STMicroelectronics-TDA7786

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STMicroelectronics-TDA7786
TDA7786  
TDA7786M  
ELITE automotive tuners for AM/FM car-radio  
Datasheet
–
production data  
Description  
The TDA7786x (ELITE) tuner is an optimized high-  
performance AM/FM tuner IC family for car-radio  
applications, suitable also
 
(in combination with an  
external baseband decoder) for HD Radio™  
reception.  
‘!0’03ꢀꢀꢁꢂꢁ  
Its members integrate mixers and IF amplifiers for  
AM, FM and WX, fully integrated VCO and PLL  
synthesizer, IF- processing including adaptive  
bandwidth control, stereo decoder, RDS decoder,  
and digital interfaces for external HD Radio™  
decoding on a single IC.  
LQFP64  
Features  
AM/FM IBOC base band filtering is available in  
parallel to standard analog reception.  
AEC-Q100 qualified  
FM, AM and weather band reception  
Fully integrated VCO for world tuning  
High performance PLL for fast RDS system  
Integrated AM LNA and PIN diodes  
The utilization of digital signal processing results  
in numerous advantages: very low number of  
external components, very small space  
occupation and easy application, very high  
selectivity due to digital filters, high customization  
possibility through software control, automatic  
alignment and a powerful DSP for custom  
processing.  
Automatic self alignment for FM front-end pre-  
selection filter and image rejection  
Integrated IF filters with high selectivity,  
dynamic range and adaptive bandwidth control  
Two versions of the device cover different  
application/performance requirements:  
Drift-free Digital-IF signal processing with high  
performance  
TDA7786:
entry-level, high-performance tuner;  
RDS demodulation with group and block  
TDA7786M:
tuner with enhanced behavior in  
case of FM multipath, thanks to the proprietary  
MuSICA algorithm.  
synchronization  
High performance stereo decoder with noise-  
blanker  
Both versions are HW- and SW-compatible.  
Digital interface for HD Radio™ reception with  
digital audio blending  
Table 1. Device summary  
2
I C
 
bus-controlled  
Order code  
Package  
Packing  
2
I S
 
input/output digital audio interfaces  
TDA7786  
LQFP64  
Tray  
Single 5 V supply  
LQFP64 package  
(10x10x1.4mm)  
TDA7786M  
MuSICA (multipath noise reduction) algorithm  
available for premium version of the device  
October 2016  
DocID026122 Rev 5  
1/54  
This is information on a product in full production.  
 
 
 
 

Contents  
TDA7786, TDA7786M  
Contents  

2.15 I

2

S – serial audio interface
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
19  
2

2.17.2 I

C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
2/54  
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TDA7786, TDA7786M  
Contents  
2

I

C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
DocID026122 Rev 5  
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3

List of tables  
TDA7786, TDA7786M  
List of tables  

Audio I

S configuration overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  

I

S interface timing (receiver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
2

I

S interface timing (transmitter
)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
0  

I

C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
4/54  
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TDA7786, TDA7786M  
List of figures  
List of figures  

I

S interface timing (receiver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
2

I

S interface timing (transmitter
)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
0  
2

I

S interface 16-bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
2

Figure 10.

S interface 32/24/20/16-bi
t
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
1  

Figure 11.

C “write” sequenc
e
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
3  

Figure 12.

C “read” sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
2
2

Figure 18.

C bus timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
DocID026122 Rev 5  
5/54  
5

1
Block diagram and pin description  
1.1  
Block diagram  
Figure 1. Functional block diagram  
“LEND CONTROL  
FROM DECODER  
ꢉ”AND  
TO )”/# DECODER  
)ꢈ1 “ASE  
)”/#  
INTERF ꢄ  
.#/  
!’#  
$!#  
2$3  
“LEND  
&-  
!$#  
!$#  
35-  
$30ꢁ  
!-  
ꢀ 6  
)ꢇ#  
-%-  
$30ꢊ  
&2%&  
ꢀ .  
!’#  
0,,  
32#  
)ꢇ3  
34%2%/  
$!#  
6#/  
0,,  
3UPPLY  
/3#  
ꢂꢃꢄꢅꢆ -(Z
 
