STMicroelectronics-STL52DN4LF7AG

Part #STMicroelectronics-STL52DN4LF7AG
Download 
STMicroelectronics-STL52DN4LF7AG
STL52DN4LF7AG  
Automotive-grade dual N-
channel 40 V, 9 mΩ typ., 18 A  
STripFET™ F7 Power MOSFET in a PowerFLAT™ 5×6 DI  
Datasheet – production data  
Features  
Order code  
V

DS  

R

DS(on)

max.  
I

D  

STL52DN4LF7AG  
40 V  
16 mΩ  
18 A  
AEC-Q101 qualified  
Among the lowest R

DS(on)

on the market  
Excellent FoM (figure of merit)  
Low C

rss

/C

iss

ratio for EMI immunity  
High avalanche ruggedness  
Wettable flank package  
Applications  
Switching applications  
Description  
This N-channel Power MOSFET utilizes  
STripFET™ F7 technology with an enhanced  
Figure 1: Internal schematic diagram  
trench gate structure that results in very low on-  
state resistance, while also reducing internal  
capacitance and gate charge for faster and more  
efficient switching.  
Table 1: Device summary  
Package  
PowerFLAT™ 5×6 double island  
Order code  
Marking  
Packing  
STL52DN4LF7AG  
52DN4LF7  
Tape and reel  
December 2017  
DocID029278 Rev 4  
1/16  
This is information on a product in full production.  

STL52DN4LF7AG  
Electrical ratings  
1
Electrical ratings  
Table 2: Absolute maximum ratings  
Symbol  
V

DS  

Parameter  
Value  
40  
Unit  
V
Drain-source voltage  
V

GS  

Gate-source voltage  
±20  
18  
V
Drain current (continuous) at T

C

= 25 °C  
Drain current (continuous) at T

c

= 100 °C  
Drain current (pulsed)  
A
18  
A
72  
A
P

TOT  

T

stg  

T

J  

Total dissipation at T

C

= 25 °C  
Storage temperature range  
65  
W
-55 to 175  
°C  
Operation junction temperature range  
Notes:  

(1)

Drain current is limited by package, the current capability of the silicon is 46 A at 25 °C and 33 A at 100 °C.  

(2)

Pulse width limited by safe operating area  
Table 3: Thermal data  
Symbol  
Parameter  
Thermal resistance junction-case  
Thermal resistance junction-pcb  
Value  
2.3  
Unit  
R

thj-case  

°C/W  
R

thj-p

32  
Notes:  

(1)

When mounted on FR-4 board of 1 inch², 2oz Cu, t < 10 s  
DocID029278 Rev 4  
3/16  
 
 

Electrical characteristics  
STL52DN4LF7AG  
2
Electrical characteristics  
(T

C

= 25 °C unless otherwise specified)  
Table 4: On/Off states  
Symbol  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
Drain-source breakdown  
voltage  
V

(BR)DSS  

I

D

= 1 mA, V

GS

= 0 V  
40  
V
Zero gate voltage  
drain current  
V

GS

= 0 V  
I

DSS  

10  
µA  
V

DS

= 40 V  
Gate-body leakage  
current  
I

GSS  

V

GS

= ± 20 V, V

DS

= 0 V  
100  
nA  
V
V

GS(th)  

Gate threshold voltage  
V

DS

= V

GS

, I

D

= 250 μA  
V

GS

= 10 V, I

D

= 6 A  
V

GS

= 4.5 V, I

D

= 6 A  
1.5  
2.5  
16  
20  
9
Static drain-source  
on-resistance  
R

DS(on)  

mΩ  
12  
Table 5: Dynamic  
Test conditions  
Symbol  
C

iss  

Parameter  
Input capacitance  
Output capacitance  
Min. Typ. Max. Unit  
–
–
500  
140  
–
–
pF  
pF  
V

DS

= 25 V, f = 1 MHz,  
V

GS

= 0 V  
C

oss  

Reverse transfer  
capacitance  
C

rss  

–
20  
–
pF  
Q

g  

Total gate charge  
V

DD

= 20 V, I

D

= 12 A,  
V

GS

= 0 to 10 V  
–
–
9.4  
1.6  
–
–
nC  
nC  
Q

gs  

Gate-source charge  
Q

gd  

Gate-drain charge  
–
2
–
nC  
Table 6: Switching times  
Test conditions  
Symbol  
t

d(on)  

t

r  

Parameter  
Turn-on delay time  
Rise time  
Min. Typ. Max. Unit  
V

DD

= 32 V, I

D

= 6 A,  
6.5  
5
–
–
–
–
–
–
ns  
ns  
ns  
R

G

= 4.7 Ω, V

GS

= 10 V  
48  
t

d(off)  

Turn-off delay time  
t

f  

Fall time  
–
14.5  
–
ns  
4/16  
DocID029278 Rev 4  
 
 
 
 

STL52DN4LF7AG  
Symbol  
Electrical characteristics  
Min. Typ. Max. Unit  
Table 7: Source-drain diode  
Test conditions  
Parameter  
Source-drain  
current  
–
–
18  
72  
A
A
Source-drain  
current  
(pulsed)  
Forward on  
voltage  
I

SD

= 12 A, V

GS

= 0 V  
–
–
–
–
1.3  
V
ns  
nC  
A
Reverse  
recovery time  
t

rr  

18  
7.5  
0.8  
I

SD

= 12 A, di/dt = 100 A/µs  
V

DD

= 32 V  
Reverse  
recovery charge  
Q

rr  

Reverse  
recovery current  
I

RRM  

Notes:  

(1)

Drain current is limited by package, the current capability of the silicon is 46 A at 25 °C.  

