STMicroelectronics-STW30NM50N

Part #STMicroelectronics-STW30NM50N
Download 
STMicroelectronics-STW30NM50N
STB30NM50N,STI30NM50N,STF30NM50N  
STP30NM50N, STW30NM50N  
N-channel 500
V
,
0
.090
Ω
, 27 A MDmesh™ II Power MOSFET  
D

2

P
A
K, I

2

P
A
K, TO-220F
P
,
T
O-220, TO-247  
Features  
R

DS(on)  

max  
V

DSS  

(@Tjmax)  
Type  
I

D  

3
3
1
2
1
STB30NM50N  
STI30NM50N  
STF30NM50N  
STP30NM50N  
STW30NM50N  
550 V  
550 V  
550 V  
550 V  
550 V  
< 0.115
Ω  
< 0.115
Ω  
< 0.115
Ω
27 A

(1)  

27 A  
27 A  
D²PAK  
I²PAK  
3
2
1
TO-247  
< 0.115
Ω  
< 0.115
Ω  
27 A  
27 A  
3
3
1. Limited
 
only by maximum temperature allowed  
2
2
1
1
■
100% avalanche tested  
TO-220FP  
TO-220  
■
Low input capacitance and gate charge  
■
Low gate input resistance  
Figure 1.  
Internal schematic diagram  
Application  
■
Switching applications  
Description  
This series of devices is designed using the  
second generation of MDmesh™
T
e
chnolog
y
.  
This revolutionary Power MOSFET associates a  
new vertical structure to the Company’s strip  
layout to yield one of the world’s lowest on-  
resistance and gate charge. It is therefore suitable  
for the most demanding high efficiency  
converters.  
Table 1.  
Device summary  
Order codes  
Marking  
Package  
Packaging  
STB30NM50N  
STI30NM50N  
STF30NM50N  
STP30NM50N  
STW30NM50N  
30NM50N  
30NM50N  
30NM50N  
30NM50N  
30NM50N  
D²
P
A
K  
I²
P
A
K  
T
a
pe and reel  
T
u
be  
TO-220FP  
TO-220  
TO-247  
T
u
be  
T
u
be  
T
u
be  
September 2008  
Rev 2  
1/18  
18  

Contents  
STB/I/F/P/W30NM50N  
Contents  
1
2
Electrical ratings
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2.1  
Electrical characteristics (curves)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
6  
3
4
5
6
Test circuits  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Packaging mechanical data
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Revision history
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
2/18  

STB/I/F/P/W30NM50N  
Electrical ratings  
1
Electrical ratings  
Table 2.  
Symbol  
Absolute maximum ratings  
Parameter  
Value  
D²PAK/I²PAK  
Unit  
TO-220FP  
TO-220/TO-247  
V

DS  

V

GS  

I

D  

Drain-source voltage (V

GS

=0)  
500  
V
V
Gate-source voltage  
25  
27

(1)  

A
Drain current (continuous) at T

C

= 25 °C  
Drain current (continuous) at T

C

= 100 °C  
27  
17  
17

(1)  

A
I

D  

(2)  
108

(1)  

A
Drain current (pulsed)  
108  
190  
15  
I

DM  

P

TOT  

T
o
tal dissipation at T

C

= 25 °C  
Peak diode recovery voltage slope  
40  
W
dv/dt

(3)  

V/ns  
Insulation withstand voltage (RMS) from all  
three leads to external heat sink  
V

ISO  

—  
2500  
V
(t=1 s;T

C

=25 °C)  
T

stg  

T

j  

Storage temperature  
-55 to 150  
150  
°C  
°C  
Max. operating junction temperature  
1. Limited
 
only by maximum temperature allowed  
2. Pulse
 
width limited by safe operating area  
3. I

SD

≤
27 A, di/dt
 
≤
400 A/µs, V

DD

= 80% V

(BR)DSS  

Table 3.  
Symbol  
Thermal data  
Parameter  
I²PAK TO-220 D²PAK TO-220FP TO-247 Unit  
Thermal resistance junction-  
case max  
R

thj-case  

R

thj-pcb  

R

thj-amb  

T

l  

0.66  
—  
3.1  
—  
0.66 °C/W  
Thermal resistance junction-  
pcb max  
—  
30  
—  
—  
°C/W  
°C/W  
°C  
Thermal resistance junction-  
amb max  
62.5  
62.5  
50  
Maximum lead temperature for  
soldering purposes  
300  
Table 4.  
Symbol  
Avalanche characteristics  
Parameter  
Max value  
Unit  
Avalanche current, repetitive or not-repetitive  
(pulse width limited by T

