STMicroelectronics-T810H-6G-TR

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STMicroelectronics-T810H-6G-TR
T810H  
High temperature 8 A sensitive TRIACs  
Features  
A2  
■
Medium current TRIAC  
■
Logic level sensitive TRIAC  
G
■
150 °C max. T
 
turn-off commutation  
j
A1  
■
Clip bounding  
■
RoHS (2002/95/EC) compliant packages  
A2  
Applications  
A2  
■
The T810H is designed for the control of AC  
actuators in appliances and industrial systems.  
G
G
A2  
■
The multi-port drive of the microcontroller can  
control the multiple loads of such appliances  
and systems through these sensitive gate  
TRIACs.  
A2  
A1  
A1  
TO-220AB  
T810H-6T  
D

2

P
A
K  
T810H-6G  
Description  
Specifically designed to operate at 150 °C, the  
new 8 A T810H TRIACs provide an enhanced  
performance in terms of power loss and thermal  
dissipation. This allows the optimization of the  
heatsink size, leading to space and cost  
effectiveness when compared to electro-  
mechanical solutions.  
Table 1.  
Device summary  
Symbol  
Value  
Unit  
I

T(RMS)  

V

DRM

/V

RRM  

I

GT MAX  

8
A
V
Based on ST logic level technolog
y
,
t
hey offer an  
I
lower than 10 mA and specified minimal  
600  
10  
GT  
commutation and high noise immunity levels valid  
mA  
up to the T max.  
j
May 2009  
Doc ID 15714 Rev 1  
1/10  
10  

Characteristics  
T810H  
1
Characteristics  
Table 2.  
Absolute maximum ratings  
Symbol  
I

T(RMS)  

Parameter  
Value  
Unit  
On-state rms current (full sine wave)  
D

2

P
A
K, TO-220AB
 
T

c

= 135 °C  
8
A
F = 60 Hz  
F = 50 Hz  
t

p

= 10 ms  
t = 16.7 ms  
t = 20 ms  
84  
80  
42  
Non repetitive surge peak on-state  
current (full
 
cycle, T

j

initial = 25 °C)  
I

TSM  

A
²
²
²
I t  
I t Value for fusing  
A s  
Critical rate of rise of on-state current  
dI/dt  
F = 120 Hz  
T

j

= 150 °C  
T

j

= 25 °C  
50  
A/µs  
V
I

G

= 2 x I

GT

, t

r

≤
100 ns  
Non repetitive surge peak off-state  
voltage  
V

DRM

/V

RRM  

+ 100  
V

DSM

/V

RSM  

t

p

= 10 ms  
t

p

= 20 µs  
I

GM  

Peak gate current  
T

j

= 150 °C  
T

j

= 150 °C  
4
1
A
P

G(AV)  

Average gate power dissipation  
W
T

stg  

T

j  

Storage junction temperature range  
Operating junction temperature range  
– 40 to + 150  
– 40 to + 150  
°C  
Table 3.  
Symbol  
Electrical characteristics (T
 
= 25 °C, unless otherwise specified)  
j
Test conditions  
Quadrant  
Min  
Max.  
Unit  
I

GT  

V

GT  

V

GD  

I – II – III  
I – II – III  
I – II – III  
1
10  
mA  
V
V

D

= 12 V
 
R

L

= 33
Ω  
1.0  
V

D

= V

DRM

, R

L

= 3.3 k
Ω  
0.15  
V
(1)  
I

H  

I

T

= 100 mA  
25  
30  
35  
mA  
I – III  
II  
I

L  

I

G

= 1.2 I

GT  

mA  
V/µs  
A/ms  
dV/dt

(1)  

(dI/dt)c

(1)  

V

D

= 67%
 
V

DRM,

gate open, T

j

= 150 °C  
Logic level, 0.1 V/µs, T

j

= 150 °C  
Logic level, 15 V/µs, T

j

= 150 °C  
75  
11.4  
3.0  
1. For
 
both polarities of A2 referenced to A1.  
2/10  
Doc ID 15714 Rev 1  

T810H  
Characteristics  
Table 4.  
Static characteristics  
Symbol  
Test conditions  
T

j

= 25 °C  
Value  
Unit  
(1)  
(1)  
(1)  
V

T  

V

t0  

R

d  

I

TM

= 11.3 A, t

p

= 380 µs  
Threshold voltage  
MAX.  
MAX.  
MAX.  
MAX.  
MAX.  
MAX.  
MAX.  
1.5  
0.80  
55.0  
5
V
V
T

j

= 150 °C  
T

j

= 150 °C  
T

j

= 25 °C  
T

j

= 150 °C  
Dynamic resistance  
m
Ω  
µA  
V

DRM

= V

RRM  

3.1  
2.5  
2.0  
I

DRM  

I

RRM  

V

D

/V

R

= 400 V (at peak mains voltage)
 
T

j

= 150 °C  
V

D

/V

R

= 200 V (at peak mains voltage)
 