!UDIO /UT  
)NꢈOUT $IGITAL  
AUDIO  
‘!0’03ꢀꢃꢄꢅꢆ  

TDA7786, TDA7786M  
Block diagram and pin description  
1.2  
Pin description  
Figure 2. Pin connection (top view)  
ꢃꢅ ꢃꢂ ꢃꢇ ꢃꢊ ꢃꢁ ꢋꢍ ꢋꢆ ꢋꢌ ꢋꢃ ꢋꢋ ꢋꢅ ꢋꢂ ꢋꢇ ꢋꢊ ꢋꢁ ꢅꢍ  
ꢊ
ꢇ
ꢂ
ꢅ
ꢋ
ꢃ
ꢌ
ꢆ
ꢍ
&-0).$26  
&-0).$DEC  
&–)8DEC  
&–)8ꢇIN  
&–)8ꢊIN  
‘.$ꢉ2&  
4#!-  
ꢅꢆ  
ꢅꢌ  
ꢅꢃ  
ꢅꢋ  
ꢅꢅ  
ꢅꢂ  
ꢅꢇ  
ꢅꢊ  
ꢅꢁ  
ꢂꢍ  
ꢂꢆ  
ꢂꢌ  
ꢂꢃ  
ꢂꢋ  
ꢂꢅ  
ꢂꢂ  
4
E
ST  
6$$ #/2% ꢊ6ꢇ  
‘.$ ꢊ6ꢇ  
“,%.$ꢈ!3  
3!)?””?1  
3!)?””?)  
3!)?””?7#,+  
3!)?””?”#,+  
3!)?!5$)/?$)  
3!)?!5$)/?$/  
3!)?!5$)/?7#,+  
3!)?!5$)/?”#,+  
‘.$ ꢂ6ꢂ  
6##ꢉ2&  
#+?3%,  
‘.$ 6#/  
,&REF  
ꢊꢁ  
ꢊꢊ  
ꢊꢇ  
ꢊꢂ  
ꢊꢅ  
,&ꢊ  
6## 6#/  
4#!-ꢇ  
6$$ ꢂ6ꢂ  
0).$DEC  
0).$IN  
3#,  
ꢊꢋ  
ꢊꢃ  
3$!  
ꢊꢌ ꢊꢆ ꢊꢍ ꢇꢁ ꢇꢊ ꢇꢇ ꢇꢂ ꢇꢅ ꢇꢋ ꢇꢃ ꢇꢌ ꢇꢆ ꢇꢍ ꢂꢁ ꢂꢊ ꢂꢇ  
‘!0’03ꢀꢃꢄꢇꢀ  
Table 2. Pin description  
Pin  
Pin name  
I/O  
Function  
Description  
Equivalent circuit  
1
FMPINDRV  
Out  
FM PIN diode driver output  
‘!0’03ꢀꢀꢈꢀꢉ  
Integrated FM PINdiode  
decoupling  
2
FMPINDdec  
In  
FM  
‘!0’03ꢀꢀꢈꢀꢄ  
3
4
FMMIXdec  
FMMIXin2  
–
FM RF signal ground  
FM mixer input 2  
In  
5
6
FMMIXin1  
GNDRF  
In  
–
FM mixer input 1  
RF power ground  
‘!0’03ꢀꢀꢈꢀꢆ  
–
–
DocID026122 Rev 5  
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53  
 

