STMicroelectronics-STN3NF06

Part #STMicroelectronics-STN3NF06
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STMicroelectronics-STN3NF06
STN3NF06  
N-channel 60V – 0.07
Ω
-4A – SO
T
–
223  
S
T
r
ipFET™ II Power MOSFET  
General features  
V

DSS  

Type  
R

DS(on)  

I

D  

4A  
(@Tjmax)  
2
STN3NF06  
60V  
<0.1
Ω  
3
2
■
Exceptional dv/dt capability  
■
100% avalanche tested  
1
SO
T
–
223  
■
Avalanche rugged technology  
Description  
This Power MOSFET is the latest development of  
STMicroelectronics unique “Single Feature  
Size™” strip-based process. The resulting  
transistor shows extremely high packing density  
for low on-resistance, rugged avalanche  
characteristics and less critical alignment steps  
therefore a remarkable manufacturing  
reproducibilit
y
.  
Internal schematic diagram  
Applications  
■
Switching application  
Order codes  
Part number  
Marking  
Package  
Packaging  
STN3NF06  
N3NF06  
SO
T
–
223  
T
a
pe & reel  
February 2007  
Rev 6  
1/12  
12  

STN3NF06  
Electrical ratings  
1
Electrical ratings  
Table 1.  
Symbol  
Absolute maximum ratings  
Parameter  
Value  
Unit  
V

DS  

V

GS  

I

D  

Drain-source voltage (V

GS

= 0)  
Gate-source voltage  
60  
20  
V
V
Drain current (continuous) at T

C

= 25°C  
Drain current (continuous) at T

C

=100°C  
Drain current (pulsed)  
4
A
I

D  

2.9  
16  
A
(1)  
I

DM  

A
P

TOT  

T
o
tal dissipation at T

C

= 25°C  
Derating factor  
3.3  
0.026  
10  
W
W/°C  
V/ns  
mJ  
dv/dt

(2)  

Peak diode recovery voltage slope  
Single pulse avalanche energy  
(3)  
E

AS  

200  
T

J  

Operating junction temperature  
Storage temperature  
-55 to 150  
°C  
T

stg  

1. Pulse
 
width limited by safe operating area  
2. I

SD

≤
4
A, di/dt
≤
150
A
/µ
s
,
V

DD

≤
V

(BR)DSS

, T

J

≤
T

JMAX  

3. Starting
 
T

j

= 25

o

C, I

D

= 4A, V

DD

= 30V  
Table 2.  
Rthj-pcb  
Thermal data  
Thermal resistance junction-PCB

(1)

max  
38  
°C/W  
°C/W  
Rthj-pcb  
T

l

(3)  

Thermal resistance junction-PCB

(2)

max  
100  
Maximum lead temperature for soldering  
purpose typ  
260  
°C  
1. When
 
Mounted on FR-4 board with 1 inch

2

pad, 2 oz. of Cu. and t
<
10 sec.  
2. When
 
Mounted on minimum recommended footprint  
3. for
 
10 sec. 1.6 mm from case  
3/12  
 
 

Electrical characteristics  
STN3NF06  
2
Electrical characteristics  
(T  
=25°C unless otherwise specified)  
CASE  
Table 3.  
Symbol  
On/off states  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
Drain-source breakdown  
voltage  
I

D

= 250 µA, V

GS

= 0  
V

(BR)DSS  

60  
V
V

DS

= Max rating,  
1
µA  
µA  
Zero gate voltage drain  
current (V

GS

= 0)  
I

DSS  

V

DS

= Max rating @125°C  
10  
Gate body leakage current  
(V

DS

= 0)  
V

GS

= 20V  
I

GSS  

100  
nA  
V

DS

= V

GS

, I

D

= 250µA  
V

GS

= 10
V
,
I

D

= 1.5A  
V

GS(th)

Gate threshold voltage  
2
3
4
V
Static drain-source on  
R

DS(on)  

0.07  
0.10  
Ω
resistance  
Table 4.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min.  
Typ.  
Max. Unit  
(1)  
V

DS

= 15
V
,
I

D

=1.5A  
g

fs  

Forward transconductance  
3
S
Input capacitance  
Output capacitance  
C

iss  

C

oss  

C

rss  

315  
70  
pF  
pF  
pF  
V

DS

=25
V
,
f
=1 MHz, V

GS

=0  
Reverse transfer  
capacitance  
30  
Q

g  

Q

gs  

Q

gd  

T
o
tal gate charge  
Gate-source charge  
Gate-drain charge  
V

DD

=48
V
,
I

D

= 3A  
V

GS

=10V  
10  
3.5  
3.5  
13  
nC  
nC  
nC  
1. Pulsed:
 
pulse duration=300µs, duty cycle 1.5%  
Table 5.  
Symbol  
Switching times  
Parameter  
Test conditions  
Min. Typ. Max.
 