j

max)  
I

AR  

12  
A
Single pulse avalanche energy  
E

AS  

900  
mJ  
(starting T

j

= 25 °C, I

D

= I

AR

, V

DD

= 50 V)  
3/18  

Electrical characteristics  
STB/I/F/P/W30NM50N  
2
Electrical characteristics  
(T  
= 25 °C unless otherwise specified)  
CASE  
Table 5.  
Symbol  
On /off states  
Parameter  
Test conditions  
I

D

= 1 mA, V

GS

= 0  

DS

= Max rating  
Min.  
Typ.  
Max. Unit  
Drain-source  
breakdown voltage  
V

(BR)DSS  

500  
V
Zero gate voltage  
V
1
µA  
µA  
I

DSS  

drain current (V

GS

= 0)
 
V

DS

= Max rating, T

C

=125 °C  
100  
Gate-body leakage  
I

GSS  

V

GS  

=
20 V  
100  
4
nA  
V
current (V

DS

= 0)  
V

GS(th)  

R

DS(on  

Gate threshold voltage
 
V

DS

= V

GS

, I

D

= 250 µA  
Static drain-source on  
2
3
V

GS

= 10
V
,
I

D

= 13.5 A  
0.090 0.115  
Ω
resistance  
Table 6.  
Symbol  
Dynamic  
Parameter  
Test conditions  
Min.  
Typ.  
Max. Unit  
Forward  
transconductance  
(1)  
g

fs  

V

DS

= 15
V
,
I

D

= 13.5 A  
23  
S
Input capacitance  
C

iss  

C

oss  

C

rss  

2740  
160  
15  
pF  
pF  
pF  
Output capacitance  
V

DS

= 50
V
, f = 1
M
Hz, V

GS

= 0  
f=1MHz Gate DC Bias=0  
Reverse transfer  
capacitance  
R

g  

Gate input resistance
 
T
e
st signal level=20 mV  
open drain  
2.7  
Ω
Q

g  

Q

gs  

Q

gd  

T
o
tal gate charge  
Gate-source charge  
Gate-drain charge  
V

DD

= 400
V
,
I

D

= 27 A,  
V

GS

= 10 V  
94  
15  
50  
nC  
nC  
nC  
(see Figure 19)  
1. Pulsed:
 
Pulse duration = 300 µs, duty cycle 1.5%  
4/18  

STB/I/F/P/W30NM50N  
Electrical characteristics  
Min. Typ.
 
Max Unit  
Table 7.  
Symbol  
Switching times  
Parameter  
Test conditions  
t

d(on)  

t

r  

t

d(off)  

t

f  

T
u
rn-on delay time  
Rise time  
23  
20  
ns  
ns  
ns  
ns  
V

DD

= 250
V
,
I

D

= 13.5 A,  
R

G

= 4.7
Ω,
V

GS

= 10 V  
(see Figure 18)  
T
u
rn-off-delay time  
Fall time  
115  
60  
Table 8.  
Symbol  
Source drain diode  
Parameter  
Test conditions  
Min Typ. Max
 
Unit  
I

SD  

Source-drain current  
27  
A
A
(1)  
I

SDM  

Source-drain current (pulsed)  
108  
(2)  
V

SD  

Forward on voltage  
I

SD

= 27 A, V

GS

= 0  
1.5  
V
t

rr  

Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
I

SD

= 27 A, di/dt = 100 A/µs  
V

DD

= 100 V Tj = 25°C  
(see Figure 20)  
480  
8
ns  
µC  
A
Q

rr  

I

RRM  

33  
t

rr  

Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
I

SD

= 27 A, di/dt = 100 A/µs  
V

DD

= 100 V Tj = 150°C  
(see Figure 20)  
540  
10  
ns  
µC  
A
Q

rr  

I

RRM  

35  
1. Pulse
 
width limited by safe operating area  
2. Pulsed:
 
pulse duration = 300µs, duty cycle 1.5%  
5/18  

Electrical characteristics  
STB/I/F/P/W30NM50N  
2.1  
Electrical characteristics (curves)  
Figure 2.
 
Safe operating area for TO-220 /  
D²PAK / I²PAK  
Figure 3.
 
