STMicroelectronics-STW35N60DM2

Part #STMicroelectronics-STW35N60DM2
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STMicroelectronics-STW35N60DM2
STW35N60DM2  
N-channel 600 V, 0.094
Ω typ., 28 A MDmesh™ DM2  
Power MOSFET in a TO-247 package  
Datasheet – production data  
Features  
R

DS(on)  

max.  
Order code  
V

DS  

I

D  

P

TOT  

STW35N60DM2 600
 
V  
0.110
Ω  
28 A
 
210 W  
Fast-recovery body diode  
Extremely low gate charge and input  
capacitance  
3
2
1
Low on-resistance  
100% avalanche tested  
Extremely high dv/dt ruggedness  
Zener-protected  
TO-247  
Figure 1: Internal schematic diagram  
Applications  
Switching applications  
Description  
This high voltage N-channel Power MOSFET is  
part of the MDmesh™ DM2 fast recovery diode  
series. It offers very low recovery charge (Q

rr

)  
and time (t

rr

) combined with low R

DS(on)

, rendering  
it suitable for the most demanding high efficiency  
converters and ideal for bridge topologies and  
ZVS phase-shift converters.  
Table 1: Device summary  
Order code  
Marking  
Package  
Packing  
STW35N60DM2  
35N60DM2  
TO-247  
Tube  
September 2015  
DocID028306 Rev 1  
1/12  
This is information on a product in full production.  

STW35N60DM2  
Electrical ratings  
1
Electrical ratings  
Table 2: Absolute maximum ratings  
Symbol  
Parameter  
Value  
±25  
28  
Unit  
V

GS  

Gate-source voltage  
V
Drain current (continuous) at T

case

= 25 °C  
Drain current (continuous) at T

case

= 100 °C  
Drain current (pulsed)  
I

D  

A
17  
112  
210  
50  
A
P

TOT  

T

stg  

Total dissipation at T

case

= 25 °C  
Peak diode recovery voltage slope  
MOSFET dv/dt ruggedness  
W
V/ns  
°C  
50  
Storage temperature  
-55 to 150  
T

j  

Operating junction temperature  
Notes:  

(1)

Pulse width is limited by safe operating area.  
(2)  
I
≤ 28 A, di/dt=900 A/μs; V

DS

peak < V

(BR)DSS

,V

DD

= 400 V  
SD  
(3)  
V
≤ 480 V.  
DS  
Table 3: Thermal data  
Symbol  
R

thj-case  

R

thj-amb  

Parameter  
Thermal resistance junction-case  
Thermal resistance junction-amb  
Value  
0.6  
Unit  
°C/W  
50  
Table 4: Avalanche characteristics  
Symbol  
Parameter  
Avalanche current, repetitive or not repetitive  
Single pulse avalanche energy  
Value  
6
Unit  
I

AR  

A
650  
mJ  
Notes:  

(1)

starting T

j

= 25 °C, I

D

= I

AR

, V

DD

= 50 V.  
DocID028306 Rev 1  
3/12  
 
 
 
 

Electrical characteristics  
STW35N60DM2  
2
Electrical characteristics  
(T

case

= 25 °C unless otherwise specified)  
Table 5: Static  
Test conditions  
Symbol  
Parameter  
Min. Typ. Max.
 
Unit  
Drain-source breakdown  
voltage  
V

(BR)DSS  

V

GS

= 0 V, I

D

= 1 mA  
600  
V
V

GS

= 0 V, V

DS

= 600 V  
10  
Zero gate voltage drain  
current  
I

DSS  

µA  
V

GS

= 0 V, V

DS

= 600 V,  
T

case

= 125 °C  
100  
Gate-body leakage  
current  
I

GSS  

V

DS

= 0 V, V

GS

= ±25 V  
V

DS

= V

GS

, I

D

= 250 µA  
V

GS

= 10 V, I

D

= 14 A  
±5  
5
µA  
V
V

GS(th)  

R

DS(on)  

Gate threshold voltage  
3
4
Static drain-source on-  
resistance  
0.094 0.11  
Ω
Table 6: Dynamic  
Test conditions  
Symbol  
Parameter  
Input capacitance  
Output  
Min. Typ. Max. Unit  
C

iss  

–
–
2400  
110  
–
–
C

oss  

C

rss  

capacitance  
V

DS

= 100 V, f = 1 MHz, V

GS

= 0 V  
pF  
Reverse transfer  
capacitance  
–
–
2.8  
–
–
C

oss  

Equivalent output  
capacitance  
V

DS

= 0 to 480 V, V

GS

= 0 V  
f = 1 MHz, I

D

= 0 A  
190  
pF  
Intrinsic gate  
resistance  
R

G  

Q

g  

–
–
–
–
4.3  
54  
–
–
–
–
Ω
Total gate charge  
V

DD

= 480 V, I

D

= 28 A, V

GS

= 10 V (see  
Gate-source  
charge  
Q

gs  

Q

gd  

14.6  
24.2  
nC  
Gate-drain charge  
Notes:  
(1)  
C
oss eq.  
is defined as a constant equivalent capacitance giving the same charging time as C

oss

when V

DS  

increases from 0 to 80% V

DSS  

.
Table 7: Switching times  
Test conditions  
Symbol  
Parameter  
Min. Typ. Max. Unit  
Turn-on  
delay time  
t

d(on)  

t

r  

t

d(off)  

t

f  

–
–
–
–
21.2  
17  
–
–
–
–
V

DD

= 300 V, I

D

= 14 A R

G

= 4.7
Ω,  
Rise time  
ns  
Turn-off  
delay time  
68  
Fall time  
10.7  
4/12  
DocID028306 Rev 1  
 

