STMicroelectronics-T835H-6I
| Part # | STMicroelectronics-T835H-6I |
Download  | STMicroelectronics-T835H-6I |
T835H, T850H
High temperature 8 A Snubberless™ Triacs
Datasheet – production data
Applications
Especially designed to operate in high power
density or universal motor applications such as
vacuum cleaner and washing machine drum
motor, these 8 A Triacs provide a very high
switching capability up to 150 °C junction
temperatures.
A2
A2
The heatsink can be reduced, compared to
traditional Triac, according to the high
performance at given junction temperatures.
G
A2
A1
G
A2
A1
Description
Available in through-hole or surface mount
packages, these Triacs series are suitable for
general purpose mains power ac switching.
TO-220AB
TO-220AB Ins.
A2
By using an internal ceramic pad, they provide
voltage insulation (rated at 2500 V
RMS
).
Table 1: Device summary
G
A2
A1
Symbol
Value
8
Unit
A
D²PAK
I
T(RMS)
V
DRM
/V
RRM
I
GT
600
V
Features
35 or 50
mA
Medium current Triac
150 °C max. T
j
turn-off commutation
Low thermal resistance with clip bonding
Very high 3 quadrant commutation capability
Packages are RoHS (2002/95/EC) compliant
UL certified (ref. file E81734)
March 2017
DocID13564 Rev 3
1/12
This is information on a product in full production.
T835H, T850H
1
Characteristics
Table 2: Absolute ratings (limiting values)
Symbol
Parameter
Value
Unit
D²PAK,
T
C
= 136 °C
RMS on-state current
(full sine wave)
TO-220AB
TO-220AB Ins.
f = 50 Hz
I
T(RMS)
8
A
T
C
= 123 °C
t
p
= 20 ms
Non repetitive surge peak
on-state current
80
84
42
I
TSM
A
f = 60 Hz
t
p
= 16.7 ms
t
p
= 10 ms
(full cycle, T
j
initial = 25 °C)
I²t
I²t value for fusing
A²s
A/µs
Critical rate of rise of on-state
current
f = 50 Hz
dl/dt
T
j
= 150 °C
T
j
= 25 °C
50
I
G
= 2 x I
GT
, tr ≤ 100 ns
V
DSM
V
RSM
/
Non repetitive surge peak off-
state voltage
V
DRM
/V
RRM
+ 100
t
p
= 10 ms
t
p
= 20 µs
V
I
GM
Peak forward gate current
T
j
= 150 °C
T
j
= 150 °C
4
A
P
G(AV)
T
stg
T
j
Average gate power dissipation
1
W
°C
°C
Storage junction temperature range
Operating junction temperature range
-40 to +150
-40 to +150
Table 3: Electrical characteristics (T
j
= 25 °C unless otherwise specified)
Value
Unit
Symbol
Test conditions
Quadrant
T835H T850H
Max.
Max.
Min.
35
50
mA
V
V
D
= 12 V, R
L
= 33 Ω
I – II – III
I – II – III
V
GT
V
GD
1.0
V
D
= V
DRM
, R
L
= 3.3 kΩ
0.15
V
75
60
I
T
= 500 mA
Max.
35
50
mA
I – III
II
I
L
I
G
= 1.2 x I
GT
Max.
mA
110
1500
14
80
V
D
= 2/3 x V
DRM
, gate open
T
j
= 150 °C
T
j
= 150 °C
Min.
Min.
1000
11
V/µs
A/ms
Notes:
(1)
minimum I
GT
is guaranted at 20% of I
GT
max.
(2)
for both polarities of A2 referenced to A1.
2/12
DocID13564 Rev 3
T835H, T850H
Table 4: Static characteristics
Test conditions
Symbol
Value
1.5
0.80
52
Unit
V
Max.
Max.
Max.
Max.
Max.
Max.
Max.
