STMicroelectronics-STF16N65M2

Part #STMicroelectronics-STF16N65M2
Download 
STMicroelectronics-STF16N65M2
STF16N65M2  
N-channel 650
V
,
0
.32
Ω
typ., 11 A MDmesh M2  
Power MOSFET in a TO-220FP package  
Datasheet  
−
production data  
Features  
Order code  
V

DS

@ T

Jmax

R

DS(on)

max  
710 V
 
0.36
Ω
 
I

D  

STF16N65M2  
11 A  
•
Extremely low gate charge  
•
Excellent output capacitance (C

oss

) profile  
•
100% avalanche tested  
•
Zener-protected  
Applications  
72ꢀꢁꢁꢂ)3  
•
Switching applications  
Figure 1. Internal schematic diagram  
Description  
, TAB  
This device is an N-channel Power MOSFET  
developed using MDmesh™ M2 technology.  
Thanks to its strip layout and an improved vertical  
structure, the device exhibits low on-resistance  
and optimized switching characteristics, rendering  
it suitable for the most demanding high efficiency  
converters.  
AM15572v1  
Table 1. Device summary  
Order codes  
Marking  
16N65M2  
Package  
Packaging  
STF16N65M2  
TO-220FP  
Tube  
October 2014  
DocID027084 Rev 1  
1/13  
This is information on a product in full production.  

STF16N65M2  
Electrical ratings  
1
Electrical ratings  
Table 2. Absolute maximum ratings  
Parameter  
Symbol  
Value  
Unit  
V

GS  

Gate-source voltage  
± 25  
11  
V
A
(1)  
I

D  

Drain current (continuous) at T

C

= 25 °C  
Drain current (continuous) at T

C

= 100 °C  
Drain current (pulsed)  
I

D  

6.9  
44  
A
(2)  
I

DM  

A
P

TOT  

T
o
tal dissipation at T

C

= 25 °C  
Peak diode recovery voltage slope  
MOSFET dv/dt ruggedness  
25  
W
dv/dt

(3)  

dv/dt

(4)  

15  
V/ns  
V/ns  
50  
Insulation withstand voltage (RMS) from  
all three leads to external heat sink  
V

ISO  

2500  
V
(t=1 s;TC=25 °C)  
T

stg  

T

j  

Storage temperature  
– 55 to 150  
°C  
Max. operating junction temperature  
1. Limited
 
only by maximum temperature allowed.  
2. Pulse
 
width limited by safe operating area.  
3.  
4.  
I
≤
11 A, di/dt
 
≤
400 A/µs; V  
≤
520 V  
< V  
, V
 
=400
V
.  
(BR)DSS DD  
SD  
DS peak  
V
DS  
Table 3. Thermal data  
Parameter  
Symbol  
Value  
Unit  
R

thj-case

Thermal resistance junction-case max  
5
°C/W  
°C/W  
R

thj-amb  

Thermal resistance junction-ambient max  
62.50  
Table 4. Avalanche characteristics  
Symbol  
Parameter  
Value  
Unit  
Avalanche current, repetitive or not  
repetitive (pulse width limited by T

jmax  

I

AR  

1.9  
A
)
Single pulse avalanche energy (starting  
T

j

=25°C, I

D

= I

AR

; V

DD

=50)  
E

AS  

360  
mJ  
DocID027084 Rev 1  
3/13  
13  

Electrical characteristics  
STF16N65M2  
2
Electrical characteristics  
(T

C

= 25 °C unless otherwise specified)  
Table 5. On /off states  
Test conditions  
Symbol  
Parameter  
Drain-source  
Min.  
Typ.  
Max. Unit  
V

(BR)DSS  

V

GS

= 0, I

D

= 1 mA  
650  
V
breakdown voltage  
V

GS

= 0, V

DS

= 650 V  

GS

= 0, V

DS

= 650 V,  
1
µA  
µA  
Zero gate voltage  
drain current  
I

DSS  

V
100  
T

C

=125 °C  
Gate-body leakage  
current  
I

GSS  

V

DS

= 0, V

GS

= ± 25 V  
±10  
4
µA  
V
V

GS(th)  

R

DS(on)  

Gate threshold voltage
 
V

DS

= V

GS

, I

D

= 250 µA  
Static drain-source  
2
3
V

GS

= 10
V
,
I

D

= 5.5 A  
0.32  
0.36  
Ω
on-resistance  
Table 6. Dynamic  
Test conditions  
Symbol  
Parameter  
Min.  
Typ.  
Max. Unit  
C

iss  

Input capacitance  
Output capacitance  
–
–
718  
32  
–
–
pF  
pF  
C

oss  

V

GS

= 0, V

DS

= 100 V,  
f = 1 MHz  
Reverse transfer  
capacitance  
C

rss  

–
–
–
1.1  
189  
5.2  
–
–
–
pF  
pF  
Ω
Equivalent output  
capacitance  
(1)  
C

oss eq.  

