STMicroelectronics-STP25N60M2-EP

Part #STMicroelectronics-STP25N60M2-EP
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STMicroelectronics-STP25N60M2-EP
STP25N60M2-EP  
Datasheet  
N-channel 600
V
,
0
.175 Ω typ., 18 A MDmesh™ M2 EP  
Power MOSFET in a TO-220 package  
Features  
V
at T
 
max.  
R
max.  
I
D
Order code  
DS  
J
DS(on)  
TAB  
STP25N60M2-EP  
650 V  
0.188 Ω  
18 A  
•
•
•
•
•
Extremely low gate charge  
3
2
Excellent output capacitance (C

OSS

) profile  
Very low turn-off switching losses  
100% avalanche tested  
1
TO-220  
Zener-protected  
D(2, TAB)  
Applications  
•
•
Switching applications  
G(1)  
T
a
ilored for Very high frequency converters (f > 150 kHz)  
Description  
S(3)  
AM01475V1  
This device is an N-channel Power MOSFET developed using MDmesh™  
M2 enhanced performance (EP) technology. Thanks to its strip layout and an  
improved vertical structure, the device exhibits low on-resistance, optimized switching  
characteristics with very low turn-off switching losses, rendering it suitable for the  
most demanding very high frequency converters.  
Product status link  
Product summary  
Order code  
Marking  
STP25N60M2-EP  
25N60M2EP  
TO-220  
Package  
Packing  
Tube  
DS10739
–
Rev 4
–
May 2018  
For further information contact your local STMicroelectronics sales office.  

STP25N60M2-EP  
Electrical ratings  
1
Electrical ratings  
Table 1.
Absolute maximum ratings  
Parameter  
Symbol  
Value  
±25  
18  
Unit  
V
V
Gate-source voltage  
GS  
I
Drain current (continuous) at T
 
= 25 °C  
A
D
D
C
I
Drain current (continuous) at T
 
= 100 °C  
11.3  
72  
A
C
I
Drain current (pulsed)  
A
DM  
P
T
o
tal dissipation at T
 
= 25 °C  
150  
15  
W
TOT  
C
dv/dt

dv/dt

Peak diode recovery voltage slope  
MOSFET dv/dt ruggedness  
V/ns  
V/ns  
50  
T
Storage temperature range  
stg  
-55 to 150  
°C  
T
Operating junction temperature range  
j
1. Pulse
 
width limited by safe operating area.  
2.  
3.  
I
≤ 18 A, di/dt ≤ 400 A/µs, V  
< V  
, V
 
= 400 V.  
(BR)DSS DD  
SD  
DS peak  
V
≤ 480 V  
DS  
Table 2.
Thermal data  
Parameter  
Symbol  
Value  
0.83  
Unit  
°C/W  
°C/W  
R
Thermal resistance junction-case  
Thermal resistance junction-ambient  
thj-case  
R
thj-amb  
62.5  
Table 3.
Avalanche characteristics  
Symbol  
Parameter  
Value  
3.5  
Unit  
A
I
Avalanche current, repetitive or not repetitive (pulse width limited by T  
)
jmax  
AR  
E
Single pulse avalanche energy (starting T
 
= 25 °C, I
 
= I
 
, V
 
= 50 V)  
j D
 
AR DD  
200  
mJ  
AS  
DS10739
–
Rev 4  
page 2/14  
 
 
 
 
 

STP25N60M2-EP  
Electrical characteristics  
2
Electrical characteristics  
T

C

= 25 °C unless otherwise specified  
Table 4.
On/off states  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
V
V
V
V
= 0
V
, I
 
= 1
m
A  
Drain-source breakdown voltage  
600  
(BR)DSS  
GS  
GS  
GS  
D
= 0
V
, V
 
=
6
00 V  
1
µA  
DS  
I
Zero gate voltage drain current  
DSS  
V
T
= 0
V
, V
 
=
6
00 V,  
DS  
= 125 °C

100  
µA  
C
I
V
V
V
= 0
V
, V
 
=
±
25 V  
Gate-body leakage current  
Gate threshold voltage  
±10  
4.75  
µA  
V
GSS  
DS  
GS  
V
= V
 
