STMicroelectronics-STS9NF3LL

Part #STMicroelectronics-STS9NF3LL
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STMicroelectronics-STS9NF3LL
STS9NF3LL  
N-CHANNEL 30V – 0.016
Ω
– 9A SO-8  
LOW GATE CHARGE STripFET™ II POWER MOSFET  
V
R
I
D
TYPE  
DSS  
DS(on)  
STS9NF3LL  
30 V  
<0.019
Ω  
9 A  
■
■
■
■
TYPICAL R
 
(on) = 0.016
Ω  
DS  
OPTIMAL R
 
(on) x Qg TRADE-OFF @ 4.5V  
DS  
CONDUCTION LOSSES REDUCED  
SWITCHING LOSSES REDUCED  
DESCRIPTION  
This application specific Power MOSFET is the second  
generation of STMicroelectronis unique “Single Feature  
Size™” strip-based process. The resulting transistor  
shows the best trade-off between on-resistance and gate  
charge. When used as high and low side in buck  
regulators, it gives the best performance in terms of both  
conduction and switching losses. This is extremely  
important for motherboards where fast switching and  
high efficiency are of paramount importance.  
SO-8  
I
TERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
■
SPECIFICALLY DESIGNED AND OPTIMISED  
FOR HIGH EFFICIENCY CPU CORE DC/DC  
CONVERTERS FOR MOBILE PC  
S
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
30  
Unit  
V
V
Drain-source Voltage (V
 
= 0)  
DS  
GS  
V
Drain-gate Voltage (R
 
= 20 k
Ω
)  
30  
V
DGR  
GS  
V
Gate- source Voltage  
± 16  
9
V
GS  
I
Drain Current (continuos) at T
 
= 25°C  
A
D
C
I
Drain Current (continuos) at T
 
= 100°C  
5.6  
36  
A
D
C
I
(
•
)  
Drain Current (pulsed)  
A
DM  
P
T
o
tal Dissipation at T
 
= 25°C  
2.5  
W
tot  
C
(
•
)
Pulse width limited by safe operating area.  
November 2001  
1/8  
.

STS9NF3LL  
THERMAL DATA  
(*)  
Rthj-amb  
Max  
50  
150  
-55 to 150  
°C/W  
°C  
°C  
Thermal Resistance Junction-ambient  
T
Maximum Operating Junction
T
e
mperature  
Storage
T
e
mperature  
j
T
stg  
(*)  
2
When mounted on FR-4 board with 0.5 in
 
pad of Cu.  
ELECTRICAL CHARACTERISTICS
(T  
= 25 °C unless otherwise specified)  
case  
OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
I
= 250 µA, V
 
= 0  
D
GS  
V
30  
V
(BR)DSS  
Breakdown Voltage  
V
= Max Rating  
DS  
Zero Gate Voltage  
1
10  
µA  
µA  
I
DSS  
Drain Current (V
 
= 0)  
V
DS  
= Max Rating
 
T =
 
125°C  
GS  
C
Gate-body Leakage  
V
GS  
= ± 16 V  
±100  
nA  
I
GSS  
Current (V
 
= 0)  
DS  
(*
)  
ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
V
= V  
I
I
= 250 µA  
Gate Threshold Voltage  
1
V
GS(th)  
DS  
GS  
D
V
V
= 10 V  
= 4.5
= 4.5 A  
Static Drain-source On  
Resistance  
0.016  
0.019  
0.019  
0.022  
Ω
Ω
GS  
D
I
R
DS(on)  
= 4.5 A  
GS  
D
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
=15 V
 
= 4 A  
Min.  
Typ.  
Max.  
Unit  
(*)  
V
V
I
D
g
fs  
Forward Transconductance  
12.5  
S
DS  
DS  
C
iss  
= 25
V
, f = 1 MHz, V
 
= 0  
GS  
Input Capacitanc
Output Capac
nce  
Revers
Transfer  
Capacitance  
800  
250  
60  
pF  
pF  
pF  
C
oss  
C
rss  
2/8  

STS9NF3LL  
ELECTRICAL CHARACTERISTICS
(continued)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
= 15 V  
Min.  
Typ.  
Max.  
Unit  
V
R
I
= 4.5 A  
= 4.5 V  
Turn-on Delay Time  
Rise Time  
18  
32  
ns  
ns  
t
DD  
D
d(on)  
= 4.7
Ω  
V
GS  
t
r
G
(Resistive Load, Figure 1)  
Q
V
= 15 V
 
I =
 
9 A V
 
= 5 V  
T
o
tal Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
12.5  
3.2  
4.5  
17  
nC  
nC  
nC  
g
DD  
D
GS  
Q
gs  
Q
(see test circuit, Figure 2)  
gd  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Min.  
Typ.  
Max.  
Unit  
V
R
= 15 V  
= 4.7
Ω,  
I
= 4.5 A  
= 4.5 V  
Turn-off Delay Time  
Fall Time  
21  
11  
ns  
ns  
t
DD  
D
d(off)  
V
GS  
t
G
f
(Resistive Load, Figure 3)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Typ.  
Max.  
Unit  
I
Source-drain Current  
Source-drain Current (pulsed)  
9
36  
A
A
SD  
( )  
•
I
SDM  
(*)  
I
I
= 9 A  
= 0  
GS  
V
Forward On Voltage  
1.2  
V
SD  
SD  
SD  
t
rr  
= 9 A  
di/dt = 100A/µs  
T =
 
150°C  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
23  
17  
1.5  
ns  
nC  
A
Q
V
= 15 V  
rr  
DD  
j
I
(see test circuit, Figure 3)  
RRM  
(*)  
(
Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
•
)
Pulse width limited by safe operating area.  
Thermal Impedance  
Safe O
ating Area  
3/8  

STS9NF3LL  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source O
esistance  
Gate C
ge vs Gate-source Voltage  
Capacitance Variations  
4/8  

STS9NF3LL  
Normalized Gate Threshold Voltage vs Temperature  
Normalized on Resistance vs Temperature  
Source-drain Diode Forward Characteristics  
Normalized Breakdow
Voltage vs Temperature.  
.
.
5/8  

STS9NF3LL  
Fig. 1:
Switching Times Test Circuits For Resistive  
Fig. 2:
Gate Charge test Circuit  
Load  
Fig. 3:
Test Circuit For Diode Recovery Behaviour  
6/8  

STS9NF3LL  
SO-8 MECHANICAL
 
DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
TYP.  
MAX.  
1.75  
0.25  
1.65  
0.85  
0.48  
0.25  
0.5  
MIN.  
MAX.  
0.068  
0.009  
0.064  
0.033  
0.018  
0.010  
0.019  
A
a1  
a2  
a3  
b
0.1  
0.003  
0.65  
0.35  
0.19  
0.25  
0.025  
0.013  
0.007  
0.010  
b1  
C
c1  
D
45 (typ.)  
4.8  
5.8  
5.0  
6.2  
0.188  
0.228  
0.196  
0.244  
E
e
1.27  
3.81  
0.050  
0.150  
e3  
F
3.8  
0.4  
4.0  
1.27  
0.14  
0.157  
0.050  
0.023  
L
0.015  
M
S
8 (max.)  
0016023  
7/8  

STS9NF3LL  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is registered trademark of STMicroelectronics  
2001 STMicroelectronics – All Rights Reserved  
All other names are the property of their respective owners.  
STMicroelectronics GROUP OF COMPANIES  
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