STMicroelectronics-STL40N75LF3

Part #STMicroelectronics-STL40N75LF3
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STMicroelectronics-STL40N75LF3
STL40N75LF3  
N-channel 75
V
,
1
6 m
Ω
typ., 10 A S
T
r
ipFET™ III Power MOSFET  
in a PowerFL
A
T
™ 5×6 package  
Datasheet —
 
production data  
Features  
R

DS(on)  

max  
Order code  
V

DSS  

I

D  

STL40N75LF3  
75 V  
< 19 m
Ω  
10 A

(1)  

1. The
 
value is rated according to R  
thj-pcb  
1
2
■
N-channel enhancement mode  
■
Low gate charge  
3
4
PowerFLAT™ 5×6  
■
Low threshold voltage device  
Applications  
■
Switching applications  
Description  
Figure 1.  
Internal schematic diagram  
ꢉ
ꢁ
ꢃ
ꢈ
ꢈ
ꢃ
ꢁ
ꢉ
This device is an N-channel enhancement mode  
Power MOSFET produced using  
STMicroelectronics’ S
T
r
ipFET™ III technolog
y
,  
which is specifically designed to minimize on-  
resistance and gate charge to provide superior  
switching performance.  
$
$
$
$
‘
ꢇ
3
ꢆ
3
ꢅ
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ꢄ
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ꢅ
ꢆ
ꢇ
“OTTOM 6IEW  
4
O
P 6IEW  
!-ꢀꢁꢂꢃꢃ6ꢄ  
Table 1.  
Order code  
STL40N75LF3  
Device summary  
Marking  
Package  
Packaging  
T
a
pe and reel  
40N75LF3  
PowerFL
A
T
™ 5×6  
October 2012  
Doc ID 023810 Rev 1  
1/16  
This is information on a product in full production.  
16  

STL40N75LF3  
Electrical ratings  
1
Electrical ratings  
T
a
ble 2.  
Symbol  
Absolute maximum ratings  
Parameter  
Value  
Unit  
V

DS  

V

GS  

Drain-source voltage  
75  
+20-16  
40  
V
V
Gate-source voltage  
(1)  
I

D  

Drain current (continuous) at T

C

= 25 °C  
Drain current (continuous) at T

C

= 100 °C  
Drain current (continuous) at T

pcb

= 25 °C  
Drain current (continuous) at T

pcb

=100 °C  
Drain current (pulsed)  
A
(1)  
I

D  

26  
A
(2)  
I

D  

10  
A
(3)  
I

D  

6
A
(3)  
I

DM  

160  
62  
A
(1)  
P

TOT  

T
o
tal dissipation at T

C

= 25 °C  
T
o
tal dissipation at T

pcb

= 25 °C  
W
W
(3)  
P

TOT  

4
T

J  

Operating junction temperature  
Storage temperature  
-55 to 150  
°C  
T

stg  

1. The
 
value is rated according to R  
2. The
 
value is rated according to R  
thj-case  
thj-pcb  
3. Pulse
 
width limited by safe operating area  
Table 3.  
Symbol  
Thermal resistance  
Parameter  
Value  
Unit  
R

thj-case  

Thermal resistance junction-case  
Thermal resistance junction-ambient  
2
°C/W  
°C/W  
(1)  
R

thj-pcb  

31.3  
1. When
 
mounted on FR-4 board of 1inch², 2oz Cu., t < 10 sec.  
Doc ID 023810 Rev 1  
3/16  

Electrical characteristics  
STL40N75LF3  
2
Electrical characteristics  
(T

CASE

= 25 °C unless otherwise specified).  
T
a
ble 4.  
Symbol  
On/off states  
Parameter  
Test conditions  
I

D

= 250 µA  
Min. Typ.  
Max.  
Unit  
Drain-source breakdown  
voltage (V

GS

= 0)  
V

(BR)DSS  

75  
V
V

DS

= 75
V
,  
1
µA  
µA  
Zero gate voltage drain  
current (V

GS

= 0)  
I

DSS  

V

DS

= 75
V
,
T

C

= 125 °C  
10  
Gate body leakage current  
(V

DS

= 0)  
I

GSS  

V

GS

= +20 / -16 V  
100  
nA  
V
V

GS(th)

Gate threshold voltage  
V

DS

= V

GS

, I

D

= 250 µA  
1
V

GS

= 10
V
,
I

D

= 20 A  
V

GS

= 5
V
,
I

D

= 20 A  
16  
19  
22  
m
Ω  
m
Ω  
Static drain-source on  
resistance  
R

DS(on)  

18.7  
T
a
ble 5.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
Input capacitance  
Output capacitance  
C

iss  

C

oss  

C

rss  

1300  
228  
15  
pF  
pF  
pF  
V

DS

= 25
V
,
f
=1 MHz,  
–
–
V

GS

=0  
Reverse transfer  
capacitance  
Q

g  

Q

gs  

Q

gd  

T
o
tal gate charge  
Gate-source charge  
Gate-drain charge  
V

DD

= 37.5
V
,
I

D

= 40 A  
V

GS

= 10 V  
12  
5
nC  
nC  
nC  
–
–
–
–
5.3  
f=1 MHz Gate DC Bias = 0  
T
e
st signal level = 20 mV  
open drain  
R

G  

Gate input resistance  
3.5  
Ω
T
a
ble 6.  
Symbol  
Switching times  
Parameter  
Test conditions  
Min. Typ. Max.
 
