STMicroelectronics-STP20NM50FD

Part #STMicroelectronics-STP20NM50FD
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STMicroelectronics-STP20NM50FD
STB20NM50FD  
STF20NM50FD – STP20NM50FD  
N-channel 500
V
,
0
.22
Ω
, 20 A D

2

P
A
K, TO-220F
P
,
T
O-220  
FDmesh™ Power MOSFET (with fast diode)  
Features  
R

DS(on)  

max  
Type  
V

DSS  

R

DS(on)

* Qg  
I

D  

STB20NM50FD 500 V < 0.25
Ω
8.36
Ω
* nC  
STF20NM50FD 500 V < 0.25
Ω
8.36
Ω
* nC  
STP20NM50FD 500 V < 0.25
Ω
8.36
Ω
* nC  
20 A  
20 A  
20 A  
3
3
2
2
1
1
TO-220  
TO-220FP  
3
■
High dv/dt and avalanche capabilities  
■
100% avalanche tested  
1
D²
P
A
K  
■
Low input capacitance and gate charge  
■
Low gate input resistance  
■
Tight process control and high manufacturing  
yields  
Figure 1.  
Internal schematic diagram  
Application  
■
Switching applications  
Description  
The FDmesh™ associates all advantages of  
reduced on-resistance and fast switching with an  
intrinsic fast-recovery body diode. It is therefore  
strongly recommended for bridge topologies, in  
particular ZVS phase-shift converters.  
Table 1.  
Device summary  
Order codes  
Marking  
Package  
D²
P
A
K  
Packaging  
STB20NM50FD  
STF20NM50FD  
STP20NM50FD  
B20NM50FD  
F20NM50FD  
P20NM50FD  
T
a
pe and reel  
T
u
be  
TO-220FP  
TO-220  
T
u
be  
April 2008  
Rev 9  
1/16/  
16  
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Contents  
STB20NM50FD – STF20NM50FD – STP20NM50FD  
Contents  
1
2
Electrical ratings
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2.1  
Electrical characteristics (curves)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
6  
3
4
5
6
Test circuit
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Packaging mechanical data
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Revision history
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
2/16  
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STB20NM50FD – STF20NM50FD – STP20NM50FD  
Electrical ratings  
1
Electrical ratings  
Table 2.  
Symbol  
Absolute maximum ratings  
Value  
Parameter  
Unit  
D²
P
A
K  
TO-220  
TO-220FP  
V

DS  

V

GS  

I

D  

Drain-source voltage (V

GS

=0)  
500  
30  
V
V
A
A
Gate-source voltage  
20

(1)  

14

(1)  

Drain current (continuous) at T

C

= 25 °C  
Drain current (continuous) at T

C

= 100 °C  
20  
14  
I

D  

(2)  
80

(1)  

45  
Drain current (pulsed)  
80  
A
W
I

DM  

P

TOT  

T
o
tal dissipation at T

C

= 25 °C  
Peak diode recovery voltage slope  
192  
dv/dt

(3)  

20  
V/ns  
Insulation withstand voltage (RMS) from all three  
leads to external heat sink  
V

ISO  

—  
2500  
V
(t=1 s;T

C

=25 °C)  
T

stg  

T

j  

Storage temperature  
-65 to 150  
150  
°C  
°C  
Operating junction temperature  
1. Limited
 
only by maximum temperature allowed  
2. Pulse
 
width limited by safe operating area  
3. I

SD

≤
20 A, di/dt
 
≤
200 A/µs, V

DD

= 80% V

(BR)DSS  

Table 3.  
Symbol  
Thermal data  
Parameter  
TO-220  
D²
P
A
K  
TO-220FP  
Unit  
°C/W  
°C/W  
°C/W  
R

thj-case  

R

thj-amb  

R

thj-pcb  

Thermal resistance junction-case max  
Thermal resistance junction-amb max  
Thermal resistance junction-pcb max  
0.65  
2.8  
62.5  
—  
62.5  
—  
—  
30  
Maximum lead temperature for  
soldering purposes  
T

l  

300  
°C  
Table 4.  
Symbol  
Avalanche characteristics  
Parameter  
Max value  
Unit  
Avalanche current, repetitive or not-repetitive  
(pulse width limited by Tj max)  
I