V

GS

= 0, V

DS

= 0 to 520 V  
f = 1 MHz open drain  
Intrinsic gate  
resistance  
R

G  

Q

g  

Q

gs  

Q

gd  

T
o
tal gate charge  
Gate-source charge  
Gate-drain charge  
–
–
–
19.5  
4
–
nC  
nC  
nC  
V

DD

= 520 V, I

D

= 11 A,  
–
V

GS

= 10 V (see

)  
8.3  
–
1.  
C
is defined as a constant equivalent capacitance giving the same charging time as C  
when V  
DS  
oss eq.  
oss  
increases from 0 to 80% V  
DSS  
4/13  
DocID027084 Rev 1  

STF16N65M2  
Electrical characteristics  
Table 7. Switching times  
Test conditions  
Symbol  
Parameter  
Min.  
Typ.  
Max. Unit  
t

d(on)  

t

r  

t

d(off)  

t

f  

Turn-on delay time  
Rise time  
–
–
–
–
11.3  
8.2  
–
–
–
–
ns  
ns  
ns  
ns  
V

DD

= 325 V, I

D

= 5.5 A,  
R

G

= 4.7
Ω
,
V

GS

= 10 V  
(see

and

)  
Turn-off delay time  
Fall time  
36  
11.3  
Table 8. Source drain diode  
Test conditions  
Symbol  
Parameter  
Min. Typ. Max.
 
Unit  
I

SD  

Source-drain current  
–
–
–
–
–
–
–
–
–
11  
44  
A
A
(1)  
I

SDM  

Source-drain current (pulsed)  
Forward on voltage  
(2)  
V

SD  

V

GS

= 0, I

SD

= 11 A  

SD

= 11 A, di/dt = 100 A/µs  
1.6  
V
t

rr  

Q

rr  

Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
342  
3.5  
ns  
µC  
A
I
V

DD

= 60 V (see

)  
I

RRM  

t

rr  

20.4  
458  
4.6  
ns  
µC  
A
I

SD

= 11 A, di/dt = 100 A/µs  
Q

rr  

V

DD

= 60
V
,
T

j

=150 °C  
(see

)  
I

RRM  

20.5  
1. Pulse
 
width limited by safe operating area  
2. Pulsed:
 
pulse duration = 300 µs, duty cycle 1.5%  
DocID027084 Rev 1  
5/13  
13  

Electrical characteristics  
STF16N65M2  
2.1  
Electrical characteristics (curves)  
Figure 2. Safe operating area  
Figure 3. Thermal impedance  
*,3’ꢇꢈꢂꢀꢇꢀꢂꢉꢀꢊꢉꢋ)65
 
,
‘
 
ꢃ$ꢄ
 
ꢂꢀ
 
ꢂꢀ—V
 
ꢂꢀꢀ—V
 
ꢂ
ꢀꢁꢂ
 
ꢂPV
 
ꢂꢀPV
 
7M ꢂꢆꢀƒ&
 
7
F
 ꢇꢆƒ&
 
6LQJOHꢅSXOVH
 
ꢀꢁꢀꢂ
 
ꢂꢀ
 
9

‘6

ꢃ9ꢄ
 
ꢀꢁꢂ
 
ꢂ
ꢂꢀꢀ
 
Figure 4. Output characteristics  
Figure 5. Transfer characteristics  
*,3’ꢇꢇꢂꢀꢇꢀꢂꢉꢂꢉꢂꢇ)65
 
