STMicroelectronics-STL65N3LLH5

Part #STMicroelectronics-STL65N3LLH5
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STMicroelectronics-STL65N3LLH5
STL65N3LLH5  
N-channel 30
V
,
0
.0048
Ω
, 19 A, PowerFL
A
T
™ 5×6  
S
T
r
ipFET™ V Power MOSFET  
Features  
R

DS(on)  

max  
<0.0058
Ω
19 A

(1)  

Order code  
V

DSS  

30 V  
I

D  

STL65N3LLH5  
1. The
 
value is rated according R  
thj-pcb  
1
2
3
■
R

DS(on)

* Q

g

industry benchmark  
■
Extremely low on-resistance R

DS(on)  

■
Very low switching gate charge  
■
High avalanche ruggedness  
4
PowerFLAT™ 5×6  
■
Low gate drive power losses  
Applications  
Figure 1.  
Internal schematic diagram  
■
Switching applications  
ꢉ
ꢁ
ꢃ
ꢈ
ꢈ
ꢃ
ꢁ
ꢉ
Description  
$
$
$
$
This device is an N-channel Power MOSFET  
developed using STMicroelec
ronics’  
S
T
r
ipFET™V technolog
y
.
T
he device has been  
optimized to achieve
ery low on-state resistance,  
contributing to an FOM that is among the best in  
its class.  
‘
ꢇ
3
ꢆ
3
ꢅ
3
ꢄ
ꢄ
ꢅ
ꢆ
ꢇ
“OTTOM 6IEW  
4
O
P 6IEW  
!-ꢀꢁꢂꢃꢃ6ꢄ  
Table 1.  
Order code  
STL65N3LLH5  
Device summary  
Marking  
Package  
Packaging  
T
a
pe and reel  
65N3LLH5  
PowerFL
A
T
™ 5×6  
December 2011  
Doc ID 14299 Rev 5  
1/16  
16  

STL65N3LLH5  
Electrical ratings  
1
Electrical ratings  
T
a
ble 2.  
Symbol  
Absolute maximum ratings  
Parameter  
Value  
30  
22  
Unit  
V

DS  

V

GS  

Drain-source voltage  
V
V
Gate-source voltage  
(1)  
I

D  

Drain current (continuous) at T

C

= 25 °C  
Drain current (continuous) at T

C

= 100 °C  
Drain current (continuous) at T

pcb

= 25 °C  
Drain current (continuous) at T

pcb

=100°C  
Drain current (pulsed)  
65  
41  
A
(1)  
I

D  

A
(2)  
I

D  

19  
A
(2)  
I

D  

11.8  
76  
A
(3)  
I

DM  

A
(1)  
P

TOT  

T
o
tal dissipation at T

C

= 25°C  
T
o
tal dissipation at T

pcb

= 25°C  
Derating factor  
60  
W
W
W/°C  
(2)  
P

TOT  

4
0.03  
T

J  

Operating junction temperature  
Storage temperature  
-55 to 150  
°C  
T

stg  

1. The
 
value is rated according to R  
2. The
 
value is rated according to R  
thj-c  
thj-pcb  
3. Pulse
 
width limited by safe operating area  
Table 3.  
Symbol  
Thermal resistance  
Parameter  
Value  
Unit  
R

thj-c
se  

Thermal resistance junction-case  
Thermal resistance junction-pcb  
2.08  
31.3  
°C/W  
°C/W  
(1)  
R

thj-pcb  

1. When
 
mounted on FR-4 board of 1inch², 2oz Cu, t < 10 sec  
T
a
ble 4.  
Symbol  
Avalanche data  
Parameter  
Value  
Unit  
Not-repetitive avalanche current,  
(pulse width limited by Tj Max)  
I

