STMicroelectronics-STFI13NK60Z

Part #STMicroelectronics-STFI13NK60Z
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STMicroelectronics-STFI13NK60Z
STFI13NK60Z  
N-channel 600
V
,
0
.48
Ω
, 13 A, Zener-protected SuperMESH™  
Power MOSFET in I²
P
A
KFP package  
Datasheet — production data  
Features  
R

DS(on)  

max  
Order code  
V

DSS  

I

D  

P

TOT  

STFI13NK60Z 600
 
V <0.55
 
Ω
13 A  
35 W  
■
Fully insulated and low profile package with  
increased creepage path from pin to heatsink  
plate  
1
■
Gate charge minimized  
2
3
■
Very low intrinsic capacitance  

2

P
A
KFP  
I
(TO-281)  
Applications  
■
Switching applications  
Figure 1.  
Internal schematic diagram  
D(2)  
Description  
This device is an N-channel Zener-protected  
Power MOSFET developed using  
STMicroelectronics’ SuperMESH™ technolog
y
,  
achieved through optimization of ST’s well  
established strip-based PowerMESH™ layout. In  
addition to a significant reduction in on-  
resistance, this device is designed to ensure a  
high level of dv/dt capability for the most  
demanding applications.  
G(1)  
S(3)  
AM01476v1  
Table 1.  
Device summary  
Order code  
Marking  
Package  
Packaging  
I²
P
A
KFP  
(TO-281)  
STFI13NK60Z  
13NK60Z  
T
u
be  
March 2012  
Doc ID 018969 Rev 3  
1/13  
This is information on a product in full production.  
13  

STFI13NK60Z  
Electrical ratings  
1
Electrical ratings  
Table 2.  
Symbol  
Absolute maximum ratings  
Parameter  
Value  
Unit  
V
V

DS  

V

GS  

I

D  

Drain-source voltage  
600  
30  
Gate-source voltage  
V
13

(1)  

Drain current (continuous) at T

C

= 25 °C  
Drain current (continuous) at T

C

= 100 °C  
A
8.2

(1)  

I

D  

A
(2)  
52

(1)  

35  
Drain current (pulsed)  
A
I

DM  

P

TOT  

ESD  
T
o
tal dissipation at T

C

= 25 °C  
W
kV  
Gate-source human body model (R=1,5 k
Ω
, C=100 pF)  
Peak diode recovery voltage slope  
4
dv/dt

(3)  

4.5  
V/ns  
Insulation withstand voltage (RMS) from all three leads  
to external heat sink (t=1 s;T

C

=25 °C)  
V

ISO  

2500  
V
T

j  

Operating junction temperature  
Storage temperature  
-55 to 150  
°C  
T

stg  

1. Limited
 
by maximum junction temperature.  
2. Pulse
 
width limited by safe operating area.  
3.  
I
< 13 A, di/dt < 200 A/µs, V
 
= 80% V  
.
SD  
DD  
(BR)DSS  
T
a
ble 3.  
Symbol  
R

thj-case  

R

thj-amb  

Thermal data  
Parameter  
Value  
3.6  
Unit  
°C/W  
°C/W  
Thermal resistance junction-case Max  
Thermal resistance junction-amb Max  
62.5  
T
a
ble 4.  
Avalanche characteristics  
Parameter  
Symbol  
Max value  
Unit  
10

(1)  

I

AR  

Repetitive or non repetitive avalanche current  
A
Single pulse avalanche energy  
E

AS  

400  
mJ  
(starting T

j

=25 °C, I

D

=I

AR

, V

DD

= 50 V)  
1. Limited
 
by maximum junction temperature  
Doc ID 018969 Rev 3  
3/13  

Electrical characteristics  
STFI13NK60Z  
2
Electrical characteristics  
(T

CASE

= 25 °C unless otherwise specified).  
T
a
ble 5.  
Symbol  
On/off states  
Parameter  
Test conditions  
I

D

= 1 mA  

DS

= 600
V
,  
Min. Typ. Max. Unit  
Drain-source breakdown  
voltage (V

GS

= 0)  
V

(BR)DSS  

600  
V
V
1
µA  
µA  
Zero gate voltage drain  
current (V

GS

= 0)  
I

DSS  

V

DS

= 600
V
,
T
c=125 °C  
50  
Gate body leakage  
current (V

DS

= 0)  
I

GSS  

V

GS

= 20
 
V  
10  
4.5  
µA  
V
V

GS(th)  

