STMicroelectronics-STB80NF55L-06T4
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STB80NF55L-06
STP80NF55L-06
N-CHANNEL 55V – 0.005
Ω
– 80A D
²PAK/TO-220
STripFET™ II POWER MOSFET
V
DSS
R
I
D
TYPE
DS(on)
STB80NF55L-06
STP80NF55L-06
55 V
55 V
< 0.0065
Ω
< 0.0065
Ω
80 A
80 A
■
■
■
■
TYPICAL R
(on) = 0.005
Ω
DS
LOW THRESHOLD DRIVE
LOGIC LEVEL DEVICE
3
2
SURFACE-MOUNTING D PAK (TO-263)
POWER PACKAGE IN TUBE (NO SUFFIX) OR
IN TAPE & REEL (SUFFIX “T4”)
3
1
2
1
2
D PAK
TO-263
TO-220
(Suffix “T4”)
DESCRIPTION
This Power MOSFET is the latest development of
STMicroelectronis unique “Single Feature Size™”
strip-based process. The resulting transistor
shows extremely high packing density for low on-
resistance, rugged avalanche characteristics and
less critical alignment steps therefore a remark-
able manufacturing reproducibility.
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■
■
■
■
■
HIGH CURRENT, HIGH SPEED SWITCHING
SOLENOID AND RELAY DRIVERS
MOTOR CONTROL, AUDIO AMPLIFIERS
DC-DC & DC-AC CONVERTERS
AUTOMOTIVE
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
55
Unit
V
V
Drain-source Voltage (V
= 0)
DS
GS
V
Drain-gate Voltage (R
= 20 k
Ω
)
55
V
DGR
GS
V
Gate- source Voltage
± 16
80
V
GS
I (#)
D
Drain Current (continuous) at T
= 25°C
A
C
I
D
Drain Current (continuous) at T
= 100°C
80
A
C
I
(
•
)
Drain Current (pulsed)
320
300
2
A
DM
P
T
o
tal Dissipation at T
= 25°C
W
tot
C
Derating Factor
W/°C
V/ns
J
(1)
(2)
Peak Diode Recovery voltage slope
Single Pulse Avalanche Energy
Storage
T
e
mperature
7
dv/dt
E
1.3
AS
T
stg
-55 to 175
°C
T
Operating Junction
T
e
mperature
j
(#
)
Current limited by the package
(1) I
≤
80A, di/dt
≤
400A/µs, V
≤
V
, T
≤
T
SD
DD
(BR)DSS j
JMAX
o
(
•
)
Pulse width limited safe operating area
(2) Starting T
= 25
C, I
= 40A, V
= 35V
j
D
DD
January 2003
1/10
NEW DATASHEET ACCORDING TO PCN DSG/CT/2C13
MARKING: P80NF55L-06 @
B80NF55L-06 @
STB80NF55L-06 STP80NF55L-06
THERMAL DATA
Rthj-case
Rthj-amb
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Maximum Lead
T
e
mperature For Soldering Purpose
Max
Max
0.5
62.5
300
°C/W
°C/W
°C
T
l
ELECTRICAL CHARACTERISTICS
(T
= 25 °C UNLESS OTHERWISE SPECIFIED)
CASE
OFF
Symbol
Parameter
Drain-source
Test Conditions
Min.
Typ.
Max.
Unit
I
= 250 µA, V
= 0
55
V
V
D
GS
(BR)DSS
Breakdown Voltage
V
= Max Rating
= Max Rating
T =
125°C
Zero Gate Voltage
1
10
µA
µA
I
I
DS
DSS
Drain Current (V
= 0)
V
DS
GS
C
Gate-body Leakage
V
GS
= ± 16 V
±100
nA
GSS
Current (V
= 0)
DS
(*
)
ON
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
GS(th)
V
= V
I
= 250 µA
Gate Threshold Voltage
1
V
DS
GS
D
V
V
= 10 V
= 5 V
I
I
= 40 A
= 40 A
Static Drain-source On
Resistance
0.005
0.0055
0.0065
0.008
Ω
Ω
R
GS
D
D
DS(on)
GS
DYNAMIC
Symbol
Parameter
Test Conditions
= 15 V
= 40 A
Min.
Typ.
Max.
Unit
(*)
V
I
D
g
fs
Forward Transconductance
150
S
DS
V
DS
= 25V
f = 1 MHz
V =
0
GS
C
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
4850
1040
375
pF
pF
pF
iss
C
oss
C
rss
2/10
STB80NF55L-06 STP80NF55L-06
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHING ON
Symbol
Parameter
Test Conditions
= 27 V
Min.
Typ.
Max.
Unit
V
R
I
= 40 A
= 4.5 V
GS
Turn-on Delay Time
Rise Time
32
180
ns
ns
t
DD
D
d(on)
= 4.7
Ω
V
t
r
G
(Resistive Load, Figure 3)
Q
V
= 44V I
= 80A V
= 5V
D GS
T
o
tal Gate Charge
Gate-Source Charge
Gate-Drain Charge
100
18
53
136
nC
nC
nC
g
DD
Q
gs
Q
gd
SWITCHING OFF
Symbol
Parameter
Test Conditions
= 27 V
Min.