I
TM
= 11 A, t
p
= 380 μs
T
j
= 25 °C
T
j
= 150 °C
T
j
= 150 °C
T
j
= 25 °C
Threshold voltage
Dynamic resistance
V
m
Ω
µA
5
V
DRM
= V
RRM
T
j
= 150 °C
T
j
= 150 °C
T
j
= 150 °C
3.1
2.5
2.0
V
D
/V
R
= 400 V (at peak mains voltage)
V
D
/V
R
= 200 V (at peak mains voltage)
mA
Notes:
(1)
for both polarities of A2 referenced to A1
(2)
t
p
= 380 μs
Table 5: Thermal parameters
Parameter
Symbol
Value
1.85
3.7
Unit
D²PAK, TO-220AB
TO-220AB Ins.
D²PAK
R
th(j-c)
Junction to case (AC)
Junction to ambient (S
cu
= 1 cm
2
)
Junction to ambient
45
°C/W
R
th(j-a)
TO-220AB,
60
TO-220AB Ins.
DocID13564 Rev 3
3/12
T835H, T850H
1.1
Characteristics (curves)
Figure 1: Maximum power dissipation versus
on-state RMS current (full cycle)
Figure 2: On-state RMS current versus case
temperature (full cycle)
I
(A)
P(W)
T(RMS)
10
9
8
7
6
5
4
3
2
1
0
9
8
7
6
5
4
3
2
1
0
TO-220AB/D²
P
A
K
α
=180 °
TO-220AB
Insulated
180°
α
=180 °
I
T(RMS)
(A)
T
C
(°C)
75
0
1
2
3
4
5
6
7
8
0
25
50
100
125
150
Figure 4: Variation of thermal impedance versus
pulse duration
Figure 3: On-state RMS current versus ambient
temperature
Z
(°C/W)
I
(A)
T(RMS)
th
1,0E+00
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
α
=180 °
D²
P
A
K
S
CU
=1 cm²
Epoxy printed circuit board FR4,
copper thickness = 35 µm
Z
th(j-c)
1,0E-01
1,0E-02
1,0E-03
Z
th(j-a)
t
P
(s)
1,0E-02 1,0E-01 1,0E+00
1,0E+01 1,0E+02 1,0E+03
T
am
b
(°C)
0
25
50
75
100
125
150
1,0E-03
Figure 6: Surge peak on-state current versus
number of cycles
Figure 5: On-state characteristics
(maximum values)
I
(A)
TM
100
T
j
= 150 °C
10
T
j
= 25°C
T
j
max. :
V
t0
= 0.80 V
R
d
= 52 m
Ω
V
TM
(V)
2.0 2.5
1
0.0
0.5
1.0
1.5
3.0
3.5
4.0
4.5
4/12
DocID13564 Rev 3
T835H, T850H
Figure 7: Non-repetitive surge peak on-state
Figure 8: Relative variation of I
GT
, I
H
, I
L
versus
junction temperature (typical values)
current for a sinusoidal pulse
Figure 9: Relative variation of critical rate of
decrease of main current (dI/dt)c versus reapplied
(dV/dt)c
Figure 10: Relative variation of critical rate of
decrease of main current versus junction
temperature
(dl/dt)c[(T ] / (dl/dt)c [T
= 150 °C]
(dl/dt)c[(dV/dt)c] / specified (dl/dt)c
2.0
j
j
8
7
6
5
4
3
2
1
0
typical values
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
T
j
(°C)
(dV/dt
)
C
(V/µs)
0.0
0.1
1.0
10.0
100.0
25
50
75
100
125
150
Figure 11: Leakage current versus junction
temperature for different values of blocking
voltage (typical values)
Figure 12: Variation of thermal resistance junction
to ambient versus copper surface under tab
R
th(j-a)
(°C/W)
80
70
60
50
40
30
20
Epoxy printed board FR4, e
= 35 µm
CU
10
S
Cu
(cm²)
0
0
5
10
15
20
25
30
35
40
DocID13564 Rev 3
5/12
T835H, T850H
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
ECOPACK
®
is an ST trademark.
Epoxy meets UL94, V0
Lead-free package leads
Cooling method: by conduction (C)
2.1
D²PAK package information
Figure 13: D²PAK package outline
6/12
DocID13564 Rev 3
T835H, T850H
Table 6: D²PAK package mechanical data
Dimensions
Ref.
