STMicroelectronics-STF13N95K3

Part #STMicroelectronics-STF13N95K3
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STMicroelectronics-STF13N95K3
STF13N95K3, STFI13N95K3,  
STP13N95K3, STW13N95K3  
N-channel 950
V
,
0
.68
Ω
typ., 10 A Zener-protected SuperMESH3™  
Power MOSFET in TO-220F
P
,
I

2

P
A
KF
P
,
T
O-220 and TO-247  
Datasheet
−
production data  
Features  
Order codes
 
V

DSS

R

DS(on)

max  
I

D  

P

TOT  

STF13N95K3  
STFI13N95K3  
40 W  
I

2  

950 V  
< 0.85
Ω  
10 A  
P
A
KFP  
TO-220FP  
STP13N95K3  
STW13N95K3  
1
190 W  
2
3
T
A
B  
■
Gate charge minimized  
■
Extremely large avalanche performance  
■
100% avalanche tested  
TO-247  
TO-220  
■
Very low intrinsic capacitance  
■
Zener-protected  
Applications  
Figure 1.  
Internal schematic diagram  
■
Switching applications  
D(2 or TAB)  
Description  
These SuperMESH3™ Power MOSFETs are the  
result of improvements applied to  
G(1)  
STMicroelectronics’ SuperMESH™ technolog
y
,  
combined with a new optimized vertical structure.  
These devices boast an extremely low on-  
resistance, superior dynamic performance and  
high avalanche capabilit
y
,
r
endering them suitable  
for the most demanding applications.  
S(3)  
AM01476v1  
Table 1.  
Device summary  
Order codes  
Marking  
Package  
Packaging  
STF13N95K3  
STFI13N95K3  
STP13N95K3  
STW13N95K3  
TO-220FP  
I

2

P
A
KFP  
TO-220  
13N95K3  
T
u
be  
TO-247  
June 2012  
Doc ID15685 Rev 3  
1/19  
This is information on a product in full production.  
19  
 

STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
Electrical ratings  
1
Electrical ratings  
.
Table 2.  
Absolute maximum ratings  
Value  
Symbol  
Parameter  
Unit  
TO-220  
TO-247  
TO-220FP  
I

2

P
A
KFP  
V

DS  

V

GS  

I

D  

Drain source voltage  
950  
30  
V
V
Gate- source voltage  
Drain current (continuous) at T

C

= 25 °C  
Drain current (continuous) at T

C

= 100 °C  
Drain current (pulsed)  
10  
6
10

(1)  

6

(1)  

40

(1)  

40  
A
I

D  

A
(2)  
I

DM  

40  
190  
A
P

TOT  

I

AR  

T
o
tal dissipation at T

C

= 25 °C  
W
Max current during repetitive or single  
pulse avalanche (pulse width limited by  
13  
A
mJ  
V
T

jmax  

)
Single pulse avalanche energy  
E

AS  

400  
(starting T

J

= 25 °C, I

D

=I

AS

, V

DD

= 50 V)  
Insulation withstand voltage (RMS) from  
all three leads to external heat sink  
V

ISO  

2500  
(t = 1 s; TC = 25 °C)  
dv/dt

(3)  

Peak diode recovery voltage slope  
9
V/ns  
°C  
T

j  

Operating junction temperature  
Storage temperature  
– 55 to 150  
T

stg  

1. Limited
 
by maximum junction temperature.  
2. Pulse
 
width limited by safe operating area.  
3.  
I
≤
10 A, di/dt
 
≤
400 A/µs, V  
≤
V  
Peak (BR)DSS.  
SD  
T
a
ble 3.  
Symbol  
Thermal data  
Value  
Parameter  
Unit  
TO-220FP  
I

2

P
A
KFP  
TO-220  
TO-247  
Rthj-case Thermal
 
resistance junction-case max  
Rthj-amb Thermal
 
resistance junction-amb max  
0.66  
3.13  
62.5  
°C/W  
°C/W  
62.5  
50  
Doc ID15685 Rev 3  
3/19  
 
