STMicroelectronics-STP32N65M5

Part #STMicroelectronics-STP32N65M5
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STMicroelectronics-STP32N65M5
STB32N65M5  
Datasheet  
N-channel 650 V, 95 mΩ typ., 24 A MDmesh™ M5 Power MOSFET  
in D²PAK package  
Features  
TAB  
V
at T  
R
DS(on)  
max.  
I
D
Order codes  
DS  
jmax.  
STB32N65M5  
710 V  
119 mΩ  
24 A  
2
1
3
•
•
•
•
Extremely low R

DS(on)  

Low gate charge and input capacitance  
Excellent switching performance  
100% avalanche tested  
D²  
PAK  
D(2, TAB)  
Applications  
•
Switching applications  
Description  
G(1)  
This device is an N-channel Power MOSFET based on the MDmesh™ M5 innovative  
vertical process technology combined with the well-known PowerMESH™ horizontal  
layout. The resulting product offers extremely low on-resistance, making it particularly  
suitable for applications requiring high power and superior efficiency.  
S(3)  
AM01475v1_noZen  
Product status link  
Product summary  
Order code  
Marking  
STB32N65M5  
32N65M5  
2
Package  
Packing  
D PAK  
T
a
pe and reel  
DS6032
–
Rev 5
–
November 2018  
For further information contact your local STMicroelectronics sales office.  

STB32N65M5  
Electrical ratings  
1
Electrical ratings  
Table 1.
Absolute maximum ratings  
Parameter  
Symbol  
Value  
Unit  
V
V
Gate-source voltage  
±25  
24  
GS  
I
Drain current (continuous) at T
 
= 25 °C  
A
D
D
C
I
Drain current (continuous) at T
 
= 100 °C  
15  
A
C
I
Drain current (pulsed)  
96  
A
DM  
P
T
o
tal power dissipation at T
 
= 25 °C  
150  
15  
W
TOT  
C
dv/dt

Peak diode recovery voltage slope  
Operating junction temperature range  
Storage temperature range  
V/ns  
T
j
-55 to 150  
°C  
T
stg  
1. Pulse
 
width limited by safe operating area.  
2. ≤
 
24 A, di/dt ≤ 400 A/μs, V
 
≤ V
 
.  
(BR)DSS  
I
SD  
DS(peak)  
Table 2.
Thermal data  
Parameter  
Symbol  
Value  
0.83  
30  
Unit  
°C/W  
°C/W  
R
thj-case  
Thermal resistance junction-case  
Thermal resistance junction-pcb  
R
thj-pcb  
1. When
 
mounted on FR-4 board of 1 inch², 2oz Cu.  
Table 3.
Avalanche characteristics  
Symbol  
Parameter  
Value  
8
Unit  
A
I
Avalanche current, repetitive or not-repetitive (pulse width limited by T
 
Max)  
AR  
j
E
Single pulse avalanche energy (starting T
 
= 25 °C, I
 
= I
 
, V
 
= 50 V)  
650  
mJ  
AS  
j
D
AR  
DD  
DS6032
–
Rev 5  
page 2/17  
 
 
 
 

STB32N65M5  
Electrical characteristics  
2
Electrical characteristics  
(T

CASE

= 25 °C unless otherwise specified)  
Table 4.
On/off states  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
V
V
I =
 
1 mA, V
 
= 0 V  
D GS  
Drain-source breakdown voltage  
650  
(BR)DSS  
V
V
T
= 650
V
, V
 
= 0 V,  
1
µA  
DS  
DS  
GS  
I
= 650
V
, V
 
= 0 V,  
Zero gate voltage drain current  
DSS  
GS  
100  
µA  
= 125 °C

C
I
V
V
V
= 0
V
, V
 
=
±
25 V  
Gate body leakage current  
Gate threshold voltage  
±100  
5
nA  
V
GSS  
DS  
GS  
V
= V
 
, I
 
= 250 µA  
3
4
GS(th)  
DS(on)  
DS  
GS  
GS  
D
R
= 10 V, I
 
= 12 A  
D
Static drain-source on resistance  
95  
119  
mΩ  
1. Defined
 
by design, not subject to production test.  
Table 5.
Dynamic  
Symbol  
Parameter  
Input capacitance  
Test conditions  
Min.  
Typ.  
3320  
75  
Max.  
Unit  
C
iss  
V
V
= 100 V, f = 1 MHz,  
= 0 V  
DS  
C
oss  
Output capacitance  
–
–
pF  
GS  
C
Reverse transfer capacitance  
Equivalent capacitance time related  
5
rss  
C
–
–
–
210  
–
–
–
pF  
pF  
Ω
o(tr)  
V
= 0
V
, V
 