Millimeters
Typ.
Min.
4.30
2.49
0.03
0.70
1.25
0.45
1.21
8.95
7.50
1.30
10.00
8.30
6.85
4.88
15
Typ.
Max.
4.60
2.69
0.23
0.93
Min.
Max.
A
A1
A2
B
0.1693
0.0980
0.0012
0.0276
0.0492
0.0177
0.0476
0.3524
0.2953
0.0512
0.3937
0.3268
0.2697
0.1921
0.5906
0.0500
0.0551
0.1811
0.1059
0.0091
0.0366
B2
C
1.40
0.0551
0.60
1.36
9.35
8.00
1.70
10.28
8.70
7.25
5.28
15.85
1.40
1.75
0.0236
0.0535
0.3681
0.3150
0.0669
0.4047
0.3425
0.2854
0.2079
0.6240
0.0551
0.0689
C2
D
D1
D2
E
E1
E2
G
L
L2
L3
R
1.27
1.40
0.0157
0.40
V2
0°
8°
0°
8°
Notes:
(1)
Dimensions in inches are given for reference only
DocID13564 Rev 3
7/12
T835H, T850H
Figure 14: D²PAK recommended footprint (dimensions are in mm)
8/12
DocID13564 Rev 3
T835H, T850H
2.2
TO-220AB (NIns. and Ins.) package information
Figure 15: TO-220AB (NIns. and Ins.) package outline
DocID13564 Rev 3
9/12
T835H, T850H
Table 7: TO-220AB (NIns. and Ins.) package mechanical data
Dimensions
Ref.
Millimeters
Typ.
Typ.
Min.
Max.
Min.
Max.
A
a1
a2
B
15.20
15.90
0.5984
0.6260
3.75
0.1476
13.00
10.00
0.61
1.23
4.40
0.49
2.40
2.40
6.20
3.73
2.65
1.14
1.14
15.80
14.00
10.40
0.88
1.32
4.60
0.70
2.72
2.70
6.60
3.88
2.95
1.70
1.70
16.80
0.5118
0.3937
0.0240
0.0484
0.1732
0.0193
0.0945
0.0945
0.2441
0.1469
0.1043
0.0449
0.0449
0.6220
0.5512
0.4094
0.0346
0.0520
0.1811
0.0276
0.1071
0.1063
0.2598
0.1528
0.1161
0.0669
0.0669
0.6614
b1
b2
C
c1
c2
e
F
I
L
I2
I3
I4
16.40
2.6
0.6457
0.1024
M
Notes:
(1)
Inch dimensions are for reference only.
10/12
DocID13564 Rev 3
T835H, T850H
3
Ordering information
Figure 16: Ordering information scheme
T
8
xx H
– 6
y -TR
Triac series
Current
8 = 8 A
Sensitivity
35 = 35 mA
50 = 50 mA
High temperature
V
o
ltage
6 = 600 V
Package
G = D²PAK
T = TO-220AB
I = TO-220AB Ins
Packing
Blank =
T
u
be (D²PAK, TO-220AB)
-TR =
T
a
pe and reel (D²PAK)
Table 8: Ordering information
Order code
T8xxH-6G
T8xxH-6G-TR
T8xxH-6T
Marking
T8xxH 6G
T8xxH 6G
T8xxH 6T
T8xxH 6I
Package
D²PAK
Weight
1.5 g
1.5 g
2.3 g
2.3 g
Base qty.
50
Delivery mode
Tube
Tape and reel
Tube
D²PAK
1000
50
TO-220AB
TO-220AB Ins.
T8xxH-6I
50
Tube
4
Revision history
Table 9: Document revision history
Date
Revision Changes
17-Apr-2007
19-Sep-2011
1
2
First issue.
Updated:
Features
,
Description
,
Figure 2
,
Table 2
and
4
.
30-Mar-2017
3
DocID13564 Rev 3
11/12
T835H, T850H
IMPORTANT NOTICE
–
PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications
, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST
products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of or
der
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the
design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics
–
All rights reserved
12/12
DocID13564 Rev 3
