STMicroelectronics-STGW80H65DFB-4

Part #STMicroelectronics-STGW80H65DFB-4
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STMicroelectronics-STGW80H65DFB-4
STGW80H65DFB-4  
Datasheet  
Trench gate field-stop 650 V, 80 A high speed HB series IGBT  
Features  
•
•
•
•
•
•
•
•
•
V

CE(sat)

= 1.6 V (typ.) @ I

C

= 80 A  
Maximum junction temperature: T

J

= 175 °C  
High speed switching series  
Minimized tail current  
4
3
Tight parameter distribution  
2
1
Safe paralleling  
TO247-4  
Low thermal resistance  
Very fast soft recovery antiparallel diode  
Excellent switching performance thanks to the extra driving kelvin pin  
C(1, TAB)  
G(4)  
K(3)  
Applications  
•
•
Photovoltaic inverters  
High frequency converters  
E(2)  
NG4K3E2C1_TAB  
Description  
This device is an IGBT developed using an advanced proprietary trench gate field-  
stop structure. The device is part of the new HB series of IGB
T
s
, which represents  
an optimum compromise between conduction and switching loss to maximize the  
efficiency of any frequency converter. A faster switching event can be achieved by  
the Kelvin pin, which separates power path from driving signal. Furthermore, the  
slightly positive V

CE(sat)

temperature coefficient and very tight parameter distribution  
result in safer paralleling operation.  
Product status link  
Product summary  
Order code  
Marking  
STGW80H65DFB-4  
G80H65DFB  
TO247-4  
Package  
Packing  
Tube  
DS11137
–
Rev 5
–
December 2021  
For further information contact your local STMicroelectronics sales office.  

STGW80H65DFB-4  
Electrical ratings  
1
Electrical ratings  
Table 1.
Absolute maximum ratings  
Symbol  
Parameter  
Value  
650  
Unit  
V
Collector-emitter voltage (V
 
= 0 V)  
GE  
V
CES  
80  
Continuous collector current at T
 
= 25 °C  
C
I
A
C
Continuous collector current at T
 
= 100 °C  
C
Pulsed collector current (t
 
≤ 1 μs, T
 
< 175 °C)  
I
300  
±20  
A
V
V
p
J
CP  
Gate-emitter voltage  
Transient gate-emitter voltage  
V
GE  
±30  
80  
Continuous forward current at T
 
= 25 °C  
C
I
A
F
Continuous forward current at T
 
= 100 °C  
C
Pulsed forward current (t
 
≤ 1 μs, T
 
< 175 °C)  
I
FP  
300  
A
p
J
P
T
o
tal power dissipation at T
 
= 25 °C  
470  
W
TOT  
STG  
C
T
Storage temperature range  
– 55 to 150  
– 55 to 175  
°C  
T
Operating junction temperature range  
J
1. Current
 
level is limited by bond wires  
2. Defined
 
by design, not subject to production test.  
Table 2.
Thermal data  
Symbol  
Parameter  
Thermal resistance junction-case IGBT  
Thermal resistance junction-case diode  
Thermal resistance junction-ambient  
Value  
0.32  
0.66  
50  
Unit  
R
thJC  
R
°C/W  
thJC  
R
thJA  
DS11137
–
Rev 5  
page 2/15  
 
 
 

STGW80H65DFB-4  
Electrical characteristics  
2
Electrical characteristics  
T

C

= 25 °C unless otherwise specified  
Table 3.
Static characteristics  
Test conditions  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Unit  
Collector-emitter breakdown  
voltage  
V
V
= 0
V
, I
 
= 2
m
A  
650  
V
(BR)CES  
GE  
C
V
V
V
= 15
V
, I
 
=
8
0 A  
1.6  
1.8  
1.9  
2.15  
1.8  
1.7  
6
2.0  
GE  
GE  
GE  
C
Collector-emitter saturation  
voltage  
V
= 15
V
, I
 
=
8
0 A, T
 
= 125 °C  
V
V
CE(sat)  
C
J
= 15
V
, I
 
=
8
0 A, T
 
= 175 °C  
C
J
I =
 
80 A  
F
2.8  
V
I =
 
80 A, T
 
= 125 °C  
F J  
Forward on-voltage  
F
I =
 
80 A, T
 
= 175 °C  
F
J
V
V
= V
 
, I
 
= 1 mA  
Gate threshold voltage  
Collector cut-off current  
Gate-emitter leakage current  
5
7
V
GE(th)  
CE  
GE  
C
I
V
V
= 0
V
, V
 