 

Electrical characteristics  
STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
2
Electrical characteristics  
(T

CASE

= 25 °C unless otherwise specified)  
T
a
ble 4.  
Symbol  
On/off states  
Parameter  
Test conditions  
I

D

= 1 mA, V

GS

= 0  
Min. Typ. Max. Unit  
Drain-source breakdown  
voltage  
V

(BR)DSS  

950  
V
V

DS

= 950
V
,  
1
µA  
µA  
Zero gate voltage drain  
current (V

GS

= 0)  
I

DSS  

V

DS

= 950
V
,
T
c=125 °C  
50  
Gate body leakage current  
(V

DS

= 0)  
I

GSS  

V

GS  

=
20 V  
10  
µA  
V
V

GS(th)

Gate threshold voltage  
V

DS

= V

GS

, I

D

= 100 µA  
V

GS

= 10
V
,
I

D

= 5 A  
3
4
5
Static drain-source on-  
resistance  
R

DS(on)  

0.68 0.85  
Ω
T
a
ble 5.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
C

iss  

Input capacitance  
Output capacitance  
1620  
117  
pF  
pF  
C

oss  

V

DS

=100
V
,
f
=1 MHz, V

GS

=0  
–
–
–
–
Reverse transfer  
capacitance  
C

rss  

1.2  
pF  
pF  
Equivalent capacitance time  
related  
(1)  
C

o(tr)  

115  
V

GS

= 0, V

DS

= 0 to 760 V  
Equivalent capacitance  
energy related  
(2)  
C

o(er)  

–
–
131  
2.3  
–
–
pF  
R

G  

Intrinsic gate resistance  
f = 1MHz open drain  
Ω
Q

g  

Q

gs  

Q

gd  

T
o
tal gate charge  
Gate-source charge  
Gate-drain charge  
V

DD

= 760
V
,
I

D

= 10 A  
51  
10  
30  
nC  
nC  
nC  
V

GS

=10 V  
–
–
(see

)  
1. Time
 
related is defined as a constant equivalent capacitance giving the same charging time as C  
when  
oss  
V
increases from 0 to 80% V  
DSS  
DS  
2. Energy
 
related is defined as a constant equivalent capacitance giving the same stored energy as C  
oss  
when V
 
increases from 0 to 80% V  
DS  
DSS  
4/19  
Doc ID15685 Rev 3  

STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
Electrical characteristics  
Min. Typ. Max. Unit  
T
a
ble 6.  
Symbol  
Switching times  
Parameter  
Test conditions  
t

d(on)  

t

r  

t

d(off)  

t

f  

T
u
rn-on delay time  
Rise time  
18  
16  
50  
21  
ns  
ns  
ns  
ns  
V

DD

= 475
V
,
I

D

= 5 A,  
R

G

=4.7
Ω
, V

GS

=10 V  
(see

)  
–
–
T
u
rn-off delay time  
Fall time  
T
a
ble 7.  
Symbol  
Source drain diode  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
I

SD  

Source-drain current  
10  
40  
mA  
A
–
–
I

SDM  

Source-drain current (pulsed)  
(1)  
V

SD  

Forward on voltage  
I

SD

= 10 A, V

GS

=0  
1.6  
V
t

rr  

Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
I

SD

= 10 A, V

DD

= 60 V  
di/dt = 100 A/µs,  
500  
9
ns  
µ
C  
A
Q

rr  

–
–
I

RRM  

36  
I

SD

= 10 A,V

DD

= 60 V  
t

rr  

Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
624  
11  
ns  
µ
C  
A
di/dt=100 A/µs,  
Q

rr  

Tj=150 °C
(see  
I

RRM  

37  
1. Pulsed:
 
pulse duration = 300 µs, duty cycle 1.5%  
Table 8.  
Symbol  
Gate-source Zener diode  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
30  
BV

