STMicroelectronics-T2550-12I

Part #STMicroelectronics-T2550-12I
Download 
STMicroelectronics-T2550-12I
T2550-12G, T2550-12
T
,
T
2550-12I  
Datasheet  
25 A, 1200 V Snubberless Triacs  
A2  
A1  
Features  
•
•
•
•
•
•
•
On-state RMS current: 25 A  
Blocking voltage: 1200 V  
G
High static community and dynamic commutation  
I

GT

= 50 mA  
A2  
High endurance reliability  
Compact high voltage device  
G
G
UL recognized component : UL1557 standard, reference file E81734  
A2  
A2  
A1  
A1  
TO-220AB  
TO-220AB Ins.  
A2  
Applications  
•
•
Motor control circuits  
Heating control circuits  
G
A2  
A1  
D²PAK  
Description  
The T2550-12x is a 25 A 1200 V Snubberless Triac available in three packages:  
D²PAK, TO-220AB and TO-220AB insulated.  
Its 1200 V blocking voltage enables use in 3-phase industrial application. Its noise  
immunity and dynamic commutation makes it suitable for either inductive, capacitive  
or resistive load control.  
Product status link  
Product summary  
I
25 A  
T(RMS)  
V
/V  
1200 V  
50 mA  
DRM RRM  
I
GT  
DS10039
–
Rev 5
–
September 2020  
For further information contact your local STMicroelectronics sales office.  
 

T2550-12G, T2550-12
T
,
T
2550-12I  
Characteristics  
1
Characteristics  
Table 1.
Absolute maximum ratings (limiting values, T

j

= 25 °C, unless otherwise stated)  
Symbol  
Parameters  
Value  
Unit  
T =
 
100 °C  
D²PAK, TO-220AB  
TO-220AB Ins.  
c
I
RMS on-state current (full sine wave)  
25  
A
T(RMS)  
T =
 
71 °C  
c
t =
 
20 ms  
240  
252  
380  
Non repetitive surge peak on-state current  
p
I
A
TSM  
(full cycle, T
 
initial = 25 °C)  
t =
 
16.7 ms  
p
j
2
2
2
t =
 
10 ms  
p
I t  
I t
 
value for fusing  
A s  
Critical rate of rise of on-state current  
T =
 
125 °C  
j
dl/dt  
f = 60 Hz  
100  
A/µs  
I
= 2 x I
 
, t
 
≤ 100 ns  
GT r  
G
V
/V  
Repetitive peak off-state voltage  
Non repetitive surge peak off-state voltage  
Peak gate current  
1200  
V
V
DRM RRM  
V
/V  
t =
 
10 ms  
1300  
DSM RSM  
p
I
t =
 
20 µs  
p
4
16  
A
GM  
V
t =
 
20 µs  
p
Peak positive gate voltage  
V
GM  
P
Average gate power dissipation  
Storage junction temperature range  
Operating junction temperature range  
Insulation RMS voltage, 1 minute  
1
W
°C  
°C  
V
G(AV)  
T
-40 to +150  
-40 to +125  
2500  
stg  
T
j
V
TO-220AB Ins.  
ins.  
Table 2.
Electrical characteristics (T

j

= 25 °C, unless otherwise specified) – Snubberless™ (3 quadrants)  
Symbol  
Parameters  
Quadrant  
Value  
2.5  
Unit  
Min.  
Max.  
Max.  
I
I – II – III  
mA  
GT  
V
V
= 12
V
, R
 
=
3
3 Ω  
50  
D
L
V
I – II – III  
I – II – III  
1.3  
V
V
GT  
V
GD  
= V  
, R
 
= 3,3 kΩ, T
 
= 125 °C  
DRM L
 
j  
Min.  
Max.  
Max.  
Min.  
Min.  
Typ.  
0.2  
60  
D
I =
 
500 mA, gate open  
T
I
H
mA  
mA  
V/µs  
A/ms  
µs  
I
L
I =
 
1.2 I  
G GT  
I – II – III  
I – II – III  
80  
dV/dt

V
= 67 % V  
gate open, T
 
= 125 °C  
DRM j  
2500  
20  
D
(dI/dt)c

Without snubber, T
 
= 125 °C  
j
t
gt  
I
= 13 A, V
 
= 400
V
, I
 
=
1
00 mA, dl
 
/dt = 100 mA/µs, R
 
= 30 Ω  
TM D G
 
G L  
2
1. For
 
both polarities of A2 referenced to A1  
DS10039
–
Rev 5  
page 2/14  
 

T2550-12G, T2550-12
T
,
T
2550-12I  
Characteristics  
Table 3.
Static electrical characteristics  
T
Symbol  
Test conditions  
= 35 A, t
 
