STMicroelectronics-T1635H-8T
| Part # | STMicroelectronics-T1635H-8T |
| Download | STMicroelectronics-T1635H-8T |
T1635H-8T
Datasheet
16 A – 800 V – 150 °C 8H Triac in TO-220AB
Features
A2
A1
•
•
•
•
•
•
•
•
16 A medium current Triac
800 V symmetrical blocking voltage
150 °C maximum junction temperature T
j
Three triggering quadrants
G
High noise immunity – static dV/dt
Robust dynamic turn-off commutation – (dl/dt)c
ECOPACK2
compliant component
Molding resin UL94-V0 flammability certified
A2
Applications
G
A2
A1
•
•
•
•
•
•
Home automation Smart AC plug
Water heater, room heater and coffee machine
AC Induction and Universal Motor control
Inrush current limiter in AC DC rectifiers
Lighting and automation I/O control
TO-220AB
General purpose AC line load control
Description
in TO-220AB provides an enhanced thermal management: this 16 A Triac is the
right choice for a compact drive of heavy AC loads and enables the heatsink size
reduction.
Product status link
Product summary
Based on the ST Snubberless high temperature technology, it offers higher specified
turn off commutation and noise immunity levels up to the T
j
max.
I
16 A
T(RMS)
and inductive loads for industrial control and home appliances.
V
/V
800 V
900 V
35 mA
150 °C
DRM RRM
V
/V
DSM RSM
I
GT
T max.
j
DS13214
–
Rev 2
–
December 2020
For further information contact your local STMicroelectronics sales office.
T1635H-8T
Characteristics
1
Characteristics
Table 1.
Absolute maximum ratings (limiting values)
Parameter
Symbol
Value
16
Unit
I
T =
131 °C
RMS on-state current (full sine wave)
A
T(RMS)
c
Non repetitive surge peak on-state current
t = 16.7 ms
t = 20 ms
168
160
169
I
A
TSM
(full cycle,T
initial = 25 °C)
j
2
2
2
t =
10 ms
p
I t
I t
value for fusing
A s
Critical rate of rise of on-state current,
T =
25 °C
dl/dt
/V
100
A/µs
j
I
= 2 x I
, tr ≤ 100 ns, f = 100 Hz
GT
G
V
Repetitive peak off-state voltage
Non Repetitive peak off-state voltage
Peak gate current
800
V
V
DRM RRM
V
/V
t =
10 ms, T
= 25 °C
p
900
DSM RSM
j
I
4
A
GM
t =
20 µs, T
= 150 °C
p
j
P
Maximum gate power dissipation
Average gate power dissipation
Storage temperature range
5
1
W
W
°C
°C
°C
GM
P
T =
150 °C
j
G(AV)
T
-40 to +150
-40 to +150
260
stg
T
Operating junction temperature range
j
T
Maximum lead temperature for soldering during 10 s
L
Table 2.
Electrical characteristics (T
j
= 25 °C, unless otherwise specified)
Quadrants; T
I – II – III
Symbol
Test conditions
Value
5
Unit
mA
mA
V
j
Min.
Max.
Max.
I
V
= 12
V
, R
=
3
0 Ω
GT
D
L
35
V
V
V
= 12
V
, R
=
3
0 Ω
I – II – III
1.3
GT
D
L
V
= V
, R
= 3.3 kΩ
T =
150 °C
j
I – II – III
I – III
II
Min.
Max.
Max.
Max.
0.15
50
V
GD
D
DRM
L
mA
mA
mA
I
I =
1.2 x I
G GT
L
80
I =
500 mA, gate open
I
35
T
H
V
= 536
V
,
g
ate open
T =
150 °C
Min.
Min.
2000
16
V/µs
D
j
T =
150 °C
j
Without snubber network
A/ms
1. For
both polarities of A2 referenced to A1.
DS13214
–
Rev 2
page 2/11
T1635H-8T
Characteristics
Table 3.
Static characteristics
T
Symbol
Test conditions
= 22 A, t
= 380 µs
Value
1.50
Unit
V
j
V
I
25 °C
Max.
Max.
Max.
TM
p
TM
V
Threshold voltage
Dynamic resistance
150 °C
0.80
V
TO
R
150 °C
25 °C
23
2.0
5.5
2.3
mΩ
µA
D
V
V
= V
= V
= V
DRM RRM
Max.
Max.
D
R
I
/I
150°C
150 °C
mA
mA
DRM RRM
= V
= 400
V
,
p
eak voltage
D
R
1. For
both polarities of A2 referenced to A1.
Table 4.
Thermal resistance
Parameter
Symbol
Value
1.1
Unit
°C/W
°C/W
R
Junction to case (AC)
Junction to ambient
Max.
Typ.
th(j-c)
th(j-a)
R
60
DS13214
–
Rev 2
page 3/11
T1635H-8T
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1.
Maximum power dissipation versus on-state
RMS current
Figure 2.
On-state RMS current versus case temperature
I
(A)
T(RMS)
P(W)
20
15
10
5
20
α = 180°
α = 180°
15
10
5
180°
T
(°C)
c
I
(A)
T
(RMS)
0
0
0
25
50
75
100
125
150
0
2
4
6
8
10
12
14
16
Figure 3.
On-state RMS current versus ambient
temperature (free air convection)
Figure 4.
On-state characteristics (maximum values)
I
TM
(A)
1000
I
(A)
T(RMS)
3.5
T max.
j
V
= 0.8 V
to
= 23 mΩ
α = 180°
3
R
d
2.5
100
10
1
2
T =
150 °C
j
1.5
1
T =
25 °C
j
0.5
T
(°C)
a
V
(V)
TM
0
0
1
2
3
4
5
0
25
50
75
100
125
150
Figure 6.
