STMicroelectronics-STP5NK60ZFP
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STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Datasheet
N-channel 600
V
,
1
.2 Ω typ., 5 A SuperMESH™ Power MOSFET in
DPAK, TO-220 and TO-220FP packages
Features
TAB
3
2
1
DPAK
V
@
DS
R
DS(on)
max.
Order codes
Package
TAB
T
jmax.
STD5NK60ZT4
DPAK
TO-220
3
3
2
2
1
1
STP5NK60Z
650 V
1.6 Ω
TO-220
TO-220FP
STP5NK60ZFP
TO-220FP
D(2, TAB)
•
•
•
100% avalanche tested
Low input capacitance and gate charge
Low gate input resistance
G(1)
Applications
•
Switching applications
S(3)
AM01475V1
Description
These high-voltage devices are Zener-protected N-channel Power MOSFE
T
s
developed using the SuperMESH™ technology by STMicroelectronics, an
optimization of the well-established PowerMESH™. In addition to a significant
reduction in on-resistance, these devices are designed to ensure a high level of dv/dt
capability for the most demanding applications.
Product status link
DS2857
–
Rev 8
–
August 2018
For further information contact your local STMicroelectronics sales office.
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Electrical ratings
1
Electrical ratings
Table 1.
Absolute maximum ratings
Value
Symbol
Parameter
Unit
DPAK,TO-220
TO-220FP
V
V
Drain-source voltage
600
±30
V
V
DS
Gate-source voltage
GS
25
I
Drain current (continuous) at T
= 25 °C
5
3.16
20
A
D
D
C
I
Drain current (continuous) at T
= 100 °C
A
C
I
Drain current (pulsed)
A
DM
P
T
o
tal dissipation at T
= 25 °C
90
W
TOT
C
Gate-source human body model
(R = 1.5 kΩ, C = 100 pF)
ESD
3
kV
Insulation withstand voltage (RMS) from all three
V
2.5
kV
ISO
leads to external heat-sink (t = 1 s, T
= 25 °C)
C
Peak diode recovery voltage slope
Operating junction temperature range
Storage temperature range
4.5
V/ns
T
j
-55 to 150
°C
T
stg
1. Limited
by maximum junction temperature.
2. Pulse
width limited by safe operating area.
3.
I
≤ 5 A, di/dt ≤ 200 A/μs, V
≤ V
, V
= 80% V
DD
.
(BR)DSS
SD
DSpeak
(BR)DSS
Table 2.
Thermal data
Value
Symbol
Parameter
Unit
DPAK
TO-220
TO-220FP
R
Thermal resistance junction-case
1.39
5
°C/W
°C/W
°C/W
thj-case
R
Thermal resistance junction-ambient
Thermal resistance junction-pcb
62.5
thj-amb
R
thj-pcb
50
1. When
mounted on 1 inch² FR-4, 2 Oz copper board.
Table 3.
Avalanche characteristics
Symbol
Parameter
Avalanche current, repetitive or not-repetitive
Value
Unit
I
5
A
AR
(pulse width limited by T
Max)
j
Single pulse avalanche energy
E
220
mJ
AS
(starting T
= 25 °C, I
= I
, V
= 50 V)
j
D
AR
DD
DS2857
–
Rev 8
page 2/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Electrical characteristics
2
Electrical characteristics
(T
CASE
= 25 °C unless otherwise specified)
Table 4.
On/off states
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Drain-source breakdown
voltage
V
I
= 1 mA, V
= 0 V
600
V
(BR)DSS
D
GS
V
V
= 0
V
, V
=
6
00 V
1
µA
µA
GS
DS
Zero gate voltage drain
current
I
I
DSS
50
GS
DS
DS
GS
DS
C
Gate body leakage
current
V
V
V
= 0
V
, V
=
±
20 V
±10
4.5
1.6
µA
V
GSS
GS
V
R
= V
, I
= 50 µA
Gate threshold voltage
3
3.75
1.2
GS(th)
GS
D
Static drain-source on
resistance
= 10
V
, I
=
2
.5 A
Ω
DS(on)
D
1. Defined
by design, not subject to production test.
