STMicroelectronics-STW45N60DM2AG

Part #STMicroelectronics-STW45N60DM2AG
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STMicroelectronics-STW45N60DM2AG
STW45N60DM2AG  
Automotive-grade N-
channel 600 V, 0.085 Ω typ., 34 A  
MDmesh™ DM2 Power MOSFET in a TO-247 package  
Datasheet – production data  
Features  
V

DS  

T

Jmax.  

@
R

DS(on)  

max.  
Order code  
I

D  

P

TOT  

34  
A
250  
W
STW45N60DM2AG  
650 V  
0.093 Ω  
3
•
Designed for automotive applications and  
AEC-Q101 qualified  
2
1
•
•
Fast-recovery body diode  
Extremely low gate charge and input  
capacitance  
TO-247  
•
•
•
•
Low on-resistance  
100% avalanche tested  
Extremely high dv/dt ruggedness  
Zener-protected  
Figure 1: Internal schematic diagram  
Applications  
•
Switching applications  
Description  
This high voltage N-channel Power MOSFET is  
part of the MDmesh™ DM2 fast recovery diode  
series. It offers very low recovery charge (Q

rr

)  
and time (t

rr

) combined with low R

DS(on)

, rendering  
it suitable for the most demanding high efficiency  
converters and ideal for bridge topologies and  
ZVS phase-shift converters.  
Table 1: Device summary  
Order code  
Marking  
Package  
Packing  
STW45N60DM2AG  
45N60DM2  
TO-247  
Tube  
July 2015  
DocID028062 Rev 1  
1/12  
This is information on a product in full production.  

STW45N60DM2AG  
Electrical ratings  
1
Electrical ratings  
Table 2: Absolute maximum ratings  
Symbol  
Parameter  
Value  
±25  
34  
Unit  
V

GS  

Gate-source voltage  
V
Drain current (continuous) at T

case

= 25 °C  
Drain current (continuous) at T

case

= 100 °C  
Drain current (pulsed)  
I

D  

A
21  
136  
250  
50  
A
P

TOT  

T

stg  

Total dissipation at T

case

= 25 °C  
Peak diode recovery voltage slope  
MOSFET dv/dt ruggedness  
W
V/ns  
°C  
50  
Storage temperature  
-55 to 150  
T

j  

Operating junction temperature  
Notes:  

(1)

Pulse width is limited by safe operating area.  
(2)  
I
≤ 34 A, di/dt=800 A/μs; V

DS

peak < V

(BR)DSS

, V

DD

= 80%
 
V

(BR)DSS

.  
SD  
(3)  
V
≤ 480 V.  
DS  
Table 3: Thermal data  
Parameter  
Symbol  
R

thj-case  

R

thj-amb  

Value  
0.50  
50  
Unit  
Thermal resistance junction-case  
Thermal resistance junction-ambient  
°C/W  
Table 4: Avalanche characteristics  
Parameter  
Symbol  
Value  
6
Unit  
A
I

AR  

Avalanche current, repetitive or not repetitive  
Single pulse avalanche energy  
800  
mJ  
Notes:  

(1)

starting T

j

= 25 °C, I

D

= I

AR

, V

DD

= 50 V.  
DocID028062 Rev 1  
3/12  
 
 
 
 
 

Electrical characteristics  
STW45N60DM2AG  
2
Electrical characteristics  
(T

case

= 25 °C unless otherwise specified)  
Table 5: Static  
Symbol  
Parameter  
Drain-source  
Test conditions  
V

GS

= 0 V, I

D

= 1 mA  
V

GS

= 0 V, V

DS

= 600 V  
Min.  
Typ.  
Max. Unit  
V

(BR)DSS  

600  
V
breakdown voltage  
1
Zero gate voltage  
drain current  
I

DSS  

µA  
V

GS

= 0 V, V

DS

= 600 V,  
T

case

= 125 °C  
100  
Gate-body leakage  
current  
I

GSS  

V

DS

= 0 V, V

GS

= ±25 V  
±5  
5
µA  
V
Gate threshold  
voltage  
V

GS(th)  

R

DS(on)  

V

DS

= V

GS

, I

D

= 250 µA  

GS

= 10 V, I

D

= 17 A  
3
4
Static drain-source  
on-resistance  
V
0.085  
0.093  
Ω
Table 6: Dynamic  
Test conditions  
Symbol  
C

iss  

Parameter  
Input capacitance  
Output capacitance  
Min.  
Typ.  
2500  
120  
Max. Unit  
–
–
–
C

oss  

V

DS

= 100 V, f = 1 MHz,  
V

GS

= 0 V  
–
pF  
Reverse transfer  
capacitance  
C

rss  

–
–
–
3
200  
4
–
Equivalent output  
capacitance  
C

oss

V

DS

= 0 to 480 V, V

GS

= 0 V  
f = 1 MHz, I

D

= 0 A  
–
–
pF  
Intrinsic gate  
resistance  
R

G  

Ω
Q

g  

Q

gs  

Q

gd  

Total gate charge  
Gate-source charge  
Gate-drain charge  
–
–
–
56  
13  
30  
–
–
–
V