Thermal impedance for TO-220 /  
D²PAK / I²PAK  
!-ꢀꢀꢈꢉꢊVꢂ  
GC20540  
)
$  
ꢃ!ꢄ  
K
4Jꢅꢂꢆꢀ #  
4Cꢅꢇꢆ #  
δ
=0.5  
3INGLE PULSE  
ꢂꢀꢀ  
ꢂꢀ  
/PERATING IN THIS AREA IS  
,IMITED BY MAX 2
$3ꢃONꢄ  
0.2  
0.1  
10

-1  

ꢂꢀ—S  
ꢂꢀꢀ—S  
ꢂMS  
0.05  
Zth=k Rthj-c  
δ
=tp/
τ  
0.02  
ꢂꢀMS  
0.01  
ꢂ
S
ingle p
u
l
s
e  
t

p

τ  
10

-2  

10

-5  

ꢀꢁꢂ  
ꢀꢁꢂ  
10

-2  

p

(
s
)  
10

-4  

10

–
3
 

10

-1  

t
ꢂ
ꢂꢀꢀ  
6
$3
ꢃ6ꢄ  
ꢂꢀ  
Figure 4.
 
Safe operating area for TO-220FP  
Figure 5.
 
Thermal impedance for TO-220FP  
GC20521  
!-ꢀꢀꢈꢉꢈVꢂ  
)
$  
ꢃ!ꢄ  
K
4Jꢅꢂꢆꢀ #  
4Cꢅꢇꢆ #  
δ
=0.5  
3INGLE PULSE  
0.2  
ꢂꢀꢀ  
ꢂꢀ  
0.1  
-1  
10  
ꢂꢀ—S  
ꢂꢀꢀ—S  
0.05  
0.02  
Zth=k Rthj-c  
δ
=t /
τ  
0.01  
S
ingle p
u
l
s
e  
ꢂMS  
p
-2  
ꢂꢀMS  
10  
ꢂ
t

p

τ  
–
3
 
10  
10  
ꢀꢁꢂ  
ꢀꢁꢂ  
-1  
10

0  

-4  
–
3  
-2  

p

(
s
)  
t
10  
10  
10  
ꢂ
ꢂꢀꢀ  
6
$3
ꢃ6ꢄ  
ꢂꢀ  
Figure 6.
 
Safe operating area for TO-247  
Figure 7.
 
Thermal impedance for TO-247  
!-ꢀꢀꢈꢋꢀVꢂ  
GC1
8
460  
)
$  
ꢃ!ꢄ  
K
δ
=0.5  
4Jꢅꢂꢆꢀ #  
4Cꢅꢇꢆ #  
3INGLE PULSE  
0.2  
0.1  
ꢂꢀꢀ  
ꢂꢀ  
10

-1  

10

-2  

10

–
3  

0.05  
0.02  
ꢂꢀ—S  
ꢂꢀꢀ—S  
0.01  
S
ingle p
u
l
s
e  
Zth=k Rthj-c  
δ
=tp/
τ  
ꢂMS  
ꢂꢀMS  
ꢂ
t

p

τ  
ꢀꢁꢂ  
ꢀꢁꢂ  
10

-2  

10

-5  

10

-4  

10

–
3  

10

-1  

p

(
s
)  
t
ꢂ
ꢂꢀꢀ  
6
$3
ꢃ6ꢄ  
ꢂꢀ  
6/18  

STB/I/F/P/W30NM50N  
Electrical characteristics  
Figure 8.
 
Output characteristics  
Figure 9.
 
Transfer characteristics  
AM00941v1  
!-ꢀꢀꢈꢋꢇVꢂ  
I
D  
)
$  
(A)  
ꢃ!ꢄ  
V
G
S
=10V  
ꢉꢆ  
3
5  
ꢉꢀ  
3
0  
ꢇꢆ  
ꢇꢀ  
ꢂꢆ  
25  
20  
5V  
15  
10  
5
ꢂꢀ  
ꢆ
4V  
0
ꢀ
ꢀ
0
10  
ꢇ
ꢋ
ꢌ
V
D
S
(V)  
ꢂꢀ 6

‘3

ꢃ6ꢄ  
20  
ꢊ
3
0  
Figure 10.
 
Transconductance  
Figure 11.
 
