STMicroelectronics-STP11NK50Z

Part #STMicroelectronics-STP11NK50Z
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STMicroelectronics-STP11NK50Z
STB11NK50Z – STP11NK50ZFP  
STP11NK50Z  
N-channel 500
V
,
0
.48
Ω
, 10 A
 
TO-220, TO-220F
P
,
D

2

P
A
K  
Zener-protected SuperMESH

TM

Power MOSFET  
Features  
R

DS(on)  

Type  
V

DSS  

I

D  

Pw  
max  
500 V
 
< 0.52
Ω
10 A
 
125 W  
STB11NK50Z  
3
3
2
2
1
1
STP11NK50ZFP 500
 
V <
 
0.52
Ω
10 A
 
30 W  
STP11NK50Z 500
 
V <
 
0.52
Ω
10 A
 
125 W  
TO-220FP  
TO-220  
■
Extremely high dv/dt capability  
■
100% avalanche tested  
3
1
D

2

P
A
K  
■
Gate charge minimized  
■
Very low intrinsic capacitances  
Application  
■
Switching applications  
Figure 1.  
Internal schematic diagram  
Description  
The SuperMESH™ series is obtained through an  
extreme optimization of ST’s well established  
strip-based PowerMESH™ layout. In addition to  
pushing on-resistance significantly down, special  
care is taken to ensure a very good dv/dt  
capability for the most demanding applications.  
Table 1.  
Device summary  
Order codes  
Marking  
Package  
Packaging  
STB11NK50ZT4  
STP11NK50ZFP  
STP11NK50Z  
B11NK50Z  
P11NK50ZFP  
P11NK50Z  
D²
P
A
K  
TO-220FP  
TO-220  
T
a
pe and reel  
T
u
be  
T
u
be  
May 2008  
Rev 6  
1/16  
16  

Contents  
STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
Contents  
1
2
Electrical ratings
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2.1  
Electrical characteristics (curves)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
7  
3
5
6
Test circuit
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Packaging mechanical data
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Revision history
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
2/16  

STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
Electrical ratings  
1
Electrical ratings  
Table 2.  
Symbol  
Absolute maximum ratings  
Value  
Parameter  
Unit  
TO-220  
D²
P
A
K  
TO-220FP  
V

DS  

V

GS  

I

D  

Drain-source voltage (V

GS

= 0)  
Gate-source voltage  
500  
30  
V
V
Drain current (continuous) at T

C

= 25 °C  
Drain current (continuous) at T

C

=100 °C  
Drain current (pulsed)  
10  
6.3  
40  
125  
1
10

(1)  

6.3

(1)  

40

(1)  

30  
A
A
I

D  

(2)  
I

DM  

A
P

TOT  

T
o
tal dissipation at T

C

= 25 °C  
Derating factor  
W
0.24  
W/°C  
Gate source ESD (HBM-C= 100 p
F
,  
V

ESD(G-S)  

4000  
4.5  
V
R= 1.5 k
Ω
)  
dv/dt

(3)  

V

ISO  

Peak diode recovery voltage slope  
Insulation withstand voltage (DC)  
V/ns  
V
—  
2500  
T

J  

Operating junction temperature  
Storage temperature  
-55 to 150  
°C  
T

stg  

1. Limited
 
only by maximum temperature allowed  
2. Pulse
 
width limited by safe operating area  
3.
I

SD

≤
10 A, di/dt
 
≤
200 A/µs, V

DD

≤
V

(BR)DSS

, T

j

≤
T

JMAX  

.
Table 3.  
Thermal data  
Value  
Symbol  
Parameter  
Unit  
TO-220  
TO-220FP  
D²
P
A
K  
R

thj-case

Thermal resistance junction-case max  
1
4.2  
°C/W  
°C/W  
R

thj-a  

T

l  

Thermal resistance junction-ambient max  
62.5  
300  
Maximum lead temperature for soldering  
purpose  
°C  
Table 4.  
Avalanche characteristics  
Parameter  
Symbol  
Value  
Unit  
Avalanche current, repetitive or not-  
repetitive (pulse width limited by Tj max)  
I