AV  

8.5  
A
Single pulse avalanche energy  
E

AS  

180  
mJ  
(starting T

J

= 25 °C, I

D

= I

AV

, V

DD

= 24 V)  
Doc ID 14299 Rev 5  
3/16  
 

Electrical characteristics  
STL65N3LLH5  
2
Electrical characteristics  
(T

CASE

=25°C unless otherwise specified)  
Table 5.  
Symbol  
On/off states  
Parameter  
Test conditions  
Min. Typ.  
Max. Unit  
Drain-source breakdown  
voltage  
V

(BR)DSS  

I

D

= 250 µA, V

GS

= 0  
30  
V
V

DS

= 30
V
,  
Zero gate voltage drain  
current (V

GS

= 0)  
1
µA  
µA  
I

DSS  

V

DS

= 30 V at T

C

= 125 °C  
10  
Gate body leakage current  
(V

DS

= 0)  
I

GSS  

V

GS

= 22
 
V  
100  
2.5  
nA  
V
V

GS(th)  

R

DS(on)  

V

DS

= V

GS

, I

D

= 250 µA  
Gate threshold voltage  
1
.65  
V

GS

= 10
V
,
I

D

= 9.5 A  
0.0048 0.0058  
0.006 0.0075  
Ω
Ω
Static drain-source on  
resistance  
V

GS

= 4.5
V
,
I

D

= 9.5 A  
Table 6.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
C

iss  

C

oss  

C

rss  

Input capacitance  
Output capacitance  
1500  
295  
39  
pF  
pF  
pF  
V

DS

=25
V
,
f
=1 MHz,  
–
–
–
–
V

GS

=0  
Reverse transfer  
capacitance  
Q

g  

Q

gs  

Q

gd  

V

DD

=15
V
,
I

D

= 19 A  
T
o
tal
e charge  
Ga
-source charge  
Gate-drain charge  
12  
4
nC  
nC  
nC  
V

GS

=4.5 V  
4.7  
4/16  
Doc ID 14299 Rev 5  
 

STL65N3LLH5  
Electrical characteristics  
Min. Typ. Max.
 
Unit  
Table 7.  
Switching times  
Parameter  
Symbol  
Test conditions  
t

d(on)  

t

r  

t

d(off)  

t

f  

T
u
rn-on delay time  
Rise time  
9.3  
14.5  
22.7  
4.5  
ns  
ns  
ns  
ns  
V

DD

=15
V
,
I

D

= 9.5 A,  
R

G

=4.7
Ω
,
V

GS

=10 V  
–
–
T
u
rn-off delay time  
Fall time  
T
a
ble 8.  
Symbol  
Source drain diode  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
I

SD  

Source-drain current  
–
–
–
19  
76  
A
A
V
(1)  
Source-drain current (pulsed)  
Forward on voltage  
I

SDM  

(2)  
I

SD

= 19 A, V

GS

=0  
1.1  
V

SD  

t

rr  

I

SD

= 19 A,  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
25  
17.5  
1.4  
ns  
nC  
A
Q

rr  

di/dt = 100 A/µs,  
–
V

DD

=25
V
,
T
j=150 °C  
I

RRM  

1. Pulse
 
width limited by safe operating area  
2. Pulsed:
 
pulse duration=300µs, duty cycle 1
Doc ID 14299 Rev 5  
5/16  

Electrical characteristics  
STL65N3LLH5  
2.1  
Electrical characteristics (curves)  
Figure 2.
 
Safe operating area  
Figure 3.
 
Thermal impedance  
HV42910  
I
D
(A)  
T
J
=150°C  
T
C
=25°C  
100  
10  
1
S
ingle p
u
l
s
e  
10 m
s  
100 m
s  
1
s  
0.1  
0.01  
0.1  
1
10  
V
S
D
(V)  
Figure 4.
 
Output characteristics  
Figure 5.
 
Transfer
aracteristics  
Figure 6.
 
Normalized B

VDSS

vs temperature  
Figure 7.
 