Table 5.
Dynamic
Test conditions
Symbol
Parameter
Input capacitance
Output capacitance
Min.
Typ.
690
90
Max.
Unit
C
iss
C
oss
V
= 25 V, f = 1 MHz, V
= 0 V
–
pF
DS
GS
Reverse transfer
capacitance
C
20
40
rss
Equivalent output
capacitance
V
V
= 0 to 480
V
, V
= 0 V
C
–
–
pF
nC
DS
DD
GS
oss eq.
Q
T
o
tal gate charge
Gate-source charge
Gate-drain charge
26
6
34
g
= 400
V
, I
= 5
A
, V
= 0 to 10 V
D
GS
Q
gs
Q
14
gd
1.
C
oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C
when V
increases from 0
oss DS
to 80% V
.
DSS
Table 6.
Switching times
Test conditions
Symbol
Parameter
Min.
Typ.
16
Max.
Unit
t
Turn-on delay time
Rise time
V
R
= 300
V
, I
=
2
.5 A,
d(on)
DD
D
= 4.7 Ω, V
= 10 V
t
25
G
GS
r
t
Turn-off delay time
Fall time
36
d(off)
t
r
25
–
–
ns
t
V
= 480 V, I
= 5 A,
Off-voltage rise time
Fall time
12
r(Voff)
DD
D
R
= 4.7 Ω, V
= 10 V
t
G
GS
10
f
t
Cross-over time
24
c
DS2857
–
Rev 8
page 3/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Electrical characteristics
Table 7.
Source drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
I
Source-drain current
5
SD
–
–
A
Source-drain current
(pulsed)
I
20
SDM
V
I
I
= 5 A, V
= 0 V
Forward on voltage
1.6
V
ns
μC
A
SD
GS
SD
t
rr
= 5 A, di/dt = 100 A/µs
Reverse recovery time
Reverse recovery charge
Reverse recovery current
485
2.7
11
SD
V
Q
DD
–
rr
I
RRM
1. Pulse
width limited by safe operating area.
2. Pulsed:
pulse duration = 300 μs, duty cycle 1.5%.
Table 8.
Gate-Source Zener Diode
Symbol
Parameter
Test conditions
= ±1 mA, I
= 0 A
Min.
Typ.
Max.
Unit
Gate-source breakdown
voltage
V
I
GS
30
–
–
V
(BR)GSO
D
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD performance of the device.
The Zener voltage facilitates efficient and cost-effective device integrity protection, thus eliminating the need for
additional external componentry.
DS2857
–
Rev 8
page 4/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Electrical characteristics curves
2.1
Electrical characteristics curves
Figure 2.
Thermal impedance for DPAK and TO-220
Figure 1.
Safe operating area for DPAK and TO-220
Figure 3.
Safe operating area for TO-220FP
Figure 4.
Thermal impedance for TO-220FP
GC20940
K
10
-1
10
-2
10
-3
10
-4
10
-3
10
-2
10
-1
10
0
t
p
(s)
Figure 5.
Output characterisics
Figure 6.
Transfer characteristics
DS2857
–
Rev 8
page 5/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Electrical characteristics curves
Figure 7.
Static drain-source on resistance
Figure 8.
Gate charge vs gate-source voltage
Figure 10.
Normalized gate threshold voltage vs
temperature
Figure 9.
Capacitance variations
Figure 11.
Normalized on resistance vs temperature
Figure 12.
Source-drain diode forward characteristic
DS2857
–
Rev 8
page 6/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Electrical characteristics curves
Figure 13.
Normalized V
(BR)DSS
vs temperature
Figure 14.
Maximum avalanche energy vs temperature
DS2857
–
Rev 8
page 7/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Test circuits
3
Test circuits
Figure 15.
Test circuit for resistive load switching times
Figure 16.
Test circuit for gate charge behavior
V
DD
12 V
47 kΩ
1 kΩ
100 nF
R
L
2200
μF
3.3
μF
V
DD
+
I
G
= CONST
2.7 kΩ
V
D
R
G
D.U.