*,3’ꢇꢇꢂꢀꢇꢀꢂꢉꢂꢎꢉꢀ)65
 
,
‘
 
,
‘
 
ꢃ$ꢄ
 
ꢃ$ꢄ
 
9

*6

 ꢅꢌꢍꢅꢊꢍꢅꢋꢍꢅꢂꢀꢅ9
 
ꢇꢉ
 
ꢇꢀ
 
ꢂꢎ
 
ꢂꢇ
 
ꢊ
ꢇꢉ
 
ꢎ9
 
ꢆ9
 
ꢇꢀ
 
ꢂꢎ
 
ꢂꢇ
 
9

‘6ꢅ

 ꢅꢂꢊꢅ9
 
ꢊ
ꢉ
ꢀ
ꢉ
ꢀ
ꢉ9
 
ꢀ
ꢆ
ꢂꢀ
 
ꢂꢆ
 
9

‘6

ꢃ9ꢄ
 
ꢀ
ꢇ
ꢉ
ꢎ
ꢊ
9

*6

ꢃ9ꢄ
 
Figure 6. Normalized gate threshold voltage vs.
 
Figure 7. Normalized V

(BR)DSS

vs. temperature  
temperature  
GIPD180920141442FSR  
GIPD180920141448FSR  
V
GS(th)  
(norm)  
V
(BR)DSS  
(norm)  
I
D
= 250 µA  
1.1  
1.08  
1.04  
1.00  
I
D
= 1mA  
1.0  
0.9  
0.8  
0.96  
0.92  
0.88  
0.7  
0.6  
-75  
-25  
25  
75  
125  
-75  
-25  
25  
75  
125  
T
j  
(°C)  
T
j
(°C)  
6/13  
DocID027084 Rev 1  

STF16N65M2  
Electrical characteristics  
Figure 8. Static drain-source on-resistance  
Figure 9. Normalized on-resistance vs.  
temperature  
*,3’ꢇꢇꢂꢀꢇꢀꢂꢉꢂꢌꢀꢇ)65
 
5
‘6ꢃRQꢄ
 
GIPD180920141459FSR  
R
DS(on)  
(norm)  
ꢃȍꢄ
 
9

*6

 ꢅꢂꢀ9
 
2.2  
ꢀꢁꢈꢉ
 
ꢀꢁꢈꢈ
 
ꢀꢁꢈꢇ
 
V
GS
= 10V  
1.8  
1.4  
1
0.6  
0.2  
ꢀꢁꢈꢂ
 
ꢀꢁꢈꢀ
 
ꢀ
ꢇ
ꢉ
ꢎ
ꢊ
ꢂꢀ
 
,

‘

ꢃ$ꢄ
 
-75  
-25  
25  
75  
125  
T
j
(°C)  
Figure 10. Gate charge vs. gate-source voltage  
Figure 11. Capacitance variations  
*,3’ꢇꢇꢂꢀꢇꢀꢂꢉꢂꢌꢂꢎ)65
 

*,3’ꢇꢇꢂꢀ
ꢇ

9

ꢀ
ꢂ

‘

ꢉ

6

ꢂ
ꢌꢀꢊ)65
 

9
*6
 
&
ꢃ9ꢄ
 
ꢃ9ꢄ
 
ꢃS)ꢄ
 
9

‘6
 

9

”

ꢅ ꢅꢆꢇꢀꢅ9
 
&LVV
 
ꢆꢀꢀ
 
ꢉꢀꢀ
 
ꢈꢀꢀ
 
ꢇꢀꢀ
 
ꢂꢀꢀ
 
ꢂꢀ
 
ꢊ
,

‘

ꢅ ꢅꢂꢂꢅ$
 
ꢂꢀꢀꢀ
 
ꢂꢀꢀ
 
ꢂꢀ
 
&RVV
 
&UVV
 
ꢎ
ꢉ
ꢇ
ꢀ
ꢂ
ꢀ
ꢀꢁꢂ
 
ꢀ
ꢉ
ꢊ
ꢂꢇ
 
ꢂꢎ
 
ꢇꢀ
 
4

J

ꢃQ&ꢄ
 
ꢀꢁꢂ
 
ꢂ
ꢂꢀ
 
ꢂꢀꢀ
 
9

‘6

ꢃ9ꢄ
 
Figure 12. Output capacitance stored energy  
Figure 13. Source-drain diode forward  
characteristics  
*,3’ꢇꢇꢂꢀꢇꢀꢂꢉꢂꢌꢇꢂ)65
 