AS  

10  
A
Single pulse avalanche energy  
E

AS  

700  
mJ  
(starting Tj = 25 °C, I

D

= I

AS

, V

DD

= 35 V)  
3/16  
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Electrical characteristics  
STB20NM50FD – STF20NM50FD – STP20NM50FD  
2
Electrical characteristics  
(T  
=25°C unless otherwise specified)  
CASE  
Table 5.  
Symbol  
On/off states  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
Drain-source breakdown  
voltage  
V

(BR)DSS  

I

D

= 250 µA, V

GS

= 0  
500  
V
V

DS

= Max rating,  
1
µA  
µA  
Zero gate voltage drain  
current (V

GS

= 0)  
I

DSS  

V

DS

= Max rating,@125 °C  
10  
Gate body leakage current  
(V

DS

= 0)  
I

GSS  

V

GS  

=
30 V  
100  
nA  
V

GS(th)  

R

DS(on)  

V

DS

= V

GS

, I

D

= 250 µA  
V

GS

= 10
V
,
I

D

= 10 A  
Gate threshold voltage  
3
4
5
V
Static drain-source on  
resistance  
0.22  
0.25  
Ω
Table 6.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
V

DS

> I

D(on)

x R

DS(on)max  

I

D

= 10 A  
,
(1)  
g

fs  

Forward transconductance  
9
S
Input capacitance  
C

iss  

C

oss  

C

rss  

1380  
290  
40  
pF  
pF  
pF  
V

DS

= 25
V
, f
=
1 MHz,  
V

GS

= 0  
Output capacitance  
Reverse transfer  
capacitance  
Equivalent output  
capacitance  
(2)  
V

GS

= 0, V

DS

= 0 to 400 V  
C

oss eq.  

130  
2.8  
pF  
f=1 MHz Gate DC Bias=0  
T
e
st signal level=20 mV  
open drain  
Rg  
Gate input resistance  
Ω
V

DD

= 400
V
,
I

D

= 20 A  
V

GS

= 10 V  
Q

g  

Q

gs  

Q

gd  

T
o
tal gate charge  
Gate-source charge  
Gate-drain charge  
38  
18  
10  
53  
nC  
nC  
nC  
(see Figure 16)  
1. Pulsed:
 
pulse duration = 300 µs, duty cycle 1.5%  
2. C

oss eq.

is defined as a constant equivalent capacitance giving the same charging time as C

oss

when V

DS  

increases from 0 to 80% V

DSS  

4/16  
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STB20NM50FD – STF20NM50FD – STP20NM50FD  
Electrical characteristics  
Min Typ Max
 
Unit  
Table 7.  
Symbol  
Switching times  
Parameter  
Test conditions  
V

DD

= 250
V
,
I

D

= 10 A,  
R

G

= 4.7
Ω
,
V

GS

= 10 V  
(see Figure 15)  
t

d(on)  

t

r  

T
u
rn-on delay time  
Rise time  
22  
20  
ns  
ns  
t

r(Voff)  

V

DD

= 400
V
,
I

D

= 20 A,  
R

G

= 4.7
Ω
,
V

GS

= 10 V  
(see Figure 15)  
Off-voltage rise time  
Fall time  
6
ns  
ns  
ns  
t

f  

15  
30  
Cross-over time  
t

c  

Table 8.  
Symbol  
Source drain diode  
Parameter  
Test conditions  
Min Typ Max Unit  
I

SD  

Source-drain current  
20  
80  
A
A
(1)  
I

SDM  

Source-drain current (pulsed)  
(2)  
V

SD  

Forward on voltage  
I

SD

= 20 A, V

GS

=0  
1.5  
V
t

rr  

Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
245  
2
ns  
nC  
A
I

SD

=20 A, di/dt =100 A/µs,  
V

DD

= 60
V
,
T

J

=150 °C  
Q

rr  

(see Figure 17)  
I

RRM  

16  
1. Pulse
 
width limited by safe operating area  
2. Pulsed:
 
pulse duration = 300 µs, duty cycle 1.5%  
5/16  
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Electrical characteristics  
STB20NM50FD – STF20NM50FD – STP20NM50FD  
2.1  
Electrical characteristics (curves)  
Figure 2.
 