GSO

Gate-source breakdown voltage
 
Igs 1mA,
 
(open drain)  
–
V
The built-in-back Zener diodes have specifically been designed to enhance not only the  
device’s ESD capabilit
y
, but also to make them safely absorb possible voltage transients that  
may occasionally be applied from gate to source. In this respect the Zener voltage is  
appropriate to achieve an efficient and cost-effective intervention to protect the device’s  
integrit
y
.
T
hese integrated Zener diodes thus avoid the usage of external components.  
Doc ID15685 Rev 3  
5/19  

Electrical characteristics  
STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
2.1  
Electrical characteristics (curves)  
Figure 2.  
Safe operating area for TO-220FP  
and
I

2

P
A
KFP  
Figure 3.  
Thermal impedance for TO-220FP  
and
I

2

P
A
KFP  
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Safe operating area for TO-220  
Figure 5.  
Thermal impedance for TO-220  
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Figure 6.  
Safe operating area for TO-247  
Figure 7.  
Thermal impedance for TO-247  
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6/19  
Doc ID15685 Rev 3  
 
 

STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
Electrical characteristics  
Figure 8.  
Output characteristics  
Figure 9.  
Transfer characteristics  
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!-ꢁꢈꢁꢉꢋVꢀ  
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ꢍ
6

‘3

ꢃ6ꢄ  
ꢁ
ꢀꢁ  
ꢀꢆ  
ꢁ
ꢋ
ꢆ
ꢊ
ꢈ
Figure 10.
 
Gate charge vs gate-source voltage
 
Figure 11.
 
Static drain-source on-resistance  
!-ꢁꢈꢁꢉꢆVꢀ  
!-ꢁꢈꢁꢉꢊVꢀ  
2
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6
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6

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ꢀꢁ  
ꢉ
ꢁꢂꢊꢊ  
ꢁꢂꢊꢋ  
ꢁꢂꢊꢇ  
ꢁꢂꢊꢁ  
ꢊ
ꢌꢁꢁ  
ꢇꢁꢁ  
ꢋ
ꢇ
ꢁ
ꢀꢁꢁ  
ꢁ
ꢇ
ꢌ
ꢆ
ꢊ
ꢀ
ꢋ
ꢇꢁ  
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1

G

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ꢁ
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ꢁ
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Figure 12.
 
Capacitance variations  
Figure 13.
 
Output capacitance stored energy  
!-ꢁꢈꢁꢉꢈVꢀ  
!-ꢁꢈꢁꢉꢉVꢀ  
#
%
OSS  
ꢃP&ꢄ  
ꢃ—*ꢄ  
#ISS  
ꢇꢁ  
ꢀꢉ  
ꢀꢊ  
ꢀꢋ  
ꢀꢇ  
ꢀꢁ  
ꢉ
ꢀꢁꢁꢁ  
ꢀꢁꢁ  
ꢀꢁ  
#OSS  
#RSS  
ꢊ
ꢀ
ꢋ
ꢇ
ꢁ
ꢁ
ꢁꢂꢀ  
ꢁꢂꢀ  
ꢀꢁꢁ  
ꢇꢁꢁ  
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ꢊꢁꢁ  
ꢀ
ꢀꢁ  
6
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ꢀꢁꢁ  
6
$3
ꢃ6ꢄ  
ꢈꢁꢁ  
ꢉꢁꢁ ꢍꢁꢁ  
Doc ID15685 Rev 3  
7/19  

Electrical characteristics  
STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
Figure 14.
 
Normalized gate threshold voltage
 
Figure 15.
 