Recommended maximum case-to-ambient
thermal resistance versus ambient temperature for
different peak off-state voltages
Figure 5.
Relative variation of thermal impedance versus
pulse duration
K = [Z
/R
]
th th
Rth(c-a) (°C/W)
(for heatsink sizing to avoid thermal runaway)
70
60
50
40
30
20
10
0
1.0E+00
1.0E-01
1.0E-02
Junction-to- ambian
t
t
hermal resistance :
Typical 6
0
°
C/W(without heatsink)
V
DRM
=V
RRM
=200 V
Z
th(j-c)
V
DRM
=V
RRM
=400 V
V
DRM
=V
RRM
= 600 V
Z
th(j-a)
V
DRM
=V
RRM
= 800 V
t
(s)
p
With 15°C/W heatsink
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02 1.0E+03
Ta
(
°C)
80
20
40
60
100
120
140
DS13214
–
Rev 2
page 4/11
T1635H-8T
Characteristics (curves)
Figure 8.
Relative variation of holding current and
latching current versus junction temperature (typical
values)
Figure 7.
Relative variation of gate trigger voltage and
current versus junction temperature (typical values)
I
,V [T
] / I
,V [T
= 25 °C]
GT GT
j
GT GT
j
I ,I [T
] / I
,I [T
= 25 °C]
H
L
j
H
L
j
2.5
2
1.6
1.2
0.8
0.4
0
I
GT
Q3
I
GT
Q1-Q2
1.5
1
I
L
V
GT
Q1-Q2-Q3
I
H
0.5
T (°C)
j
T (°C)
j
0
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
50
75
100
125
150
Figure 10.
Non repetitive surge peak on-state current for a
sinusoidal pulse with width t
p
< 10 ms
Figure 9.
Surge peak on-state current versus number of
cycles
I
(A)
TSM
I (A)
TSM
10000
1000
100
dl/dt limitation: 100 A/µs
T initial
= 25 °C
j
200
150
100
50
t=20ms
One cycle
Non repetitive
T initial
= 25 °C
j
I
TSM
Repetitive
= 131°C
T
c
Number of cycles
0
t (ms)
p
1
10
100
1000
10
0.01
0.10
1.00
10.00
Figure 11.
Relative variation of static dV/dt immunity
versus junction temperature
Figure 12.
Relative variation of critical rate of decrease of
main current versus junction temperature
(dl/dt)c [T ] / (dl/dt)c [T
]
j = 150 °C
j
dV/dt [T ] / dV/dt [T
]
j = 150 °C
j
4
3
2
1
0
14
12
10
8
V
D
= V
R
= 536 V
6
4
2
T (°C)
j
T (°C)
j
0
25
50
75
100
125
150
25
50
75
100
125
150
DS13214
–
Rev 2
page 5/11
T1635H-8T
Characteristics (curves)
Figure 13.
Relative variation of leakage current versus junction temperature for different values of
blocking voltage
I
/I
RRM
[T , V
j
/V [Tj
max.,800 V]
] / I
/I
DRM RRM
DRM RRM
DRM
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
1.0E-05
V
DRM
= V
RRM
= 800 V
V
DRM
= V
RRM
= 600 V
T (°C)
j
25
50
75
100
125
150
DS13214
–
Rev 2
page 6/11
T1635H-8T
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
2.1
TO-220AB package information
•
•
•
Epoxy resin is halogen free and meets UL94 flammability standard, level V0
Lead-free plating package leads
Recommended torque: 0.4 to 0.6 N·m
Figure 14.
TO-220AB package outline
DS13214
–
Rev 2
page 7/11
T1635H-8T
TO-220AB package information
Table 5.
TO-220AB package mechanical data
Dimensions
Millimeters
Ref.
Min.
Typ.
Max.
Min.
Typ.
Max.
A
a1
a2
B
15.20
15.90
0.5984
0.6260
3.75
0.1476
13.00
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.73
2.65
1.14
1.14
15.80
14.00
10.40
0.88
1.32
4.60
0.70
2.72
2.70
6.60
3.88
2.95
1.70
1.70
16.80
0.5118
0.3937
0.0240
0.0484
0.1732
0.0193
0.0945
0.0945
0.2441
0.1469
0.1043
0.0449
0.0449
0.6220
0.5512
0.4094
0.0346
0.0520
0.1811
0.0276
0.1071
0.1063
0.2598
0.1528
0.1161
0.0669
0.0669
0.6614
b1
b2
C
c1
c2
e
F
I
L
I2
I3
I4
M
16.40
2.6
0.6457
0.1024
1. Inch
dimensions are for reference only.
DS13214
–
Rev 2
page 8/11
T1635H-8T
Ordering information
3
Ordering information
Figure 15.
Ordering information scheme
T
16 35
H –
8
T
Series
T = Triac
RMS current
16 = 16 A
Gate triggering current
35 = 35 mA
High temperature
H = High noise immunity and robust commutations
Voltage
8 = 800 V
Package
T = TO-220-AB
Packing
Blank = Tube
Table 6.
Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
T1635H-8T
T1635H-8T
TO-220AB
2.1 g
50
Tube
DS13214
–
Rev 2
page 9/11
T1635H-8T
Revision history
Table 7.
Document revision history
Date
Version
Changes
24-Jan-2020
18-Dec-2020
1
2
Initial release.
Updated general description.
DS13214
–
Rev 2
page 10/11
T1635H-8T
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of S
T
.
F
or additional information about ST trademarks, please refer to
www.st.com/trademarks
. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2020 STMicroelectronics – All rights reserved
DS13214
–
Rev 2
page 11/11