, I
 
= 250 µA  
3.25  
4
GS(th)  
DS(on)  
DS  
GS  
GS  
D
R
= 10
V
, I
 
= 9 A  
D
Static drain-source on-resistance  
0.175  
0.188  
Ω
1. Defined
 
by design, not subject to production test.  
Table 5.
Dynamic  
Symbol  
Parameter  
Input capacitance  
Test conditions  
Min.  
Typ.  
1090  
56  
Max.  
Unit  
pF  
pF  
pF  
pF  
Ω
C
iss  
–
–
–
–
–
–
–
–
–
–
–
–
–
–
C
oss  
V
V
= 100
V
, f = 1
M
Hz, V
 
= 0 V  
Output capacitance  
DS  
GS  
C
Reverse transfer capacitance  
Equivalent output capacitance  
Intrinsic gate resistance  
T
o
tal gate charge  
1.6  
255  
7
rss  
= 0 to 480
V
, V
 
= 0 V  
C
oss eq.  
DS  
GS  
R
f = 1 MHz, I
 
= 0 A  
D
G
Q
V
V
= 480
V
, I
 
=
1
8 A,  
29  
nC  
nC  
g
DD  
D
= 0 to 10 V  
Q
GS  
Gate-source charge  
6
gs  
Q
Gate-drain charge  
–
12  
–
nC  
gd  
1.  
C
oss eq.  
is defined as a constant equivalent capacitance giving the same charging time as C  
when V
 
increases from 0  
oss DS  
to 80% V  
.
DSS  
Table 6.
Switching energy  
Test conditions  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Unit  
V
= 400
V
, I
 
= 2
A
,  
D
DD  
–
7
–
µJ  
R
= 4.7 Ω, V
 
= 10 V  
GS  
G
Turn-off energy  
(from 90% V
 
to 0% I
 
)  
E
(off)  
GS  
D
V
= 400 V, I
 
= 4 A,  
D
DD  
–
8
–
µJ  
R
G
= 4.7 Ω, V
 
= 10 V  
GS  
DS10739
–
Rev 4  
page 3/14  
 
 
 

STP25N60M2-EP  
Electrical characteristics  
Table 7.
Switching times  
Test conditions  
Symbol  
Parameter  
Turn-on delay time  
Min.  
Typ.  
15  
Max.  
Unit  
ns  
t
V
= 300
V
, I
 
= 9
A
,  
–
–
–
–
–
–
d(on)  
DD  
D
R
G
= 4.7 Ω, V
 
= 10 V  
t
GS  
Rise time  
10  
ns  
r
t
Turn-off delay time  
61  
ns  
d(off)  
t
Fall time  
–
16  
–
ns  
f
Table 8.
Source drain diode  
Test conditions  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
18  
Unit  
A
I
Source-drain current  
–
–
–
–
–
–
–
–
SD  
I
Source-drain current (pulsed)  
Forward on voltage  
72  
A
SDM  
V
V
= 0
V
, I
 
=
1
8 A  
SD  
1.6  
V
GS  
SD  
t
rr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
Reverse recovery time  
Reverse recovery charge  
360  
5
ns  
µC  
A
I
= 18 A, di/dt = 100 A/µs,  
SD  
V
= 100 V (see

DD  
Q
rr  
I
28  
RRM  
t
I
= 18 A, di/dt = 100 A/µs,  
445  
6.5  
ns  
µC  
rr  
SD  
V
= 100
V
, T
 
=
1
50 °C  
j
DD  
Q
rr  
I
Reverse recovery current  
–
29  
A
RRM  
1. Pulse
 
width is limited by safe operating area  
2. Pulsed:
 
pulse duration = 300 µs, duty cycle 1.5%  
DS10739
–
Rev 4  
page 4/14  
 
 

STP25N60M2-EP  
Electrical characteristics (curves)  
2.1  
Electrical characteristics (curves)  
Figure 1.
Safe operating area  
Figure 2.
Thermal impedance  
I

