN. MAX. MIN. MAX.
330 12.992
inch
DIM.
A
B
C
D
G
N
T
1.5
12.8
20.2
24.4
100
0.059
13.2 0.504
0.520
0795
26.4 0.960
1.039
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
TAPE MECHANICAL DATA
1000
mm
inch
DIM.
MIN. MAX. MIN. MAX.
10.5 10.7
0.413 0.421
15.7 15.9
0.618 0.626
A0
B0
D
1.5
1.6 0.059
0.063
D1
E
1.59 1.61
0.062 0.063
1.65 1.85
0.065 0.073
F
11.4
4.8
3.9
11.9
1.9
50
11.6 0.449
0.456
5.0 0.189
0.197
4.1 0.153
0.161
12.1 0.468
0.476
2.1 0.075
0.082
1.574
K0
P0
P1
P2
R
T
0.25 0.35
0.0098 0.0137
23.7 24.3
0.933 0.956
W
* on sales type
14/16
STP30NF20 – STW30NF20 – STB30NF20
Revision history
6
Revision history
Table 9.
Date
Document revision history
Revision
Changes
25-Jan-2007
18-Oct-2007
1
2
First Release
Added D²
P
A
K
15/16
STP30NF20 – STW30NF20 – STB30NF20
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS “AUTOMOTIVE
GRADE” MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics – All rights reserved
STMicroelectronics group of companies
Australia – Belgium – Brazil – Canada – China – Czech Republic – Finland – France – Germany – Hong Kong – India – Israel – Italy – Japan –
Malaysia – Malta – Morocco – Singapore – Spain – Sweden – Switzerland – United Kingdom – United States of America
16/16