Block diagram and pin description  
TDA7786, TDA7786M  
Equivalent circuit  
Table 2. Pin description (continued)  
Pin  
Pin name  
I/O  
Function  
Description  
7
8
TCAM  
–
–
–
AM AGC time constant  
RF 5 V supply  
ꢌ
ꢊꢅ  
‘!0’03ꢀꢀꢈꢂꢀ  
VCCRF  
In  
–
Master/Slave clock operation  
select  
9
CK_SEL  
In  
–
‘!0’03ꢀꢀꢈꢂꢂ  
10 GNDVCO  
11 LFref  
–
–
VCO ground  
–
–
–
–
Loop filter reference  
Loop filter output  
VCO 5V supply  
12 LF1  
–
13 VCCVCO  
In  
VCO  
14 TCAM2  
–
–
AM AGC 2

nd

order time constant  
ꢌ
ꢊꢅ  
‘!0’03ꢀꢀꢈꢂꢀ  
AM AGC internal PIN diode  
decoupling  
15 PINDdec  
‘!0’03ꢀꢀꢈꢂꢁ  
AM pin diode  
16 PINDin  
17 GNDLNA  
18 LNAin  
–
–
AM AGC internal PIN diode input  
AM LNA ground  
‘!0’03ꢀꢀꢈꢂꢃ  
–
In  
AM LNA input  
‘!0’03ꢀꢀꢈꢂꢈ  
AM LNA  
19 LNAdec  
–
AM LNA decoupling  
‘!0’03ꢀꢀꢈꢂꢅ  
20 LNAout  
21 LNAin2  
Out  
–
AM LNA output  
–
–
AM LNA input 2

nd

stage  
8/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Block diagram and pin description  
Table 2. Pin description (continued)  
Pin  
Pin name  
I/O  
Function  
Description  
Equivalent circuit  
22 LNAout2  
23 LNAdec2  
–
AM LNA output 2

nd

stage  
‘!0’03ꢀꢀꢈꢂꢇ  
AM LNA  
–
AM LNA decoupling 2

nd

stage  
‘!0’03ꢀꢀꢈꢂꢉ  
24 AMMIXin1  
25 AMMIXin2  
In  
In  
AM mixer input 1  
AM mixer input 2  
AM mixer  
inputs  
‘!0’03ꢀꢀꢈꢀꢆ  
Internal inter-IC communication  
bus ground  
26 GNDSLINK  
–
–
27 Vdig  
In  
In  
Front-end digital 5 V supply  
–
–
28 VCCreg1V2  
29 REG1V2  
Internal 1.2 V regulator 5 V supply  
Internal 1.2 V regulator output  
Out  
Supply,  
ground and  
reset  
30 Vreg3v3  
Out  
Internal 3.3 V regulator output  
‘!0’03ꢀꢀꢈꢂꢆ  
Reset (low active)  
31 RSTN  
32 RDSINT  
33 SDA  
In  
Pull-up 50 k
Ω
to 3.3 V IO supply  
‘!0’03ꢀꢀꢈꢂꢄ  
RDS interrupt output  
Out  
–
Pull-down 50 k
Ω
to ground  
I

2

C bus data  
In/Out  
Pull-up 50 k
Ω
to 3.3 V IO supply  
‘!0’03ꢀꢀꢈꢃꢀ  
I

2

C interface  
I

2

C bus clock  
34 SCL  
In  
Pull-up 50 k
Ω
to 3.3 V IO supply  
‘!0’03ꢀꢀꢈꢂꢄ  
35 VDD3V3  
36 GND3V3  
In  
–
–
–
IO ring (3.3 V) supply  
IO ring (3.3 V) supply  
–
–
DocID026122 Rev 5  
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53  

Block diagram and pin description  
TDA7786, TDA7786M  
Equivalent circuit  
Table 2. Pin description (continued)  
Pin  
Pin name  
I/O  
Function  
Description  
SAI clk  
37 SAI_AUDIO_BCLK In/Out  
38 SAI_AUDIO_WCLK
 