D

(A)  
GIPG011220141441ALS  
10  
1
10µs  
100µs  
1ms  
10ms  
T

j

=150°C  
T

C

=25°C  
Single pulse  
0.1  
0.1  
10  
V

DS

(V)  
1
100  
Figure 3.
Output characteristics  
Figure 4.
Transfer characteristics  
GIPG090220181022OCH  
GIPG090220181022TCH  
I

D  

I

D  

(A)  
(A)  
V

GS

= 8, 9, 10 V  
V

DS

=16 V  
40  
32  
24  
16  
40  
32  
24  
16  
V

GS

=7 V  
V

GS

=6 V  
8
0
8
0
V

GS

=5 V  
16  
0
4
8
12  
V

DS

(V)  
3
4
5
6
7
V

GS

(V)  
Figure 5.
Gate charge vs gate-source voltage  
Figure 6.
Static drain-source on-resistance  
GADG260320181223QVG  
GIPG090220181138RID  
V

GS  

(V)  
V

DS  

(V)  
R

DS(on)  

(Ω)  
V

DD

= 480
V
,
I

D

= 18 A  
V

GS

= 10 V  
0.185  
12  
10  
8
600  
500  
400  
300  
200  
100  
V

DS  

0.18  
6
0.175  
4
0.17  
2
0
0
0.165  
0
5
10  
15  
20  
25  
30  
Q

g

(nC)  
0
3
6
9
12  
15  
18  
I

D

(A)  
DS10739
–
Rev 4  
page 5/14  
 

STP25N60M2-EP  
Electrical characteristics (curves)  
Figure 7.
Capacitance variations  
Figure 8.
Output capacitance stored energy  
GIPG090220181022CVR  
GIPG090220181024EOS  
C
(pF)  
E

OSS  

(µJ)  
8
10

3  

10

2  

C
iss  
6
4
C

oss  

10

1  

10

0  

f = 1 MHz  
2
0
C

rss  

V

DS

(V)  
10

-1  

10

0  

10

1  

10

2  

0
100 200 300 400 500 600
 
V

DS

(V)  
Figure 10.
Normalized gate threshold voltage vs  
temperature  
Figure 9.
Turn-off switching energy vs drain current  
E

off  

(µJ)  
GADG260320181227TSL  
GIPG090220181018VTH  
V

GS(th)  

(norm.)  
V

DD

= 400 V  
R

G

= 4.7Ω  
V

GS

= 10V  
14  
12  
10  
8
I

D

= 250 µA  
1.1  
1.0  
0.9  
0.8  
6
4
2
0.7  
0.6  
0
1
2
3
4
5
6
I

D

(A)  
-75  
-25  
25  
75  
125  
T

j

(°C)  
Figure 12.
Normalized V

(BR)DSS

vs temperature  
Figure 11.
Normalized on-resistance vs temperature  
GIPG090220181019RON  
GIPG090220181020BDV  
R

DS(on)  

V

(BR)DSS  

(norm.)  
(norm.)  
V

GS

= 10 V  
2.5  
I

D

= 1 mA  
1.10  
2.0  
1.5  
1.0  
1.05  
1.00  
0.95  
0.5  
0.0  
0.90  
0.85  
-75  
-25  
25  
75  
125  
T

j

(°C)  
-75  
-25  
25  
75  
125  
T

j

(°C)  
DS10739
–
Rev 4  
page 6/14  

STP25N60M2-EP  
Electrical characteristics (curves)  
Figure 13.
Source-drain diode forward characteristics  
GIPG090220181021SDF  
V

SD  

(V)  
1.1  
T

j

= -50 °C  
1.0  
0.9  
T

j

= 25 °C  
0.8  
0.7  
T

j

= 150 °C  
0.6  
0.5  
0
3
6
9
12  
15  
18  
I

SD

(A)  
DS10739
–
Rev 4  
page 7/14  

STP25N60M2-EP  
Test circuits  
3
Test circuits  
Figure 14.
Test circuit for resistive load switching times  
Figure 15.
Test circuit for gate charge behavior  
V

