STMicroelectronics-STP14NF12FP

Part #STMicroelectronics-STP14NF12FP
Download 
STMicroelectronics-STP14NF12FP
STP14NF12  
STP14NF12FP  
N-CHANNEL 120V – 0.16
Ω
– 14A TO-220/TO-220FP  
LOW GATE CHARGE STripFET™ POWER MOSFET  
TYPE  
V
DSS  
R
I
D
DS(on)  
STP14NF12  
STP14NF12FP  
120 V  
120 V  
< 0.18
Ω  
< 0.18
Ω  
14 A  
14 A  
■
■
■
TYPICAL R
 
(on) = 0.16
Ω  
DS  
EXCEPTIONAL dv/dt CAPABILITY  
APPLICATION ORIENTED  
CHARACTERIZATION  
3
3
2
2
1
1
TO-220  
TO-220FP  
DESCRIPTION  
This Power MOSFET series realized with STMicro-  
electronics unique STripFET process has specifical-  
ly been designed to minimize input capacitance and  
gate charge. It is therefore suitable as primary  
switch in advanced high-efficiency isolated DC-DC  
converters for
T
e
lecom and Computer application. It  
is also intended for any application with low gate  
charge drive requirements  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
■
HIGH-EFFICIENCY DC-DC CONVERTERS  
■
UPS AND MOTOR CONTROL  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
STP14NF12 STP14NF12FP  
Unit  
V
Drain-source Voltage (V
 
= 0)  
120  
120  
±20  
V
V
DS  
GS  
V
Drain-gate Voltage (R
 
= 20 k
Ω
)  
DGR  
GS  
V
Gate- source Voltage  
V
GS  
I
Drain Current (continuous) at T
 
= 25°C  
14  
9
8.5  
6
A
D
C
I
Drain Current (continuous) at T
 
= 100°C  
A
D
C
I
( )  
Drain Current (pulsed)  
56  
60  
0.4  
34  
A
DM  
P
Total Dissipation at T
 
= 25°C  
25  
W
TOT  
C
Derating Factor  
0.17  
W/°C  
V/ns  
mJ  
V
dv/dt (1)  
(2)  
Peak Diode Recovery voltage slope  
Single Pulse Avalanche Energy  
Insulation Withstand Voltage (DC)  
Operating Junction
T
e
mperature  
Storage
T
e
mperature  
9
E
60  
AS  
V
–
2500  
ISO  
T
j
-55 to 175  
°C  
T
stg  
(1) I
 
≤
14A, di/dt
≤
300A/µs, V
 
≤
V  
, T
 
≤
T  
j JMAX.  
SD  
DD  
(BR)DSS  
(
●
) Pulse width limited by safe operating area  
(2) Starting T
 
= 25°C, I
 
= 14A, V
 
= 50V  
j
D
DD  
August 2002  
1/9  

STP14NF12/STP14NF12FP  
THERMAL DATA  
TO-220  
TO-220FP  
Rthj-case  
Rthj-amb  
Thermal Resistance Junction-case Max  
2.5  
6
°C/W  
°C/W  
°C  
Thermal Resistance Junction-ambient Max  
62.5  
300  
T
Maximum Lead
T
emperature For Soldering Purpose  
l
ELECTRICAL CHARACTERISTICS
(T  
= 25 °C UNLESS OTHERWISE SPECIFIED)  
CASE  
OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
T
y
p.  
Max.  
Unit  
V
I
= 250 µA, V
 
= 0  
120  
V
(BR)DSS  
D
GS  
Breakdown Voltage  
I
Zero Gate Voltage  
V
V
V
= Max Rating  
DS  
1
µA  
µA  
nA  
DSS  
Drain Current (V
 
= 0)  
GS  
= Max Rating, T
 
= 125 °C  
10  
DS  
GS  
C
I
Gate-body Leakage  
= ±20V  
±100  
GSS  
Current (V
 
= 0)  
DS  
ON (1)  
Symbol  
Parameter  
Test Conditions  
Min.  
T
y
p.  
3
Max.  
4
Unit  
V
V
R
V
V
= V
 
, I
 
= 250µA  
Gate Threshold Voltage  
2
GS(th)  
DS  
GS  
GS  
D
Static Drain-source On  
Resistance  
= 10
V
, I
 
= 7 A  
0.16  
0.18  
Ω
DS(on)  
D
DYNAMIC  
Symbol  
Parameter  
Forward Transconductance  
Input Capacitance  
Test Conditions  
Min.  
T
y
p.  
4
Max.  
Unit  
S
g
(1)  
V
= 15V
 
I =
 
7 A  
DS ,
 
D  
fs  
C
C
V
= 25V, f = 1 MHz, V
 
= 0  
DS GS  
460  
70  
pF  
pF  
pF  
iss  
Output Capacitance  
oss  
C
rss  
Reverse Transfer  
Capacitance  
30  
2/9  

STP14NF12/STP14NF12FP  
ELECTRICAL CHARACTERISTICS
(CONTINUED)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
V
R
= 50 V, I
 