R

DS(on)  

V

DS

= V

GS

, I

D

= 100 µA  
Gate threshold voltage  
3
3.75  
0.48  
Static drain-source on  
resistance  
V

GS

= 10
V
,
I

D

= 4.5 A  
0.55  
Ω
T
a
ble 6.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
Forward  
transconductance  
(1)  
V

DS

=8
V
,
I

D

= 5 A  
–
11  
S
g

fs  

Input capacitance  
Output capacitance  
C

iss  

C

oss  

C

rss  

2030  
210  
48  
pF  
pF  
pF  
V

DS

=25
V
,
f
=1 MHz, V

GS

=0  
V

GS

=0, V

DS

=0 to 480 V  
–
Reverse transfer  
capacitance  
Equivalent output  
capacitance  
(2)  
–
–
125  
pF  
C

oss eq.  

Q

g  

Q

gs  

Q

gd  

V

DD

=480
V
,
I

D

= 10 A  
T
o
tal gate charge  
Gate-source charge  
Gate-drain charge  
66  
11  
33  
92  
nC  
nC  
nC  
V

GS

=10 V  
(see

)  
1. Pulsed:
 
pulse duration = 300 µs, duty cycle 1.5%  
2. is
 
defined as a constant equivalent capacitance giving the same charging time as C  
C
when V  
DS  
oss eq.  
oss  
increases from 0 to 80% V  
DSS  
4/13  
Doc ID 018969 Rev 3  

STFI13NK60Z  
Electrical characteristics  
T
a
ble 7.  
Switching times  
Parameter  
Symbol  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
V

DD

= 300
V
,
I

D

= 5 A,  
R

G

=4.7
Ω
,
V

GS

=10 V  
(see

)  
t

d(on)  

t

r  

T
u
rn-on delay time  
Rise time  
22  
14  
ns  
ns  
–
–
V

DD

=300
V
,
I

D

= 5 A,  
t

d(off)  

t

f  

T
u
rn-off delay time  
Fall time  
61  
12  
ns  
ns  
–
–
–
–
R

G

=4.7
Ω
,
V

GS

=10 V  
(see

)  
t

r(Voff)  

Off-voltage rise time  
Fall time  
V

DD

=480
V
,
I

D

= 10 A,  
R

G

=4.7
Ω
,
V

GS

=10 V  
(see

)  
10  
9
ns  
ns  
ns  
t

f  

t

c  

Cross-over time  
20  
Table 8.  
Symbol  
Gate-source Zener diode  
Parameter  
Test conditions  
Igs= 1
 
mA  
Min.  
Typ.  
Max. Unit  
Gate-source breakdown  
voltage (I

D

=0)  
V

(BR)GSO  

30  
–
–
V
The built-in back-to-back Zener diodes have specifically been designed to enhance not only  
the device’s ESD capabilit
y
, but also to make them safely absorb possible voltage transients  
that may occasionally be applied from gate to source. In this respect the Zener voltage is  
appropriate to achieve an efficient and cost-effective intervention to protect the device’s  
integrit
y
.
T
hese integrated Zener diodes thus avoid the usage of external components.  
T
a
ble 9.  
Symbol  
Source drain diode  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
Source-drain current  
I

SD  

10  
40  
A
A
–
–
Source-drain current  
(pulsed)  
(1)  
I

SDM  

(2)  
I

SD

= 10 A, V

GS

=0  
Forward on voltage  
1.6  
V
V

SD  

t

rr  

I

SD

= 10 A,  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
570  
4.5  
16  
ns  
µC  
A
Q

rr  

–
di/dt = 100 A/µs,  
V

DD

=35
V
,
T

j

=150 °C  
I

RRM  

1. Pulse
 
width limited by safe operating area  
2. Pulsed:
 
pulse duration = 300 µs, duty cycle 1.5%  
Doc ID 018969 Rev 3  
5/13  

Electrical characteristics  
STFI13NK60Z  
2.1  
Electrical characteristics (curves)  
Figure 2.  
Safe operating area  
Output characteristics  
Transconductance  
Figure 3.  
Figure 5.  
Figure 7.  
Thermal impedance  
Figure 4.  
Transfer characteristics  
Figure 6.  
Static drain-source on resistance  
6/13  
Doc ID 018969 Rev 3  
 
 

STFI13NK60Z  
Electrical characteristics  
Figure 8.  
Gate charge vs gate-source voltage
 
Figure 9.  
Capacitance variations  
Figure 10.
 