T
.
100 Ω
V
GS
pulse width
+
D.U.
T
.
V
GS
V
G
2200
μF
pulse width
47 kΩ
1 kΩ
AM01469v1
AM01468v1
Figure 17.
Test circuit for inductive load switching and
diode recovery times
Figure 18.
Unclamped inductive load test circuit
L
A
A
A
D
S
V
D
100 µH
D
fast
G
D.U.
T
.
B
diode
2200
3.3
µF
+
V
DD
1000
µF
B
µF
3.3
µF
B
+
V
DD
I
D
25 Ω
G
D.U.
T
.
R
G
S
+
_
D.U.
T
.
V
i
pulse width
AM01471v1
AM01470v1
Figure 20.
Switching time waveform
Figure 19.
Unclamped inductive waveform
t
on
t
d(on)
t
off
t
d(off)
V
(BR)DSS
t
r
t
f
V
D
90%
90%
I
DM
V
DS
10%
V
GS
10%
0
0
I
D
V
DD
V
DD
90%
10%
AM01472v1
AM01473v1
DS2857
–
Rev 8
page 8/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Package information
4
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions
DS2857
–
Rev 8
page 9/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
DPAK (TO-252) type A2 package information
4.1
DPAK (TO-252) type A2 package information
Figure 21.
DPAK (TO-252) type A2 package outline
0068772_type-A2_rev25
DS2857
–
Rev 8
page 10/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
DPAK (TO-252) type A2 package information
Table 9.
DPAK (TO-252) type A2 mechanical data
mm
Dim.
Min.
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
4.95
6.40
5.10
2.159
4.445
9.35
1.00
2.60
0.65
0.60
Typ.
Max.
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
5.25
6.60
5.30
2.413
4.699
10.10
1.50
3.00
0.95
1.00
A
A1
A2
b
b4
c
c2
D
D1
E
5.10
E1
e
5.20
2.286
4.572
e1
H
L
L1
L2
L4
R
2.80
0.80
0.20
V2
0°
8°
DS2857
–
Rev 8
page 11/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
DPAK (TO-252) type C2 package information
4.2
DPAK (TO-252) type C2 package information
Figure 22.
DPAK (TO-252) type C2 package outline
0068772_C2_25
DS2857
–
Rev 8
page 12/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
DPAK (TO-252) type C2 package information
Table 10.
DPAK (TO-252) type C2 mechanical data
mm
Typ.
2.30
1.01
Dim.
Min.
2.20
0.90
0.00
0.72
5.13
0.47
0.47
6.00
5.10
6.50
5.20
2.186
9.80
1.40
Max.
2.38
1.10
0.10
0.85
5.46
0.60
0.60
6.20
5.60
6.70
5.50
2.386
10.40
1.70
A
A1
A2
b
b4
c
5.33
c2
D
6.10
6.60
D1
E
E1
e
2.286
10.10
H
L
1.50
L1
L2
L3
L4
L6
θ1
θ2
V2
2.90 REF
0.90
0.60
1.25
1.00
0.51 BSC
0.80
1.80 BSC
7°
5°
5°
0°
9°
9°
8°
7°
DS2857
–
Rev 8
page 13/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
DPAK (TO-252) type C2 package information
Figure 23.
DPAK (TO-252) recommended footprint (dimensions are in mm)
FP_0068772_25
DS2857
–
Rev 8
page 14/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
DPAK (TO-252) packing information
4.3
DPAK (TO-252) packing information
Figure 24.
DPAK (TO-252) tape outline
10 pitches cumulative
tolerance on tape +/- 0.2 mm
P0
Top cover
tape
P2
D
T
E
F
W
K0
B1
B0
For machine ref. only
including draft and
A0
D1
P1
radii concentric around B0
U
s
er direction o
f
f
e
ed
R
Bending radius
U
s
er direction o
f
f
e
ed
AM08852v1
DS2857
–
Rev 8
page 15/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
DPAK (TO-252) packing information
Figure 25.