= 0
t
o 520 V  
DS  
GS  
Equivalent capacitance energy  
related  
C
70  
o(er)  
f = 1 MHz, I
 
= 0 A  
Rg  
Gate input resistance  
T
o
tal gate charge  
2
D
Q
V
V
= 520 V, I
 
= 12 A,  
72  
17  
29  
g
DD  
D
= 0 to 10 V  
Q
GS  
Gate-source charge  
Gate-drain charge  
–
–
nC  
gs  
Q
gd  
1.  
2.  
C
time related is defined as a constant equivalent capacitance giving the same charging time as C  
when V  
DS  
o(tr)  
oss  
increases from 0 to 80% V  
.
DSS  
C
energy related is defined as a constant equivalent capacitance giving the same stored energy as C  
when V  
oss DS  
o(er)  
increases from 0 to 80% V  
.
DSS  
Table 6.
Switching times  
Test conditions  
Symbol  
Parameter  
Turn-off delay time  
Min.  
Typ.  
53  
Max.  
Unit  
t
V
= 400
V
, I
 
=
1
5 A,  
d(off)  
DD  
D
R
= 4.7 Ω, V
 
= 10 V  
t
G
GS  
Rise time  
12  
r
t
Cross time  
29  
–
–
ns  
c
t
Fall time  
16  
f
DS6032
–
Rev 5  
page 3/17  
 
 
 
 

STB32N65M5  
Electrical characteristics  
Table 7.
Source drain diode  
Test conditions  
Symbol  
Parameter  
Source-drain current  
Min.  
Typ.  
Max.  
24  
Unit  
I
SD  
–
–
A
I
Source-drain current (pulsed)  
Forward on voltage  
96  
SDM  
V
I
I
= 24 A, V
 
= 0 V  
1.5  
V
SD  
GS  
SD  
t
rr  
= 24 A, di/dt = 100 A/µs  
= 60 V (see  
Reverse recovery time  
Reverse recovery charge  
375  
6
ns  
µC  
SD  
V
Q
DD  
rr  
–
–
I
Reverse recovery current  
33  
A
RRM  
t
I
= 24 A, di/dt = 100 A/µs  
= 60
V
,
T
j = 150 °C  
Reverse recovery time  
440  
8
ns  
rr  
SD  
V
Q
rr  
DD  
Reverse recovery charge  
µC  
I
Reverse recovery current  
36  
A
RRM  
1. Pulse
 
width limited by safe operating area.  
2. Pulsed:
 
pulse duration = 300 μs, duty cycle 1.5%.  
DS6032
–
Rev 5  
page 4/17  
 
 

STB32N65M5  
Electrical characteristics curves  
2.1  
Electrical characteristics curves  
Figure 2.
Thermal impedance  
Figure 1.
Safe operating area  
GC20540_ZTH  
AM
0
5448v1  
I
D
K
10

-1  

10

-2  

δ=0.5  
δ=0.2  
(A)  
0.1  
10  
10µs  
100µs  
0.05  
0.02  
0.01  
1ms  
10ms  
1
Tj=150°C  
Single pulse  
Tc=25°C  
S
i
n
l
g
e  
pu
l
s
e  
0.1  
-5  
10

-2  

10  
10

-4  

10  
10

-1  

-3  
t
p
(s)  
10  
V

D
S

(V)  
0.1  
1
100  
Figure 3.
Output characterisics  
Figure 4.
Transfer characteristics  
AM
0
5451v1  
AM
0
5452v1  
I
D
I
D  
(A)  
V

GS

=10V  
V

D
S

=20V  
50  
40  
30  
20  
30  
20  
10  
0
10  
0
2
8
10  
0
4
6
V

GS

(V)  
0
10  
30  
V
DS  
Figure 5.
Gate charge vs gate-source voltage  
Figure 6.
Static drain-source on resistance  
AM
0
5457v1  
AM
0
5454v1  
V
GS  
V
D
S  
R
D
S
(
on)  
(Ω)  
V

DD

=520V  
12  
10  
8
480  
3
DS  
I
D
=12A  
0.111  
0.091  
0.071  
6
0.051  
4
2
0
0.031  
0.011  
80  
10  
15  
40  
80  
5
0
20  
60  
Q
g
0
I
D
(A)  
DS6032
–
Rev 5  
page 5/17  
 

STB32N65M5  
Electrical characteristics curves  
Figure 7.
Capacitance variations  
Figure 8.
Output capacitance stored energy  
AM
0
5456v1  
AM
0
5455v1  
C
E
oss  
(pF)  
(µ
J
)  
14  
10000  
1000  
12  
10  
8
C
i
s
s  
100  
10  
1
6
Coss  
Crss  
4
2
0
0.1  
100  
1
10  
V