Static drain-source on resistance  
!-ꢀꢀꢈꢋꢉVꢂ  
AM00944v1  
)
$  
R
D
S
(on)  
ꢃ!ꢄ  
(
Ω
)  
4

*

ꢅꢍꢆꢀ #  
ꢉꢀꢁꢆ  
0.094  
ꢇꢆꢁꢆ  
0.092  
0.090  
4

*

ꢅꢇꢆ #  
ꢇꢀꢁꢆ  
4
*
ꢅꢂꢆꢀ #  
ꢂꢆꢁꢆ  
0.0
88  
0.0
8
6  
ꢂꢀꢁꢆ  
ꢆꢁꢆ  
ꢀꢁꢆ  
ꢀ
0.0
8
4  
ꢆ
ꢂꢀ  
ꢂꢆ  
0
5
10  
15  
ꢇꢆ )
$
ꢃ!ꢄ  
25 I  
D
(A)  
ꢉꢀ  
3
0  
Figure 12.
 
Gate charge vs gate-source voltage
 
Figure 13.
 
Capacitance variations  
AM00945v1  
!-ꢀꢀꢈꢋꢌVꢂ  
#ꢃP&ꢄ  
V
G
S  
(V)  
V
DD
=400V  
=27A  
I
D
12  
ꢂꢀꢀꢀꢀ  
ꢂꢀꢀꢀ  
#ISS  
10  
8
6
#OSS  
#RSS  
ꢂꢀꢀ  
4
ꢂꢀ  
ꢂ
2
0
0
20  
40  
60  
ꢂ
ꢂꢀ  
ꢂꢀꢀ  
8
0  
100  
Q
g
(nC)  
ꢀꢁꢂ  
6
$3
ꢃ6ꢄ  
7/18  

Electrical characteristics  
STB/I/F/P/W30NM50N  
Figure 14.
 
Normalized gate threshold voltage
 
Figure 15.
 
Normalized on resistance vs  
vs temperature
 
temperature  
!-ꢀꢀꢈꢋꢎVꢂ  
!-ꢀꢀꢈꢋꢊVꢂ  
6
‘3ꢃTHꢄ  
2
$3ꢃONꢄ  
ꢃNORM

ꢄ  

ꢃNORM

ꢄ  

ꢂꢁꢂ  
ꢂꢁꢀ  
ꢇꢁꢀ  
ꢂꢁꢆ  
ꢂꢁꢀ  
ꢀꢁꢆ  
ꢀꢁꢈ  
ꢀꢁꢊ  
ꢀꢁꢎ  
ꢀ
ꢆꢀ  
ꢂꢀꢀ  
ꢆꢀ  
ꢂꢀꢀ  
4

*

ꢃ #ꢄ  
ꢀ
4

*

ꢃ #ꢄ  
ꢍꢆꢀ  
ꢍꢆꢀ  
Figure 16.
 
Source-drain diode forward  
characteristics  
Figure 17.
 
Normalized B  
vs temperature  
VDSS  
!-ꢀꢀꢈꢋꢈVꢂ  
!-ꢀꢀꢈꢆꢀVꢂ  
6
3$
ꢃ6ꢄ  
6
3$
ꢃ6ꢄ  
4
*
ꢅꢆꢀ #  
ꢂꢁꢀ  
ꢇꢆ #  
ꢀꢁꢈ  
ꢂꢁꢀꢉ  
ꢀꢁꢈꢊ  
ꢀꢁꢈꢉ  
ꢂꢆꢀ #  
ꢀꢁꢊ  
ꢀꢁꢎ  
ꢀꢁꢌ  
ꢀꢁꢆ  
ꢀꢁꢋ  
ꢇꢀ  
ꢉꢀ  
ꢆꢀ  
ꢂꢀꢀ  
ꢀ
ꢂꢀ  
ꢋꢀ  
ꢆꢀ )

3$

ꢃ!ꢄ  
ꢍꢆꢀ  
ꢀ
4

*

ꢃ #ꢄ  
8/18  

STB/I/F/P/W30NM50N  
Test circuits  
3
Test circuits  
Figure 18.
 
Switching times test circuit for  
resistive load  
Figure 19.
 
Gate charge test circuit  
Figure 20.
 
Test circuit for inductive load  
switching and diode recovery times  
Figure 21.
 
Unclamped inductive load test  
circuit  
Figure 22.
 
Unclamped inductive waveform  
Figure 23.
 