In/Out  
Pull-down 50 k
Ω
to ground,  
SINE_3V3_LIN pad  
Audio SAI word-select  
Pull-down 50 k
Ω
to ground,  
SINE_3V3_LIN pad  
Audio SAI data output  
39 SAI_AUDIO_DO  
40 SAI_AUDIO_DO  
41 SAI_BB_BCLK  
42 SA_BB_WCLK  
43 SAI_BB_I  
Out  
In  
Pull-down 50 k
Ω
to ground,  
SINE_3V3_LIN pad  
Audio SAI data-input  
Pull-down 50 k
Ω
to ground,  
SINE_3V3_LIN pad  
SAI Base-Band clock  
HD Radio™  
connectivity/  
Audio output  
I2S interface  
In/Out  
In/Out  
Out  
Pull-down 50 k
Ω
to ground,  
SINE_3V3_LIN pad  
‘!0’03ꢀꢀꢈꢃꢀ  
SAI Base-Band word-select  
Pull-down 50 k
Ω
to ground,  
SINE_3V3_LIN pad  
SAI Base-Band I data  
Pull-down 50 k
Ω
to ground,  
SINE_3V3_LIN pad  
SAI Base-Band Q data  
44 SAI_BB_Q  
Out  
Pull-down 50 k
Ω
to ground,  
SINE_3V3_LIN pad  
HD blend input  
45 BLEND/AS  
In  
Pull-down 50 k
Ω
to ground  
‘!0’03ꢀꢀꢈꢂꢄ  
46 GND1V2  
–
–
–
DSP core ground  
–
47 VDD
 
core 1V2  
In  
DSP core 1.2 V supply  
–
T
e
st Mode  
48
T
e
st  
In  
–
Pull-down 50 k
Ω
to ground  
‘!0’03ꢀꢀꢈꢂꢄ  
49 VDDPLL1V2  
50 VDDIO1V2  
In  
In  
–
–
Digital PLL 1.2 V supply  
–
Internal inter-IC communication  
1.2 V supply  
–
–
Front-end reference frequency and  
regulator 5 V supply  
51 VCC-REF  
In  
–
10/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Block diagram and pin description  
Table 2. Pin description (continued)  
Pin  
Pin name  
I/O  
Function  
Description  
Equivalent circuit  
52 OSCin  
In  
Crystal oscillator input  
–
Oscillator  
53 OSCout  
Out  
–
Crystal oscillator output  
‘!0’03ꢀꢀꢈꢃꢂ  
Front-end reference frequency and  
regulator ground  
54 GND-REF  
55 Vrefdec  
–
–
–
–
3.3 V Bias generation decoupling  
‘!0’03ꢀꢀꢈꢃꢃ  
56 GND-ADC_DAC  
57 DACoutL  
–
IFADC and audio DAC ground  
Audio output left  
–
Out  
DAC  
58 DACoutR  
Out  
Audio output right  
‘!0’03ꢀꢀꢈꢃꢁ  
59 VCC-ADC_DAC  
60 VCC-PLL  
In  
In  
–
IFADC and audio DAC 5 V supply  
Tuning PLL 5 V supply  
–
–
–
61 GND-PLL  
Tuning PLL ground  
PLL  
62 PLLtest  
Out  
PLL
T
e
st output  
‘!0’03ꢀꢀꢈꢃꢈ  
63 TCFM  
–
–
–
FM AGC time constant  
Tuning voltage output  
‘!0’03ꢀꢀꢈꢃꢁ  
64 TVDAC  
Out  
–
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53  

