STMicroelectronics-STS9P2UH7

Part #STMicroelectronics-STS9P2UH7
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STMicroelectronics-STS9P2UH7
STS9P2UH7  
P-
channel 20 V, 0.0195 Ω typ., 9 A STripFET™ H7  
Power MOSFET in a SO-8 package  
Datasheet – production data  
Features  
5
8
Order code  
V

DS  

R

DS(on)

max  
I

D  

STS9P2UH7  
20 V  
0.0225 Ω @ 4.5 V  
9 A  
4
1
Very low on-resistance  
Very low capacitance and gate charge  
High avalanche ruggedness  
Ultra logic level  
SO-8  
Figure 1: Internal schematic diagram  
Applications  
Switching applications  
Description  
This device exhibits low on-state resistance and  
capacitance for improved conduction and  
switching performance.  
Table 1: Device summary  
Marking Package  
9L2U SO-8  
Order code  
Packaging  
STS9P2UH7  
Tape and reel  
For the P-channel Power MOSFET the actual polarity of the voltages and the current must be  
reversed.  
January 2015  
DocID025143 Rev 3  
1/15  
This is information on a product in full production.  

STS9P2UH7  
Electrical ratings  
1
Electrical ratings  
Table 2: Absolute maximum ratings  
Parameter  
Symbol  
Value  
Unit  
20  
V
V

DS  

Drain-source voltage  
± 8  
V
A
V

GS  

I

D  

Gate-source voltage  
9
5.8  
Drain current (continuous) at T

pcb

= 25 °C  
Drain current (continuous) at T

pcb

= 100 °C  
Drain current (pulsed)  
A
I

D  

P

TOT  

T

stg  

T

j  

36  
A
2.7  
W
°C  
°C  
Total dissipation at T

pcb

= 25 °C  
Storage temperature  
– 55 to 150  
150  
Max. operating junction temperature  
Notes:  

(1)

Pulse width limited by safe operating area  
Table 3: Thermal data  
Parameter  
Symbol  
Value  
Unit  
°C/W  
R

thj-pcb  

47  
Thermal resistance junction-pcb max  
Notes:  

(1)

When mounted on 1inch² FR-4 board, 2 oz Cu  
For the P-channel Power MOSFET the actual polarity of the voltages and the  
current must be reversed.  
DocID025143 Rev 3  
3/15  
 
 

Electrical characteristics  
STS9P2UH7  
2
Electrical characteristics  
(T

C

= 25 °C unless otherwise specified)  
Table 4: On /off states  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max.  
Unit  
Drain-source breakdown  
voltage  
20  
V
V

(BR)DSS  

V

GS

= 0, I

D

= 250 µA  
Zero gate voltage  
drain current  
1
µA  
µA  
I

DSS  

V

GS

= 0, V

DS

= 20 V  
V

DS

= 0, V

GS

= ± 5 V  
Gate-body leakage  
current  
± 5  
I

GSS  

0.4  
1
V
Ω
Ω
Ω
Ω
V

GS(th)  

Gate threshold voltage  
V

DS

= V

GS

, I

D

= 250 µA  
V

GS

= 4.5 V, I

D

= 4.5 A  
V

GS

= 2.5 V, I

D

= 4.5 A  
V

GS

= 1.8 V, I

D

= 4.5 A  
V

GS

= 1.5 V, I

D

= 4.5 A  
0.0195  
0.02  
0.0225  
0.025  
0.043  
0.085  
Static drain-source on-  
resistance  
R

DS(on)  

0.036  
0.05  
Table 5: Dynamic  
Test conditions  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Unit  
–
–
–
–
–
–
2390  
–
pF  
C

iss  

Input capacitance  
Output capacitance  
V

GS

= 0, V

DS

= 16 V,  
f = 1 MHz  
220  
188  
22  
–
–
–
–
–
pF  
pF  
nC  
nC  
nC  
C

oss  

C

rss  

Q

g  

Reverse transfer capacitance  
Total gate charge  
Gate-source charge  
Gate-drain charge  
V

