STMicroelectronics-STF11N65M2-045Y

Part #STMicroelectronics-STF11N65M2-045Y
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STMicroelectronics-STF11N65M2-045Y
STF11N65M2(045Y)  
Datasheet  
N-channel 650
V
,
0
.60 Ω typ., 7 A MDmesh M2 Power MOSFET  
in a TO-220FP narrow leads package  
Features  
V
R
DS(on)  
max.  
I
P
TOT  
Order code  
DS  
D
STF11N65M2(045Y)  
650 V  
0.68 Ω  
7 A  
25 W  
•
•
•
•
Extremely low gate charge  
3
2
1
Excellent output capacitance (C

OSS

) profile  
100% avalanche tested  
TO-220FP narrow leads  
Zener-protected  
D(2)  
Applications  
•
Switching applications  
G(1)  
Description  
This device is an N-channel Power MOSFET developed using MDmesh M2  
S(3)  
technology. Thanks to its strip layout and an improved vertical structure, the device  
exhibits low on-resistance and optimized switching characteristics, rendering it  
suitable for the most demanding high efficiency converters.  
NG1D2S3Z  
Product status link  
Product summary  
Order code  
Marking  
STF11N65M2(045Y)  
11N65M2  
TO-220FP narrow  
leads  
Package  
Packing  
Tube  
DS10326
–
Rev 3
–
July 2019  
For further information contact your local STMicroelectronics sales office.  

STF11N65M2(045Y)  
Electrical ratings  
1
Electrical ratings  
Table 1.
Absolute maximum ratings  
Parameter  
Symbol  
Value  
±25  
7
Unit  
V
Gate-source voltage  
V
GS  
Drain current (continuous) at T
 
= 25 °C  
C
I
A
D
Drain current (continuous) at T
 
= 100 °C  
4.4  
28  
C
I
Drain current (pulsed)  
A
DM  
P
T
o
tal power dissipation at T
 
= 25 °C  
25  
W
TOT  
C
dv/dt

dv/dt

Peak diode recovery voltage slope  
15  
V/ns  
kV  
MOSFET dv/dt ruggedness  
50  
Insulation withstand voltage (RMS) from all three leads to external heat sink  
V
2.5  
ISO  
(t = 1 s, T
 
= 25 °C)  
C
T
Storage temperature range  
stg  
-55 to 150  
°C  
T
Operating junction temperature range  
J
1. Limited
 
by maximum junction temperature.  
2. Pulse
 
width limited by T
 
max.  
J
3.  
4.  
I
≤ 7 A, di/dt = 400 A/μs, V
 
(peak) < V  
, V
 
= 400 V.  
(BR)DSS DD  
SD  
DS  
V
≤ 520 V.  
DS  
Table 2.
Thermal data  
Parameter  
Symbol  
Value  
5
Unit  
R
thj-case  
Thermal resistance junction-case  
Thermal resistance junction-ambient  
°C/W  
R
thj-amb  
62.5  
Table 3.
Avalanche characteristics  
Symbol  
Parameter  
Value  
1.5  
Unit  
A
I
Avalanche current, repetitive or not repetitive (pulse width limited by T
 
max)  
AR  
J
E
Single pulse avalanche energy (starting T
 
= 25 °C, I
 
= I
 
, V
 
= 50 V)  
110  
mJ  
AS  
J
D
AR  
DD  
DS10326
–
Rev 3  
page 2/12  
 
 
 
 
 

STF11N65M2(045Y)  
Electrical characteristics  
2
Electrical characteristics  
(T

C

= 25 °C unless otherwise specified)  
Table 4.
Static  
Symbol  
Parameter  
Test conditions  
Min.  
Typ. Max. Unit  
V
V
GS  
V
GS  
V
GS  
V
DS  
V
DS  
V
GS  
= 0
V
, I
 