DPAK (TO-252) reel outline
T
40mm min.
access hole
at slot location
B
D
C
N
A
G measured
at hub
Tape slot
in core for
tape start
Full radius
2.5mm min.width
AM06038v1
Table 11.
DPAK (TO-252) tape and reel mechanical data
Tape
Reel
mm
mm
Dim.
Dim.
Min.
6.8
Max.
7
Min.
Max.
A0
B0
B1
D
A
B
C
D
G
N
T
330
10.4
10.6
12.1
1.6
1.5
12.8
20.2
16.4
50
13.2
18.4
22.4
1.5
1.5
D1
E
1.65
7.4
1.85
7.6
F
K0
P0
P1
P2
R
2.55
3.9
2.75
4.1
Base qty.
Bulk qty.
2500
2500
7.9
8.1
1.9
2.1
40
T
0.25
15.7
0.35
16.3
W
DS2857
–
Rev 8
page 16/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
TO-220 type A package information
4.4
TO-220 type A package information
Figure 26.
TO-220 type A package outline
0015988_typeA_Rev_21
DS2857
–
Rev 8
page 17/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
TO-220 type A package information
Table 12.
TO-220 type A package mechanical data
mm
Dim.
Min.
4.40
0.61
1.14
0.48
15.25
Typ.
Max.
4.60
0.88
1.55
0.70
15.75
A
b
b1
c
D
D1
E
1.27
10.00
2.40
4.95
1.23
6.20
2.40
13.00
3.50
10.40
2.70
5.15
1.32
6.60
2.72
14.00
3.93
e
e1
F
H1
J1
L
L1
L20
L30
øP
Q
16.40
28.90
3.75
2.65
3.85
2.95
DS2857
–
Rev 8
page 18/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
TO-220FP package information
4.5
TO-220FP package information
Figure 27.
TO-220FP package outline
7012510_Rev_12_B
DS2857
–
Rev 8
page 19/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
TO-220FP package information
Table 13.
TO-220FP package mechanical data
mm
Typ.
Dim.
Min.
4.4
Max.
4.6
A
B
2.5
2.7
D
2.5
2.75
0.7
E
0.45
0.75
1.15
1.15
4.95
2.4
F
1
F1
F2
G
1.70
1.70
5.2
G1
H
2.7
10
10.4
L2
L3
L4
L5
L6
L7
Dia
16
28.6
9.8
2.9
15.9
9
30.6
10.6
3.6
16.4
9.3
3
3.2
DS2857
–
Rev 8
page 20/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Ordering information
5
Ordering information
Table 14.
Order codes
Order code
STD5NK60ZT4
STP5NK60Z
Marking
Package
DPAK
Packing
T
a
pe and reel
Tube
D5NK60Z
P5NK60Z
TO-220
STP5NK60ZFP
P5NK60ZFP
TO-220FP
Tube
DS2857
–
Rev 8
page 21/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Revision history
Table 15.
Document revision history
Date
Version
Changes
05-Apr-2005
1
2
3
4
5
6
7
First issue
29-Apr-2005
06-Sep-2005
14-Oct-2005
28-Oct-2005
14-Nov-2005
15-Dec-2005
Modified value in
T
a
ble 7.
Inserted Ecopack indication
Modified value on
T
a
ble 1
T
a
pe & Reel info added
Modified value on
T
a
ble 6
Various corrections
Removed maturity status indication from cover page. The document status is production data.
22-Aug-2018
8
Minor text changes.
DS2857
–
Rev 8
page 22/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
Contents
Contents
Electrical ratings
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.
2
Electrical characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.
3
Electrical characteristics curves
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5
Test circuits
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.
8
Package information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.
9
DPAK (TO-252) type A2 package information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9
DPAK (TO-252) type C2 package informatio
n
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
DPAK (TO-252) packing information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.
14
TO-220 type A package information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.
16
TO-220FP package information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.
18
Ordering information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
Revision history
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
22
DS2857
–
Rev 8
page 23/24
STD5NK60ZT4, STP5NK60Z, STP5NK60ZFP
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of S
T
.
A
ll other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
DS2857
–
Rev 8
page 24/24
