STMicroelectronics-STB80NF55L-06T4

Part #STMicroelectronics-STB80NF55L-06T4
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STMicroelectronics-STB80NF55L-06T4
STB80NF55L-06  
STP80NF55L-06  
N-CHANNEL 55V – 0.005
Ω
– 80A D
²PAK/TO-220  
STripFET™ II POWER MOSFET  
V
DSS  
R
I
D
TYPE  
DS(on)  
STB80NF55L-06  
STP80NF55L-06  
55 V  
55 V  
< 0.0065
Ω  
< 0.0065
Ω  
80 A  
80 A  
■
■
■
■
TYPICAL R
 
(on) = 0.005
Ω  
DS  
LOW THRESHOLD DRIVE  
LOGIC LEVEL DEVICE  
3
2
SURFACE-MOUNTING D PAK (TO-263)  
POWER PACKAGE IN TUBE (NO SUFFIX) OR  
IN TAPE & REEL (SUFFIX “T4”)  
3
1
2
1
2
D PAK  
TO-263  
TO-220  
(Suffix “T4”)  
DESCRIPTION  
This Power MOSFET is the latest development of  
STMicroelectronis unique “Single Feature Size™”  
strip-based process. The resulting transistor  
shows extremely high packing density for low on-  
resistance, rugged avalanche characteristics and  
less critical alignment steps therefore a remark-  
able manufacturing reproducibility.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
■
■
■
■
■
HIGH CURRENT, HIGH SPEED SWITCHING  
SOLENOID AND RELAY DRIVERS  
MOTOR CONTROL, AUDIO AMPLIFIERS  
DC-DC & DC-AC CONVERTERS  
AUTOMOTIVE  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
55  
Unit  
V
V
Drain-source Voltage (V
 
= 0)  
DS  
GS  
V
Drain-gate Voltage (R
 
= 20 k
Ω
)  
55  
V
DGR  
GS  
V
Gate- source Voltage  
± 16  
80  
V
GS  
I (#)  
D
Drain Current (continuous) at T
 
= 25°C  
A
C
I
D
Drain Current (continuous) at T
 
= 100°C  
80  
A
C
I
(
•
)  
Drain Current (pulsed)  
320  
300  
2
A
DM  
P
T
o
tal Dissipation at T
 
= 25°C  
W
tot  
C
Derating Factor  
W/°C  
V/ns  
J
(1)  
(2)  
Peak Diode Recovery voltage slope  
Single Pulse Avalanche Energy  
Storage
T
e
mperature  
7
dv/dt  
E
1.3  
AS  
T
stg  
-55 to 175  
°C  
T
Operating Junction
T
e
mperature  
j
(#
)
Current limited by the package  
(1) I
 
≤
80A, di/dt
≤
400A/µs, V
 
≤
V  
, T
≤
T  
SD  
DD  
(BR)DSS j
 
JMAX  
o
(
•
)
Pulse width limited safe operating area  
(2) Starting T
 
= 25
 
C, I
 
= 40A, V
 
= 35V  
j
D
DD  
January 2003  
1/10  
NEW DATASHEET ACCORDING TO PCN DSG/CT/2C13
 
MARKING: P80NF55L-06 @
 
B80NF55L-06 @  

STB80NF55L-06 STP80NF55L-06  
THERMAL DATA  
Rthj-case  
Rthj-amb  
Thermal Resistance Junction-case  
Thermal Resistance Junction-ambient  
Maximum Lead
T
e
mperature For Soldering Purpose  
Max  
Max  
0.5  
62.5  
300  
°C/W  
°C/W  
°C  
T
l
ELECTRICAL CHARACTERISTICS
(T  
= 25 °C UNLESS OTHERWISE SPECIFIED)  
CASE  
OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
I
= 250 µA, V
 
= 0  
55  
V
V
D
GS  
(BR)DSS  
Breakdown Voltage  
V
= Max Rating  
= Max Rating
 