= 1
m
A  
Drain-source breakdown voltage  
650  
V
(BR)DSS  
D
= 0
V
, V
 
=
6
50 V  
1
DS  
I
Zero gate voltage drain current  
µA  
DSS  
= 0
V
, V
 
=
6
50 V, T
 
= 125 °C

100  
DS  
C
I
= 0
V
, V
 
=
±
25 V  
Gate-body leakage current  
Gate threshold voltage  
±10  
4
µA  
V
GSS  
GS  
V
= V
 
, I
 
= 250 µA  
2
3
GS(th)  
DS(on)  
GS  
D
R
= 10
V
, I
 
=
3
.5 A  
D
Static drain-source on-resistance  
0.60  
0.68  
Ω
1. Defined
 
by design, not subject to production test.  
Table 5.
Dynamic  
Symbol  
Parameter  
Input capacitance  
Test conditions  
Min.  
Typ. Max. Unit  
C
iss  
–
–
–
–
–
–
–
–
410  
20  
–
–
–
–
–
–
–
–
C
oss  
V
V
= 100
V
, f = 1
M
Hz, V
 
= 0 V  
Output capacitance  
pF  
DS  
GS  
C
rss  
Reverse transfer capacitance  
Equivalent output capacitance  
Intrinsic gate resistance  
T
o
tal gate charge  
0.9  
43  
= 0 to 520
V
, V
 
= 0 V  
C
oss eq.  
pF  
Ω
DS  
GS  
R
G
f = 1 MHz, I
 
= 0 A  
D
6.4  
12.5  
3.2  
5.8  
Q
g
V
DD  
= 520
V
, I
 
= 7
A
, V
 
= 0 to 10 V  
D GS  
Q
Gate-source charge  
nC  
gs  
Q
Gate-drain charge  
gd  
1.  
C
oss eq.  
is defined as a constant equivalent capacitance giving the same charging time as C  
when V
 
increases from 0  
oss DS  
to 80% V  
.
DSS  
Table 6.
Switching times  
Test conditions  
Symbol  
Parameter  
Min.  
Typ. Max. Unit  
t
Turn-on delay time  
Rise time  
–
–
–
–
9.5  
7.5  
26  
–
–
–
–
V
= 325
V
, I
 
=
3
.5 A,  
d(on)  
DD  
D
R
= 4.7 Ω, V
 
= 10 V  
t
G
GS  
r
ns  
t
Turn-off delay time  
Fall time  
d(off)  
t
15  
f
DS10326
–
Rev 3  
page 3/12  
 
 
 

STF11N65M2(045Y)  
Electrical characteristics  
Table 7.
Source-drain diode  
Test conditions  
Symbol  
Parameter  
Source-drain current  
Min.  
Typ. Max. Unit  
I
–
–
–
–
–
–
–
–
7
A
A
SD  
I
Source-drain current (pulsed)  
Forward on voltage  
28  
1.6  
SDM  
V
V
= 0
V
, I
 
= 7 A  
SD  
V
GS  
SD  
t
rr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
Reverse recovery time  
Reverse recovery charge  
318  
2.5  
ns  
µC  
A
I
= 7 A, di/dt = 100 A/µs, V
 
= 60 V  
DD  
SD  
Q
rr  
I
15.5  
437  
3.2  
RRM  
t
I
= 7 A, di/dt = 100 A/µs,  
= 60 V, T
 
= 150 °C  
ns  
µC  
rr  
SD  
V
Q
DD  
J
rr  
I
Reverse recovery current  
–
15  
A
RRM  
1. Pulse
 
width is limited by safe operating area.  
2. Pulse
 
test: pulse duration = 300 µs, duty cycle 1.5%.  
DS10326
–
Rev 3  
page 4/12  
 
 

STF11N65M2(045Y)  
Electrical characteristics (curves)  
2.1  
Electrical characteristics (curves)  
Figure 1.
Safe operating area  
Figure 2.
Thermal impedance  
GC20940  
GIPG080915MQF1045YFSOA  
K
I

D  

(A)  
is  
this area  
Operation in  
limited by R

DS(on)  