Unit  
V

DD

=30
V
,
I

D

=1.5A,  
R

G

=4.7
Ω
,
V

GS

=10V  
t

d(on)  

t

r  

T
u
rn-on delay time  
rise time  
7
ns  
ns  
18  
V

DD

=30
V
,
I

D

=1.5A,  
R

G

=4.7
Ω
,
V

GS

=10V  
17  
6
t

d(off)  

t

f  

T
u
rn-off delay time  
fall time  
ns  
ns  
4/12  
 

STN3NF06  
Electrical characteristics  
Min. Typ. Max Unit  
Table 6.  
Symbol  
Source drain diode  
Parameter  
Test conditions  
I

SD  

Source-drain current  
4
A
A
(1)  
I

SDM  

Source-drain current (pulsed)  
16  
(2)  
I

SD

=4A, V

GS

=0  
Forward on voltage  
1.3  
V
V

SD  

I

SD

=4 A,  
t

rr  

Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
50  
88  
ns  
nC  
A
di/dt = 100A/µs,  
V

DD

=25
V
,
T
j=150°C  
Q

rr  

3.5  
I

RRM  

1. Pulse
 
width limited by safe operating area.  
2. Pulsed:
 
pulse duration=300µs, duty cycle 1.5%  
5/12  

Electrical characteristics  
STN3NF06  
2.1  
Electrical characteristics (curves)  
Figure 1.
 
Safe operating area  
Figure 2.
 
Thermal impedance  
Figure 3.  
Output characteristics  
Figure 4.  
Transfer characteristics  
Figure 5.
 
Transconductance  
Figure 6.
 
Static drain-source on resistance  
6/12  
 

STN3NF06  
Electrical characteristics  
Figure 7.
 
Gate charge vs. gate-source voltage
 
Figure 8.
 
Capacitance variations  
Figure 9.
 
Normalized gate threshold voltage
 
Figure 10.
 
Normalized on resistance vs.  
vs. temperature  
temperature  
Figure 11.
 
Source-drain diode forward  
characteristics  
Figure 12.
 
Normalized
b
reakdown voltage vs.  
temperature  
7/12  

Test circuit  
STN3NF06  
3
Test circuit  
Figure 13.
 
Switching times test circuit for  
resistive load  
Figure 14.
 
Gate charge test circuit  
Figure 15.
 
Test circuit for inductive load  
switching and diode recovery times  
Figure 16.
 
Unclamped Inductive load test  
circuit  
Figure 17.
 
Unclamped inductive waveform  
Figure 18.
 
Switching time waveform  
8/12  
 

STN3NF06  
Package mechanical data  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in ECO
P
A
CK®  
packages. These packages have a Lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECO
P
ACK is an ST trademark.  
ECO
P
ACK specifications are available at:

9/12  
 

Package mechanical data  
STN3NF06  
SOT-223 MECHANICAL DATA  
mm  
mils  
TYP.  
90.6  
181.1  
15.7  
25.6  
63  
DIM.  
MIN.  
2.27  
4.57  
0.2  
TYP.  
2.3  
MAX.  
2.33  
4.63  
0.6  
MIN.  
89.4  
179.9  
7.9  
MAX.  
a
b
91.7  
182.3  
23.6  
4.6  
c
0.4  
d
0.63  
1.5  
0.65  
1.6  
0.67  
1.7  
24.8  
59.1  
26.4  
e1  
e4  
f
66.9  
0.32  
3.1  
12.6  
2.9  
0.67  
6.7  
3
114.2  
26.4  
118.1  
27.6  
122.1  
28.7  
g
0.7  
7
0.73  
7.3  
l1  
l2  
L
263.8  
137.8  
248  
275.6  
137.8  
255.9  
287.4  
145.7  
263.8  
3.5  
3.5  
6.5  
3.7  
6.3  
6.7  
L
l2  
d
a
e4  
c
b
f
C
C
B
E
g
P008B  
10/12  

STN3NF06  
Revision history  
5
Revision history  
Table 7.  
Date  
Revision history  
Revision  
Changes  
21-Jun-2004  
04-Oct-2006  
01-Feb-2007  
4
5
6
Complete datasheet  
The document has been reformatted  
T
y
po mistake on

.  
11/12  
 

STN3NF06  
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12/12  

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