=
6
50 V  
100  
±250  
µA  
nA  
CES  
GES  
GE  
CE  
CE  
I
= 0
V
, V
 
=
±
20 V  
GE  
Table 4.
Dynamic characteristics  
Test conditions  
Symbol  
Parameter  
Input capacitance  
Min.  
Typ.  
10524  
385  
Max.  
Unit  
C
–
–
–
–
–
–
–
–
–
–
–
–
ies  
C
oes  
V
= 25
V
, f = 1
M
Hz, V
 
= 0 V  
GE  
Output capacitance  
pF  
CE  
C
res  
Reverse transfer capacitance  
T
o
tal gate charge  
215  
Q
414  
g
V
= 520
V
, I
 
=
8
0 A, V
 
= 0 to 15 V  
CC  
C
GE  
Q
ge  
Gate-emitter charge  
Gate-collector charge  
78  
nC  
Q
170  
gc  
DS11137
–
Rev 5  
page 3/15  
 
 

STGW80H65DFB-4  
Electrical characteristics  
Table 5.
IGBT switching characteristics (inductive load)  
Symbol  
Parameter  
Turn-on delay time  
Test conditions  
Min.  
Typ.  
75  
Max.  
Unit  
ns  
t
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
d(on)  
t
Current rise time  
35  
r
(di/dt)  
Turn-on current slope  
Turn-off-delay time  
Current fall time  
1750  
336  
23  
A/µs  
ns  
on  
V
R
= 400
V
, I
 
=
8
0 A, V
 
= 15
V
,  
C GE  
CE  
t
d(off)  
= 10 Ω  
G
t
f
E
Turn-on switching energy  
Turn-off switching energy  
T
o
tal switching energy  
Turn-on delay time  
1
on  
E
mJ  
1.7  
2.7  
66  
off  
E
ts  
t
d(on)  
ns  
A/µs  
ns  
t
Current rise time  
38  
r
(di/dt)  
Turn-on current slope  
Turn-off-delay time  
Current fall time  
1670  
403  
45  
on  
V
= 400 V, I
 
= 80 A, V
 
= 15 V,  
C GE  
CE  
t
d(off)  
R
= 10 Ω, T
 
= 175 °C  
J
G
t
f
E
Turn-on switching energy  
Turn-off switching energy  
T
o
tal switching energy  
1.5  
2.47  
3.97  
on  
E
mJ  
off  
E
ts  
1. Including
 
the reverse recovery of the diode.  
2. Including
 
the tail of the collector current.  
Table 6.
Diode switching characteristics (inductive load)  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
112  
Max.  
Unit  
ns  
t
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
Peak rate of fall of reverse  
–
–
–
–
–
–
rr  
Q
955  
27.2  
nC  
A
rr  
I =
 
80 A, V
 
= 400
V
, V
 
=
1
5 V  
F
R
GE  
di/dt = 1000 A/µs  
I
rrm  
dI /dt  
rr  
–
1515  
–
A/µs  
recovery current during t  
b
E
Reverse recovery energy  
Reverse recovery time  
–
–
–
–
170  
164  
3838  
52  
–
–
–
–
µJ  
ns  
nC  
A
rr  
t
rr  
Q
Reverse recovery charge  
Reverse recovery current  
Peak rate of fall of reverse  
rr  
I =
 
80 A, V
 
= 400 V, V
 
= 15 V,  
F
R
GE  
T =
 
175 °C di/dt = 1000 A/µs  
J
I
rrm  
dI /dt  
rr  
–
–
785  
635  
–
–
A/µs  
µJ  
recovery current during t  
b
E
Reverse recovery energy  
rr  
DS11137
–
Rev 5  
page 4/15  
 
 

STGW80H65DFB-4  
Electrical characteristics (curves)  
2.1  
Electrical characteristics (curves)  
Figure 1.
Power dissipation vs. case temperature  
Figure 2.
Collector current vs. case temperature  
GIPD160920130941FSR  
I
C  
P