T =
 
125°C  
Zero Gate Voltage  
1
10  
µA  
µA  
I
I
DS  
DSS  
Drain Current (V
 
= 0)  
V
DS  
GS  
C
Gate-body Leakage  
V
GS  
= ± 16 V  
±100  
nA  
GSS  
Current (V
 
= 0)  
DS  
(*
)  
ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
GS(th)  
V
= V  
I
= 250 µA  
Gate Threshold Voltage  
1
V
DS  
GS  
D
V
V
= 10 V  
= 5 V  
I
I
= 40 A  
= 40 A  
Static Drain-source On  
Resistance  
0.005  
0.0055  
0.0065  
0.008  
Ω
Ω
R
GS  
D
D
DS(on)  
GS  
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
= 15 V
 
= 40 A  
Min.  
Typ.  
Max.  
Unit  
(*)  
V
I
D
g
fs  
Forward Transconductance  
150  
S
DS  
V
DS  
= 25V
 
f = 1 MHz
 
V =
 
0  
GS  
C
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
4850  
1040  
375  
pF  
pF  
pF  
iss  
C
oss  
C
rss  
2/10  

STB80NF55L-06 STP80NF55L-06  
ELECTRICAL CHARACTERISTICS
(continued)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
= 27 V  
Min.  
Typ.  
Max.  
Unit  
V
R
I
= 40 A  
= 4.5 V  
GS  
Turn-on Delay Time  
Rise Time  
32  
180  
ns  
ns  
t
DD  
D
d(on)  
= 4.7
Ω  
V
t
r
G
(Resistive Load, Figure 3)  
Q
V
= 44V I
 
= 80A V
 
= 5V  
D GS  
T
o
tal Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
100  
18  
53  
136  
nC  
nC  
nC  
g
DD  
Q
gs  
Q
gd  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
= 27 V  
Min.  
Min.  
Typ.  
Max.  
Unit  
V
R
I
= 40 A  
= 4.5 V  
Turn-off Delay Time  
Fall Time  
135  
80  
ns  
ns  
t
DD  
D
d(off)  
= 4.7
Ω,  
V
GS  
t
G
f
(Resistive Load, Figure 3)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Typ.  
Max.  
Unit  
I
Source-drain Current  
Source-drain Current (pulsed)  
80  
320  
A
A
SD  
( )  
•
I
SDM  
(*)  
I
I
= 80 A  
V
= 0  
GS  
V
Forward On Voltage  
1.5  
V
SD  
SD  
SD  
t
= 80 A  
= 25 V  
di/dt = 100A/µs  
T =
 
150°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
100  
310  
6.2  
ns  
nC  
A
rr  
Q
V
rr  
DD  
j
I
(see test circuit, Figure 5)  
RRM  
(*)  
(
Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
•
)
Pulse width limited by safe operating area.  
Safe Operating Area  
Thermal Impedance  
3/10  

STB80NF55L-06 STP80NF55L-06  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source On Resistance  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
4/10  

STB80NF55L-06 STP80NF55L-06  
Normalized Gate Threshold Voltage vs Temperature  
Normalized on Resistance vs Temperature  
Source-drain Diode Forward Characteristics  
Normalized Breakdown Voltage vs Temperature.  
.
.
5/10  

STB80NF55L-06 STP80NF55L-06  
Fig. 1:
Unclamped Inductive Load Test Circuit  
Fig. 2:
Unclamped Inductive Waveform  
Fig. 3:
Switching Times Test Circuits For Resistive  
Fig. 4:
Gate Charge test Circuit  
Load  
Fig. 5:
Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
6/10  