*,3’ꢇꢇꢂꢀꢇꢀꢂꢉꢂꢌꢈꢈ)65
 
(
ꢃ—-ꢄ
 
9
6′
 
ꢃ9ꢄ
 
ꢂꢁꢂ
 
7

M

 ꢅꢏꢆꢀƒ&
 
ꢆ
ꢂ
ꢉ
ꢈ
ꢇ
ꢀꢁꢋ
 
7

M

 ꢅꢇꢆƒ&
 
ꢀꢁꢊ
 
ꢀꢁꢌ
 
7

M

 ꢅꢂꢆꢀƒ&
 
ꢂ
ꢀ
ꢀꢁꢎ
 
ꢀꢁꢆ
 
ꢀ
ꢂꢀꢀ
 
ꢇꢀꢀ
 
ꢈꢀꢀ
 
ꢉꢀꢀ
 
ꢆꢀꢀ
 
ꢎꢀꢀ
 
9

‘6

ꢃ9ꢄ
 
ꢀ
ꢇ
ꢉ
ꢎ
ꢊ
ꢂꢀ
 
,

6′

ꢃ$ꢄ
 
DocID027084 Rev 1  
7/13  
13  

Test circuits  
STF16N65M2  
3
Test circuits  
Figure 14. Switching times test circuit for  
resistive load  
Figure 15. Gate charge test circuit  
V
DD  
12V  
47k
Ω
 
1k
Ω  
100nF  
2200  
μ
F  
3.3  
μ
F  
R
L  
I
G
=CONST  
V

DD  

100
Ω  
V

i

=20V=V
GMAX  
D.U.T.  
V
D  
R
G  
V
GS  
2200  
μ
F  
D.U.T.  
V

G  

2.7k
Ω  
47k
Ω  
P
W  
1k
Ω  
P
W  
AM01468v1  
AM01469v1  
Figure 16. Test circuit for inductive load  
switching and diode recovery times  
Figure 17. Unclamped inductive load test circuit  
L
A
A
A
B
D
S
FAST  
DIODE  
L=100
μ
H  
V
D  
G
2200  
μ
F  
D.U.T.  
B
3.3  
μ
F  
V
DD  
3.3  
μ
F  
1000  
μ
F  
B
V

DD  

25  
Ω
I
D  
D
G
R

G  

S
V
i  
D.U.T.  
P
w  
AM01470v1  
AM01471v1  
Figure 18. Unclamped inductive waveform  
Figure 19. Switching time waveform  
t
on  
t
off  
td
off  
9
ꢃ%5ꢄ’66
 
t
r  
t
f  
td
on  
9
‘
 
90%  
10%  
90%  
,
‘0
 
10%  
V

GS  

V
DS  
,
‘
 
0
0
9
”
 
9
”
 
90%  
10%  
$0ꢀꢂꢉꢌꢇYꢂ
 
AM01473v1  
8/13  
DocID027084 Rev 1  

STF16N65M2  
Package mechanical data  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK

®  

specifications, grade definitions and product status are available at:

.  
ECOPACK

®

is an ST trademark.  
DocID027084 Rev 1  
9/13  
13  

Package mechanical data  
STF16N65M2  
Figure 20. TO-220FP drawing  
7012510_Rev_K_B  
10/13  
DocID027084 Rev 1  

STF16N65M2  
Package mechanical data  
Table 9. TO-220FP mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
B
4.4  
2.5  
4.6  
2.7  
D
2.5  
2.75  
0.7  
E
0.45  
0.75  
1.15  
1.15  
4.95  
2.4  
F
1
F1  
F2  
G
1.70  
1.70  
5.2  
G1  
H
2.7  
10  
10.4  
L2  
L3  
L4  
L5  
L6  
L7  
Ø
16  
28.6  
9.8  
2.9  
15.9  
9
30.6  
10.6  
3.6  
16.4  
9.3  
3
3.2  
DocID027084 Rev 1  
11/13  
13  

Revision history  
STF16N65M2  
5
Revision history  
Table 10. Document revision history  
Changes  
Date  
Revision  
24-Oct-2014  
1
First release.  
12/13  
DocID027084 Rev 1  

STF16N65M2  
IMPORTANT NOTICE – PLEASE READ CAREFUL
L
Y  
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and  
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on  
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order  
acknowledgement.  
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or  
the design of Purchasers’ products.  
No license, express or implied, to any intellectual property right is granted by ST herein.  
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.  
ST and the ST logo are trademarks of S
T
.
A
ll other product or service names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2014 STMicroelectronics – All rights reserved  
DocID027084 Rev 1  
13/13  
13