TOT  

(W)  
GIPD160920130948FSR  
V

GE

= 15 V, T

J

= 175 °C  
(A)  
V

GE

=15
V
,
T

J

=175 °C  
120  
100  
80  
400  
300  
200  
60  
40  
100  
0
20  
0
0
25 50 75
 
100 125 150  
T
C
(°C)  
0
50  
100  
150  
T

C

(°C)  
Figure 3.
Output characteristics (T

J

= 25 °C)  
Figure 4.
Output characteristics (T

J

= 175 °C)  
IGBT060715EWFRWOC25  
I

C  

(A)  
160  
I

C  

(A)  
160  
V

GE

= 15 V  
V

GE

= 15 V

IGBT060715EWFRWOC175  

13 V  
13 V  
11 V  
11 V  
9 V  
140  
120  
100  
80  
140  
120  
100  
80  
9 V  
60  
60  
40  
40  
7 V  
20  
0
20  
0
7 V  
0
1
2
3
4
V

CE

(V)  
0
1
2
3
4
V

CE

(V)  
Figure 5.
V

CE

(sat) vs. junction temperature  
Figure 6.
V

CE

(sat) vs. collector current  
IGBT060715EWFRWVCET  
IGBT060715EWFRWVCEC  
V

GE

= 15 V  
V

CE(sat)  

V

CE(sat)  

(V)  
(V)  
V

GE

= 15 V  
2.4  
T

J

= 175 °C  
T

J

= 25 °C  
T

J

= -40 °C  
2.6  
I

C

= 160 A  
2.0  
1.6  
1.2  
0.8  
2.2  
1.8  
I

C

= 80 A  
I

C

= 40 A  
1.4  
1.0  
0.4  
0.0  
-50  
0
50  
100  
150  
T

J

(°C)  
0
40  
80  
120  
160  
I

C

(A)  
DS11137
–
Rev 5  
page 5/15  
 

STGW80H65DFB-4  
Electrical characteristics (curves)  
Figure 7.
Collector current vs. switching frequency  
Figure 8.
Forward bias safe operating area  
IGBT060715EWFRWCCS  
IGBT171120161002FSOA  
I

C  

I

C  

(A)  
(A)  
160  
140  
120  
100  
t

p

= 1µs  
10

2  

T

C

= 100 °C  
T

C

= 80 °C  
t

p

= 10µs  
80  
60  
40  
t

p

= 100µs  
10

1  

Rectangular current shape  
single pulse, T

C

= 25°C  
T

J

< 175 °C, V

GE

= 15 V  
10

1

10

2  

20  
0
(duty cycle = 0.5, V
 
= 400
V
, R
 
=
1
0 Ω,  
CC  
G
V
= 0/15
V
, T
 
=
1
75 °C)  
GE  
J
10

0  

10

0  

10

0  

10

1  

10

2  

f (kHz)  
V

CE

(V)  
Figure 10.
Diode V

F

vs. forward current  
Figure 9.
Transfer characteristics  
IGBT060715EWFRWTCH  
I

C  

(A)  
IGBT060715EWFRWDVF  
V

F  

(V)  
V

CE

= 4 V  
2.6  
2.2  
1.8  
1.4  
1.0  
200  
T

J

= -40 °C  
T

J

= 25 °C  
T

J

= 175 °C  
160  
120  
80  
T

J

= 175 °C  
40  
0
0.6  
0.2  
T

J

= 25 °C  
9
5
6
7
8
V

GE

(V)  
0
20  
40  
60  
80  
100  
I

F

(A)  
Figure 11.
Normalized V

GE(th)

vs. junction temperature  
Figure 12.
Normalized V

(BR)CES

vs. junction temperature  
V

GE(th)  

(norm)  
GIPD160920131151FSR  
GIPD160920131144FSR  
V

BR(CES)  

(norm)  
1.1  
I

C

= 2 mA  
I

C

= 1mA  
1.1  
1.0  
0.9  
0.8  
1.0  
0.9  
0.7  
0.6  
-50  
0
50  
100  
150  
T

J

(°C)  
-50  
0
50  
100  
150  
T

J

(°C)  
DS11137
–
Rev 5  
page 6/15  

STGW80H65DFB-4  
Electrical characteristics (curves)  
Figure 13.
Capacitance variations  
Figure 14.
Gate charge vs. gate-emitter voltage  
C
GIPD160920131156FSR  
GIPD160920131200FSR  
V

