STMicroelectronics-STN3NF06
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STN3NF06
N-channel 60V – 0.07
Ω
-4A – SO
T
–
223
S
T
r
ipFET™ II Power MOSFET
General features
V
DSS
Type
R
DS(on)
I
D
4A
(@Tjmax)
2
STN3NF06
60V
<0.1
Ω
3
2
■
Exceptional dv/dt capability
■
100% avalanche tested
1
SO
T
–
223
■
Avalanche rugged technology
Description
This Power MOSFET is the latest development of
STMicroelectronics unique “Single Feature
Size™” strip-based process. The resulting
transistor shows extremely high packing density
for low on-resistance, rugged avalanche
characteristics and less critical alignment steps
therefore a remarkable manufacturing
reproducibilit
y
.
Internal schematic diagram
Applications
■
Switching application
Order codes
Part number
Marking
Package
Packaging
STN3NF06
N3NF06
SO
T
–
223
T
a
pe & reel
February 2007
Rev 6
1/12
12
Contents
STN3NF06
Contents
Electrical ratings
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Test circuit
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2/12
STN3NF06
Electrical ratings
1
Electrical ratings
Table 1.
Symbol
Absolute maximum ratings
Parameter
Value
Unit
V
DS
V
GS
I
D
Drain-source voltage (V
GS
= 0)
Gate-source voltage
60
20
V
V
Drain current (continuous) at T
C
= 25°C
Drain current (continuous) at T
C
=100°C
Drain current (pulsed)
4
A
I
D
2.9
16
A
(1)
I
DM
A
P
TOT
T
o
tal dissipation at T
C
= 25°C
Derating factor
3.3
0.026
10
W
W/°C
V/ns
mJ
dv/dt
(2)
Peak diode recovery voltage slope
Single pulse avalanche energy
(3)
E
AS
200
T
J
Operating junction temperature
Storage temperature
-55 to 150
°C
T
stg
1. Pulse
width limited by safe operating area
2. I
SD
≤
4
A, di/dt
≤
150
A
/µ
s
,
V
DD
≤
V
(BR)DSS
, T
J
≤
T
JMAX
3. Starting
T
j
= 25
o
C, I
D
= 4A, V
DD
= 30V
Table 2.
Rthj-pcb
Thermal data
Thermal resistance junction-PCB
(1)
max
38
°C/W
°C/W
Rthj-pcb
T
l
(3)
Thermal resistance junction-PCB
(2)
max
100
Maximum lead temperature for soldering
purpose typ
260
°C
1. When
Mounted on FR-4 board with 1 inch
2
pad, 2 oz. of Cu. and t
<
10 sec.
2. When
Mounted on minimum recommended footprint
3. for
10 sec. 1.6 mm from case
3/12
Electrical characteristics
STN3NF06
2
Electrical characteristics
(T
=25°C unless otherwise specified)
CASE
Table 3.
Symbol
On/off states
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Drain-source breakdown
voltage
I
D
= 250 µA, V
GS
= 0
V
(BR)DSS
60
V
V
DS
= Max rating,
1
µA
µA
Zero gate voltage drain
current (V
GS
= 0)
I
DSS
V
DS
= Max rating @125°C
10
Gate body leakage current
(V
DS
= 0)
V
GS
= 20V
I
GSS
100
nA
V
DS
= V
GS
, I
D
= 250µA
V
GS
= 10
V
,
I
D
= 1.5A
V
GS(th)
Gate threshold voltage
2
3
4
V
Static drain-source on
R
DS(on)
0.07
0.10
Ω
resistance
Table 4.
Symbol
Dynamic
Parameter
Test conditions
Min.
Typ.
