STMicroelectronics-T2035T-8G

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STMicroelectronics-T2035T-8G
T2035T-8G  
Datasheet  
20 A 800 V D

2

PAK Snubberless™ Triac  
Features  
A2  
•
•
•
•
•
•
High static dV/dt  
High dynamic turn-off commutation (dl/dt)c  
150 °C maximum junction temperature  
Three quadrants  
Surge capability V

DSM

, V

RSM

= 900 V  
Benefits:  
A2  
G
A1  
–
–
–
–
High immunity to false turn-on thanks to high static dV/dt  
Better turn-off in high temperature environments thanks to (dI/dt)c  
Increase of thermal margin due to extended working T

j

up to 150 °C  
Good thermal resistance due to non-insulated tab.  
D²PAK  
A2  
A2: Anode2  
A1: Anode1  
Applications  
•
•
•
•
•
•
•
General purpose AC line load switching  
G: Gate  
G
Motor control circuits  
Home appliances  
Heating  
A1  
Lighting  
Inrush current limiting circuits  
Overvoltage crowbar protection  
Product status link  
Description  
Available in SMD, the

Triac can be used for the on/off or phase angle  
control function in general purpose AC switching where high commutation capability  
is required. The

can be used without a snubber RC circuit when the limits  
defined are respected.  
Product summary  
I
20 A  
800 V  
900 V  
35 mA  
T(RMS)  
V
/V  
DRM RRM  
D

2

PAK package is UL-94,V0 flammability resin compliance.  
V
/V  
DSM RSM  
Package environmentally friendly Ecopack

®

2 graded (RoHS and Halogen Free  
compliance).  
I
GT  
Snubberless™ is a trademark of STMicroelectronics.  
DS12739
–
Rev 1
–
September 2018  
For further information contact your local STMicroelectronics sales office.  

T2035T-8G  
Characteristics  
1
Characteristics  
Table 1.
Absolute maximum ratings (limiting values)  
Parameter  
Symbol  
Value  
20  
Unit  
I
T =
 
122 °C  
RMS on-state current (full sine wave)  
A
T(RMS)  
c
t =
 
20 ms  
160  
168  
169  
100  
800  
600  
900  
4
p
Non repetitive surge peak on-state current (full cycle, T
 
initial  
= 25 °C  
j
I
A
TSM  
t =
 
16.7 ms  
p
2
2
2
t =
 
10 ms  
p
I t  
I t
 
value for fusing  
A s  
Critical rate of rise of on-state current, I
 
= 2 x I
 
, tr ≤ 100 ns
 
T initial
 
= 150 °C, f = 100 Hz  
dl/dt  
/V  
A/µs  
V
G
GT  
j
T =
 
125 °C  
j
V
Repetitive peak off-state voltage (50-60 Hz)  
DRM RRM  
T =
 
150 °C  
j
V
V
/V  
t =
 
10 ms, T
 
= 25 °C  
p
Non Repetitive peak off-state voltage  
Peak gate current  
V
DSM RSM  
j
I
A
GM  
t =
 
20 µs, T
 
= 150 °C  
p
j
V
Peak Gate Voltage  
5
V
GM  
P
T =
 
150 °C  
j
Average gate power dissipation  
Storage junction temperature range  
Operating junction temperature range  
1
W
G(AV)  
T
-40 to +150
 
°C  
-40 to +150
 
°C  
stg  
T
j
Table 2.
Electrical characteristics (T

j

= 25 °C, unless otherwise specified)  
Quadrants; T  
Symbol  
Test conditions  
Value  
Unit  
j
V
V
V
= 12
V
, R
 
=
3
0 Ω  
I
I – II – III  
Max.  
35  
mA  
D
D
D
L
GT  
V
= 12 V, R
 
= 30 Ω  
I – II – III  
I – II – III  
I – III  
Max.  
Max.  
Max.  
Max.  
Max.  
1.0  
0.15  
50  
V
GT  
L
V
= 600
V
, R
 
=
3
.3 kΩ  
T =
 
150 °C  
j
V
GD  
L
mA  
mA  
mA  
I
I =
 
1.2 x I  
G GT  
L
II  
80  
I =
 
500 mA, gate open  
T
I
45  
H
V
V
= 536
V
,
g
ate open  
= 402
V
,
g
ate open  
T =
 
125 °C  
Min.  
Min.  
Min.  
Min.  
1500  
1000  
27.5  
17.5  
V/µs  
V/µs  
A/ms  
A/ms  
D
D
j
dV/dt

T =
 
150 °C  
j
T =
 
125 °C  
j
(dl/dt)c

Without snubber  
T =
 
150 °C  
j
1. Minimum
 
I is
 
guaranteed at 5% of I
 
max  
GT  
GT  
2. For
 
both polarities of A2 referenced to A1.  
DS12739
–
Rev 1  
page 2/12  
 
 