AS  

10  
A
Single pulse avalanche energy  
E

AS  

190  
mJ  
(starting T

J

= 25 °C, I

D

=I

AR

, V

DD

= 50 V)  
3/16  

Electrical characteristics  
STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
2
Electrical characteristics  
(T  
= 25 °C unless otherwise specified)  
CASE  
Table 5.  
Symbol  
On/off states  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
Drain-source breakdown  
voltage  
V

(BR)DSS  

I

D

= 1 mA, V

GS

= 0  
500  
V
V

DS

= Max rating,  
1
µA  
µA  
Zero gate voltage drain  
current (V

GS

= 0)  
I

DSS  

V

DS

= Max rating @125 °C  
50  
Gate body leakage current  
(V

DS

= 0)  
I

GSS  

V

GS

= 20
 
V  
±
10  
µA  
V

GS(th)  

R

DS(on)  

V

DS

= V

GS

, I

D

= 100 µA  
V

GS

= 10
V
,
I

D

= 4.5 A  
Gate threshold voltage  
3
3.75  
0.48  
4.5  
V
Static drain-source on  
resistance  
0.52  
Ω
Table 6.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
(1)  
V

DS

=15
V
,
I

D

= 4.5 A  
Forward transconductance  
7.7  
S
g

fs  

C

iss  

C

oss  

C

rss  

Input capacitance  
1390  
173  
42  
pF  
pF  
pF  
Output capacitance  
V

DS

=25
V
,
f
=1 MHz, V

GS

=0  
Reverse transfer  
capacitance  
(2)  
Equivalent output  
capacitance  
C

oss eq  

.
V

GS

=0, V

DS

=0 to 400 V  
110  
pF  
Q

g  

Q

gs  

Q

gd  

V

DD

=400
V
,
I

D

= 11.4 A  
V

GS

=10 V  
T
o
tal gate charge  
Gate-source charge  
Gate-drain charge  
49  
10  
25  
68  
nC  
nC  
nC  
1. Pulsed:
 
pulse duration=300µs, duty cycle 1.5%  
2. C

oss eq.

is defined as a constant equivalent capacitance giving the same charging time as C

oss

when V

DS  

increases from 0 to 80% V

DSS  

4/16  
 

STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
Electrical characteristics  
Min. Typ. Max.
 
Unit  
Table 7.  
Symbol  
Switching times  
Parameter  
Test conditions  
V

DD

= 250
V
,
I

D

=5.5 A,  
R

G

= 4.7
Ω
,
V

GS

=10 V  
t

d(on)  

t

r  

T
u
rn-on delay time  
Rise time  
14.5  
18  
ns  
ns  
V

DD

= 250
V
,
I

D

=5.5 A,  
t

d(off)  

t

f  

T
u
rn-off delay time  
Fall time  
41  
15  
ns  
ns  
R

G

= 4.7
Ω
,
V

GS

=10 V  
t

r(Voff)  

V

DD

=400
V
,
I

D

=11.4 A,  
R

G

=4.7
Ω
,
V

GS

=10 V  
Off-voltage rise time  
Fall time  
11.5  
12  
ns  
ns  
ns  
t

f  

Cross-over time  
27  
t

c  

Table 8.  
Symbol  
Source drain diode  
Parameter  
Test conditions  
Min Typ. Max Unit  
I

SD  

Source-drain current  
10  
40  
A
A
V
(1)  
Source-drain current (pulsed)  
Forward on voltage  
I

SDM  

(2)  
I

SD

=10 A, V

GS

=0  
I

SD

=10 A,  
1.6  
V

SD  

t

rr  

Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
308  
2.4  
16  
ns  
µC  
A
Q

rr  

di/dt = 100 A/µs,  
V

DD

=45
V
,
T
j=150 °C  
I

RRM  

1. Pulse
 
width limited by safe operating area  
2. Pulsed:
 
pulse duration=300µs, duty cycle 1.5%  
Table 9.  
Symbol  
Gate-source Zener diode  
Parameter  
Test conditions  
Min. Typ. Max.
 