Normalized gate threshold voltage
 
Figure 11.
 
Normalized on resistance vs  
vs temperature  
temperature  
Figure 12.
 
Source-drain diode forward  
characteristics  
Figure 13.
 
Normalized B

VDSS

vs temperature  
Doc ID 018969 Rev 3  
7/13  

Electrical characteristics  
STFI13NK60Z  
Figure 14.
 
Maximum avalanche energy vs  
temperature  
8/13  
Doc ID 018969 Rev 3  

STFI13NK60Z  
Test circuits  
3
Test circuits  
Figure 15.
 
Switching times test circuit for  
resistive load  
Figure 16.
 
Gate charge test circuit  
V
DD  
12V  
47k
Ω  
1k
Ω  
100nF  
2200  
3
.
3  
μ
F  
R
L  
μ
F  
I
G
=CON
S
T  
V

DD  

100
Ω  
V

i

=20V=V
GMAX  
D.U.
T
.  
V

G  

V
D  
R
G  
V
G
S
 
2200  
μ
F  
D.U.
T
.  
2.7k
Ω  
47k
Ω  
P
W  
1k
Ω  
P
W  
AM0146
8
v1  
AM01469v1  
Figure 17.
 
Test circuit for inductive load  
switching and diode recovery times  
Figure 18.
 
Unclamped inductive load test  
circuit  
L
A
A
A
B
D
FA
S
T  
DIODE  
L=100
μ
H  
V
D  
G
2200  
μ
F  
D.U.
T
.  
B
3
.
3  
μ
F  
V
DD  
S
3
.
3  
μ
F  
1000  
μ
F  
B
V

DD  

25  
Ω
I
D  
D
G
R

G  

S
V
i  
D.U.
T
.  
P
w  
AM01470v1  
AM01471v1  
Figure 19.
 
Unclamped inductive waveform  
Figure 20.
 
Switching time waveform  
t
on  
td
on  
t
off  
td
off  
V
(BR)D
SS  
t
r  
t
f  
V
D  
90
%  
10
%  
90
%  
I
DM  
10
%  
V
D
S  
I
D  
0
0
V
DD  
V
DD  
90
%  
V

G
S  

10
%  
AM01472v1  
AM0147
3
v1  
Doc ID 018969 Rev 3  
9/13  

Package mechanical data  
STFI13NK60Z  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECO
P
A
CK

®

packages, depending on their level of environmental compliance. ECO
P
ACK

®  

ECO
P
A
CK is an ST trademark.  
10/13  
Doc ID 018969 Rev 3  

STFI13NK60Z  
Package mechanical data  
T
a
ble 10.
 
I

2

P
A
KFP (TO-281) mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
B
4.40  
2.50  
2.50  
0.65  
0.45  
0.75  
4.60  
2.70  
2.75  
0.85  
0.70  
1.00  
1.20  
5.20  
10.40  
23.00  
14.10  
10.85  
3.20  
1.25  
7.50  
D
D1  
E
F
F1  
G
4.95  
10.00  
21.00  
13.20  
10.55  
2.70  
–
H
L1  
L2  
L3  
L4  
L5  
L6  
0.85  
7.30  
Figure 21.
 
I

2

P
A
KFP (TO-281) drawing  
ꢀꢁꢂꢃꢄꢅꢆ REVꢇ!  
Doc ID 018969 Rev 3  
11/13  

Revision history  
STFI13NK60Z  
5
Revision history  
T
a
ble 11.
 
Document revision history  
Date  
Revision  
Changes  
06-Jul-2011  
1
First release.  
have been added.  
07-Nov-2011  
20-Mar-2012  
2
3
Document status promoted from preliminary data to production data.  
The package name has been updated.  
12/13  
Doc ID 018969 Rev 3  

STFI13NK60Z  
Please Read Carefully:  
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Doc ID 018969 Rev 3  
13/13