T

j

= 150 °C  
mA  
1. for
 
both polarities of A2 referenced to A1.  
Table 5.  
Symbol  
R

th(j-c)  

Thermal resistance  
Parameter  
Value  
Unit  
Junction to case (AC)  
Junction to ambient  
D

2

P
A
K / TO-220AB  
1.60  
45  
S = 1 cm

2  

D

2

P
A
K  
°C/W  
R

th(j-a)  

TO-220AB  
60  
Figure 1.  
Maximum power dissipation versus
 
Figure 2.  
on-state rms current (full cycle)  
On-state rms current versus case  
temperature (full cycle)  
P(W)  
I

T(RMS)

(A)  
10  
9
8
7
6
5
4
3
2
1
0
10  
9
8
7
6
5
4
3
2
1
0
T

C

(°C)  
I

T(RMS
)

(A)  
4
0
25  
50  
75  
100  
125  
150  
0
1
2
3
5
6
7
8
Doc ID 15714 Rev 1  
3/10  

Characteristics  
T810H  
Figure 3.  
On-state rms current versus  
Figure 4.  
Relative variation of thermal  
ambient temperature (free air  
convection, full cycle)  
impedance, versus pulse duration  
K=[Zth/Rth]  
I

T(RMS)

(A)  
1.E+00  
1.E-01  
1.E-02  
1.E-03  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Zth(j-c)  
Zth(j-a)  
T

a

(°C)  
tp(s)  
0
25  
50  
75  
100  
125  
150  
1.E-03  
1.E-02  
1.E-01  
1.E+00  
1.E+01  
1.E+02  
1.E+03  
Figure 5.  
Relative variation of gate trigger  
current and voltage versus junction  
temperature (typical values)  
Figure 6.  
Relative variation of holding and  
latching current versus junction  
temperature (typical values)  
I

GT

, V

GT

[T

j

] / I

GT

, V

GT

[T

j

=25 °C]  
I

H

, I

L

[T

j

] / I

H

, I

L

[T

j

=25 °C]  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
2.0  
1.5  
1.0  
0.5  
0.0  
I
Q3  
GT  
I
Q1
–
Q
2  
GT  
I
H
I
L
V
GT  
Q1- Q2 -Q3  
T

j

(°C)  
T

j

(°C)  
50  
-50  
-25  
0
25  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Figure 7.  
Surge peak on-state current  
versus number of cycles  
Figure 8.  
Non-repetitive surge peak on-state  
current and corresponding value  
of I
 
t  
2
I

TSM

(A), I²t (A²s)  
I

TSM

(A)  
1000  
100  
10  
80  
70  
60  
50  
40  
30  
20  
10  
0
T

j

initial=25 °C  
I

TSM  

t=20ms  
dI/dt limitation: 50 A/µs  
One cycle  
Non repetitive  
T

j

initial=25 °C  
I²t  
Repetitive  
T

C

=135 °C  
Sinusoidal pulse width t
 
< 10 ms  
p
Number of cycles  
100  
t

P

(ms)  
1
1
10  
1000  
0.01  
0.10  
1.00  
10.00  
4/10  
Doc ID 15714 Rev 1  

T810H  
Characteristics  
Figure 9.  
On-state characteristics (maximum
 
Figure 10.
 
Relative variation of critical rate of  
values)  
decrease of main current versus  
junction temperature  
I

TM

(A)  
100  
(dI/dt)

C

[T

j

] / (dI/dt)

c

[T

j

=150 °C]  
15  
14  
13  
12  
11  
10  
9
T

j

max  

to

= 0.80 V  

d

= 55 m
Ω
 
V
R
8
7
6
10  
T

j

=150 °C  
5
4
3
T

j

=25 °C  
2
1
T

j

(°C)  
V

TM

(V)  
0
1
25  
50  
75  
100  
125  
150  
0
1
2
3
4
5
Figure 11.
 
Relative variation of critical rate of
 
Figure 12.
 
Relative variation of static dV/dt  
decrease of main current versus  
reapplied dV/dt (typical values)  
immunity versus junction  
temperature  
dV/dt [T

j

] / dV/dt [
T

j

=150 °C]  
(dI/dt)

c

[ (dV/dt)

c

] / Specified (dI/dt)  
c
15  
14  
13  
12  
11  
10  
9
4
3
2
1
0
V

D

=V

R

=400 V  
8
7
6
5
4
3
2
1
(dV/dt)

C

(V/µs)  
T

j

(°C)  
0
0.1  
1.0  
10.0  
100.0  
25  
50  
75  
100  
125  
150  
Figure 13.
 
Variation of leakage current versus
 
Figure 14.
 