10

1  

10

0  

10

-1  

10

-2  

10

-3  

10 μs  
100 μs  
1 ms  
10 ms  
10

-1  

10

-2  

T
≤
1  
c
single  
50 °C  
T

j

= 25  
°C  
pulse  
10

-4  

10

-3  

10

-2  

10

-1  

10

0  

t

p

(s)  
10

-1  

10

0  

10

1  

10

2  

V

DS

(V)  
Figure 3.
Output characteristics  
Figure 4.
Transfer characteristics  
GIPG110515MQF1LOCH  
GIPG110515MQF1LTCH  
I

D  

I

D  

(A)  
(A)  
V

GS

= 8,9,10 V  
12  
10  
8
V

GS

= 7 V  
12  
10  
8
V

DS

= 19 V  
V

GS

= 6 V  
6
6
4
4
2
0
2
V

GS

= 5 V  
0
0
0
4
8
12  
16  
V

DS

(V)  
2
4
6
8
V

GS

(V)  
Figure 5.
Gate charge vs gate-source voltage  
Figure 6.
Static drain-source on-resistance  

GIPG110515MQF1LQVG

V

DS  

GIPG140815MQF1PRID  
V

GS  

(V)  
R

DS(on)  

(V)  
(Ω)  
12  
600  
V

DS  

V

DD

= 520 V  
I

D

= 7 A  
V

GS

= 10 V  
0.624  
10  
8
500  
400  
300  
200  
100  
0.608  
6
4
0.592  
0.576  
2
0
0
0
2
4
6
8
10  
12  
Q

g

(nC)  
0
2
4
6
I

D

(A)  
DS10326
–
Rev 3  
page 5/12  
 

STF11N65M2(045Y)  
Electrical characteristics (curves)  
Figure 8.
Normalized gate threshold voltage vs  
temperature  
Figure 7.
Capacitance variations  
GIPG140815MQF1PCVR  
C
(pF)  
GIPG110515MQF1LVTH  
V

GS(th)  

(norm.)  
I

D

= 250 µA  
1.1  
10

3  

10

2  

10

1  

C

ISS  

1.0  
0.9  
0.8  
C

OSS  

f = 1 MHz  
10

0  

C

RSS  

0.7  
0.6  
10

-1  

10

-1  

10

0  

10

1  

10

2  

V

DS

(V)  
-75  
-25  
25  
75  
125  
T

j

(°C)  
Figure 10.
Normalized V

(BR)DSS

vs temperature  
Figure 9.
Normalized on-resistance vs temperature  
GIPG110515MQF1LRON  
R

DS(on)  

(norm.)  
GIPG110515MQF1LBDV  
V

(BR)DSS  

(norm.)  
V

GS

= 10 V  
I

D

= 1 mA  
2.2  
1.08  
1.04  
1.00  
0.96  
1.8  
1.4  
1.0  
0.6  
0.2  
0.92  
0.88  
-75  
-25  
25  
75  
125  
T

j

(°C)  
-75  
-25  
25  
75  
125  
T

j

(°C)  
Figure 11.
Output capacitance stored energy  
Figure 12.
Source- drain diode forward characteristics  
GIPG110515MQF1LEOS  
GIPG140815MQF1PSDF  
E

OSS  

V

SD  

(V)  
(μJ)  
T

j

= -50 °C  
3
1.0  
T

j

= 25 °C  
2
0.8  
T

j

= 150 °C  
1
0
0.6  
0.4  
0
100 200 300 400 500 600
 
V

DS

(V)  
0
2
4
6
I

SD

(A)  
DS10326
–
Rev 3  
page 6/12  

STF11N65M2(045Y)  
Test circuits  
3
Test circuits  
Figure 13.
Test circuit for resistive load switching times  
Figure 14.
Test circuit for gate charge behavior  
V