Function description  
TDA7786, TDA7786M  
2
Function description  
2.1  
FM – mixers  
The FM Image Rejection mixer has two single ended inputs, selectable through software.  
They are designed to achieve best performance both in case of a passive tuned  
preselection and of a passive fixed band-pass preselection without tuning for lower cost  
applications.  
The input frequency is down-converted to very low IF with high image rejection.  
The tuned application is supported by an 8-bit tuning DAC. The alignment of the DAC is  
performed automatically on-chip.  
2.2  
FM – AGC  
The programmable RFAGC senses the mixer input to avoid overload.  
When the RFAGC threshold is reached, the PIN diode output is activated in order to  
attenuate the incoming RF signal  
The PIN diode driver is able to drive external PIN diodes with up to 15 mA current.  
The time constant of the FM AGC is defined by the combination of an external capacitor and  
internal currents. There are two programmable attack and decay time constants.  
2.3  
2.4  
AM – LNA  
The integrated AM LNA feature is integrated with low-noise and high IIP2 and IIP3. The gain  
of the LNA is controlled by the AGC. The maximum gain is set with an external resistor,  
typically 26 dB with 470
Ω
.  
AM – AGC  
The programmable AM RFAGC senses the mixer inputs and controls the internal PIN  
diodes and LNA gains.  
Firstly the LNA gain is reduced by about 10 dB, and then the PIN diodes are activated to  
further attenuate the signal.  
nd  
The time constant of the 2
 
order AM AGC LPF is defined by both external components  
and programmable internal currents.  
2.5  
AM – Mixers  
The image rejection mixer has two AM inputs selectable via software. It easily supports low-  
cost applications for extended frequency bands like short-waves.  
The input frequency is converted to low IF with high image rejection.  
12/54  
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TDA7786, TDA7786M  
Function description  
2.6  
IF A/D converters  
A high performance IQ-IFADC converts the IF signal to the digital domain for subsequent  
digital signal processing.  
Two fully differential, continuous-time Sigma-Delta (
Σ∆
) IF-ADCs are used for both the ‘I’  
path and the ‘Q’ path. For each IFADC, two fully differential input nodes are fed with an input  
signal having a bandwidth up to 325 kHz. This fully differential design provides good  
suppression of even-order harmonics. For complex filtering, the input signals of the ‘I’ path  
and the ‘Q’ path have a 90 degree phase shift. The IFADC sampling frequency is 36.48  
MHz.  
2.7  
2.8  
Audio D/A converters  
A CD-quality (>100dB DR) stereo DAC provides the left/right audio signals after IF  
processing and stereo-decoding by the DS
P
.
I
n presence of an external HD Radio™  
decoder the DAC delivers the high quality audio resulting from the decoding of the  
HD Radio™ transmissions.  
VCO  
The VCO is fully integrated without any external tuning component. It covers all the FM  
frequency bands including EU, US, Japan, East-Europe, Weather-Band and the AM bands  
including LW, MW and SW. Its center frequency is approximately 2.7 GHz.  
2.9  
PLL  
2.9.1  
Tuner PLL  
The very high-speed tuning PLL is able to settle within about 100 µs for fast RDS  
applications. The frequency step can be as low as 5 kHz in FM and 500 Hz in AM.  
2.10  
Crystal oscillator  
The device works with a 36.48 MHz fundamental tone crystal. The oscillator block diagram  
is shown in

. On the PCB the crystal must be connected as close as possible to the  
chip oscillator input and output pins of the chip. The internal load capacitance together with  
pin and pad capacitance is optimized for fundamental tone crystal units at 36.48 MHz. It is  
not recommended to put any additional external load capacitors. By suitably configuring pin  
#9 (CK_SEL), the device can be operated as either a clock master or a clock slave. If pin 9  
is left open or tied to GND, the device is configured as clock master (typical operation  
mode). In case the device is configured as clock slave, pin 9 needs to be connected to 5 V.  
Then the crystal oscillator is switched off and the device expects a crystal equivalent signal  
on the OSCout/OSCin pins.  
DocID026122 Rev 5  
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53  
 