= 380 µs  
Value  
1.55  
Unit  
V
j
V
I
25 °C  
Max.  
Max.  
Max.  
TM  
p
TM  
V
threshold on-state voltage  
Dynamic resistance  
125 °C  
0.85  
V
TO  
R
125 °C  
25 °C  
20  
10  
6
mΩ  
µA  
D
I
I
DRM  
V
= V
 
= 1200 V  
R
Max.  
D
125 °C  
mA  
RRM  
1. For
 
both polarities of A2 referenced to A1  
Table 4.
Thermal resistance  
Symbol  
Parameters  
Value  
Unit  
TO-220AB / D²PAK  
TO-220AB insulated  
D²PAK  
0.8  
1.7  
45  
R
Junction to case (AC)  
Max.  
Typ.  
th(j-c)  
th(j-a)  
°C/W  
Junction to ambient (S = 2 cm²)

Junction to ambient  
R
TO-220AB / TO-220AB ins  
60  
1. Copper
 
surface under tab.  
DS10039
–
Rev 5  
page 3/14  
 
 

T2550-12G, T2550-12
T
,
T
2550-12I  
Characteristics (curves)  
1.1  
Characteristics (curves)  
Figure 1.
Maximum power dissipation versus on-state  
RMS current (full cycle)  
Figure 2.
RMS on-state current versus case temperature  
(full cycle)  
I
(A)  
T
(RMS)  
P(W)  
32  
26  
24  
22  
20  
18  
16  
14  
12  
10  
8
30  
28  
26  
TO-220AB  
D²PAK  
α = 180°  
α = 180 °  
24  
22  
20  
18  
16  
14  
12  
10  
8
TO-22AB Ins  
180°  
α
α
6
6
4
4
2
0
T (°C)  
c
2
I
(A)  
T
(RMS)  
0
0
25  
50  
75  
100  
125  
0
5
10  
15  
20  
25  
Figure 3.
On-state RMS current versus ambient  
temperature (free air convection)  
Figure 4.
Surge peak on-state current versus number of  
cycles  
I
(A)  
TSM  

3.5

I

T(RM
S

(

)

A)  
250  
Non repetitive T
 
= 25 °C  
225  
200  
175  
150  
125  
100  
75  
j
D²PAK  
3.0  
2.5  
S

CU

= 2 cm²  
t

p

= 20ms  
One cycle  
2.0  
TO-220AB,  
TO-220AB Ins  
T
= 71 °C (TO-220AB Ins)  
1.5  
c
1.0  
0.5  
0.0  
Repetitive  
50  
T (°C)  
A
25  
T
= 100 °C (TO-220AB, D²PAK)  
10  
Number of cycles  
c
0
0
2 5  
5 0  
7 5  
100  
125  
1
100  
1000  
Figure 5.
Relative variation of thermal impedance versus  
pulse duration (T2550-12I)  
Figure 6.
Relative variation of thermal impedance versus  
pulse duration  
K = [Z
 
/ R  
]
K = [Z
 
/ R  
]
th th  
th th  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E+00  
TO-220AB, D²PAK  
TO-220AB Ins  
Z

th(j-c)  

Z
Z

th(j-a)  

th(j-c)  
Z
th(j-a)  
1.0E-01  
1.0E-02  
TO-220AB  
D²PAK  
S

CU

= 2 cm²  
tp(s)  
1.0E+04  
tp(s)  
1.E-03 1.E-02 1.E-01 1.E+00
 
1.E+01 1.E+02 1.E+03 1.E+04  
1.0E-02  
1.0E+00  
1.0E+02  
1.0E-03  
1.0E-01  
1.0E+01  
1.0E+03  
DS10039
–
Rev 5  
page 4/14  

T2550-12G, T2550-12
T
,
T
2550-12I  
Characteristics (curves)  
Figure 8.
Relative variation of holding current and  
latching current versus junction temperature (typical  
values)  
Figure 7.
Relative variation of gate trigger current and  
gate voltage versus junction temperature (typical values)  
I
V
[ T
 
] / I  
V
[ T
 
= 25 °C]  
GT
,
GT  
j
GT
,
GT  
j
I
I
[ T
 
] / I  
j
I
[ T
 
= 25 °C]  
j
H, L  
H, L  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
2.0  
1.8  
1.5  
1.3  
1.0  
0.8  
0.5  
I
H
I
Q1-Q2  
GT  
I
Q3  
GT  
V
GT  
T (°C)  
j
T (°C)  
j
-50  
-25  
0
25  
50  
75  
100  
125  
-50  
-25  
0
25  
50  
75  
100  
125  
Figure 9.
Relative variation of critical rate of decrease of
 