Acceptable case to ambient thermal  
junction temperature for different  
values of blocking voltage  
resistance versus repetitive peak  
off-state voltage  
I

DRM

/I

RRM

[Tj;
V

DRM/

V

RRM

]/I

DRM

/I  

RRM

[Tj=150°C
;
6
00V]  
R

th(c-a
)

(°C/W)  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
R

th(j-c)

=1.6 °C/W  
T

J

=150 °C  
V

DRM

=V

RRM

=600 V  
V

DRM

=V

RRM

=400 V  
V

DRM

=V

RRM

=200 V  
V

AC PEA
K

(V)  
T

j

(°C)  
0
200  
300  
400  
500  
600  
25  
50  
75  
100  
125  
150  
Doc ID 15714 Rev 1  
5/10  

Ordering information scheme  
T810H  
2
Ordering information scheme  
Figure 15.
 
Ordering information scheme  
T
8
10 H
 
– 6
 
y -TR  
Triac series  
Current  
8 = 8 A  
Sensitivity  
10 = 10 mA  
High temperature  
Voltage  
6 = 600 V  
Package  
2
G = D
 
P
A
K  
T = TO-220AB  
Packing  
Blank =
T
u
be (D
 
P
A
K, TO-220AB)  
-TR =
T
a
pe and reel (D
 
P
A
K)  
2
2
6/10  
Doc ID 15714 Rev 1  

T810H  
Package information  
3
Package information  
●
●
Epoxy meets UL94, V0  
Recommended torque 0.4 to 0.6 N·m  
In order to meet environmental requirements, ST offers these devices in different grades of  
®
®
ECO
P
A
CK packages,
 
depending on their level of environmental compliance. ECO
P
A
CK  
specifications, grade definitions and product status are available at:

.  
®
ECO
P
A
CK is
 
an ST trademark.  
2
Table 6.  
D
P
A
K
 
dimensions  
Dimensions  
Millimeters  
Min. Typ. Max. Min. Typ. Max.  
Ref.  
Inches  
A
4.30  
4.60 0.169  
2.69 0.098  
0.23 0.001  
0.93 0.027  
0.181  
0.106  
0.009  
0.037  
A
A1 2.49  
A2 0.03  
E
C2  
L2  
B
0.70  
B2 1.25 1.40  
0.45  
C2 1.21  
D
0.048 0.055  
L
L3  
C
0.60 0.017  
1.36 0.047  
9.35 0.352  
10.28 0.393  
5.28 0.192  
15.85 0.590  
1.40 0.050  
1.75 0.055  
0.024  
0.054  
0.368  
0.405  
0.208  
0.624  
0.055  
0.069  
A1  
B2  
B
R
C
D
E
G
L
8.95  
10.00  
4.88  
G
A2  
2mm min.  
FLAT ZONE  
15.00  
L2 1.27  
L3 1.40  
R
V2  
0.40  
0.016  
V2  
0°  
8°  
0°  
8°  
Figure 16.
 
Footprint (dimensions in mm)  
16.90  
10.30  
5.08  
1.30  
3.70  
8.90  
Doc ID 15714 Rev 1  
7/10  

Package information  
Table 7.  
T810H  
TO-220AB dimensions  
Dimensions  
Millimeters  
Min. Typ. Max. Min. Typ. Max.  
Ref.  
Inches  
A
15.20  
15.90 0.598  
0.625  
a1  
3.75  
0.147  
a2 13.00  
10.00  
14.00 0.511  
10.40 0.393  
0.88 0.024  
1.32 0.048  
4.60 0.173  
0.70 0.019  
2.72 0.094  
2.70 0.094  
6.60 0.244  
3.85 0.147  
0.551  
0.409  
0.034  
0.051  
0.181  
0.027  
0.107  
0.106  
0.259  
0.151  
C
B
Ø I  
b2  
B
L
b1 0.61  
b2 1.23  
F
A
I4  
C
4.40  
l3  
c1 0.49  
c2 2.40  
c2  
a1  
l2  
a2  
e
F
2.40  
6.20  
M
c1  
b1  
e
ØI 3.75  
I4 15.80
 
16.40 16.80 0.622 0.646 0.661  
L
2.65  
1.14  
1.14  
2.95 0.104  
1.70 0.044  
1.70 0.044  
0.116  
0.066  
0.066  
l2  
l3  
M
2.60  
0.102  
8/10  
Doc ID 15714 Rev 1  

T810H  
Ordering information  
4
Ordering information  
Table 8.  
Order code  
T810H-6G  
Ordering information  
Marking  
Package  
Weight  
Base qty
 
Delivery mode  
T810H 6G  
T810H 6G  
T810H 6T  
D

2

P
A
K  
D

2

P
A
K  
1.5 g  
1.5 g  
2.3 g  
50  
1000  
50  
T
u
be  
T
a
pe and reel  
T
u
be  
T810H-6G-TR  
T810H-6T  
TO-220AB  
5
Revision history  
Table 9.  
Date  
15-May-2009  
Document revision history  
Revision  
Changes  
1
First issue.  
Doc ID 15714 Rev 1  
9/10  

T810H  
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10/10  
Doc ID 15714 Rev 1