STB80NF55L-06 STP80NF55L-06  
2
D
P
A
K
 
MECHANICAL DATA  
mm.  
inch.  
TY
P
.  
DIM.  
MIN.  
4.4  
TY
P
.  
MAX.  
4.6  
MIN.  
0.173  
0.098  
0.001  
0.028  
0.045  
0.018  
0.048  
0.352  
TY
P
.  
0.181  
0.106  
0.009  
0.037  
0.067  
0.024  
0.054  
0.368  
A
A1  
A2  
B
2.49  
0.03  
0.7  
2.69  
0.23  
0.93  
1.7  
B2  
C
1.14  
0.45  
1.21  
8.95  
0.6  
C2  
D
1.36  
9.35  
D1  
E
8
0.315  
0.334  
10  
10.4  
0.394  
0.409  
E1  
G
8.5  
4.88  
15  
5.28  
15.85  
1.4  
0.192  
0.591  
0.050  
0.055  
0.094  
0.208  
0.624  
0.055  
0.069  
0.126  
L
L2  
L3  
M
1.27  
1.4  
1.75  
3.2  
2.4  
R
0.4  
0.015  
V2  
0°  
8°  
0°  
8°  
7/10  

STB80NF55L-06 STP80NF55L-06  
TO-220 MECHANICAL DATA  
mm.  
TY
P
.  
inch.  
TY
P
.  
DIM.  
MIN.  
4.4  
MAX.  
4.6  
MIN.  
0.173  
0.048  
0.094  
0.019  
0.024  
0.044  
0.044  
0.194  
0.094  
0.393  
TY
P
.  
0.181  
0.051  
0.107  
0.027  
0.034  
0.067  
0.067  
0.203  
0.106  
0.409  
A
C
1.23  
2.40  
0.49  
0.61  
1.14  
1.14  
4.95  
2.40  
10  
1.32  
2.72  
0.70  
0.88  
1.70  
1.70  
5.15  
2.70  
10.40  
D
E
F
F1  
F2  
G
G1  
H2  
L2  
L3  
L4  
L5  
L6  
L7  
L9  
DIA  
16.40  
28.90  
0.645  
1.137  
13  
14  
0.511  
0.104  
0.600  
0.244  
0.137  
0.147  
0.551  
0.116  
0.620  
0.260  
0.154  
0.151  
2.65  
15.25  
6.20  
3.50  
3.75  
2.95  
15.75  
6.60  
3.93  
3.85  
8/10  

STB80NF55L-06 STP80NF55L-06  
D

2

PAK FOOTPRINT  
TUBE SHIPMENT (no suffix)*  
T
A
PE AND REEL SHIPMENT (suffix ”T4”)*  
REEL MECHANICAL DATA  
mm  
inch  
MAX.  
DIM.  
M
I
N.  
MAX.  
MIN.  
A
B
C
D
G
N
T
330  
12.992  
0.520  
1.039  
1.197  
1.5  
12.8  
20.2  
24.4  
100  
0.059  
0.504  
0.795  
0.960  
3.937  
13.2  
26.4  
30.4  
BASE QTY  
BULK QTY  
1000  
1000  
TAPE MECHANICAL DATA  
mm  
inch  
DIM.  
MIN.  
10.5  
15.7  
1.5  
MAX.  
10.7  
15.9  
1.6  
MIN.  
0.413  
0.618  
0.059  
0.062  
0.065  
0.449  
0.189  
0.153  
0.468  
0075  
MAX.  
0.421  
0.626  
0.063  
0.063  
0.073  
0.456  
0.197  
0.161  
0.476  
0.082  
A0  
B0  
D
D1  
E
1.59  
1.65  
1
1
.4  
4.8  
1.61  
1.85  
11.6  
5.0  
F
K0  
P0  
P1  
P2  
R
3.9  
4.1  
1
1
.9  
1.9  
12.1  
2.1  
50  
1.574  
T
0.25  
23.7  
0.35  
24.3  
.0.0098 0.0137  
0.933 0.956  
W
* on sales type  
9/10  

STB80NF55L-06 STP80NF55L-06  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is registered trademark of STMicroelectronics  
2002 STMicroelectronics – All Rights Reserved  
All other names are the property of their respective owners.  
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10/10