Unit  
t

d(on)  

t

r  

t

d(off)  

t

f  

T
u
rn-on delay time  
Rise time  
12  
25  
25  
3
ns  
ns  
ns  
ns  
V

DD

= 32.5
V
,
I

D

= 20 A,  
R

G

= 4.7
Ω
,
V

GS

=10 V  
–
–
T
u
rn-off delay time  
Fall time  
4/16  
Doc ID 023810 Rev 1  

STL40N75LF3  
Electrical characteristics  
Min Typ. Max Unit  
T
a
ble 7.  
Source drain diode  
Parameter  
Symbol  
Test conditions  
I

SD  

Source-drain current  
40  
160  
1.1  
A
A
V
–
–
(1)  
I

SDM  

Source-drain current (pulsed)  
Forward on voltage  
(2)  
V

SD  

I

SD

= 40 A, V

GS

=0  
t

rr  

Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
I

SD

= 40 A,  
35  
44  
27  
ns  
nC  
A
Q

rr  

di/dt = 100 A/µs,  
–
I

RRM  

V

DD

=60
V
,
T

j

=25 °C  
1. Pulse
 
width limited by safe operating area  
2. Pulsed:
 
pulse duration=300µs, duty cycle 1.5%  
Doc ID 023810 Rev 1  
5/16  

Electrical characteristics  
STL40N75LF3  
2.1  
Electrical characteristics (curves)  
Figure 2.  
Safe operating area  
Figure 3.  
Thermal impedance  
AM15409v1  
I
D
(A)  
100  
10  
1
10m
s
 
100m
s  
1
s  
Tj= 175°C  
Tc=25°C  
0.1  
S
ingle  
p
u
l
s
e  
0.01  
10  
V
D
S
(V)  
0.1  
1
Figure 4.  
Output characteristics  
Figure 5.  
Transfer characteristics  
AM15410v1  
AM15411v1  
I
D
(A)  
I
D
(A)  
V
D
S
= 4 V  
V
= 10 V  
G
S  
100  
100  
8
0  
8
0  
V
= 5 V  
G
S  
60  
60  
40  
20  
0
V
= 4 V  
G
S  
40  
20  
0
V
= 2 V  
G
S  
2
4
1
V
D
S
(V)  
5
6
8
V
G
S
(V)  
0
0
2
3
3
1
7
Figure 6.  
Gate charge vs gate-source voltage
 
Figure 7.  
Static drain-source on-resistance  
AM15412v1  
AM1541
3
v1  
V
(V)  
G
S  
R
D
S
(on)  
(m
Ω
)  
V
DD
=
3
7V  
=40A  
V
G
S
=10V  
3
0  
10  
I
D
25  
20  
15  
8
6
4
10  
2
0
5
0
Q
25  
g
(nC)  
40  
I
D  
(A)  
0
0
10  
20  
3
0  
20  
5
10  
15  
6/16  
Doc ID 023810 Rev 1  

STL40N75LF3  
Electrical characteristics  
Figure 8.  
Capacitance variations  
Figure 9.  
Normalized B

VDSS

vs temperature  
AM15414v1  
AM15415v1  
C
(pF)  
V
D
S  
(norm)  
1.15  
3
500  
I
D
= 1mA  
3
000  
1.1  
1.05  
2500  
2000  
1500  
1
0.95  
Ci
ss  
0.9  
0.
8
5  
0.
8  
1000  
500  
Co
ss  
Cr
ss  
D
S
(V)  
0
0
20  
-55  
–
3
0 -5
 
20 45
 
70  
10  
3
0  
V
T
J
(°C)  
40  
95  
120  
Figure 10.
 
Normalized gate threshold voltage
 
Figure 11.
 
Normalized on-resistance vs  
vs temperature
 
temperature  
AM15
3
44v1  
AM15417v1  
V
G
S
(th)  
R
D
S
(on)  
(norm)  
(norm)  
1.2  
V
G
S
=5V  
2
I
D
=250
µ
A  
1
1.5  
0.
8  
1
0.6  
0.5  
0
0.4  
0.2  
-55  
–
3
0  
-5  
20 45 70  
T
J
(°C)  
-55  
-5 20  
70  
95  
120  
I
D
(A)  
95  
120  
–
3
0  
45  
Figure 12.
 
Source-drain diode forward  
characteristics  
AM1541
8
v1  
V
S
D  
(V)  
T
J
=-50°C  
1
0.9  
T
J
=25°C  
0.
8  
0.7  
0.6  
0.5  
0.4  
T
J
=175°C  
0
10  
I
S
D
(A)  
20  
3
0  
40  
Doc ID 023810 Rev 1  
7/16  

Test circuits  
STL40N75LF3  
3
Test circuits  
Figure 13.
 