DD

= 16 V, I

D

= 9 A,  
V

GS

= 4.5 V  
4.2  
3.6  
Q

gs  

Q

gd  

Table 6: Switching times  
Test conditions  
Symbol  
Parameter  
Turn-on delay time  
Rise time  
Min.  
Typ.  
Max  
Unit  
–
–
–
–
12.5  
30.5  
128  
–
ns  
t

d(on)  

–
–
–
ns  
ns  
ns  
t

r  

t

d(off)  

t

f  

V

DD

= 16 V, I

D

= 9 A,  
R

G

= 1 Ω, V

GS

= 4.5 V  
Turn-off delay time  
Fall time  
84.5  
4/15  
DocID025143 Rev 3  
 
 
 
 

STS9P2UH7  
Electrical characteristics  
Min. Typ. Max. Unit  
Table 7: Source drain diode  
Test conditions  
Symbol  
Parameter  
Forward on voltage  
Reverse recovery time  
V

SD  

–
1
V
V

GS

= 0, I

SD

= 1 A  
–
–
–
15.8  
5.9  
ns  
nC  
A
t

rr  

V

DD

= 16 V  
Q

rr  

Reverse recovery charge  
Reverse recovery current  
di/dt = 100 A/µs, I

SD

= 1 A  
0.7  
I

RRM  

Notes:  

(1)

Pulsed: pulse duration = 300 µs, duty cycle 1.5%  
For the P-channel Power MOSFET the actual polarity of the voltages and the  
current must be reversed.  
DocID025143 Rev 3  
5/15  
 
 

Electrical characteristics  
STS9P2UH7  
2.1  
Electrical characteristics (curves)  
Figure 3: Thermal impedance  
Figure 2: Safe operating area  
GIPG210520141
0
1
1
SA  
I
D  
(A)  
δ
0.2  
0.1  
100µs  
1ms  
10  
1
0.05  
0.02  
10ms  
0.01  
pcb  
0.1  
Tj=150°C  
Tpcb=25°C  
Single pulse  
0.01  
V
DS
(V)  
0.1  
1
10  
Figure 4: Output characteristics  
Figure 5: Transfer characteristics  
GIPG210520141044
S
A  
GIPG210520141055
S
A  
I
D  
I
D
(A)  
V
G
S
=2.5, 3, 3.5, 4, 4.5, 5V  
(A)  
V
DS
=2V  
20  
12.00  
8.00  
2V  
15  
10  
5
1.5V  
4.00  
0.00  
0
0.5  
6
8
V
DS
(V)  
2
0
2
4
0
1
1.5  
V
G
S
(V)  
Figure 6: Gate charge vs gate-source voltage  
Figure 7: Static drain-source on-resistance  
GIPG210520141043
S
A  
GIPG2105201
4
1
102SA  
V
GS  
R
DS(on)  
(V)  
(m
Ω
)  
V
DD
=16V  
V
G
S
=4.5V  
20.5  
I
D
=9A  
4
20.0  
19.5  
3
2
19.0  
18.5  
18.0  
1
0
15  
2
3
4
5
1
6
0
5
10  
20  
Q
g
(nC)  
I
D
(A)  
0
6/15  
DocID025143 Rev 3  
 