GE  

(pF)  
10000  
1000  
(V)  
16  
I

C

= 80 A  
V

CC

= 520 V  
C

IES  

12  
8
C

OES  

C

RES  

100  
10  
4
0
0
100  
200  
300  
400  
Q

g

(nC)  
0.1  
1
10  
100  
V

CE

(V)  
Figure 15.
Switching energy vs. collector current  
Figure 16.
Switching energy vs. gate resistance  
IGBT060715EWFRWSLG  
IGBT060715EWFRWSLC  
E
E
(mJ)  
(mJ)  
6
E

OFF  

4
5
4
3
E

OFF  

3
2
E

ON  

2
E

ON  

1
1
0
0
0
0
40  
80  
120  
I

C

(A)  
5
10  
15  
20  
R

G

(Ω)  
160  
Figure 17.
Switching energy vs. temperature  
Figure 18.
Switching energy vs. collector emitter voltage  
IGBT060715EWFRWSLT  
IGBT060715EWFRWSLV  
E
(mJ)  
E
(mJ)  
V

CC

= 400
V
,
I

C

= 80 A, R

G

= 10 Ω, V

GE

= 15 V  
I

C

= 80 A, R

G

= 10 Ω, V

GE

= 15
V
,
T

J

= 175 °C  
2.5  
3.0  
E

OFF  

2.0  
1.5  
E

OFF  

2.0  
E

ON  

E

ON  

1.0  
0
1.0  
0.5  
0
50  
100  
150  
T

J

(°C)  
150  
250  
350  
450  
V

CE

(V)  
DS11137
–
Rev 5  
page 7/15  

STGW80H65DFB-4  
Electrical characteristics (curves)  
Figure 19.
Switching times vs. collector current  
Figure 20.
Switching times vs. gate resistance  
IGBT060715EWFRWSTC  
IGBT060715EWFRWSTR  
t
t
(ns)  
(ns)  
t

d(off)  

t

d(off)  

10

2  

t

d(on)  

t

f  

10

2  

t

d(on)  

t

r  

10

1  

t

f  

t

r  

V

CC

= 400
V
,
V

GE

= 15
V
,
R

G

= 10 Ω, T

J

= 175 °C  
V

CC

= 400
V
,
V

GE

= 15 V, I

C

= 80 A, T

J

= 175 °C  
10

1  

10

0  

0
40  
80  
120  
160  
I

C

(A)  
0
5
10  
15  
20  
R

G

(Ω)  
Figure 21.
Reverse recovery current vs. diode current  
slope  
Figure 22.
Reverse recovery time vs. diode current slope  
IGBT060715EWFRWRRT  
t

rr  

(ns)  
IGBT060715EWFRWRRC  
V

CC

= 400
V
,
V

GE

= 15
V
,
I

F

= 80 A, T

J

= 175 °C  
(A)  
I

rrm  

V

CC

= 400
V
,
V

GE

= 15
V
,
I

F

= 80 A, T
 
= 175 °C  
J
180  
100  
90  
80  
70  
60  
50  
160  
140  
120  
100  
80  
60  
40  
500 1000
 
1500 2000 2500 3000
 
di/dt (A/µs)  
500 1000
 
1500 2000 2500 3000
 
di/dt (A/µs)  
Figure 23.
Reverse recovery charge vs. diode current  
slope  
Figure 24.
Reverse recovery energy vs. diode current  
slope  
IGBT060715EWFRWRRQ  
IGBT060715EWFRWRRE  
V

CC

= 400
V
,
V

GE

= 15
V
,
I

F

= 80 A, T

J

= 175 °C  
(µJ)  
Q

rr  

E

rr  

V

CC

= 400
V
,
V

GE

= 15
V
,
I

F

= 80 A, T

J

= 175 °C  
(µC)  
700  
600  
500  
400  
300  
200  
100  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
0
500 1000
 
1500 2000 2500 3000
 
di/dt (A/µs)  
500 1000
 
1500 2000 2500 3000
 
di/dt (A/µs)  
DS11137
–
Rev 5  
page 8/15  

STGW80H65DFB-4  
Electrical characteristics (curves)  
Figure 25.
Thermal impedance for IGBT  
ZthTO2T_A  
K
δ = 0.5  
δ = 0.2  
δ = 0.05  
δ = 0.1  
δ = 0.02  
δ = 0.01  
10

-1  

Single pulse  
Z

th

= k*R

thJC  

δ = t

p

/t  
t

p  

t
10

-2  

10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

t

p

(s)  
Figure 26.
Thermal impedance for diode  
DS11137
–
Rev 5  
page 9/15  

STGW80H65DFB-4  
Test circuits  
3
Test circuits  
Figure 27.
 