STW35N60DM2  
Symbol  
I

SD  

Electrical characteristics  
Min. Typ. Max. Unit  
Table 8: Source-drain diode  
Test conditions  
Parameter  
Source-drain  
current  
–
–
28  
112  
1.6  
A
A
Source-drain  
current  
(pulsed)  
Forward on  
voltage  
V

GS

= 0 V, I

SD

= 28 A  
–
–
V
Reverse  
recovery time  
t

rr  

120  
572  
ns  
Reverse  
recovery  
charge  
I

SD

= 28 A, di/dt = 100 A/µs, V

DD

= 60 V  
Q

rr  

–
nC  
Reverse  
recovery  
current  
I

RRM  

–
–
–
10.2  
215  
A
Reverse  
recovery time  
t

rr  

ns  
µC  
Reverse  
recovery  
charge  
I

SD

= 28 A, di/dt = 100 A/µs, V

DD

= 60 V,  
Q

rr  

1.89  
Reverse  
recovery  
current  
I

RRM  

–
17.7  
A
Notes:  

(1)

Pulse width is limited by safe operating area.  

(2)

Pulse test: pulse duration = 300 µs, duty cycle 1.5%.  
Table 9: Gate-source Zener diode  
Symbol  
Parameter  
Test conditions  
Min. Typ. Max. Unit  
±30  
V

(BR)GSO

Gate-source breakdown voltage  
I

GS

= ±250 µA, I

D

= 0 A  
–
–
V
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD  
performance of the device. The Zener voltage facilitates efficient and cost-effective device  
integrity protection, thus eliminating the need for additional external componentry.  
DocID028306 Rev 1  
5/12  
 
 

Electrical characteristics  
STW35N60DM2  
2.2  
Electrical characteristics (curves)  
Figure 3: Thermal impedance  
Figure 2: Safe operating area  
GC18460  
K
-1  
10  
-2  
-3  
10  
10  
t

p

(s)  
-5  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
10  
Figure 5: Transfer characteristics  
Figure 4: Output characteristics  
Figure 7: Static drain-source on-resistance  
Figure 6: Gate charge vs gate-source voltage  
6/12  
DocID028306 Rev 1  

STW35N60DM2  
Electrical characteristics  
Figure 9: Normalized gate threshold voltage  
vs temperature  
Figure 8: Capacitance variations  
Figure 11: Normalized V(BR)DSS vs  
temperature  
Figure 10: Normalized on-resistance vs  
temperature  
Figure 13: Source-drain diode forward  
characteristics  
Figure 12: Output capacitance stored energy  
DocID028306 Rev 1  
7/12  

Test circuits  
STW35N60DM2  
3
Test circuits  
Figure 14: Test circuit for resistive load  
switching times  
Figure 15: Test circuit for gate charge  
behavior  
Figure 16: Test circuit for inductive load  
switching and diode recovery times  
Figure 17: Unclamped inductive load test  
circuit  
Figure 19: Switching time waveform  
Figure 18: Unclamped inductive waveform  
8/12  
DocID028306 Rev 1  

STW35N60DM2  
Package information  
4
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK

®  

specifications, grade definitions and product status are available at:

.  
ECOPACK

®

is an ST trademark.  
4.1  
TO-247 package information  
Figure 20: TO-247 package outline  
DocID028306 Rev 1  
9/12  

Package information  
STW35N60DM2  
Table 10: TO-247 package mechanical data  
mm.  
Dim.  
Min.  
4.85  
2.20  
1.0  
Typ.  
Max.  
5.15  
2.60  
1.40  
2.40  
3.40  
0.80  
20.15  
15.75  
5.60  
14.80  
4.30  
A
A1  
b
b1  
b2  
c
2.0  
3.0  
0.40  
19.85  
15.45  
5.30  
14.20  
3.70  
D
E
e
5.45  
18.50  
5.50  
L
L1  
L2  
ØP  
ØR  
S
3.55  
4.50  
5.30  
3.65  
5.50  
5.70  
10/12  
DocID028306 Rev 1  

STW35N60DM2  
Revision history  
5
Revision history  
Table 11: Document revision history  
Revision  
Date  
Changes  
Initial version  
02-Sep-2015  
1
DocID028306 Rev 1  
11/12  

STW35N60DM2  
IMPORTANT NOTICE
–
PLEASE READ CAREFULLY  
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, and  
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der  
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2015 STMicroelectronics
–
All rights reserved  
12/12  
DocID028306 Rev 1