STS9P2UH7  
Electrical characteristics  
Figure 9: Normalized gate threshold voltage  
vs temperature  
Figure 8: Capacitance variations  
C
GIPG2105201
4
1
108SA  
GIPG2105201
4
1
114SA  
V
GS(th)  
(norm)  
(pF)  
I
D
=250µ A  
1.4  
Ciss  
1.2  
1
1000  
0.8  
0.6  
Coss  
Crss  
0.4  
0.2  
100  
0
12  
4
8
16  
V
DS
(V)  
-75  
-25  
75  
T
J
(°C)  
125  
25  
Figure 10: Normalized on-resistance vs  
temperature  
Figure 11: Normalized V(BR)DSS vs  
temperature  
GIPG2105201
4
1
119SA  
GIPG2105201
4
1
1
32SA  
R
DS(on)  
V
(BR)DSS  
(norm)  
(norm)  
I
D
=4.
5
A  
1.6  
I
D
=1
m
A  
V
G
S
=4.5V  
1.4  
1.04  
1.2  
1.0  
0.8  
0.6  
0.4  
1
0.96  
0.92  
0.2  
0.0  
-75  
-75  
-25  
75  
T
J
(°C)  
-25  
75  
T
J
(°C)  
125  
125  
25  
25  
Figure 12: Source-drain diode forward characteristics  
GIPG2105201
4
1
1
34SA  
(V)  
V
SD  
T
J
=-55°C  
0.9  
T
J
=25°C  
0.8  
0.7  
T
J
=75°C  
0.6  
0.5  
1
2
3
4
5
6
7
8
I
SD
(A)  
DocID025143 Rev 3  
7/15  

Test circuits  
STS9P2UH7  
3
Test circuits  
Figure 13: Switching times test circuit for  
resistive load  
Figure 14: Gate charge test circuit  
Figure 15: Test circuit for inductive load switching and diode recovery times  
8/15  
DocID025143 Rev 3  

STS9P2UH7  
Package mechanical
data  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK

®  

specifications, grade definitions and product status are available at:

.  
ECOPACK

®

is an ST trademark.  
4.1  
SO-8 package mechanical data  
Figure 16: SO-8 drawing  
DocID025143 Rev 3  
9/15  

Package mechanical
data  
STS9P2UH7  
Table 8: SO-8 mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
A1  
A2  
b
1.75  
0.25  
0.10  
1.25  
0.31  
0.28  
0.10  
0.10  
4.80  
5.80  
3.80  
0.51  
0.48  
0.25  
0.23  
5.00  
6.20  
4.00  
b1  
c
c1  
D
4.90  
6.00  
3.90  
1.27  
E
E1  
e
h
0.25  
0.40  
0.50  
1.27  
L
L1  
L2  
k
1.04  
0.25  
0°  
8°  
ccc  
0.10  
10/15  
DocID025143 Rev 3  

STS9P2UH7  
Package mechanical
data  
Figure 17: SO-8 recommended footprint  
DocID025143 Rev 3  
11/15  

Packaging mechanical
data  
STS9P2UH7  
5
Packaging mechanical data  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK

®  

specifications, grade definitions and product status are available at:

.  
ECOPACK

®

is an ST trademark.  
5.1  
SO-8 tape and reel mechanical data  
Figure 18: SO-8 tape and reel dimensions  
12/15  
DocID025143 Rev 3  

STS9P2UH7  
Packaging mechanical
data  
Table 9: SO-8 tape and reel mechanical data  
mm  
Dim.  
Min.  
Typ.  
Max.  
A
C
–
330  
12.8  
20.2  
60  
–
–
–
–
–
–
–
–
–
13.2  
D
N
T
22.4  
8.5  
5.9  
2.3  
4.1  
8.1  
Ao  
Bo  
Ko  
Po  
P
8.1  
5.5  
2.1  
3.9  
7.9  
DocID025143 Rev 3  
13/15  

Revision history  
STS9P2UH7  
6
Revision history  
Table 10: Document revision history  
Changes  
Date  
Revision  
27-Aug-2013  
1
First release.  
Document status promoted from preliminary data to production data  
Modified: title  
Modified: R

DS(on)

max value in cover page  
Modified: R

DS(on)

(typical and maximum) values in

04-Jun-2014  
12-Jan-2015  
2
3
Modified: the entire typical values in

Minor text changes  
Updated title, features and description in cover page.  
14/15  
DocID025143 Rev 3  

STS9P2UH7  
IMPORTANT NOTICE
–
PLEASE READ CAREFULLY  
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications
, and  
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST  
products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of or
der  
acknowledgement.  
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the  
design of Purchasers’ products.  
No license, express or implied, to any intellectual property right is granted by ST herein.  
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.  
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2015 STMicroelectronics
–
All rights reserved  
DocID025143 Rev 3  
15/15