Figure 10.
Relative variation of critical rate of decrease of  
main current versus junction temperature (typical values)  
main current versus reapplied dV/dt  
(dl/dt)c [T ] / (dl/dt)c [T  
]
j = 125 °C  
(dl/dt)c [(dV/dt)c] / Specified (dl/dt)c  
j
8
7
6
5
4
3
2
1
0
4
3
2
1
0
T (°C)  
j
(dV/dt)c (V/µs)  
10.0 100.0  
25  
50  
75  
100  
125  
0.1  
1.0  
Figure 11.
Non repetitive surge peak on-state current  
versus sinusoidal pulse width (t

P

< 10 ms)  
Figure 12.
On-state characteristics (maximum values)  
I
(A)  
TM  
I
(A)  
1000  
100  
10  
TSM  
10000  
1000  
100  
dl/dt limitation: 100 A/µs  
T initial
 
= 25 °C  
j
I
TSM  
T max:  
j
V
= 0.85 V  
to  
Rd = 20 mΩ  
T =
 
125 °C  
T =
 
25 °C  
j
V
(V)  
TM  
j
t (ms)  
p
1
0.0  
10  
0.01  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
0.10  
1.00  
10.00  
DS10039
–
Rev 5  
page 5/14  

T2550-12G, T2550-12
T
,
T
2550-12I  
Characteristics (curves)  
Figure 14.
D²PAK thermal resistance junction to ambient  
versus copper surface under tab  
Figure 13.
Relative variation of leakage current versus  
junction temperature for different values of blocking  
voltage (typical values)  
R

th(j-a)

(°C/W)  
80  
I
I
, I  
[ T
 
;
V  
,
V  
] /  
DRM RRM  
j
DRM  
RRM  
D²PAK  
/
I  
[ 125 °C; V  
= 1200
V
,
V  
= 1200
 
V  
= 1200 V]  
RRM  
DRM RRM  
DRM  
RRM  
70  
Epoxy printed board FR4, copper thickness = 35 µm  
1.0E+00  
1.0E-01  
60  
50  
40  
30  
20  
V
=
V  
DRM  
V
=
V
= 1000
 
V  
RRM  
DRM  
1.0E-02  
1.0E-03  
1.0E-04  
V
=
V
= 800
 
V  
RRM  
DRM  
10  
S

Cu

(cm²)  
0
T (°C)  
j
0
5
10  
15  
20  
25  
30  
35  
40  
25  
50  
75  
100  
125  
DS10039
–
Rev 5  
page 6/14  

T2550-12G, T2550-12
T
,
T
2550-12I  
Package information  
2
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of

packages,  
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product  
status are available at:

. ECOPACK is an ST trademark.  
2.1  
D²PAK package information  
•
•
Molding epoxy meets UL94 level V0  
lead-free plating of package leads  
Figure 15.
D²PAK package outline  
A
E
E1  
E2  
c2  
1
2
3
b2  
e
Max resin gate protrusion: 0.5 mm (1)  
b
G
A1  
A2  
A3  
R
Gauge Plane  
(1) Resin gate is accepted in each of position shown on the drawing, or their symmetrical.  
DS10039
–
Rev 5  
page 7/14  

T2550-12G, T2550-12
T
,
T
2550-12I  
D²PAK package information  
Table 5.
D²PAK package mechanical data  
Dimensions  
Inches

Typ.  
Ref.  
Millimeters  
Typ.  
Min.  
4.30  
2.49  
0.03  
Max.  
4.60  
2.69  
0.23  
Min.  
Max.  
A
A1  
A2  
A3  
b
0.1693  
0.0980  
0.0012  
0.1811  
0.1059  
0.0091  
0.25  
0.0098  
0.70  
1.25  
0.45  
1.21  
8.95  
7.50  
1.30  
2.54  
10.00  
8.30  
6.85  
4.88  
15  
0.93  
1.7  
0.0276  
0.0492  
0.0177  
0.0476  
0.3524  
0.2953  
0.0512  
0.1  
0.0366  
0.0669  
0.0236  
0.0535  
0.3681  
0.3150  
0.0669  
b2  
c
0.60  
1.36  
9.35  
8.00  
1.70  
c2  
D
D1  
D2  
e
E
10.28  
8.70  
7.25  
5.28  
15.85  
2.28  
1.40  
1.75  
0.3937  
0.3268  
0.2697  
0.1921  
0.5906  
0.0701  
0.0500  
0.0551  
0.4047  
0.3425  
0.2854  
0.2079  
0.6240  
0.0898  
0.0551  
0.0689  
E1  
E2  
G
H
L
1.78  
1.19  
1.40  
L2  
L3  
R
0.40  
0.0157  
V2  
0°  
8°  
0°  
8°  
1. Dimensions
 
in inches are given for reference only  
DS10039
–
Rev 5  
page 8/14  
 
 