D
S

(V)  
200  
300  
400 500  
600  
V

D
S

(V)  
0
100  
Figure 9.
Normalized gate threshold voltage vs  
temperature  
Figure 10.
Normalized on resistance vs temperature  
AM
0
5460v1  
R
D
S
(
on)  
AM
0
5459v1  
V
GS(th)  
(norm)  
2.1  
(norm)  
1.10  
I

D

= 250 μA  
1.9  
1.7  
1.5  
1.3  
1.1  
V

GS

= 10 V  
1.00  
0.90  
0.9  
0.80  
0.70  
0.7  
0.5  
-50  
-25  
0
25 50 75  
T
J
(°C)  
100  
-50  
-25  
0
25 50 75  
T
J
(°C)  
100  
Figure 12.
Normalized V

(BR)DSS

vs temperature  
Figure 11.
Source-drain diode forward characteristics  
AM
0
5453v1  
AM
0
5461v1  
V
S
D  
V

(BR)DSS  

(V)  
T
J
=-50°C  
1.2  
1.0  
0.8  
0.6  
I

D

= 1 mA  
1.03  
T
J
=25°C  
1.01  
0.99  
0.97  
T
J
=150°C  
0.4  
0.2  
0.95  
3
0
0
10  
20  
30  
40  
50  
I
S
D
(A)  
-50  
T
J
0
DS6032
–
Rev 5  
page 6/17  

STB32N65M5  
Electrical characteristics curves  
Figure 13.
Switching energy vs gate resistance  
AM
0
5458v1  
E
μJ)  
I
D
=15A  
V
C
L
=400V  
V
GS
=10V  
Eon  
400  
300  
Eo
f
f  
200  
100  
0
20  
30  
40  
10  
R

G

(Ω  
0
* Eon including reverse recovery of a SiC diode.  
DS6032
–
Rev 5  
page 7/17  

STB32N65M5  
Test circuits  
3
Test circuits  
Figure 14.
Test circuit for resistive load switching times  
Figure 15.
Test circuit for gate charge behavior  
V

DD  

12 V  
47 kΩ  
1 kΩ  
100 nF  
R

L  

2200  
μF  
3.3  
μF  
V

DD  

+
I

G

= CONST  
2.7 kΩ  
V

D  

R

G  

D.U.
T
.  
100 Ω  
V

GS  

pulse width  
+
D.U.
T
.  
V

GS  

V

G  

2200  
μF  
pulse width  
47 kΩ  
1 kΩ  
AM01469v1  
AM01468v1  
Figure 16.
Test circuit for inductive load switching and  
diode recovery times  
Figure 17.
Unclamped inductive load test circuit  
L
A
A
A
D
S
V

D  

100 µH  
D
fast  
G
D.U.
T
.  
B
diode  
2200  
3.3  
µF  
1000  
µF  
B
V

DD  

+
3.3  
µF  
µF  
B
+
V

DD  

25 Ω  
I

D  

G
D.U.
T
.  
R

G  

S
+
_
D.U.
T
.  
V

i  

pulse width  
AM01471v1  
AM01470v1  
Figure 18.
Unclamped inductive waveform  
Figure 19.
Switching time waveform  
Concept waveform for Inductive Load Turn-off  
V
(BR)DSS  
Id  
V
D  
90%
V
d
s  
90%Id  
Tdelay -off  
I
DM  
V
g
s  
90%
V
g
s  
10%
V
d
s  
on  
I
D  
V
g
s(
I
(
t ))  
V
DD  
V
DD  
10%Id  
V
d
s  
Trise  
T
f
a
ll  
Tcro
s
s -over  
AM05540v2  
AM01472v1  
DS6032
–
Rev 5  
page 8/17  
 
 
 
 

STB32N65M5  
Package information  
4
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of

packages, depending on their level of environmental compliance. ECOPACK

®

specifications, grade definitions  
and product status are available at:

. ECOPACK

®

is an ST trademark.  
DS6032
–
Rev 5  
page 9/17  
 
 

STB32N65M5  
D²PAK (TO-263) type A package information  
4.1  
D²PAK (TO-263) type A package information  
Figure 20.
D²PAK (TO-263) type A package outline  
0079457_25  
DS6032
–
Rev 5  
page 10/17  