Static drain-source on resistance  
HV42990  
HV42950  
BV
D
SS  
R
D
S
(on)  
(
Ω
)  
(norm)  
1.1  
I
D
=17.5A  
V

G
S

=10V  
5
1.0
8
 
I
D
=1 mA  
1.06  
1.04  
1.02  
1
4.5  
4
3
.5  
3
0.9
8  
0.96  
0.94  
0.92  
22  
27  
-55 –
3
0  
12  
17  
7
-5  
20 45  
70  
95 120  
2
I

D

(A)  
145  
T
J
(°C)  
6/16  
Doc ID 14299 Rev 5  
 

STL65N3LLH5  
Electrical characteristics  
Figure 8.
 
Gate charge vs gate-source voltage
 
Figure 9.
 
Capacitance variations  
HV429
3
0  
HV42940  
C(pF)  
V
G
S
(V)  
f=1MHz  
G
S
=0  
I
V
V
D
=14 A  
12  
V
G
S
=5 V  
DD
=15 V  
2000  
1500  
1000  
500  
0
10  
8
Ci
ss  
6
4
Cr
ss  
Co
ss  
2
0
0
5
10  
15  
20  
Qg(nC)  
0
10  
20  
C(pF)  
Figure 10.
 
Normalized gate threshold voltage
 
Figure 11.
 
Normalized on re
stance vs  
vs temperature  
temperature  
HV42970  
HV42960  
R

D
S
(on)  

V

G
S
(th)  

(norm)  
(norm)  
1.
8
 
1.6  
1.
1.2  
1
1.2  
1
I
D
=250
µ
A  
I
8
.5 A  
V

G
S

=10 V  
0.
8  
0.6  
0.4  
0.2  
0
0.
8  
0.6  
0.4  
0.2  
0
-55  
45 7
95 120
 
145 T

J

(°C)  
–
3
0 -5  
20  
-55 –
3
0 -5  
20 45
 
70 95  
T

J

(°C)  
120 145  
Figure 12.
 
Source
drain diode forward  
characteristics  
HV429
8
0  
V
S
D
(V)  
0.9  
T
J
=-55 °C  
0.
8  
0.7  
0.6  
0.5  
0.4  
T
J
=25 °C  
T
J
=150 °C  
0
5
10  
15  
I
S
D
(A)  
Doc ID 14299 Rev 5  
7/16  
 

Test circuits  
STL65N3LLH5  
3
Test circuits  
Figure 13.
 
Switching times test circuit for  
resistive load  
Figure 14.
 
Gate charge test circuit  
V
DD  
12V  
47k
Ω  
100nF  
1k
Ω  
2200  
3
.
3  
μ
F  
R
L  
μ
F  
I
G
=CON
S
T  
V

DD  

100
Ω  
V

i

=20V=V
GMAX  
D.U.
T
.  
V
D  
R
G  
V
G
S
 
2200  
μ
F  
D.U.
T
.  
V

G  

2.7k
Ω  
47k
Ω  
P
W  
1k
Ω  
P
W  
AM0146
8
v1  
AM01469v1  
Figure 15.
 
Test circuit for inductive load  
switching and diode recovery times  
Figure 16.
 
Unclamped inductive load test  
circuit  
L
A
A
A
B
D
FA
S
T  
DIODE  
L=100
μ
H  
V
D  
G
2200  
μ
F  
D.U.
T
.  
B
3
.
3  
μ
F  
V
DD  
S
3
.
3  
μ
F  
1000  
μ
F  
B
V

DD  

25  
Ω
I
D  
D
G
R

G  

S
V
i  
D.U.
T
.  
P
w  
AM01470v1  
AM01471v1  
Figure 17.
 
Unclamped inductive waveform  
Figure 18.
 