T2550-12G, T2550-12
T
,
T
2550-12I  
D²PAK package information  
Figure 16.
D²PAK recommended footprint (dimensions are in mm)  
16.90  
10.30  
5.08  
1.30  
3.70  
8.90  
Figure 17.
D²PAK footprint and stencil dimensions’ definitions (dimensions in mm)  
8,90  
4,30  
3,70  
0,05  
2×0,27  
4×2  
0,26  
4,39  
3,60  
8,81  
Note:
Blue = Stencil
, Black = Footprint  
DS10039
–
Rev 5  
page 9/14  

T2550-12G, T2550-12
T
,
T
2550-12I  
TO-220AB non ins. and insulated package information  
2.2  
TO-220AB non ins. and insulated package information  
•
•
•
Molding compound resin is halogen-free and meets flammability standard UL94 level 0  
Lead-free package leads finishing  
Recommended torque: 0.4 to 0.6 N.m  
Figure 18.
TO-220AB non ins. and insulated package outline  
C
B
I
b2  
Resin gate 0.5 mm  
max. protusion

(1)  

L
F
A
I4  
l3  
l2  
c2  
a1  
a2  
M
c1  
Resin gate 0.5 mm  
max. protusion

(1)  

b1  
e
(1)Resin gate position accepted in one of the two positions or in the symmetrical opposites.  
DS10039
–
Rev 5  
page 10/14  

T2550-12G, T2550-12
T
,
T
2550-12I  
TO-220AB non ins. and insulated package information  
Table 6.
TO-220AB non ins. and insulated package mechanical data  
Dimensions  
Ref.  
Millimeters  
Typ.  
Inches1  
Typ.  
Min.  
Max.  
Min.  
Max.  
A
a1  
a2  
B
15.20  
15.90  
0.5984  
0.6260  
3.75  
0.1476  
13.00  
10.00  
0.61  
1.23  
4.40  
0.49  
2.40  
2.40  
6.20  
3.73  
2.65  
1.14  
1.14  
15.80  
14.00  
10.40  
0.88  
1.32  
4.60  
0.70  
2.72  
2.70  
6.60  
3.88  
2.95  
1.70  
1.70  
16.80  
0.5118  
0.3937  
0.0240  
0.0484  
0.1732  
0.0193  
0.0945  
0.0945  
0.2441  
0.1469  
0.1043  
0.0449  
0.0449  
0.6220  
0.5512  
0.4094  
0.0346  
0.0520  
0.1811  
0.0276  
0.1071  
0.1063  
0.2598  
0.1528  
0.1161  
0.0669  
0.0669  
0.6614  
b1  
b2  
C
c1  
c2  
e
F
I
L
I2  
I3  
I4  
M
16.40  
2.6  
0.6457  
0.1024  
1. Inch
 
dimensions are for reference only.  
DS10039
–
Rev 5  
page 11/14  

T2550-12G, T2550-12
T
,
T
2550-12I  
Ordering information  
3
Ordering information  
Figure 19.
Ordering information scheme  
T
25 50
 
– 12
 
G – TR  
Series  
Triac  
Current  
25 = 25 A  
Gate sensitivity  
50 = 50 mA  
Voltage  
12 = 1200 V  
Package  
T = TO-220AB non insulated  
I = T
O
-220AB insulated  
G = D²PAK  
Delivery mode  
Blank = Tube  
TR = Tape and reel  
Table 7.
Ordering information  
Order code  
T2550-12G  
T2550-12G-TR  
T2550-12T  
Marking  
Package  
Weight  
Base qty.  
Delivery mode  
Tube  
50  
1000  
50  
T2550-12G  
D²PAK  
1.50 g  
T
a
pe and reel 13″  
Tube  
T2550-12T  
T2550-12  
TO-220AB  
2.3 g  
2.3 g  
T2550-12I  
TO-220AB Ins.  
50  
Tube  
DS10039
–
Rev 5  
page 12/14  

T2550-12G, T2550-12
T
,
T
2550-12I  
Revision history  
Table 8.
Document revision history  
Date  
Revision  
Changes  
9-Jan-2014  
1
2
Initial release.  
30-Jan-2014  
10-Dec-2015  
Updated table 4.  
Inserted TO-220AB insulated package information and reformatted to current  
standard.  
3
Updated
T
a
ble 1,
T
a
ble 4 and Figure 15.  
Added Figure 18.  
17-May-2019  
23-Sep-2020  
4
5
Minor text changed.  
DS10039
–
Rev 5  
page 13/14  

T2550-12G, T2550-12
T
,
T
2550-12I  
IMPORTANT NOTICE – PLEASE READ CAREFULLY  
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST  
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST  
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.  
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of  
Purchasers’ products.  
No license, express or implied, to any intellectual property right is granted by ST herein.  
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.  
ST and the ST logo are trademarks of S
T
.
F
or additional information about ST trademarks, please refer to

. All other product or service  
names are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2020 STMicroelectronics – All rights reserved  
DS10039
–
Rev 5  
page 14/14