STMicroelectronics-T1610T-8I

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STMicroelectronics-T1610T-8I
T1610
T
–
8I  
Logic level 16 A
T
r
iac  
Datasheet
−
production data  
Features  
A2  
■
High static and dynamic commutation  
■
Three quadrants  
G
A1  
■
Logic level (direct microcontroller driven)  
■
Package is RoHS (2002/95/EC) compliant  
■
Tab insulated, voltage = 2500 V rms  
■
UL certified (ref. file E81734)  
A1  
A2  
G
Applications  
TO-220AB insulated  
(T1610
T
–
8l)  
■
General purpose AC line load switching  
■
Home appliances:  
– Fan  
Table 1.  
Order code  
T1610
T
–
8I  
Device summary  
– Pump  
Quadrants  
Value I

GT

(mA)  
– Solenoid  
I – II – III  
10  
■
Lighting  
■
Heaters  
■
Inrush current limiting circuits  
■
Overvoltage crowbar protection circuits  
Description  
Available in TO220AB-Insulated (ceramic  
insulated), the T1610
T
–
8I series of
T
r
iac can be  
used in an on/off or phase angle control function  
in general purpose AC switching.  
T1610
T
–
8I can be directly driven through a  
microcontroller allowing usage of small capacitive  
or resistive power supplies.  
Provides insulation rated at 2500 V rms  
(TO-220AB insulated package).  
April 2012  
Doc ID 018766 Rev 3  
1/10  
This is information on a product in full production.  
10  

Characteristics  
T1610T-8I  
1
Characteristics  
Table 2.  
Symbol  
Absolute maximum rating (T
 
= 25 °C, unless otherwise specified)  
j
Parameter  
Value  
Unit  
T

c

= 108 °C  
16  
12  
I

T(RMS)

On-state rms current (full sine wave)  
A
T

c

= 119 °C  
t = 20 ms  
F = 50 Hz  
F = 60 Hz  
120  
126  
95  
Non repetitive surge peak on-state current (full  
cycle, T

j

initial = 25 °C)  
I

TSM  

A
t = 16.7 ms  
t

p

= 10 ms  
T

j

= 150 °C  
T

j

= 125 °C  
²
²
²
I t  
I t Value for fusing  
A s  
600  
800  
V

DRM  

V

RRM  

,
Repetitive peak off-state voltage, gate open  
V
V
V

DSM  

V

RSM  

,
Non repetitive surge peak  
off-state voltage  
t

p

= 10 ms  
T

j

= 25 °C  
900  
dI/dt  
I

GM  

Critical rate of rise of on-state current I

G

= 2 x I

GT  

Peak gate current  
F = 100 Hz  
t

p

= 20 µs  
100  
4
A/µs  
A
P

G(AV)  

Average gate power dissipation  
1
W
T

stg  

T

j  

Storage junction temperature range  
Operating junction temperature range  
-40 to +150  
-40 to +150  
°C  
Lead temperature for soldering during 10 s  
(at 4 mm from case for TO220AB-ins.)  
T

L  

260  
°C  
V
V

ins

(rms) Insulation
 
rms voltage, 1 minute, TO220AB ceramic insulated  
2500  
2/10  
Doc ID 018766 Rev 3  

T1610T-8I  
Characteristics  
Table 3.  
Symbol  
Electrical characteristics (T
 
= 25 °C, unless otherwise specified)  
j
Test conditions  
Quadrant  
Value  
Unit  
I – II – III  
I – II – III  
MIN.  
0.5  
10  
mA  
mA  
(1)  
I

GT  

V

D

= 12
V
,
R

L

= 30
Ω
 
MAX.  
V

GT  

V

GD  

VD = 12
V
,
R
L = 30
Ω  
All  
All  
MAX.  
1.3  
V
V

D

= 800
V
,
R

L

= 3.3 k
Ω,
T

j

= 125 °C  
MIN.  
0.2  
25  
20  
30  
100  
50  
9
V
(1)  
I

H  

I

T

= 500 mA  
MAX.  
mA  
I – III  
II  
I

L  

I

G

= 1.2 I

GT  

MAX.  
MIN.  
mA  
V

D

= 67% x 800 V gate open  
V

D

= 67% x 600 V gate open  
(dV/dt)c = 0.1 V/µs  
T

j

= 125 °C  
T

j

= 150 °C  
T

j

= 125 °C  
dV/dt

(1)  

V/µs  
T

j

= 125 °C  
T

j

= 150 °C  
T

j

= 150 °C  
(dV/dt)c = 10 V/µs  
(dV/dt)c = 0.1 V/µs  
(dV/dt)c = 10 V/µs  
3
(dl/dt)c

(1)  