Unit  
(1)  
Gate-source breakdown voltage
 
Igs= 1mA
 
(open drain)  
30  
V
BV

GSO  

1. The
 
built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s  
ESD capabilit
y
, but also to make them safely absorb possible voltage transients that may occasionally be  
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and  
cost-effective intervention to protect the device’s integrit
y
.
T
hese integrated Zener diodes thus avoid the  
usage of external components.  
5/16  

Electrical characteristics  
STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
2.1  
Electrical characteristics (curves)  
Figure 2.
 
Safe operating area for TO-220 /  
D²
P
A
K  
Figure 3.
 
Thermal impedance for TO-220 /  
D²
P
A
K  
Figure 4.
 
Safe operating area for TO-220FP  
Figure 5.
 
Thermal impedance for TO-220FP  
Figure 6.
 
Output characteristics  
Figure 7.
 
Transfer characteristics  
6/16  

STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
Figure 8.
 
Transconductance  
Electrical characteristics  
Figure 9.
 
Static drain-source on resistance  
Figure 10.
 
Gate charge vs gate-source voltage
 
Figure 11.
 
Capacitance variations  
Figure 12.
 
Normalized gate threshold voltage
 
Figure 13.
 
Normalized on resistance vs  
vs temperature
 
temperature  
7/16  

Electrical characteristics  
STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
Figure 14.
 
Source-drain diode forward  
characteristics  
Figure 15.
 
Normalized B  
vs temperature  
VDSS  
Figure 16.
 
Maximum avalanche energy vs  
temperature  
8/16  

STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
Test circuit  
3
Test circuit  
Figure 17.
 
Switching times test circuit for  
resistive load  
Figure 18.
 
Gate charge test circuit  
Figure 19.
 
Test circuit for inductive load  
switching and diode recovery times  
Figure 20.
 
Unclamped Inductive load test  
circuit  
Figure 21.
 
Unclamped inductive waveform  
Figure 22.
 
Switching time waveform  
9/16  

Package mechanical data  
STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in ECO
P
A
CK®  
packages. These packages have a lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECO
P
ACK is an ST trademark.  
ECO
P
ACK specifications are available at:

10/16  
 

STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
Package mechanical data  
TO-220 mechanical data  
mm  
Typ  
inch  
Dim  
Min  
Max  
Min  
Typ  
Max  
A
b
4.40  
0.61  
1.14  
0.4
8
 
15.25  
4.60  
0.
88  
1.70  
0.70  
15.75  
0.17
3  
0.024  
0.044  
0.01
9  
0.6  
0.1
8
1  
0.0
3
4  
0.066  
0.027  
0.62  
b
1  
c
D
D1  
E
1.27  
0.050  
10  
10.40  
2.70  
5.15  
1.
3
2  
6.60  
2.72  
14  
0.
393  
0.0
9
4  
0.1
9
4  
0.04
8  
0.244  
0.0
9
4  
0.511  
0.1
3
7  
0.40
9  
0.106  
0.202  
0.051  
0.256  
0.107  
0.551  
0.154  
e
2.40  
4.
9
5  
1.2
3  
6.20  
2.40  
1
3  
e1  
F
H1  
J1  
L
L1  
L20  
L
3
0  
∅
P  
Q
3
.50  
3
.
93  
16.40  
0.645  
2
8
.
9
0  
1.1
3
7  
3
.75  
3
.
8
5  
2.
9
5  
0.147  
0.104  
0.151  
0.116  
2.65  
11/16  