(2)

Pulse width limited by safe operating area.  

(3)

Pulsed: pulse duration = 300 µs, duty cycle 1.5%  
DocID029278 Rev 4  
5/16  
 
 
 
 

Electrical characteristics  
STL52DN4LF7AG  
2.1  
Electrical characteristics (curves)  
Figure 2: Safe operating area  
Figure 3: Thermal impedance  
Figure 4: Output characteristics  
Figure 5: Transfer characteristics  
Figure 6: Gate charge vs gate-source voltage  
Figure 7: Static drain-source on-resistance  
6/16  
DocID029278 Rev 4  

STL52DN4LF7AG  
Figure 8: Capacitance variations  
Electrical characteristics  
Figure 9: Normalized gate threshold voltage vs  
temperature  
Figure 10: Normalized on-resistance vs temperature  
Figure 11: Normalized V

(BR)DSS

vs temperature  
Figure 12: Source-drain diode forward characteristics  
DocID029278 Rev 4  
7/16  

Test circuits  
STL52DN4LF7AG  
3
Test circuits  
Figure 13: Test circuit for resistive load  
switching times  
Figure 14: Test circuit for gate charge  
behavior  
Figure 15: Test circuit for inductive load  
switching and diode recovery times  
Figure 16: Unclamped inductive load test  
circuit  
Figure 18: Switching time waveform  
Figure 17: Unclamped inductive waveform  
8/16  
DocID029278 Rev 4  

STL52DN4LF7AG  
Package information  
4
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK

®  

specifications, grade definitions and product status are available at:

.  
ECOPACK

®

is an ST trademark.  
DocID029278 Rev 4  
9/16  

Package information  
STL52DN4LF7AG  
4.1  
PowerFLAT™ 5×6 double island WF type R
 
package  
information  
Figure 19
: PowerFLAT™ 5×6 double island WF type R package outline  
8256945_r16_typeR-WF  
10/16  
DocID029278 Rev 4  

STL52DN4LF7AG  
Package information  
Table 8: PowerFLAT™ 5×6 double island WF type R mechanical data  
mm  
Dim.  
Min.  
0.80  
0.02  
Typ.  
Max.  
1.00  
0.05  
A
A1  
A2  
b
0.25  
0.30  
5.80  
5.00  
4.15  
4.05  
4.80  
0.25  
0.15  
1.68  
0.50  
6.10  
5.40  
4.45  
4.35  
5.10  
0.55  
0.45  
1.98  
C
6.00  
5.20  
D
D2  
D3  
D4  
D5  
D6  
D7  
e
4.20  
5.00  
0.40  
0.30  
1.27  
6.40  
E
6.20  
3.50  
2.35  
0.40  
0.08  
0.20  
0.85  
0.55  
4.00  
3.55  
1.275  
0.725  
0.175  
0°  
6.60  
3.70  
2.55  
0.60  
0.28  
0.45  
1.15  
0.75  
4.40  
3.85  
1.575  
0.925  
0.375  
12°  
E2  
E3  
E4  
E5  
E6  
E7  
E8  
E9  
E10  
K
0.325  
1.00  
4.20  
3.70  
L
0.825  
0.275  
L1  
θ
DocID029278 Rev 4  
11/16  

Package information  
STL52DN4LF7AG  
Figure 20
: PowerFLAT™ 5×6 double island recommended footprint (dimensions
are in mm)  
8256945_FP_std_R16  
12/16  
DocID029278 Rev 4  

STL52DN4LF7AG  
Package information  
4.2  
Packing information  
Figure 21
: PowerFLAT™ 5×6 WF tape (dimensions are in mm)  
Figure 22
: PowerFLAT™ 5×6 package orientation in carrier tape  
DocID029278 Rev 4  
13/16  

Package information  
STL52DN4LF7AG  
Figure 23
: PowerFLAT™ 5×6 reel (dimensions are in mm)  
14/16  
DocID029278 Rev 4  

STL52DN4LF7AG  
Revision history  
5
Revision history  
Table 9: Document revision history  
Changes  
Date  
Revision  
28-Apr-2016  
1
First release.  
Updated
Figure 1: “Internal schematic diagram”
and
Section 7.1:  
“PowerFLAT™ 5×6 double island WF type R package information”  
20-Jun-2016  
13-Sep-2016  
2
3
Minor text changes.  
Updated
Section 5: “Electrical characteristics”  
Datasheet promoted from preliminary data to production data.  
Modified title.  
18-Dec-2017  
4
Minor text changes.  
DocID029278 Rev 4  
15/16  

STL52DN4LF7AG  
IMPORTANT NOTICE
–
PLEASE READ CAREFULLY  
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications
, and  
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST  
products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of or
der  
acknowledgement.  
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the  
design of Purchasers’ products.  
No license, express or implied, to any intellectual property right is granted by ST herein.  
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.  
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2017 STMicroelectronics
–
All rights reserved  
16/16  
DocID029278 Rev 4