= 7 A  
Turn-on Delay Time  
16  
ns  
d(on)  
DD  
D
= 4.7
Ω
V =
 
10V  
G
GS  
t
Rise Time  
25  
ns  
r
(Resistive Load, see Figure 3)  
Q
T
o
tal Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
V
V
= 80 V, I
 
= 14 A,  
= 10V  
15.5  
3.7  
4.7  
21  
nC  
nC  
nC  
g
DD  
GS  
D
Q
gs  
Q
gd  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-off-Delay Time  
Fall Time  
V
= 50 V, I
 
= 7 A,  
32  
8
ns  
ns  
d(off)  
DD  
D
t
f
R =
 
4.7
Ω,
V =
 
10V  
G GS  
(Resistive Load, see Figure 3)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
14  
Unit  
A
I
Source-drain Current  
SD  
I
(2)  
(1)  
Source-drain Current (pulsed)  
Forward On Voltage  
56  
A
SDM  
V
I
I
= 14 A, V
 
= 0  
1.5  
V
SD  
SD  
SD  
GS  
t
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
92  
230  
5
ns  
nC  
A
= 14 A, di/dt = 100A/µs,  
= 50 V, T
 
= 150°C  
rr  
Q
V
rr  
RRM  
DD  
j
I
(see test circuit, Figure 5)  
Note: 1. Pulsed:
 
Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse
 
width limited by safe operating area.  
Safe Operating Area For TO-220  
Safe Operating Area For TO-220FP  
3/9  

STP14NF12/STP14NF12FP  
Thermal Impedance For TO-220  
Thermal Impedance For TO-220FP  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source On Resistance  
4/9  

STP14NF12/STP14NF12FP  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
Normalized Gate Threshold Voltage vs Temp.  
Normalized On Resistance vs Temperature  
Source-drain Diode Forward Characteristics  
Normalized BVDSS vs Temperature  
5/9  

STP14NF12/STP14NF12FP  
Fig. 1:
Unclamped Inductive Load Test Circuit  
Fig. 2:
Unclamped Inductive Waveform  
Fig. 3:
Switching Times Test Circuit For  
Fig. 4:
Gate Charge test Circuit  
Resistive Load  
Fig. 5:
Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
6/9  

STP14NF12/STP14NF12FP  
TO-220 MECHANICAL DATA  
mm.  
inch  
DIM.  
MIN.  
4.40  
1.23  
2.40  
0.49  
0.61  
1.14  
1.14  
4.95  
2.40  
10  
TYP  
MAX.  
4.60  
1.32  
2.72  
0.70  
0.88  
1.70  
1.70  
5.15  
2.70  
10.40  
MIN.  
TYP.  
MAX.  
0.181  
0.051  
0.107  
0.027  
0.034  
0.066  
0.066  
0.202  
0.106  
0.409  
0.173  
A
C
0.048  
0.094  
0.019  
0.024  
0.044  
0.044  
0.194  
0.094  
0.393  
D
E
F
F1  
F2  
G
G1  
H2  
L2  
L3  
L4  
L5  
L6  
L7  
L9  
DIA  
16.40  
28.90  
0.645  
1.137  
13  
14  
0.511  
0.104  
0.600  
0.244  
0.137  
0.147  
0.551  
0.116  
0.620  
0.259  
0.154  
0.151  
2.65  
15.25  
6.20  
3.50  
3.75  
2.95  
15.75  
6.60  
3.93  
3.85  
1
7/9  

TO-220FP MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
TYP  
MAX.  
4.6  
2.7  
2.75  
0.7  
1
MIN.  
0.173  
0.098  
0.098  
0.017  
0.030  
0.045  
0.045  
0.195  
0.094  
0.393  
MAX.  
0.181  
0.106  
0.108  
0.027  
0.039  
0.067  
0.067  
0.204  
0.106  
0.409  
A
B
4.4  
2.5  
D
2.5  
E
0.45  
0.75  
1.15  
1.15  
4.95  
2.4  
F
F1  
F2  
G
1.7  
1.7  
5.2  
2.7  
10.4  
G1  
H
10  
L2  
L3  
L4  
L5  
L6  
L7  
Ø
16  
0.630  
28.6  
9.8  
2.9  
15.9  
9
30.6  
10.6  
3.6  
1.126  
.0385  
0.114  
0.626  
0.354  
0.118  
1.204  
0.417  
0.141  
0.645  
0.366  
0.126  
16.4  
9.3  
3
3.2  
L3  
L6  
L7  
1 2 3  
L4  
L5  
L2  

STP14NF12/STP14NF12FP  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information  
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or  
systems without express written approval of STMicroelectronics.  
© The ST logo is a registered trademark of STMicroelectronics  
© 2002 STMicroelectronics – Printed in Italy – All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia – Brazil – Canada – China – Finland – France – Germany – Hong Kong – India – Israel – Italy – Japan – Malaysia – Malta – Morocco  
Singapore – Spain – Sweden – Switzerland – United Kingdom – United States.  
9/9