Normalized on-resistance vs  
vs temperature
 
temperature  
!-ꢁꢈꢁꢉꢍVꢀ  
!-ꢁꢈꢁꢍꢁVꢀ  
6
‘3ꢃTHꢄ  
2
$3ꢃONꢄ  
ꢃNORMꢄ  
ꢃNORMꢄ  
ꢌꢂꢁ  
ꢇꢂꢆ  
ꢇꢂꢁ  
ꢀꢂꢆ  
ꢀꢂꢁ  
ꢀꢂꢋ  
ꢀꢂꢇ  
ꢀꢂꢁ  
ꢁꢂꢉ  
ꢁꢂꢊ  
ꢁꢂꢋ  
ꢁꢂꢇ  
ꢁꢂꢆ  
ꢁ
ꢎꢈꢆ  
ꢎꢈꢆ  
ꢎꢇꢆ  
ꢇꢆ  
ꢈꢆ  
4

*

ꢃ #ꢄ  
ꢎꢇꢆ  
ꢇꢆ  
ꢈꢆ  
4

*

ꢃ #ꢄ  
ꢀꢇꢆ  
ꢀꢇꢆ  
Figure 16.
 
Source-drain diode forward  
characteristics  
Figure 17.
 
Normalized B

VDSS

vs temperature  
!-ꢁꢈꢁꢍꢌVꢀ  
!-ꢁꢈꢁꢍꢀVꢀ  
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ꢁꢂꢉꢁ  
4
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ꢁꢂꢊꢆ  
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4
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ꢈꢆ  
4

*

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Figure 18.
 
Maximum avalanche energy vs  
starting Tj  
!-ꢁꢈꢁꢍꢇVꢀ  
%

!3

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ꢀꢁꢁ  
ꢀꢇꢁ  
ꢀꢋꢁ 4

*

ꢃ #ꢄ  
8/19  
Doc ID15685 Rev 3  

STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
Test circuits  
3
Test circuits  
Figure 19.
 
Switching times test circuit for  
resistive load  
Figure 20.
 
Gate charge test circuit  
V
DD  
12V  
47k
Ω  
1k
Ω  
100nF  
2200  
3
.
3  
µ
F  
R
L  
µ
F  
I
G
=CON
S
T  
V

DD  

100
Ω  
V

i

=20V=V
GMAX  
D.U.
T
.  
V

G  

V
D  
R
G  
V
G
S
 
2200  
µ
F  
D.U.
T
.  
2.7k
Ω  
47k
Ω  
P
W  
1k
Ω  
P
W  
AM0146
8
v1  
AM01469v1  
Figure 21.
 
Test circuit for inductive load  
switching and diode recovery times  
Figure 22.
 
Unclamped inductive load test  
circuit  
L
A
A
A
B
D
FA
S
T  
DIODE  
L=100
µ
H  
V
D  
G
2200  
µ
F  
D.U.
T
.  
B
3
.
3  
µ
F  
V
DD  
S
3
.
3  
µ
F  
1000  
µ
F  
B
V

DD  

25  
Ω
I
D  
D
G
R

G  

S
V
i  
D.U.
T
.  
P
w  
AM01470v1  
AM01471v1  
Figure 23.
 
Unclamped inductive waveform  
Figure 24.
 
Switching time waveform  
t
on  
t
off  
td
off  
V
(BR)D
SS  
t
r  
t
f  
td
on  
V
D  
90
%  
10
%  
90
%  
I
DM  
10
%  
V
D
S  
I
D  
0
0
V
DD  
V
DD  
90
%  
V

G
S  

10
%  
AM01472v1  
AM0147
3
v1  
Doc ID15685 Rev 3  
9/19  

Package mechanical data  
STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECO
P
A
CK