Test circuit for inductive load switching  
A
A
B
Figure 28.
 
Gate charge test circuit  
C
E
L=100 μH  
V

CC  

G
12 V  
47 kΩ  
1 kΩ  
100 nF  
B
3.3  
μF  
1000  
μF  
V

CC  

C
V

i

≤
V  
I

G

=CONST  
2.7 kΩ  
D.U.
T
.  
100 Ω  
GMAX  
G
D.U.T  
E
2200  
µF  
V

G  

R

G  

K
47 kΩ  
1 kΩ  
P

W  

GND1  
(signal ground)  
GND2  
(power ground)  
GIPG030320161351SA  
GND1  
GND2  
(signal ground)  
(power ground)  
HB650_4_leads  
Figure 29.
 
Switching waveform  
Figure 30.
 
Diode reverse recovery waveform  
90%  
10%  
V
G  
90%  
10%  
V
CE  
t

r(Voff)  

t

cross  

10  
90%  
10%  
I
C  
t

d(off)  

t

off  

t

d(on)  

t

on  

t

f  

t

r(Ion)  

AM01506v1  
GADG140820170937SA  
DS11137
–
Rev 5  
page 10/15  
 
 
 

STGW80H65DFB-4  
Package information  
4
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of

packages,  
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product  
status are available at:

. ECOPACK is an ST trademark.  
4.1  
TO247-4 package information  
Figure 31.
TO247-4 package outline  
8405626_Rev_3  
DS11137
–
Rev 5  
page 11/15  
 
 

STGW80H65DFB-4  
TO247-4 package information  
Table 7.
TO247-4 mechanical data  
mm  
Dim.  
Min.  
4.90  
2.31  
1.90  
1.16  
1.15  
0
Typ.  
5.00  
2.41  
2.00  
Max.  
5.10  
2.51  
2.10  
1.29  
1.25  
0.20  
0.66  
0.62  
21.10  
16.85  
1.35  
25.27  
15.90  
13.50  
5.10  
2.60  
2.64  
5.18  
20.10  
3.70  
7.40  
2.60  
6.00  
A
A1  
A2  
b
b1  
b2  
c
1.20  
0.59  
0.58  
20.90  
16.25  
1.05  
24.97  
15.70  
13.10  
4.90  
2.40  
2.44  
4.98  
19.80  
3.50  
c1  
D
0.60  
21.00  
16.55  
1.20  
D1  
D2  
D3  
E
25.12  
15.80  
13.30  
5.00  
E1  
E2  
E3  
e
2.50  
2.54  
e1  
L
5.08  
19.92  
3.60  
P
P1  
P2  
Q
2.40  
5.60  
2.50  
6.15  
S
T
9.80  
6.00  
10.20  
6.40  
0.10  
U
aaa  
0.04  
DS11137
–
Rev 5  
page 12/15  

STGW80H65DFB-4  
Revision history  
Table 8.
Document revision history  
Date  
Revision  
Changes  
05-Aug-2015  
1
First release.  
Updated features in cover page.  
Updated
T
a
ble 2: “Absolute maximum ratings”
and
Figure 9: “Forward bias safe  
operating area”
.  
17-Nov-2016  
2
3
Minor text changes.  
Updated the title in cover page,
T
a
ble 2: “Absolute maximum ratings”
,
Table 4: “Static  
characteristics”
and
T
a
ble 6: “IGBT switching characteristics (inductive load)”
.  
03-Mar-2017  
Minor text changes.  
Updated
T
a
ble 1. Absolute maximum ratings.  
03-Jul-2019  
03-Dec-2021  
4
5
Minor text changes.  
DS11137
–
Rev 5  
page 13/15  
 

STGW80H65DFB-4  
Contents  
Contents  

Electrical ratings

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Electrical characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Electrical characteristics (curves)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Test circuits

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TO247-4 package information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Revision history

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DS11137
–
Rev 5  
page 14/15  

STGW80H65DFB-4  
IMPORTANT NOTICE – PLEASE READ CAREFULLY  
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Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of  
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No license, express or implied, to any intellectual property right is granted by ST herein.  
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ST and the ST logo are trademarks of S
T
.
F
or additional information about ST trademarks, please refer to

. All other product or service  
names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2021 STMicroelectronics – All rights reserved  
DS11137
–
Rev 5  
page 15/15