Switching time waveform  
t
on  
td
on  
t
off  
td
off  
V
(BR)D
SS  
t
r  
t
f  
V
D  
90
%  
10
%  
90
%  
I
DM  
10
%  
V
D
S  
I
D  
0
0
V
DD  
V
DD  
90
%  
V

G
S  

10
%  
AM01472v1  
AM0147
3
v1  
8/16  
Doc ID 14299 Rev 5  

STL65N3LLH5  
Package mechanical data  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECO
P
A
CK

®

packages, depending on their level of environmental compliance. ECO
P
ACK

®  

is an ST trademark.  
Doc ID 14299 Rev 5  
9/16  
 

Package mechanical data  
STL65N3LLH5  
Table 9.  
Dim.  
PowerFLAT™ 5×6 type C-B mechanical data  
mm  
Min.  
Typ.  
Max.  
A
A1  
A3  
b
0.80  
0
0.83  
0.02  
0.20  
0.40  
5.00  
4.75  
4.20  
6.00  
5.75  
3.48  
2.63  
1
7  
0.80  
0.93  
0.05  
0.35  
4.15  
0.47  
4.25  
D
D1  
D2  
E
E1  
E2  
E4  
e
3.43  
2.58  
3.53  
2.68  
L
0.70  
0.90  
10/16  
Doc ID 14299 Rev 5  

STL65N3LLH5  
Figure 19.
 
PowerFLAT™ 5×6 type C-B drawing  
Bottom View  
Package mechanical data  
e/2  
e
1
PIN 1 IDENTIFIC
A
T
ION  
EXPO
S
ED
P
A
D  
E2  
E4  
b 8
x  
D2/2  
D2  
T
o
p View  
D/2  
E/2  
E1  
E
PIN 1 ID
IFIC
A
T
ION  
1
D1  
D
0.1  
C
A
3
 
S
E
A
T
ING PLANE  
A
A1  
C
0.0
8  
C
72
8
646
3
_Rev_H  
Doc ID 14299 Rev 5  
11/16  

Package mechanical data  
STL65N3LLH5  
Table 10.
 
PowerFLAT™ 5×6 type S-C mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
A1  
A2  
b
0.80  
0.02  
1.00  
0.05  
0.25  
0.30  
0.50  
D
5.20  
6.15  
E
D2  
E2  
e
4.11  
3.50  
4.31  
3.70  
1.27  
0.65  
e1  
L
0.715  
1.05  
1.015  
1.35  
K
12/16  
Doc ID 14299 Rev 5  

STL65N3LLH5  
Figure 20.
 
PowerFLAT™ 5×6 type S-C mechanical data  
Package mechanical data  
4
O
P VIEW  
“OTTOM VIEW  
3IDE VIEW  
ꢉꢅꢆꢄꢉꢄꢁ?$?TYPE #  
Doc ID 14299 Rev 5  
13/16  

Package mechanical data  
STL65N3LLH5  
Figure 21.
 
PowerFLAT™ 5×6 recommended footprint (dimensions in mm)  
5.
3
5  
4.41  
0.62  
1.27  
Footprint  
14/16  
Doc ID 14299 Rev 5  

STL65N3LLH5  
Revision history  
5
Revision history  
T
a
ble 11.
 
Document revision history  
Date  
Revision  
Changes  
04-Jan-2007  
01-Apr-2008  
07-May-2008  
23-Sep-2008  
1
2
3
4
First release  
Document status promoted from preliminary data to datasheet.  
V

GS

value has been changed on

and

.  
Minor text changes.  
02-Dec-2011  
5
Doc ID 14299 Rev 5  
15/16  

STL65N3LLH5  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and serv
s described herein at any  
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Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no  
liability whatsoever relating to the choice, selection or use of the ST products and services de
cribed herein.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this  
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se grant by ST for the use of such third party products  
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ERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS “AUTOMOTIVE  
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oducts with provisions different from the statements and/or technical features set forth in this document shall immediately void  
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ST and the ST logo are trademarks or registered trademarks of ST in various countries.  
Information in this document supersedes and replaces all information previously supplied.  
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16/16  
Doc ID 14299 Rev 5