®

packages, depending on their level of environmental compliance. ECO
P
ACK

®  

ECO
P
A
CK

®

is an ST trademark.  
10/19  
Doc ID15685 Rev 3  

STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
Package mechanical data  
T
a
ble 9.  
Dim.  
TO-220FP mechanical data  
mm  
Min.  
Typ.  
Max.  
A
B
4.4  
2.5  
4.6  
2.7  
D
2.5  
2.75  
0.7  
E
0.45  
0.75  
1.15  
1.15  
4.95  
2.4  
F
1
F1  
F2  
G
1.70  
1.70  
5.2  
G1  
H
2.7  
10  
10.4  
L2  
L3  
L4  
L5  
L6  
L7  
Dia  
16  
28.6  
9.8  
2.9  
15.9  
9
30.6  
10.6  
3.6  
16.4  
9.3  
3
3.2  
Doc ID15685 Rev 3  
11/19  

Package mechanical data  
STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
Figure 25.
 
TO-220FP drawing  
7012510_Rev_K_B  
12/19  
Doc ID15685 Rev 3  

STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
T
a
ble 10.
 
I

2

P
A
KFP mechanical data  
Package mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
B
4.40  
2.50  
2.50  
0.65  
0.45  
0.75  
4.60  
2.70  
2.75  
0.85  
0.70  
1.00  
1.20  
5.20  
10.40  
23.00  
14.10  
10.85  
3.20  
1.25  
7.50  
D
D1  
E
F
F1  
G
4.95  
10.00  
21.00  
13.20  
10.55  
2.70  
–
H
L1  
L2  
L3  
L4  
L5  
L6  
0.85  
7.30  
Figure 26.
 
I

2

P
A
KFP drawing  
ꢉꢇꢍꢀꢆꢁꢊ REVꢂ!  
Doc ID15685 Rev 3  
13/19  
 
 

Package mechanical data  
T
a
ble 11.
 
TO-220 type A mechanical data  
Dim.  
STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
mm  
Min.  
Typ.  
Max.  
A
b
4.40  
0.61  
1.14  
0.48  
15.25  
4.60  
0.88  
1.70  
0.70  
15.75  
b1  
c
D
D1  
E
1.27  
10  
10.40  
2.70  
5.15  
1.32  
6.60  
2.72  
14  
e
2.40  
4.95  
1.23  
6.20  
2.40  
13  
e1  
F
H1  
J1  
L
L1  
L20  
L30  
∅
P  
Q
3.50  
3.93  
16.40  
28.90  
3.75  
2.65  
3.85  
2.95  
14/19  
Doc ID15685 Rev 3  

STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
Figure 27.
 
TO-220 type A drawing  
Package mechanical data  
00159
88
_typeA_Rev_
S  
Doc ID15685 Rev 3  
15/19  

Package mechanical data  
Table 12.
 
TO-247 mechanical data  
Dim.  
STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
mm.  
Typ.  
Min.  
Max.  
A
A1  
b
4.85  
2.20  
1.0  
5.15  
2.60  
1.40  
2.40  
3.40  
0.80  
20.15  
15.75  
5.60  
14.80  
4.30  
b1  
b2  
c
2.0  
3.0  
0.40  
19.85  
15.45  
5.30  
14.20  
3.70  
D
E
e
5.45  
18.50  
5.50  
L
L1  
L2  
∅
P  
∅
R  
S
3.55  
4.50  
5.30  
3.65  
5.50  
5.70  
16/19  
Doc ID15685 Rev 3  

STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
Figure 28.
 
TO-247 drawing  
Package mechanical data  
0075
3
25_G  
Doc ID15685 Rev 3  
17/19  

Revision history  
STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
5
Revision history  
T
a
ble 13.
 
Document revision history  
Date  
Revision  
Changes  
15-May-2009  
02-Sep-2010  
1
2
First release.  
Document status promoted from preliminary data to datasheet.  
Added new device in I²
P
A
KF
P
.  

220FP and I

P

have been modified accordingl
y
.  
21-Jun-2012  
3

drawing

have been added.  
18/19  
Doc ID15685 Rev 3  

STF13N95K3, STFI13N95K3, STP13N95K3, STW13N95K3  
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Doc ID15685 Rev 3  
19/19