Min.
Typ.
Max.
Unit
V
R
I
= 40 A
= 4.5 V
Turn-off Delay Time
Fall Time
135
80
ns
ns
t
DD
D
d(off)
= 4.7
Ω,
V
GS
t
G
f
(Resistive Load, Figure 3)
SOURCE DRAIN DIODE
Symbol
Parameter
Test Conditions
Typ.
Max.
Unit
I
Source-drain Current
Source-drain Current (pulsed)
80
320
A
A
SD
( )
•
I
SDM
(*)
I
I
= 80 A
V
= 0
GS
V
Forward On Voltage
1.5
V
SD
SD
SD
t
= 80 A
= 25 V
di/dt = 100A/µs
T =
150°C
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
100
310
6.2
ns
nC
A
rr
Q
V
rr
DD
j
I
(see test circuit, Figure 5)
RRM
(*)
(
Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
•
)
Pulse width limited by safe operating area.
Safe Operating Area
Thermal Impedance
3/10
STB80NF55L-06 STP80NF55L-06
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
4/10
STB80NF55L-06 STP80NF55L-06
Normalized Gate Threshold Voltage vs Temperature
Normalized on Resistance vs Temperature
Source-drain Diode Forward Characteristics
Normalized Breakdown Voltage vs Temperature.
.
.
5/10
STB80NF55L-06 STP80NF55L-06
Fig. 1:
Unclamped Inductive Load Test Circuit
Fig. 2:
Unclamped Inductive Waveform
Fig. 3:
Switching Times Test Circuits For Resistive
Fig. 4:
Gate Charge test Circuit
Load
Fig. 5:
Test Circuit For Inductive Load Switching
And Diode Recovery Times
6/10
STB80NF55L-06 STP80NF55L-06
2
D
P
A
K
MECHANICAL DATA
mm.
inch.
TY
P
.
DIM.
MIN.
4.4
TY
P
.
MAX.
4.6
MIN.
0.173
0.098
0.001
0.028
0.045
0.018
0.048
0.352
TY
P
.
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
A
A1
A2
B
2.49
0.03
0.7
2.69
0.23
0.93
1.7
B2
C
1.14
0.45
1.21
8.95
0.6
C2
D
1.36
9.35
D1
E
8
0.315
0.334
10
10.4
0.394
0.409
E1
G
8.5
4.88
15
5.28
15.85
1.4
0.192
0.591
0.050
0.055
0.094
0.208
0.624
0.055
0.069
0.126
L
L2
L3
M
1.27
1.4
1.75
3.2
2.4
R
0.4
0.015
V2
0°
8°
0°
8°
7/10
STB80NF55L-06 STP80NF55L-06
TO-220 MECHANICAL DATA
mm.
TY
P
.
inch.
TY
P
.
DIM.
MIN.
4.4
MAX.
4.6
MIN.
0.173
0.048
0.094
0.019
0.024
0.044
0.044
0.194
0.094
0.393
TY
P
.
0.181
0.051
0.107
0.027
0.034
0.067
0.067
0.203
0.106
0.409
A
C
1.23
2.40
0.49
0.61
1.14
1.14
4.95
2.40
10
1.32
2.72
0.70
0.88
1.70
1.70
5.15
2.70
10.40
D
E
F
F1
F2
G
G1
H2
L2
L3
L4
L5
L6
L7
L9
DIA
16.40
28.90
0.645
1.137
13
14
0.511
0.104
0.600
0.244
0.137
0.147
0.551
0.116
0.620
0.260
0.154
0.151
2.65
15.25
6.20
3.50
3.75
2.95
15.75
6.60
3.93
3.85
8/10
STB80NF55L-06 STP80NF55L-06
D
2
PAK FOOTPRINT
TUBE SHIPMENT (no suffix)*
T
A
PE AND REEL SHIPMENT (suffix ”T4”)*
REEL MECHANICAL DATA
mm
inch
MAX.
DIM.
M
I
N.
MAX.
MIN.
A
B
C
D
G
N
T
330
12.992
0.520
1.039
1.197
1.5
12.8
20.2
24.4
100
0.059
0.504
0.795
0.960
3.937
13.2
26.4
30.4
BASE QTY
BULK QTY
1000
1000
TAPE MECHANICAL DATA
mm
inch
DIM.
MIN.
10.5
15.7
1.5
MAX.
10.7
15.9
1.6
MIN.
0.413
0.618
0.059
0.062
0.065
0.449
0.189
0.153
0.468
0075
MAX.
0.421
0.626
0.063
0.063
0.073
0.456
0.197
0.161
0.476
0.082
A0
B0
D
D1
E
1.59
1.65
1
1
.4
4.8
1.61
1.85
11.6
5.0
F
K0
P0
P1
P2
R
3.9
4.1
1
1
.9
1.9
12.1
2.1
50
1.574
T
0.25
23.7
0.35
24.3
.0.0098 0.0137
0.933 0.956
W
* on sales type
9/10
STB80NF55L-06 STP80NF55L-06
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is registered trademark of STMicroelectronics
2002 STMicroelectronics – All Rights Reserved
All other names are the property of their respective owners.
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