Safe operating area for TO-220 /  
D²
P
A
K  
Figure 3.
 
Thermal impedance for TO-220 /  
D²
P
A
K  
Figure 4.
 
Safe operating area for TO-220FP  
Figure 6.
 
Output characteristics  
6/16  
Figure 5.
 
Thermal impedance for TO-220FP  
Figure 7.
 
Transfer characteristics  
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STB20NM50FD – STF20NM50FD – STP20NM50FD  
Figure 8.
 
Transconductance  
Electrical characteristics  
Figure 9.
 
Static drain-source on resistance  
Figure 10.
 
Gate charge vs gate-source voltage
 
Figure 11.
 
Capacitance variations  
Figure 12.
 
Normalized gate threshold voltage
 
Figure 13.
 
Normalized on resistance vs  
vs temperature
 
temperature  
7/16  
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Electrical characteristics  
STB20NM50FD – STF20NM50FD – STP20NM50FD  
Figure 14.
 
Source-drain diode forward  
characteristics  
8/16  
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STB20NM50FD – STF20NM50FD – STP20NM50FD  
Test circuit  
3
Test circuit  
Figure 15.
 
Switching times test circuit for  
resistive load  
Figure 16.
 
Gate charge test circuit  
Figure 17.
 
Test circuit for inductive load  
switching and diode recovery times  
Figure 18.
 
Unclamped Inductive load test  
circuit  
Figure 19.
 
Unclamped inductive waveform  
Figure 20.
 
Switching time waveform  
9/16  
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Package mechanical data  
STB20NM50FD – STF20NM50FD – STP20NM50FD  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in ECO
P
A
CK®  
packages. These packages have a lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECO
P
ACK is an ST trademark.  
ECO
P
ACK specifications are available at:

10/16  
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STB20NM50FD – STF20NM50FD – STP20NM50FD  
Package mechanical data  
TO-220 mechanical data  
mm  
Typ  
inch  
Dim  
Min  
Max  
Min  
Typ  
Max  
A
b
4.40  
0.61  
1.14  
0.4
8
 