Package mechanical data  
STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
TO-220FP mechanical data  
mm.  
Typ  
inch  
Typ.  
Dim.  
Min.  
4.40  
2.5  
Max.  
4.60  
2.7  
Min.  
Max.  
0.1
8
1  
0.106  
0.10
8  
0.027  
0.0
39  
0.067  
0.067  
0.204  
0.106  
0.40
9  
A
B
0.17
3  
0.0
98  
0.0
98  
0.017  
0.0
3
0  
0.045  
0.045  
0.1
9
5  
0.0
9
4  
0.
393  
D
2.5  
2.75  
0.70  
1.00  
1.50  
1.50  
5.20  
2.70  
10.40  
E
0.45  
0.75  
1.15  
1.15  
4.
9
5  
2.40  
10  
F
F1  
F2  
G
G1  
H
L2  
L
3  
L4  
L5  
L6  
L7  
Di
a  
16  
0.6
3
0  
2
8
.6  
9
.
8
0  
2.
9  
3
0.6  
10.60  
3
.6  
1.126  
0.
38
5  
0.114  
0.626  
0.
3
54  
0.11
8  
1.204  
0.417  
0.141  
0.645  
0.
3
66  
0.126  
15.
9
0  
9
16.40  
9
.
3
0  
3
.2  
3
L3  
L6  
L7  
Di
a  
1
2 3  
L5  
L2  
L4  
7012510-I  
12/16  

STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
Package mechanical data  
D²
P
A
K (TO-26
3
) mechanical data  
mm  
Typ  
inch  
Dim  
Min  
Max  
Min  
Typ  
Max  
A
A1  
b
4.40  
0.0
3  
0.70  
1.14  
0.45  
1.2
3  
8
.
9
5  
7.50  
10  
4.60  
0.2
3  
0.
93  
1.70  
0.60  
1.
3
6  
9
.
3
5  
0.17
3  
0.001  
0.027  
0.045  
0.017  
0.04
8  
0.
3
52  
0.2
9
5  
0.
39
4  
0.
33
4  
0.1
8
1  
0.00
9  
0.0
3
7  
0.067  
0.024  
0.05
3  
0.
3
6
8  
b
2  
c
c2  
D
D1  
E
10.40  
0.40
9  
E1  
e
8
.50  
2.54  
0.1  
e1  
H
4.
88  
15  
5.2
8  
15.
8
5  
2.6
9  
2.7
9  
1.40  
1.75  
0.1
9
2  
0.5
9
0  
0.0
99  
0.0
9
0  
0.05  
0.20
8  
0.624  
0.106  
0.110  
0.055  
0.06
9  
J1  
L
2.4
9  
2.2
9  
1.27  
1.
3
0  
L1  
L2  
R
0.051  
0.4  
0.016  
V2  
0°  
8
°  
0°  
8
°  
0079457_M  
13/16  

Packaging mechanical data  
STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
5
Packaging mechanical data  
2
D PAK FOOTPRINT  
TAPE AND REEL SHIPMENT  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
24.4  
100  
0.059  
13.2 0.504
 
0.520  
0795  
26.4 0.960
 
1.039  
3.937  
30.4  
1.197  
BASE QTY  
BULK QTY  
1000  
TAPE MECHANICAL DATA  
1000  
mm  
inch  
DIM.  
MIN. MAX. MIN. MAX.  
10.5 10.7
 
0.413 0.421  
15.7 15.9
 
0.618 0.626  
A0  
B0  
D
1.5  
1.6 0.059
 
0.063  
D1  
E
1.59 1.61
 
0.062 0.063  
1.65 1.85
 
0.065 0.073  
F
11.4  
4.8  
3.9  
11.9  
1.9  
50  
11.6 0.449
 
0.456  
5.0 0.189
 
0.197  
4.1 0.153
 
0.161  
12.1 0.468
 
0.476  
2.1 0.075
 
0.082  
1.574  
K0  
P0  
P1  
P2  
R
T
0.25 0.35
 
0.0098 0.0137  
23.7 24.3
 
0.933 0.956  
W
* on sales type  
14/16  

STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
Revision history  
6
Revision history  
Table 10.
 
Revision history  
Date  
Revision  
Changes  
Complete version with curves  
08-Sep-2005  
14-Oct-2005  
26-Mar-2006  
29-Apr-2008  
3
4
5
6
Inserted ecopack indication  
New template, no content change  
I

GSS

value changed in

15/16  

STB11NK50Z – STP11NK50ZFP – STP11NK50Z  
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16/16