STMicroelectronics-STW58N60DM2AG

Part #STMicroelectronics-STW58N60DM2AG
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STMicroelectronics-STW58N60DM2AG
STW58N60DM2AG  
Automotive-grade N-
channel 600 V, 0.052 Ω typ., 50 A  
MDmesh™ DM2 Power
MOSFET in a TO-247 package  
Datasheet – production data  
Features  
R

DS(on)  

Order code  
V

DS  

I

D  

P

TOT  

max.  
STW58N60DM2AG 600
 
V
0.060 Ω
 
50 A  
360 W  
Designed for automotive applications and  
AEC-Q101 qualified  
3
2
Fast-recovery body diode  
Extremely low gate charge and input  
capacitance  
1
TO-247  
Low on-resistance  
100% avalanche tested  
Extremely high dv/dt ruggedness  
Zener-protected  
Figure 1: Internal schematic diagram  
D(2)  
Applications  
Switching applications  
Description  
This high voltage N-channel Power MOSFET is  
part of the MDmesh™ DM2 fast recovery diode  
series. It offers very low recovery charge (Q

rr

)  
and time (t

rr

) combined with low R

DS(on)

, rendering  
it suitable for the most demanding high efficiency  
converters and ideal for bridge topologies and  
ZVS phase-shift converters.  
G(1)  
S(3)  
AM15572v1_no_tab  
Table 1: Device summary  
Order code  
Marking  
Package  
Packing  
STW58N60DM2AG  
58N60DM2  
TO-247  
Tube  
July 2015  
DocID027912 Rev 2  
1/12  
This is information on a product in full production.  

STW58N60DM2AG  
Electrical ratings  
1
Electrical ratings  
Table 2: Absolute maximum ratings  
Symbol  
Parameter  
Value  
±25  
50  
Unit  
V

GS  

Gate-source voltage  
V
Drain current (continuous) at T

case

= 25 °C  
Drain current (continuous) at T

case

= 100 °C  
Drain current (pulsed)  
I

D  

A
31  
200  
360  
50  
A
P

TOT  

T

stg  

Total dissipation at T

case

= 25 °C  
Peak diode recovery voltage slope  
MOSFET dv/dt ruggedness  
W
V/ns  
°C  
50  
Storage temperature  
-55 to 150  
T

j  

Operating junction temperature  
Notes:  

(1)

Pulse width is limited by safe operating area.  
(2)  
I
≤ 50 A, di/dt=800 A/μs; V

DS

peak < V

(BR)DSS

, V

DD

= 80% V

(BR)DSS

.  
SD  
(3)  
V
≤ 480 V.  
DS  
Table 3: Thermal data  
Parameter  
Symbol  
R

thj-case  

R

thj-amb  

Value  
0.35  
50  
Unit  
Thermal resistance junction-case  
Thermal resistance junction-ambient  
°C/W  
Table 4: Avalanche characteristics  
Parameter  
Symbol  
Value  
12  
Unit  
A
Avalanche current, repetitive or not repetitive  
Single pulse avalanche energy  
800  
mJ  
Notes:  

(1)

Pulse width limited by T

jmax  

(2)

starting T

j

= 25 °C, I

D

= I

AS

, V

DD

= 50 V.  
.
DocID027912 Rev 2  
3/12  
 
 
 
 
 

Electrical characteristics  
STW58N60DM2AG  
2
Electrical characteristics  
(T

case

= 25 °C unless otherwise specified)  
Table 5: Static  
Symbol  
Parameter  
Test conditions  
V

GS

= 0 V, I

D

= 1 mA  
V

GS

= 0 V, V

DS

= 600 V  
Min. Typ.  
600  
Max. Unit  
Drain-source breakdown  
voltage  
V

(BR)DSS  

V
10  
Zero gate voltage drain  
current  
I

DSS  

µA  
V

GS

= 0 V, V

DS

= 600 V,  
T

case

= 125 °C  
100  
Gate-body leakage  
current  
I

GSS  

V

DS

= 0 V, V

GS

= ±25 V  
V

DS

= V

GS

, I

D

= 250 µA  
V

GS

= 10 V, I

D

= 25 A  
±5  
5
µA  
V
V

GS(th)  

R

DS(on)  

Gate threshold voltage  
3
4
Static drain-source on-  
resistance  
0.052 0.060  
Ω
Table 6: Dynamic  
Test conditions  
Symbol  
Parameter  
Input capacitance  
Output  
Min. Typ. Max. Unit  
C

iss  

–
–
4100  
190  
–
–
C

oss  

C

rss  

capacitance  
V

DS

= 100 V, f = 1 MHz, V

GS

= 0 V  
pF  
Reverse transfer  
capacitance  
–
–
3.2  
–
–
Equivalent output  
capacitance  
C

oss eq.  