DD  

12 V  
47 kΩ  
1 kΩ  
100 nF  
R

L  

2200  
μF  
3.3  
μF  
V

DD  

+
I

G

= CONST  
2.7 kΩ  
V

D  

R

G  

D.U.
T
.  
100 Ω  
V

GS  

pulse width  
+
D.U.
T
.  
V

GS  

V

G  

2200  
μF  
pulse width  
47 kΩ  
1 kΩ  
AM01469v1  
AM01468v1  
Figure 15.
Test circuit for inductive load switching and  
diode recovery times  
Figure 16.
Unclamped inductive load test circuit  
L
A
A
A
D
S
V

D  

100 µH  
D
fast  
G
D.U.
T
.  
B
diode  
2200  
3.3  
µF  
+
V

DD  

1000  
µF  
B
µF  
3.3  
µF  
B
+
V

DD  

25 Ω  
I

D  

G
D.U.
T
.  
R

G  

S
+
_
D.U.
T
.  
V

i  

pulse width  
AM01471v1  
AM01470v1  
Figure 18.
Switching time waveform  
Figure 17.
Unclamped inductive waveform  
t

on  

t

d(on)  

t

off  

t

d(off)  

V
(BR)DSS  
t

r  

t

f  

V
D  
90%  
90%  
I
DM  
V

DS  

10%  
V

GS  

10%  
0
0
I
D  
V
DD  
V
DD  
90%  
10%  
AM01472v1  
AM01473v1  
DS10326
–
Rev 3  
page 7/12  
 
 
 
 

STF11N65M2(045Y)  
Package information  
4
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of

packages,  
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product  
status are available at:

. ECOPACK is an ST trademark.  
4.1  
TO-220FP narrow leads package information  
Figure 19.
TO-220FP narrow leads package outline  
TOP VIEW  
SIDE VIEW  
8197858_3  
DS10326
–
Rev 3  
page 8/12  
 
 

STF11N65M2(045Y)  
TO-220FP narrow leads package information  
Table 8.
TO-220FP narrow leads package mechanical data  
mm  
Dim.  
Min.  
4.40  
2.50  
2.50  
0.45  
0.75  
0.95  
4.95  
2.40  
10.00  
15.20  
28.60  
10.30  
2.60  
15.80  
9.00  
3.00  
Typ.  
Max.  
4.60  
2.70  
2.75  
0.70  
1.00  
1.20  
5.20  
2.70  
10.40  
15.60  
30.60  
11.10  
2.90  
16.20  
9.30  
3.20  
A
B
D
E
F
F1  
G
G1  
H
L2  
L3  
L4  
L5  
L6  
L7  
Dia.  
2.70  
16.00  
DS10326
–
Rev 3  
page 9/12  

STF11N65M2(045Y)  
Revision history  
Table 9.
Document revision history  
Changes  
Date  
Revision  
09-May-2014  
1
First release.  
T
e
xt and formatting changes throughout document.  
On cover page:  
– updated
Title
,
Features
and
Description  
– updated cover image silhouette  
08-Sep-2015  
05-Jul-2019  
2
3
In section
Electrical characteristics
:  
– updated and renamed table
Static
(was On /off states)  
Updated section
Electrical characteristics (curves)  
Updated and renamed section
Package information
(was Package mechanical data)  
Minor text changes.  
DS10326
–
Rev 3  
page 10/12  
 

STF11N65M2(045Y)  
Contents  
Contents  

Electrical ratings

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Electrical characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Electrical characteristics (curves)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Test circuits

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Package information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

TO-220FP narrow leads package informatio

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Revision history

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DS10326
–
Rev 3  
page 11/12  

STF11N65M2(045Y)  
IMPORTANT NOTICE – PLEASE READ CAREFULLY  
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST  
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST  
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.  
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of  
Purchasers’ products.  
No license, express or implied, to any intellectual property right is granted by ST herein.  
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.  
ST and the ST logo are trademarks of S
T
.
F
or additional information about ST trademarks, please refer to

. All other product or service  
names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2019 STMicroelectronics – All rights reserved  
DS10326
–
Rev 3  
page 12/12