T2035T-8G  
Characteristics  
Table 3.
Static characteristics  
Test conditions  
Symbol  
Value  
Unit  
V
V
I =
 
28.2 A, t
 
= 380 µs  
25 °C  
Max.  
Max.  
Max.  
1.50  
0.85  
T
p
TM  
V
Threshold on-state voltage  
Dynamic resistance  
150 °C  
V
TO  
R
D
150 °C  
25 °C  
22  
5
mΩ  
µA  
V
DRM  
= V  
= 800 V  
= 600 V  
Max.  
Max.  
RRM  
I
/I  
125°C  
150 °C  
1.7  
4.1  
mA  
mA  
DRM RRM  
V
= V  
DRM  
RRM  
1. For
 
both polarities of A2 referenced to A1.  
Table 4.
Thermal resistance  
Symbol  
Parameter  
Value  
1.15  
Unit  
R
Junction to case (AC)  
D²PAK  
Max.  
°C/W  
th(j-c)  
DS12739
–
Rev 1  
page 3/12  
 

T2035T-8G  
Characteristics (curves)  
1.2  
Characteristics curves  
Figure 1.
Maximum power dissipation versus on-state  
RMS current  
Figure 2.
On-state RMS current versus case temperature  
I
(A)  
T(RMS)  
P(W)  
26  
22  
20  
18  
16  
14  
12  
10  
8
24  
α = 180°  
22  
α = 180°  
20  
18  
16  
14  
12  
10  
8
6
4
6
T
(°C)  
c
180°  
4
2
2
0
I
(A)  
T
(RMS)  
10  
0
0
25  
50  
75  
100  
125  
150  
0
2
4
6
8
12  
14  
16  
18  
20  
Figure 3.
On-state RMS current versus ambient  
temperature (free air convection)  
Figure 4.
Relative variation of thermal impedance versus  
pulse duration  
I
(A)  
T(RMS)  
K = [Z
 
/R  
]
th th  
1.0E+00  
1.0E-01  
1.0E-02  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
α = 180°  
Z
th(j-c)  
T
(°C)  
a
t
(s)  
p
0
25  
50  
75  
100  
125  
150  
1.0E-03  
1.0E-02  
1.0E-01  
1.0E+00  
1.0E+01  
1.0E+02  
1.0E+03  
DS12739
–
Rev 1  
page 4/12  

T2035T-8G  
Characteristics (curves)  
Figure 5.
Relative variation of gate trigger current, holding  
current and latching current versus junction temperature  
(typical values)  
Figure 6.
Surge peak on-state current versus number of  
cycles  
I (A)  
TSM  
I
, I
 
, I
 
[T ] / I
 
, I
 
, I
 
[T =
 
25 °C]  
GT  
H
L
j
GT  
H
L
j
180  
160  
140  
120  
100  
80  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
t=20ms  
I

GT  

One cycle  
Non repetitive  
T initial
 
= 25 °C  
j
I

H

and I  
L
Repetitive  
= 122°C  
60  
T
c
40  
20  
T (°C)  
j
Number of cycles  
0
1
10  
100  
1000  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
160  
Figure 7.
Non repetitive surge peak on-state current for a  
sinusoidal pulse with width t

p

< 10 ms  
Figure 8.
On-state characteristics (maximum values)  
I

TM

(A)  
1000  
I
(A)  
TSM  
T max.  
j
10000  
1000  
100  
V
= 0.85 V  
R =
 
22 mΩ  
d
to  
T initial
 
= 25 °C  
j
dl/dt limitation: 100 A/µs  
100  
10  
1
T =
 
150 °C  
j
I
TSM  
T =
 
25 °C  
j
V
(V)  
TM  
t

P

(ms)  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
0.01  
0.10  
1.00  
10.00  
Figure 10.
Relative variation of critical rate of decrease of  
main current versus reapplied (dV/dt)

c

(typical values)  
Figure 9.
Relative variation of critical rate of decrease of  
main current versus junction temperature  
(dl/dt)c [T ] / (dl/dt)c [T  
]
j
j = 150 °C  
(dl/dt)c [(dV/dt)c] / specified (dl/dt)c  
2.0  
8
7
6
5
4
3
2
1
0
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
T (°C)  
j
(dV/dt)c (V/µs)  
0.0  
25  
50  
75  
100  
125  
150  
0.1  
1.0  
10.0  
100.0  
DS12739
–
Rev 1  
page 5/12  

T2035T-8G  
Characteristics (curves)  
Figure 11.
Relative variation of leakage current versus  
junction temperature for different values of blocking  
voltage (typical values)  
Figure 12.
Thermal resistance junction to ambient versus  
copper surface under tab  
R

th(j-a)

(°C/W)  
I
I
at [ T
 
] / I  
, I  
at [T  
]*  
j max.  
DRM, RRM  
j
DRM RRM  
80  
D²PAK  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
Epoxy printed circuit board FR4, e