MIN.  
TY
P
.  
A/ms  
µs  
5.4  
1.8  
gate controlled turn on time I

TM

= 13 A, V

D

= 400
V
,  
t

GT  

I – II – III  
2
I

G

= 100 mA, dI

G

/dt = 100 mA/µs, R

L

= 30
Ω  
1. For
 
both polarities of A2 referenced to A1  
Table 4.  
Symbol  
Static characteristics  
Test conditions  
Value  
Unit  
(1)  
V

TM  

I

TM

= 22.6 A, t

p

= 380 µs  
Threshold voltage  
T

j

= 25 °C  
MAX.  
1.55  
0.85  
30  
V
V
(1)  
V

to  

T

j

= 150 °C  
T

j

= 150 °C  
T

j

= 25 °C  
MAX.  
MAX.  
(1)  
R

d  

Dynamic resistance  
m
Ω  
µA  
5
V

DRM

= V

RRM

= 800 V  
V

DRM

= V

RRM

= 600 V  
I

DRM  

I

RRM  

T

j

= 125 °C  
T

j

= 150 °C  
MAX.  
1
mA  
3.6  
1. for
 
both polarities of A2 referenced to A1  
Table 5.  
Symbol  
Thermal resistance  
Parameter  
Value  
Unit  
R

th(j-c)

Junction to case (AC)  
R

th(j-a)

Junction to ambient  
2.1  
60  
°C/W  
°C/W  
Doc ID 018766 Rev 3  
3/10  

Characteristics  
T1610T-8I  
Figure 1.  
Maximum power dissipation versus
 
Figure 2.  
On-state rms current versus case  
on-state rms current (full cycle)  
temperature (full cycle)  
I

T(RMS)

(A)  
P(W)  
20  
18  
16  
14  
12  
10  
8
180°  
18  
16  
14  
12  
10  
8
6
6
4
4
2
2
I

T(RMS)

(A)  
T

C

(°C)  
0
0
0
0
25  
50  
75  
100  
125  
150  
2
4
6
8
10  
12  
14  
16  
Figure 3.  
On-state rms current versus  
ambient temperature  
Figure 4.  
Relative variation of thermal  
impedance versus pulse duration  
(free air convection)  
I

T(RMS)

(A)  
K = [Z

th

/ R

th

]  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
1.0E+00  
1.0E-01  
1.0E-02  
Z

th(j-c)  

Z

th(j-a)  

T

a

(°C)  
75  
T

p

(s)  
0.0  
0
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
 
1.0E+02 1.0E+03 1.0E+04  
25  
50  
100  
125  
150  
Figure 5.  
On-state characteristics  
(maximum values)  
Figure 6.  
Surge peak on-state current versus  
number of cycles  
I

TM

(A)  
I

TSM

(A)  
130  
120  
110  
100  
90  
1000  
T

j

max:  
V

to

= 0.85 V  
R

d

= 30 m
Ω
 
t = 20 ms  
One cycle  
100  
10  
1
80  
Non repetitive  
T

j

initial = 25 °C  
70  
60  
T

j

= 150 °C  
50  
Repetitive  
T

c

= 108 °C  
40  
30  
T

j

= 25 °C  
20  
10  
V

TM

(V)  
Number of cycles  
100 1000  
0
0
1
2
3
4
5
1
10  
4/10  
Doc ID 018766 Rev 3  

T1610T-8I  
Figure 7.  
Characteristics  
Non repetitive surge peak on-state
 
Figure 8.  
current and corresponding values  
of I t  
Relative variation of gate trigger  
current versus junction  
temperature (typical values)  
2
I

TSM

(A), I²t (A²s)  
I

GT

[T

j

]/I

GT

[T

j

= 25 °C]  
10000  
2.0  
typical values  
T

j

initial = 25 °C  
I

GT

Q3  
1.5  
1000  
100  
10  
I

TSM  

I

GT

Q1-Q2  
1.0  
dl /dt limitation: 100 A / µs  
I²t  
0.5  
Sinusoidal pulse width t

p

<10 ms  
t

p

(ms)  
10.00  
T

j

(°C)  
0.0  
0.01  
0.10  
1.00  
-50 -30 -10 10
 
30 50 70 90 110
 
130 150  
Figure 9.  
Relative variation of gate trigger  
voltage versus junction  
temperature (typical values)  
Figure 10.
 
Relative variation of holding  
current and latching current versus  
junction temperature  
I

H

, I

L

[T

j

] / I

H

, I

L

[T

j

= 25 °C]  
2.0  
V

GT

[T

j

] / V

GT

[T

j

= 25 °C]  
2.0  
1.5  
1.0  
0.5  
0.0  
typical values  
1.5  
1.0  
V

GT  

I

L  

0.5  
I

H  

T

j

(°C)  
T

j

(°C)  
-50 -30 -10 10
 
30 50 70 90 110
 
130 150  
0.0  
-50 -30 -10 10
 
30 50 70 90 110
 
130 150  
Figure 11.
 
Relative variation of critical rate of
 
Figure 12.
 