DD

= 480 V, I

D

= 34 A,  
V

GS

= 10 V (s

nC  
Notes:  
(1)  
C
oss eq.  
is defined as a constant equivalent capacitance giving the same charging time as C

oss

when V

DS  

increases from 0 to 80% V

DSS  

.
Table 7: Switching times  
Test conditions  
Symbol  
t

d(on)  

t

r  

Parameter  
Min.  
Typ.  
29  
Max. Unit  
Turn-on delay time  
Rise time  
V

DD

= 300 V, I

D

= 25 A  
R

G

= 4.7
Ω, V

GS

= 10 V  
–
–
–
–
–
27  
t

d(off)  

Turn-off delay time  
85  
–
ns  
t

f  

Fall time  
–
6
–
4/12  
DocID028062 Rev 1  
 
 

STW45N60DM2AG  
Electrical characteristics  
Table 8: Source-drain diode  
Test conditions  
Symbol  
Parameter  
Min.  
Typ.  
Max. Unit  
I

SD  

Source-drain current  
–
34  
136  
1.6  
A
A
Source-drain current  
(pulsed)  
I

SD

–
Forward on voltage  
V

GS

= 0 V, I

SD

= 34 A  
–
–
V
t

rr  

Reverse recovery time
 
I

SD

= 34 A,  
120  
0.6  
ns  
di/dt = 100 A/µs,  
Reverse recovery  
charge  
Q

rr  

–
µC  
V

DD

= 60 V (s

Reverse recovery  
current  
I

RRM  

t

rr  

–
–
–
10.4  
240  
2.4  
A
Reverse recovery time
 
I

SD

= 34 A,  
ns  
µC  
di/dt = 100 A/µs,  
Reverse recovery  
charge  
Q

rr  

V

DD

= 60 V, T

j

= 150 °C  
Reverse recovery  
current  
I

RRM  

–
20.5  
A
Notes:  

(1)

Pulse width is limited by safe operating area.  

(2)

Pulse test: pulse duration = 300 µs, duty cycle 1.5%.  
DocID028062 Rev 1  
5/12  
 
 

Electrical characteristics  
STW45N60DM2AG  
2.1  
Electrical characteristics (curves)  
Figure 2: Safe operating area  
Figure 3: Thermal impedance  
GC18460  
K
δ=0.5  
0.2  
0.1  
-1  
10  
10  
10  
0.05  
0.02  
0.01  
-2  
Z
= K*R  
th thj-c  
δ= t
 
/
Ƭ  
Single pulse  
p
t

p

Ƭ  
-3  
-5  
-4  
-3  
-2  
-1  
t (s)  
p
10  
10  
10  
10  
10  
Figure 5: Transfer characteristics  
Figure 4: Output characteristics  
Figure 7: Static drain-source on-resistance  
Figure 6: Gate charge vs gate-source voltage  
6/12  
DocID028062 Rev 1  
 

STW45N60DM2AG  
Figure 8: Capacitance variations  
Electrical characteristics  
Figure 9: Normalized gate threshold voltage  
vs temperature  
Figure 11: Normalized V(BR)DSS vs  
temperature  
Figure 10: Normalized on-resistance vs  
temperature  
Figure 13: Source- drain diode forward  
characteristics  
Figure 12: Output capacitance stored energy  
DocID028062 Rev 1  
7/12  

Test circuits  
STW45N60DM2AG  
3
Test circuits  
Figure 14: Switching times test circuit for resistive  
load  
Figure 15: Gate charge test circuit  
Figure 16: Test circuit for inductive load switching  
and diode recovery times  
Figure 17: Unclamped inductive load test circuit  
Figure 19: Switching time waveform  
Figure 18: Unclamped inductive waveform  
8/12  
DocID028062 Rev 1  
 
 
 
 
 

STW45N60DM2AG  
Package information  
4
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK

®  

specifications, grade definitions and product status are available at:

.  
ECOPACK

®

is an ST trademark.  
4.1  
TO-247 package information  
Figure 20: TO-247 package outline  
0075325_H  
DocID028062 Rev 1  
9/12  
 
 

Package information  
STW45N60DM2AG  
Table 9: TO-247 package mechanical data  
mm.  
Dim.  
Min.  
4.85  
2.20  
1.0  
Typ.  
Max.  
5.15  
2.60  
1.40  
2.40  
3.40  
0.80  
20.15  
15.75  
5.60  
14.80  
4.30  
A
A1  
b
b1  
b2  
c
2.0  
3.0  
0.40  
19.85  
15.45  
5.30  
14.20  
3.70  
D
E
e
5.45  
18.50  
5.50  
L
L1  
L2  
ØP  
ØR  
S
3.55  
4.50  
5.30  
3.65  
5.50  
5.70  
10/12  
DocID028062 Rev 1  

STW45N60DM2AG  
Revision history  
5
Revision history  
Table 10: Document revision history  
Revision  
Date  
Changes  
03-Jul-2015  
1
Initial release.  
DocID028062 Rev 1  
11/12  
 

STW45N60DM2AG  
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