STB32N65M5  
D²PAK (TO-263) type A package information  
Table 8.
D²PAK (TO-263) type A package mechanical data  
mm  
Dim.  
Min.  
4.40  
0.03  
0.70  
1.14  
0.45  
1.23  
8.95  
7.50  
1.10  
10.00  
8.30  
6.85  
Typ.  
Max.  
4.60  
0.23  
0.93  
1.70  
0.60  
1.36  
9.35  
8.00  
1.50  
10.40  
8.70  
7.25  
A
A1  
b
b2  
c
c2  
D
D1  
D2  
E
7.75  
1.30  
E1  
E2  
e
8.50  
7.05  
2.54  
e1  
H
4.88  
15.00  
2.49  
2.29  
1.27  
1.30  
5.28  
15.85  
2.69  
2.79  
1.40  
1.75  
J1  
L
L1  
L2  
R
0.40  
V2  
0°  
8°  
DS6032
–
Rev 5  
page 11/17  

STB32N65M5  
D²PAK (TO-263) type A package information  
Figure 21.
D²PAK (TO-263) recommended footprint (dimensions are in mm)  
Footprint  
DS6032
–
Rev 5  
page 12/17  
 

STB32N65M5  
D²PAK packing information  
4.2  
D²PAK packing information  
Figure 22.
D²PAK tape outline  
DS6032
–
Rev 5  
page 13/17  

STB32N65M5  
D²PAK packing information  
Figure 23.
D²PAK reel outline  
T
40mm min.  
access hole  
at slot location  
B
D
C
N
A
G measured  
at hub  
Tape slot  
in core for  
tape start  
Full radius  
2.5mm min.width  
AM06038v1  
Table 9.
D²PAK tape and reel mechanical data  
Tape  
Reel  
mm  
mm  
Max.  
330  
Dim.  
Dim.  
Min.  
10.5  
15.7  
1.5  
Max.  
Min.  
A0  
B0  
D
10.7  
15.9  
1.6  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
24.4  
100  
13.2  
26.4  
30.4  
D1  
E
1.59  
1.65  
11.4  
4.8  
1.61  
1.85  
11.6  
5.0  
F
K0  
P0  
P1  
P2  
R
3.9  
4.1  
11.9  
1.9  
12.1  
2.1  
Base quantity  
Bulk quantity  
1000  
1000  
50  
T
0.25  
23.7  
0.35  
24.3  
W
DS6032
–
Rev 5  
page 14/17  

STB32N65M5  
Revision history  
Table 10.
Document revision history  
Date  
Version  
Changes  
16-Jan-2009  
01-Sep-2009  
30-Sep-2009  
1
2
3
First release  
Document status promoted from preliminary data to datasheet.  
Corrected V
 
value on
T
a
ble 2: Absolute maximum ratings  
GS  
C
o(er)  
and C  
values changed in
Table 5: Dynamic  
o(tr)  
T
a
ble 6: Switching times
parameters updates  
Figure 24: Switching time waveform
has been corrected  
Minor text changes  
Section 4: Package mechanical data
has been modified. Added:  
–
T
a
ble 8: D²PAK (TO-263) mechanical data
,
Figure 25: D²PAK (TO-263)  
drawing
and
Figure 26: D²PAK footprint
;  
–
T
a
ble 9: TO-220FP mechanical data
, and
Figure 27: TO-220FP drawing
;  
06-Oct-2011  
4
–
T
a
ble 10: I²PAK (TO-262) mechanical data
, and
Figure 28: I²PAK (TO-262)  
drawing
;  
–
T
a
ble 11: TO-220 type A mechanical data
, and
Figure 29: TO-220 type A  
drawing
;  
–
T
a
ble 12: TO-247 mechanical data
, and
Figure 30: TO-247 drawing
;  
Section 5: Packaging mechanical data
has been modified. Added:  
–
T
a
ble 13: D²PAK (TO-263) tape and reel mechanical data
,  
Figure 31:
T
a
pe
and
Figure 32: Reel;  
The part numbers STF32N65M5, STI32N65M5, STP32N65M5,  
STW32N65M5 have been moved to a separate datasheet.  
02-Nov-2018  
5
Content reworked to improve readability, no technical changes.  
DS6032
–
Rev 5  
page 15/17  
 

STB32N65M5  
Contents  
Contents  

Electrical ratings

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Electrical characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Electrical characteristics curves

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Test circuits

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Package information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

D²PAK (TO-263) type A package information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

D²PAK packing information

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.

Revision history

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DS6032
–
Rev 5  
page 16/17  

STB32N65M5  
IMPORTANT NOTICE – PLEASE READ CAREFULLY  
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST  
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST  
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.  
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of  
Purchasers’ products.  
No license, express or implied, to any intellectual property right is granted by ST herein.  
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.  
ST and the ST logo are trademarks of S
T
.
A
ll other product or service names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2018 STMicroelectronics – All rights reserved  
DS6032
–
Rev 5  
page 17/17