Relative variation of critical rate of  
decrease of current (dI/dt)c versus  
reapplied (dV/dt)c  
decrease of current (dI/dt)c versus  
junction temperature  
(dl / dt)c [T

j

] / (dl / dt)c [T

j

= 150 °C]  
(dI/dt)c[(dV/dt)c]/Specified(dI/dt)c[(dV/dt)

c

10 V/µs]  
4
3
2
1
0
10  
9
8
7
6
5
4
3
2
1
0
typical values  
typical values  
logic level  
(dV/dt)c (V/µs)  
10.0 100.0  
T

j

(°C)  
0.1  
1.0  
25  
50  
75  
100  
125  
150  
Doc ID 018766 Rev 3  
5/10  

Characteristics  
T1610T-8I  
Figure 13.
 
Relative variation of static dV/dt  
immunity versus junction  
temperature  
Figure 14.
 
Relative variation of static dV/dt  
immunity versus junction  
temperature  
dV / dt [T

j

] / dV / dt [T

j

= 125 °C]  
4
dV / dt [T

j

] / dV / dt [T

j

= 150 °C]  
7
6
5
4
3
2
1
0
V

D

= V

R

= 402 V  
V

D

= V

R

= 536 V  
3
2
1
T

j

(°C)  
T

j

(°C)  
125  
0
25  
25  
50  
75  
100  
125  
150  
50  
75  
100  
Figure 15.
 
Relative variation of leakage current versus junction temperature for different values  
of blocking voltage  
I

DRM

/I

RRM

[T

j

;
V

DRM

/ V

RRM

] / I

DRM

/I

RRM  

1.0E+00  
V

DRM

= V

RRM

= 800 V  
V

DRM

= V

RRM

= 600 V  
1.0E-01  
1.0E-02  
[T

j

= 125 °C; 800 V];  
[T

j

= 150 °C; 600 V]  
1.0E-03  
V

DRM

= V

RRM

= 400 V  
T

j

(°C)  
1.0E-04  
25  
50  
75  
100  
125  
150  
6/10  
Doc ID 018766 Rev 3  

T1610T-8I  
Package information  
2
Package information  
■
■
Epoxy meets UL94, V0  
Recommended torque value: 0.4 to 0.6 N·m  
In order to meet environmental requirements, ST offers these devices in different grades of  
®
®
ECO
P
A
CK packages,
 
depending on their level of environmental compliance. ECO
P
A
CK  
specifications, grade definitions and product status are available at:

.  
®
ECO
P
A
CK is
 
an ST trademark.  
Table 6.  
TO-220AB insulated dimensions  
Dimensions  
Millimeters  
Min. Typ. Max. Min. Typ. Max.  
Ref.  
Inches  
A
15.20  
15.90 0.598  
0.625  
a1  
3.75  
0.147  
C
B
a2 13.00  
10.00  
14.00 0.511  
10.40 0.393  
0.88 0.024  
1.32 0.048  
4.60 0.173  
0.70 0.019  
2.72 0.094  
2.70 0.094  
6.60 0.244  
3.85 0.147  
0.551  
0.409  
0.034  
0.051  
0.181  
0.027  
0.107  
0.106  
0.259  
0.151  
Ø I  
b2  
B
L
F
b1 0.61  
b2 1.23  
A
I4  
C
4.40  
l3  
c1 0.49  
c2 2.40  
c2  
a1  
l2  
a2  
e
F
2.40  
6.20  
M
c1  
b1  
ØI 3.75  
e
I4 15.80
 
16.40 16.80 0.622 0.646 0.661  
L
2.65  
1.14  
1.14  
2.95 0.104  
1.70 0.044  
1.70 0.044  
0.116  
0.066  
0.066  
l2  
l3  
M
2.60  
0.102  
Doc ID 018766 Rev 3  
7/10  

Ordering information scheme  
T1610T-8I  
3
Ordering information scheme  
Figure 16.
 
Ordering information scheme  
16  
T
10  
T
8
I
–
Triac series  
Current  
16 = 16 Ampere  
Sensitivity  
10 = 10 mA  
Specific application  
Voltage  
8 = 800 V  
Package  
I = TO220AB-insulated  
8/10  
Doc ID 018766 Rev 3  

T1610T-8I  
Ordering information  
4
Ordering information  
Table 7.  
Ordering information  
Order code  
Marking  
Package  
Weight Base
 
qty Delivery
 
mode  
TO-220AB  
insulated  
T1610
T
–
8I  
T1610
T
–
8I  
2.3  
50  
T
u
be  
5
Revision history  
Table 8.  
Date  
Document revision history  
Revision  
Changes  
08-Aug-2011  
20-Jan-2012  
25-Apr-2012  
1
2
3
First issue.  
Corrected subscripting error in
T
a
ble 3
.  
Updated UL certification.  
Doc ID 018766 Rev 3  
9/10  

T1610T-8I  
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10/10  
Doc ID 018766 Rev 3