Cu

= 35 µm  
70  
60  
50  
40  
30  
20  
V

DRM

= V

RRM

= 800 V  
V

DRM

= V

RRM

= 600 V  
S

Cu

(cm²)  
10  
*[T max
 
= 125 °C; V

DRM

, V  
= 800 V]  
RRM  
= 600 V]  
RRM  
j
[T max
 
= 150 °C; V

DRM

, V  
j
T (°C)  
j
0
0
5
10  
15  
20  
25  
30  
35  
40  
25  
50  
75  
100  
125  
150  
DS12739
–
Rev 1  
page 6/12  

T2035T-8G  
Package information  
2
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK

®  

packages, depending on their level of environmental compliance. ECOPACK

®

specifications, grade definitions  
and product status are available at:

. ECOPACK

®

is an ST trademark.  
2.1  
D²PAK package information  
•
•
•
ECOPACK

®

2compliant  
Lead-free package leads finishing  
Molding compound resin is halogen-free and meets UL94 standard level V0  
Figure 13.
D²PAK package outline  
A
E
E1  
E2  
c2  
1
2
3
b2  
e
Max resin gate protrusion: 0.5 mm (1)  
b
G
A1  
A2  
A3  
R
Gauge Plane  
c
V2  
(1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical.  
DS12739
–
Rev 1  
page 7/12  

T2035T-8G  
D²PAK package information  
Table 5.
D²PAK package mechanical data  
Dimensions  
Inches

Ref.  
Millimeters  
Typ.  
Min.  
4.30  
2.49  
0.03  
Max.  
4.60  
2.69  
0.23  
Min.  
Typ.  
Max.  
A
A1  
A2  
A3  
b
0.1693  
0.0980  
0.0012  
0.1811  
0.1059  
0.0091  
0.25  
0.0098  
0.70  
1.25  
0.45  
1.21  
8.95  
7.50  
1.30  
0.93  
1.7  
0.0276  
0.0492  
0.0177  
0.0476  
0.3524  
0.2953  
0.0512  
0.0366  
0.0669  
0.0236  
0.0535  
0.3681  
0.3150  
0.0669  
b2  
c
0.60  
1.36  
9.35  
8.00  
1.70  
c2  
D
D1  
D2  
e
2.54  
0.1  
E
10.00  
8.30  
6.85  
4.88  
15  
10.28  
8.70  
7.25  
5.28  
15.85  
2.28  
1.40  
1.75  
0.3937  
0.3268  
0.2697  
0.1921  
0.5906  
0.0701  
0.0500  
0.0551  
0.4047  
0.3425  
0.2854  
0.2079  
0.6240  
0.0898  
0.0551  
0.0689  
E1  
E2  
G
H
L
1.78  
1.27  
1.40  
L2  
L3  
R
0.40  
0.0157  
0°  
8°  
0°  
8°  
1. Dimensions
 
in inches are given for reference only  
2. Degrees  
DS12739
–
Rev 1  
page 8/12  
 
 

T2035T-8G  
D²PAK package information  
Figure 14.
D²PAK recommended footprint (dimensions are in mm)  
16.90  
10.30  
5.08  
1.30  
3.70  
8.90  
Figure 15.
D²PAK stencil definitions(dimensions are in mm)  
DS12739
–
Rev 1  
page 9/12  

T2035T-8G  
Ordering information  
3
Ordering information  
Figure 16.
Ordering information scheme  
T
20 35  
T
–
8
G – TR  
SnubberlessTM TRIAC  
T = Triac  
Current (RMS) / Type  
20 = 20 A  
Gate Current  
35 = 35 mA  
Specific application  
T = increased (dl/dt)c and dV/dt producing reduced I

TSM  

Voltage  
8 = 800 V  
Package  
G = D²PAK  
Packing  
Blank = Tube  
TR =
T
a
pe and reel  
Table 6.
Ordering information  
Order code  
T2035T-8G-TR  
T2035T-8G  
Marking  
Package  
Weight  
Base qty.  
1000  
Delivery mode  
T
a
pe and reel  
Tube  
T2035T-8G  
D²PAK  
1.6 g  
50  
DS12739
–
Rev 1  
page 10/12  

T2035T-8G  
Revision history  
Table 7.
Document revision history  
Date  
12-Sep-2018  
Version  
Changes  
1
Initial release.  
DS12739
–
Rev 1  
page 11/12  

T2035T-8G  
IMPORTANT NOTICE – PLEASE READ CAREFULLY  
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST  
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products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.  
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of  
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No license, express or implied, to any intellectual property right is granted by ST herein.  
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.  
ST and the ST logo are trademarks of S
T
.
A
ll other product or service names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2018 STMicroelectronics – All rights reserved  
DS12739
–
Rev 1  
page 12/12