Switching time waveform  
9/18  

Package mechanical data  
STB/I/F/P/W30NM50N  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in ECO
P
A
CK®  
packages. These packages have a Lead-free second level interconnect. The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECO
P
ACK is an ST trademark.  
ECO
P
ACK specifications are available at:

10/18  

STB/I/F/P/W30NM50N  
Package mechanical data  
TO-220 mechanical data  
mm  
inch  
Dim  
Min  
Typ  
Max  
Min  
Typ  
Max  
A
b
4.40  
0.61  
1.14  
0.4
9
 
15.25  
4.60  
0.
88  
1.70  
0.70  
15.75  
0.17
3  
0.024  
0.044  
0.01
9  
0.6  
0.1
8
1  
0.0
3
4  
0.066  
0.027  
0.62  
b
1  
c
D
D1  
E
1.27  
0.050  
10  
10.40  
2.70  
5.15  
1.
3
2  
6.60  
2.72  
14  
0.
393  
0.0
9
4  
0.1
9
4  
0.04
8  
0.244  
0.0
9
4  
0.511  
0.1
3
7  
0.40
9  
0.106  
0.202  
0.051  
0.256  
0.107  
0.551  
0.154  
e
2.40  
4.
9
5  
1.2
3  
6.20  
2.40  
1
3  
e1  
F
H1  
J1  
L
L1  
L20  
L
3
0  
∅
P  
Q
3
.50  
3
.
93  
16.40  
0.645  
2
8
.
9
0  
1.1
3
7  
3
.75  
3
.
8
5  
2.
9
5  
0.147  
0.104  
0.151  
0.116  
2.65  
11/18  

Package mechanical data  
STB/I/F/P/W30NM50N  
TO-220FP mechanical data  
mm.  
inch  
Dim.  
Min.  
4.40  
2.5  
Typ  
Max.  
4.60  
2.7  
Min.  
Typ.  
Max.  
0.1
8
1  
0.106  
0.10
8  
0.027  
0.0
39  
0.067  
0.067  
0.204  
0.106  
0.40
9  
A
B
0.17
3  
0.0
98  
0.0
98  
0.017  
0.0
3
0  
0.045  
0.045  
0.1
9
5  
0.0
9
4  
0.
393  
D
2.5  
2.75  
0.70  
1.00  
1.50  
1.50  
5.20  
2.70  
10.40  
E
0.45  
0.75  
1.15  
1.15  
4.
9
5  
2.40  
10  
F
F1  
F2  
G
G1  
H
L2  
L
3  
L4  
L5  
L6  
L7  
Di
a  
16  
0.6
3
0  
2
8
.6  
9
.
8
0  
2.
9  
3
0.6  
10.60  
3
.6  
1.126  
0.
38
5  
0.114  
0.626  
0.
3
54  
0.11
8  
1.204  
0.417  
0.141  
0.645  
0.
3
66  
0.126  
15.
9
0  
9
16.40  
9
.
3
0  
3
.2  
3
L3  
L6  
L7  
Di
a  
1
2 3  
L5  
L2  
L4  
7012510-I  
12/18  

STB/I/F/P/W30NM50N  
Package mechanical data  
TO-247 mechanical data  
mm.  
Typ  
D
i
m.  
Min.  
Max .  
A
A1  
b
4.85  
5.15  
2.20  
1.0  
2.60  
1.40  
b1  
b2  
c
2.0  
2.40  
3.0  
3.40  
0.40  
19.85  
15.45  
0.80  
D
20.15  
15.75  
E
e
5.45  
18.50  
5.50  
L
14.20  
3.70  
14.80  
4.30  
L1  
L2  
øP  
øR  
S
3.55  
4.50  
3.65  
5.50  
13/18  

Package mechanical data  
STB/I/F/P/W30NM50N  
TO-262 mechanical data  
mm  
inch  
Dim  
Min  
Typ  
Max  
Min  
Typ  
Max  
A
A1  
b
4.40  
2.40  
0.61  
1.14  
0.4
9  
1.2
3  
8
.
9
5  
2.40  
4.
9
5  
10  
4.60  
2.72  
0.
88  
1.70  
0.70  
1.
3
2  
9
.
3
5  
2.70  
5.15  
10.40  
14  
0.17
3  
0.0
9
4  
0.024  
0.044  
0.01
9  
0.04
8  
0.
3
52  
0.0
9
4  
0.1
9
4  
0.
393  
0.511  
0.1
3
7  
0.050  
0.1
8
1  
0.107  
0.0
3
4  
0.066  
0.027  
0.052  
0.
3
6
8  
0.106  
0.202  
0.410  
0.551  
0.154  
0.055  
b
1  
c
c2  
D
e
e1  
E
L
1
3  
L1  
L2  
3
.50  
1.27  
3
.
93  
1.40  
14/18  