DD  

12 V  
47 kΩ  
1 kΩ  
100 nF  
R

L  

2200  
μF  
3.3  
μF  
V

DD  

+
I

G

= CONST  
2.7 kΩ  
V

D  

R

G  

D.U.
T
.  
100 Ω  
V

GS  

pulse width  
+
D.U.
T
.  
V

GS  

V

G  

2200  
μF  
pulse width  
47 kΩ  
1 kΩ  
AM01469v1  
AM01468v1  
Figure 16.
Test circuit for inductive load switching and  
diode recovery times  
Figure 17.
Unclamped inductive load test circuit  
L
A
A
A
D
S
V

D  

100 µH  
D
fast  
G
D.U.
T
.  
B
diode  
2200  
3.3  
µF  
+
V

DD  

1000  
µF  
B
µF  
3.3  
µF  
B
+
V

DD  

I

D  

25 Ω  
G
D.U.
T
.  
R

G  

S
+
_
D.U.
T
.  
V

i  

pulse width  
AM01471v1  
AM01470v1  
Figure 19.
Switching time waveform  
Figure 18.
Unclamped inductive waveform  
V
(BR)DSS  
t

on  

t

d(on)  

t

off  

t

d(off)  

V
D  
t

r  

t

f  

90%  
90%  
10%  
I
DM  
V

DS  

10%  
V

GS  

0
0
I
D  
90%  
V
DD  
V
DD  
10%  
AM01472v1  
AM01473v1  
DS10739
–
Rev 4  
page 8/14  
 
 
 
 

STP25N60M2-EP  
Package information  
4
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK

®  

packages, depending on their level of environmental compliance. ECOPACK

®

specifications, grade definitions  
and product status are available at:

. ECOPACK

®

is an ST trademark.  
DS10739
–
Rev 4  
page 9/14  
 
 

STP25N60M2-EP  
TO-220 type A package information  
4.1  
TO-220 type A package information  
Figure 20.
TO-220 type A package outline  
0015988_typeA_Rev_21  
DS10739
–
Rev 4  
page 10/14  

STP25N60M2-EP  
TO-220 type A package information  
Table 9.
TO-220 type A package mechanical data  
mm  
Dim.  
Min.  
4.40  
0.61  
1.14  
0.48  
15.25  
Typ.  
Max.  
4.60  
0.88  
1.55  
0.70  
15.75  
A
b
b1  
c
D
D1  
E
1.27  
10.00  
2.40  
4.95  
1.23  
6.20  
2.40  
13.00  
3.50  
10.40  
2.70  
5.15  
1.32  
6.60  
2.72  
14.00  
3.93  
e
e1  
F
H1  
J1  
L
L1  
L20  
L30  
øP  
Q
16.40  
28.90  
3.75  
2.65  
3.85  
2.95  
DS10739
–
Rev 4  
page 11/14  

STP25N60M2-EP  
Revision history  
Table 10.
Document revision history  
Date  
Revision  
Changes  
01-Dec-2014  
12-Jan-2015  
1
2
First release.  
Updated product status from “preliminary data” to “production data”.  
Removed maturity status indication from cover page.  
Modified schematic on cover page.  
Modified
T
a
ble 1. Absolute maximum ratings,
T
a
ble 4. On/off states,
T
a
ble 5.  
Dynamic,
T
a
ble 6. Switching energy, Table 7. Switching times
and
T
a
ble 8.  
Source drain diode.  
13-Feb-2018  
28-May-2018  
3
4
Updated
Section 2.1 Electrical characteristics (curves)
.  
Minor text changes.  
Minor text changes  
DS10739
–
Rev 4  
page 12/14  
 

STP25N60M2-EP  
Contents  
Contents  

Electrical ratings

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Electrical characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Electrical characteristics (curves)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Test circuits

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Package information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

TO-220 type A package information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Revision history

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DS10739
–
Rev 4  
page 13/14  

STP25N60M2-EP  
IMPORTANT NOTICE – PLEASE READ CAREFULLY  
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST  
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Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of  
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Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.  
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T
.
A
ll other product or service names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2018 STMicroelectronics – All rights reserved  
DS10739
–
Rev 4  
page 14/14