15.25  
4.60  
0.
88  
1.70  
0.70  
15.75  
0.17
3  
0.024  
0.044  
0.01
9  
0.6  
0.1
8
1  
0.0
3
4  
0.066  
0.027  
0.62  
b
1  
c
D
D1  
E
1.27  
0.050  
10  
10.40  
2.70  
5.15  
1.
3
2  
6.60  
2.72  
14  
0.
393  
0.0
9
4  
0.1
9
4  
0.04
8  
0.244  
0.0
9
4  
0.511  
0.1
3
7  
0.40
9  
0.106  
0.202  
0.051  
0.256  
0.107  
0.551  
0.154  
e
2.40  
4.
9
5  
1.2
3  
6.20  
2.40  
1
3  
e1  
F
H1  
J1  
L
L1  
L20  
L
3
0  
∅
P  
Q
3
.50  
3
.
93  
16.40  
0.645  
2
8
.
9
0  
1.1
3
7  
3
.75  
3
.
8
5  
2.
9
5  
0.147  
0.104  
0.151  
0.116  
2.65  
11/16  
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Package mechanical data  
STB20NM50FD – STF20NM50FD – STP20NM50FD  
TO-220FP mechanical data  
mm.  
Typ  
inch  
Typ.  
Dim.  
Min.  
4.40  
2.5  
Max.  
4.60  
2.7  
Min.  
Max.  
0.1
8
1  
0.106  
0.10
8  
0.027  
0.0
39  
0.067  
0.067  
0.204  
0.106  
0.40
9  
A
B
0.17
3  
0.0
98  
0.0
98  
0.017  
0.0
3
0  
0.045  
0.045  
0.1
9
5  
0.0
9
4  
0.
393  
D
2.5  
2.75  
0.70  
1.00  
1.50  
1.50  
5.20  
2.70  
10.40  
E
0.45  
0.75  
1.15  
1.15  
4.
9
5  
2.40  
10  
F
F1  
F2  
G
G1  
H
L2  
L
3  
L4  
L5  
L6  
L7  
Di
a  
16  
0.6
3
0  
2
8
.6  
9
.
8
0  
2.
9  
3
0.6  
10.60  
3
.6  
1.126  
0.
38
5  
0.114  
0.626  
0.
3
54  
0.11
8  
1.204  
0.417  
0.141  
0.645  
0.
3
66  
0.126  
15.
9
0  
9
16.40  
9
.
3
0  
3
.2  
3
L3  
L6  
L7  
Di
a  
1
2 3  
L5  
L2  
L4  
7012510-I  
12/16  
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STB20NM50FD – STF20NM50FD – STP20NM50FD  
Package mechanical data  
D²
P
A
K (TO-26
3
) mechanical data  
mm  
Typ  
inch  
Dim  
Min  
Max  
Min  
Typ  
Max  
A
A1  
b
4.40  
0.0
3  
0.70  
1.14  
0.45  
1.2
3  
8
.
9
5  
7.50  
10  
4.60  
0.2
3  
0.
93  
1.70  
0.60  
1.
3
6  
9
.
3
5  
0.17
3  
0.001  
0.027  
0.045  
0.017  
0.04
8  
0.
3
52  
0.2
9
5  
0.
39
4  
0.
33
4  
0.1
8
1  
0.00
9  
0.0
3
7  
0.067  
0.024  
0.05
3  
0.
3
6
8  
b
2  
c
c2  
D
D1  
E
10.40  
0.40
9  
E1  
e
8
.50  
2.54  
0.1  
e1  
H
4.
88  
15  
5.2
8  
15.
8
5  
2.6
9  
2.7
9  
1.40  
1.75  
0.1
9
2  
0.5
9
0  
0.0
99  
0.0
9
0  
0.05  
0.20
8  
0.624  
0.106  
0.110  
0.055  
0.06
9  
J1  
L
2.4
9  
2.2
9  
1.27  
1.
3
0  
L1  
L2  
R
0.051  
0.4  
0.016  
V2  
0°  
8
°  
0°  
8
°  
0079457_M  
13/16  
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Packaging mechanical data  
STB20NM50FD – STF20NM50FD – STP20NM50FD  
5
Packaging mechanical data  
2
D PAK FOOTPRINT  
TAPE AND REEL SHIPMENT  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
24.4  
100  
0.059  
13.2 0.504
 
0.520  
0795  
26.4 0.960
 
1.039  
3.937  
30.4  
1.197  
BASE QTY  
BULK QTY  
1000  
TAPE MECHANICAL DATA  
1000  
mm  
inch  
DIM.  
MIN. MAX. MIN. MAX.  
10.5 10.7
 
0.413 0.421  
15.7 15.9
 
0.618 0.626  
A0  
B0  
D
1.5  
1.6 0.059
 
0.063  
D1  
E
1.59 1.61
 
0.062 0.063  
1.65 1.85
 
0.065 0.073  
F
11.4  
4.8  
3.9  
11.9  
1.9  
50  
11.6 0.449
 
0.456  
5.0 0.189
 
0.197  
4.1 0.153
 
0.161  
12.1 0.468
 
0.476  
2.1 0.075
 
0.082  
1.574  
K0  
P0  
P1  
P2  
R
T
0.25 0.35
 
0.0098 0.0137  
23.7 24.3
 
0.933 0.956  
W
* on sales type  
14/16  
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STB20NM50FD – STF20NM50FD – STP20NM50FD  
Revision history  
6
Revision history  
Table 9.  
Date  
Document revision history  
Revision  
Changes  
21-Jun-2004  
21-Apr-2008  
8
Figure 4: Safe operating area for TO-220FP
and
Figure 5: Thermal  
impedance for TO-220FP
added.  
9
15/16  
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STB20NM50FD – STF20NM50FD – STP20NM50FD  
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