Switching times test circuit for  
resistive load  
Figure 14.
 
Gate charge test circuit  
V
DD  
12V  
47k
Ω  
1k
Ω  
100nF  
2200  
3
.
3  
μ
F  
R
L  
μ
F  
I
G
=CON
S
T  
V

DD  

100
Ω  
V

i

=20V=V
GMAX  
D.U.
T
.  
V
D  
R
G  
V
G
S
 
2200  
μ
F  
D.U.
T
.  
V

G  

2.7k
Ω  
47k
Ω  
P
W  
1k
Ω  
P
W  
AM0146
8
v1  
AM01469v1  
Figure 15.
 
Test circuit for inductive load  
switching and diode recovery times  
Figure 16.
 
Unclamped inductive load test  
circuit  
L
A
A
A
B
D
FA
S
T  
DIODE  
L=100
μ
H  
V
D  
G
2200  
μ
F  
D.U.
T
.  
B
3
.
3  
μ
F  
V
DD  
S
3
.
3  
μ
F  
1000  
μ
F  
B
V

DD  

25  
Ω
I
D  
D
G
R

G  

S
V
i  
D.U.
T
.  
P
w  
AM01470v1  
AM01471v1  
Figure 17.
 
Unclamped inductive waveform  
Figure 18.
 
Switching time waveform  
t
on  
td
on  
t
off  
td
off  
V
(BR)D
SS  
t
r  
t
f  
V
D  
90
%  
10
%  
90
%  
I
DM  
10
%  
V
D
S  
I
D  
0
0
V
DD  
V
DD  
90
%  
V

G
S  

10
%  
AM01472v1  
AM0147
3
v1  
8/16  
Doc ID 023810 Rev 1  

STL40N75LF3  
Package mechanical data  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECO
P
A
CK

®

packages, depending on their level of environmental compliance. ECO
P
ACK

®  

specifications, grade definitions and product status are available at:

.  
ECO
P
A
CK

®

is an ST trademark.  
Doc ID 023810 Rev 1  
9/16  

Package mechanical data  
STL40N75LF3  
Table 8.  
Dim.  
PowerFLAT™ 5×6 type C-B mechanical data  
mm  
Min.  
Typ.  
Max.  
A
A1  
A3  
b
0.80  
0
0.83  
0.02  
0.20  
0.40  
5.00  
4.75  
4.20  
6.00  
5.75  
3.48  
2.63  
1.27  
0.80  
0.93  
0.05  
0.35  
4.15  
0.47  
4.25  
D
D1  
D2  
E
E1  
E2  
E4  
e
3.43  
2.58  
3.53  
2.68  
L
0.70  
0.90  
10/16  
Doc ID 023810 Rev 1  

STL40N75LF3  
Figure 19.
 
PowerFLAT™ 5×6 type C-B drawing  
Bottom View  
Package mechanical data  
e/2  
e
1
PIN 1 IDENTIFIC
A
T
ION  
EXPO
S
ED
P
A
D  
E2  
E4  
b 8
x  
D2/2  
D2  
T
o
p View  
D/2  
E/2  
E1  
E
PIN 1 IDENTIFIC
A
T
ION  
1
D1  
D
0.1  
C
A
3
 
S
E
A
T
ING PLANE  
A
A1  
C
0.0
8  
C
72
8
646
3
_Rev_H  
Doc ID 023810 Rev 1  
11/16  

Package mechanical data  
STL40N75LF3  
Table 9.  
Dim.  
PowerFLAT™ 5×6 type S-C mechanical data  
mm  
Min.  
Typ.  
Max.  
A
A1  
A2  
b
0.80  
0.02  
1.00  
0.05  
0.25  
0.30  
0.50  
D
5.20  
6.15  
E
D2  
E2  
e
4.11  
3.50  
4.31  
3.70  
1.27  
0.65  
e1  
L
0.715  
1.05  
1.015  
1.35  
K
12/16  
Doc ID 023810 Rev 1  

STL40N75LF3  
Figure 20.
 
PowerFLAT™ 5×6 type S-C mechanical data  
Package mechanical data  
4
O
P VIEW  
“OTTOM VIEW  
3IDE VIEW  
ꢉꢅꢆꢄꢉꢄꢁ?$?TYPE #  
Doc ID 023810 Rev 1  
13/16  

Package mechanical data  
STL40N75LF3  
Figure 21.
 
PowerFLAT™ 5×6 recommended footprint (dimensions in mm)  
2%6?$?TYPE #  
14/16  
Doc ID 023810 Rev 1  

STL40N75LF3  
Revision history  
5
Revision history  
T
a
ble 10.
 
Document revision history  
Date  
Revision  
Changes  
19-Oct-2012  
1
First release.  
Doc ID 023810 Rev 1  
15/16  

STL40N75LF3  
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16/16  
Doc ID 023810 Rev 1