STB/I/F/P/W30NM50N  
Package mechanical data  
D²
P
A
K (TO-263) mechanical data  
mm  
inch  
Dim  
Min  
Typ  
Max  
Min  
Typ  
Max  
A
A1  
b
4.40  
0.0
3  
0.70  
1.14  
0.45  
1.2
3  
8
.
9
5  
7.50  
10  
4.60  
0.2
3  
0.
93  
1.70  
0.60  
1.
3
6  
9
.
3
5  
0.17
3  
0.001  
0.027  
0.045  
0.017  
0.04
8  
0.
3
52  
0.2
9
5  
0.
39
4  
0.
33
4  
0.1
8
1  
0.00
9  
0.0
3
7  
0.067  
0.024  
0.05
3  
0.
3
6
8  
b
2  
c
c2  
D
D1  
E
10.40  
0.40
9  
E1  
e
8
.50  
2.54  
0.1  
e1  
H
4.
88  
15  
5.2
8  
15.
8
5  
2.6
9  
2.7
9  
1.40  
1.75  
0.1
9
2  
0.5
9
0  
0.0
99  
0.0
9
0  
0.05  
0.20
8  
0.624  
0.106  
0.110  
0.055  
0.06
9  
J1  
L
2.4
9  
2.2
9  
1.27  
1.
3
0  
L1  
L2  
R
0.051  
0.4  
0.016  
V2  
0°  
8
°  
0°  
8
°  
0079457_M  
15/18  

Packaging mechanical data  
STB/I/F/P/W30NM50N  
5
Packaging mechanical data  
2
D PAK FOOTPRINT  
TAPE AND REEL SHIPMENT  
REEL MECHANICAL DATA  
mm  
MIN. MAX. MIN. MAX.  
330 12.992  
inch  
DIM.  
A
B
C
D
G
N
T
1.5  
12.8  
20.2  
24.4  
100  
0.059  
13.2 0.504
 
0.520  
0795  
26.4 0.960
 
1.039  
3.937  
30.4  
1.197  
BASE QTY  
BULK QTY  
1000  
TAPE MECHANICAL DATA  
1000  
mm  
inch  
DIM.  
MIN. MAX. MIN. MAX.  
10.5 10.7
 
0.413 0.421  
15.7 15.9
 
0.618 0.626  
A0  
B0  
D
1.5  
1.6 0.059
 
0.063  
D1  
E
1.59 1.61
 
0.062 0.063  
1.65 1.85
 
0.065 0.073  
F
11.4  
4.8  
3.9  
11.9  
1.9  
50  
11.6 0.449
 
0.456  
5.0 0.189
 
0.197  
4.1 0.153
 
0.161  
12.1 0.468
 
0.476  
2.1 0.075
 
0.082  
1.574  
K0  
P0  
P1  
P2  
R
T
0.25 0.35
 
0.0098 0.0137  
23.7 24.3
 
0.933 0.956  
W
* on sales type  
16/18  

STB/I/F/P/W30NM50N  
Revision history  
6
Revision history  
Table 9.  
Date  
Document revision history  
Revision  
Changes  
19-Feb-2008  
23-Sep-2008  
1
2
First release  
Document status promoted from preliminary data to datasheet.  
17/18  

STB/I/F/P/W30NM50N  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
time, without notice.  
All ST products are sold pursuant to ST’s terms and conditions of sale.  
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no  
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this  
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products  
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such  
third party products or services or any intellectual property contained therein.  
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED  
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED  
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS  
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.  
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT  
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING  
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,  
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS “AUTOMOTIVE  
GRADE” MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.  
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void  
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any  
liability of ST.  
ST and the ST logo are trademarks or registered trademarks of ST in various countries.  
Information in this document supersedes and replaces all information previously supplied.  
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.  
© 2008 STMicroelectronics – All rights reserved  
STMicroelectronics group of companies  
Australia – Belgium – Brazil – Canada – China – Czech Republic – Finland – France – Germany – Hong Kong – India – Israel – Italy – Japan –  
Malaysia – Malta – Morocco – Singapore – Spain – Sweden – Switzerland – United Kingdom – United States of America  
18/18