Max. Unit
(1)
V
DS
= 15
V
,
I
D
=1.5A
g
fs
Forward transconductance
3
S
Input capacitance
Output capacitance
C
iss
C
oss
C
rss
315
70
pF
pF
pF
V
DS
=25
V
,
f
=1 MHz, V
GS
=0
Reverse transfer
capacitance
30
Q
g
Q
gs
Q
gd
T
o
tal gate charge
Gate-source charge
Gate-drain charge
V
DD
=48
V
,
I
D
= 3A
V
GS
=10V
10
3.5
3.5
13
nC
nC
nC
1. Pulsed:
pulse duration=300µs, duty cycle 1.5%
Table 5.
Symbol
Switching times
Parameter
Test conditions
Min. Typ. Max.
Unit
V
DD
=30
V
,
I
D
=1.5A,
R
G
=4.7
Ω
,
V
GS
=10V
t
d(on)
t
r
T
u
rn-on delay time
rise time
7
ns
ns
18
V
DD
=30
V
,
I
D
=1.5A,
R
G
=4.7
Ω
,
V
GS
=10V
17
6
t
d(off)
t
f
T
u
rn-off delay time
fall time
ns
ns
4/12
STN3NF06
Electrical characteristics
Min. Typ. Max Unit
Table 6.
Symbol
Source drain diode
Parameter
Test conditions
I
SD
Source-drain current
4
A
A
(1)
I
SDM
Source-drain current (pulsed)
16
(2)
I
SD
=4A, V
GS
=0
Forward on voltage
1.3
V
V
SD
I
SD
=4 A,
t
rr
Reverse recovery time
Reverse recovery charge
Reverse recovery current
50
88
ns
nC
A
di/dt = 100A/µs,
V
DD
=25
V
,
T
j=150°C
Q
rr
3.5
I
RRM
1. Pulse
width limited by safe operating area.
2. Pulsed:
pulse duration=300µs, duty cycle 1.5%
5/12
Electrical characteristics
STN3NF06
2.1
Electrical characteristics (curves)
Figure 1.
Safe operating area
Figure 2.
Thermal impedance
Figure 3.
Output characteristics
Figure 4.
Transfer characteristics
Figure 5.
Transconductance
Figure 6.
Static drain-source on resistance
6/12
STN3NF06
Electrical characteristics
Figure 7.
Gate charge vs. gate-source voltage
Figure 8.
Capacitance variations
Figure 9.
Normalized gate threshold voltage
Figure 10.
Normalized on resistance vs.
vs. temperature
temperature
Figure 11.
Source-drain diode forward
characteristics
Figure 12.
Normalized
b
reakdown voltage vs.
temperature
7/12
Test circuit
STN3NF06
3
Test circuit
Figure 13.
Switching times test circuit for
resistive load
Figure 14.
Gate charge test circuit
Figure 15.
Test circuit for inductive load
switching and diode recovery times
Figure 16.
Unclamped Inductive load test
circuit
Figure 17.
Unclamped inductive waveform
Figure 18.
Switching time waveform
8/12
STN3NF06
Package mechanical data
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECO
P
A
CK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECO
P
ACK is an ST trademark.
9/12
Package mechanical data
STN3NF06
SOT-223 MECHANICAL DATA
mm
mils
TYP.
90.6
181.1
15.7
25.6
63
DIM.
MIN.
2.27
4.57
0.2
TYP.
2.3
MAX.
2.33
4.63
0.6
MIN.
89.4
179.9
7.9
MAX.
a
b
91.7
182.3
23.6
4.6
c
0.4
d
0.63
1.5
0.65
1.6
0.67
1.7
24.8
59.1
26.4
e1
e4
f
66.9
0.32
3.1
12.6
2.9
0.67
6.7
3
114.2
26.4
118.1
27.6
122.1
28.7
g
0.7
7
0.73
7.3
l1
l2
L
263.8
137.8
248
275.6
137.8
255.9
287.4
145.7
263.8
3.5
3.5
6.5
3.7
6.3
6.7
L
l2
d
a
e4
c
b
f
C
C
B
E
g
P008B
10/12
STN3NF06
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12/12
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