V

DS

= 0 to 480 V, V

GS

= 0 V  
f = 1 MHz, I

D

= 0 A  
325  
pF  
Intrinsic gate  
resistance  
R

G  

Q

g  

–
–
–
–
4.2  
90  
18  
44  
–
–
–
–
Ω
Total gate charge  
V

DD

= 480 V, I

D

= 50 A, V

GS

= 10 V  
Gate-source  
charge  
Q

gs  

Q

gd  

nC  
Gate-drain charge  
Table 7: Switching times  
Test conditions  
Symbol  
Parameter  
Min. Typ. Max. Unit  
Turn-on  
delay time  
t

d(on)  

t

r  

t

d(off)  

t

f  

–
–
–
–
24  
60  
–
–
–
–
V

DD

= 300 V, I

D

= 25 A R

G

= 4.7
Ω (see  
Rise time  
ns  
Turn-off  
delay time  
130  
12  
Fall time  
4/12  
DocID027912 Rev 2  

STW58N60DM2AG  
Electrical characteristics  
Min. Typ. Max. Unit  
Table 8: Source-drain diode  
Test conditions  
Symbol  
Parameter  
Source-drain  
current  
I

SD  

–
–
50  
200  
1.6  
A
A
Source-drain  
current  
(pulsed)  
I

SDM  

Forward on  
voltage  
V

GS

= 0 V, I

SD

= 50 A  
–
–
V
Reverse  
recovery time  
t

rr  

140  
0.7  
ns  
Reverse  
recovery  
charge  
I

SD

= 50 A, di/dt = 100 A/µs, V

DD

= 60 V  
Q

rr  

–
µC  
Reverse  
recovery  
current  
I

RRM  

–
–
–
10.6  
245  
2.6  
A
Reverse  
recovery time  
t

rr  

ns  
µC  
Reverse  
recovery  
charge  
I

SD

= 50 A, di/dt = 100 A/µs, V

DD

= 60 V,  
Q

rr  

Reverse  
recovery  
current  
I

RRM  

–
21  
A
Notes:  

(1)

Pulse test: pulse duration = 300 µs, duty cycle 1.5%.  
DocID027912 Rev 2  
5/12  
 

Electrical characteristics  
STW58N60DM2AG  
2.1  
Electrical characteristics (curves)  
Figure 2: Safe operating area  
Figure 3: Thermal impedance  
Figure 5: Transfer characteristics  
Figure 4: Output characteristics  
Figure 7: Static drain-source on-resistance  
Figure 6: Gate charge vs gate-source voltage  
6/12  
DocID027912 Rev 2  

STW58N60DM2AG  
Electrical characteristics  
Figure 9: Normalized gate threshold voltage  
vs temperature  
Figure 8: Capacitance variations  
Figure 10: Normalized on-resistance vs  
temperature  
Figure 11: Normalized V(BR)DSS vs  
temperature  
Figure 13: Source- drain diode forward  
characteristics  
Figure 12: Output capacitance stored energy  
DocID027912 Rev 2  
7/12  

Test circuits  
STW58N60DM2AG  
3
Test circuits  
Figure 14: Switching times test circuit for resistive  
load  
Figure 15: Gate charge test circuit  
Figure 16: Test circuit for inductive load switching  
and diode recovery times  
Figure 17: Unclamped inductive load test circuit  
Figure 19: Switching time waveform  
Figure 18: Unclamped inductive waveform  
8/12  
DocID027912 Rev 2  

STW58N60DM2AG  
Package information  
4
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of  
ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK

®  

specifications, grade definitions and product status are available at:

.  
ECOPACK

®

is an ST trademark.  
4.1  
TO-247 package information  
Figure 20: TO-247 package outline  
DocID027912 Rev 2  
9/12  

Package information  
STW58N60DM2AG  
Table 9: TO-247 package mechanical data  
mm.  
Dim.  
Min.  
4.85  
2.20  
1.0  
Typ.  
Max.  
5.15  
2.60  
1.40  
2.40  
3.40  
0.80  
20.15  
15.75  
5.60  
14.80  
4.30  
A
A1  
b
b1  
b2  
c
2.0  
3.0  
0.40  
19.85  
15.45  
5.30  
14.20  
3.70  
D
E
e
5.45  
18.50  
5.50  
L
L1  
L2  
ØP  
ØR  
S
3.55  
4.50  
5.30  
3.65  
5.50  
5.70  
10/12  
DocID027912 Rev 2  

STW58N60DM2AG  
Revision history  
5
Revision history  
Table 10: Document revision history  
Revision  
Date  
Changes  
12-Jun-2015  
1
2
First release.  
Updated title and features.  
Minor text changes.  
20-Jul-2015  
DocID027912 Rev 2  
11/12  

STW58N60DM2AG  
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–
PLEASE READ CAREFULLY  
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s
, and  
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© 2015 STMicroelectronics
–
All rights reserved  
12/12  
DocID027912 Rev 2