Function description  
TDA7786, TDA7786M  
Figure 3. Crystal oscillator block diagram  
!,#  
#LOCK  
BUFFER  
ꢊꢆP  
ꢊꢆP  
2BIAS  
INTERNAL  
8)  
8/  
EXTERNAL  
‘!0’03ꢀꢀꢈꢃꢇ  
2.11  
DSP and digital hardware accelerators  
The TDA7786x embeds two DSP cores for high computational power and achievable  
customization. The DSP cores, in combination with the hardware accelerators, take care of  
all the tuner digital signal processing. The main program is fixed in ROM. Control  
parameters are copied to RAM and are accessible and modifiable there, thus allowing a  
parametric performance optimization. The operations performed by the DSP cores and HW  
accelerators are:  
digital down-conversion of IF  
bandwidth selection with variable controlled bandwidth  
FM and AM noise blanking  
FM/AM demodulation with soft-mute, high-cut, weak signal processing and quality  
detection  
FM stereo decoding with stereo-blend  
RDS demodulation including error correction and block synchronization with generation  
of an RDS interrupt for the main µP  
Autonomous control of RDS-AF tests  
Self-alignment of pre-selection tuning  
14/54  
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TDA7786, TDA7786M  
Function description  
2.12  
Digital high speed IO interface pins  
The IC has several IOs tasked for connectivity to an external HD Radio™ decoder and/or to  
2
I S audio sources and destinations (pins 37 to 44).  
These pins are driven by a special buffer that has been developed to reduce disturbance  
originating from activity on the digital lines. This bidirectional buffer is based on a TTL  
Schmitt trigger receiver and a slew-rate controlled driver with programmable cut-off  
frequency and current capability.  
Typical configurations of these IOs for both analog and digital-HD reception are indicated in  

T

; for the suggested configuration all the slew-rate controlled pads are programmed  
with a 10 MHz cut-off frequency:  
Table 3. Suggested GPIO direction and driving capability  
Driving capability  
Use case:  
Use case:  
Pin  
HD reception  
digital audio out  
10 pF  
5 pF  
37  
38  
39  
40  
41  
42  
43  
44  
IN  
OUT  
X
X
X
X
IN  
OUT  
OUT  
IN  
OUT  
IN  
–
OUT  
OUT  
OUT  
OUT  
X
–
X
–
X
X
–
In case a different GPIO configuration is used, it is recommended to connect the TDA7786x  
to an externally regulated 3.3 V source.  
2.13  
Multipath reduction  
The TDA7786 is equipped with a basic FM multipath noise reduction system in addition to  
the traditional weak signal processing. The algorithm, called DANCE, assures an improved  
performance in presence of in-band interference (such as in case of multipath).  
The premium version of the ELITE family, the TDA7786M is equipped with a superior  
algorithm, called MuSICA, to further enhance the reception quality even in presence of  
strong multipath.  
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Function description  
TDA7786, TDA7786M  
2.14  
HD Radio™ connectivity  
The ELITE complies with HD Radio™ interface specifications as per Ibiquity’s  
‘RX_SSS_1108 HD Radio™ power efficient RF-IF and peripheral processing (power RIPP)  
specification’, thus providing an external HD Radio™ decoder with I/Q base-band signals  
and receiving the decoded digital audio from it, as shown in

.  
Figure 4. HD Radio™ system architecture example  
($ $ECODER  
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The complex baseband signal of an IBOC transmission is sent to the external decoder using  
the dedicated digital output interface SAI_BB. The SAI_BB supports the modes shown in  
both

and

. Timing information for the protocols shown is detailed in

and

.  
16/54  
DocID026122 Rev 5  
 
 

TDA7786, TDA7786M  
Function description  
Figure 5. SAI_BB waveforms (normal mode)  
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ꢍ
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ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ  
30,)4 -ODE  
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ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ  
-58 -ODE  
ꢊꢈ&WS  
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4S  
4H  
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1
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ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ  
!&% -ODE  
‘!0’03ꢀꢀꢈꢃꢆ  
Table 4. SAI_BB timing values (normal mode)  
Rate  
Symbol  
Parameter  
Unit  
Fpll  
PLL clock  
332.8  
650  
345.6  
675  
451.584  
882  
466.944  
912  
245.76  
48  
MHz  
KHz  
Fws  
Fbclk  
Fbclk  
Word strobe  
(332.8/512) (345.6/512)
 
(451.582/512) (466.944/512)) (245.76/5120)  
10.4  
10.8  
14.112  
14.592  
0.768  
Bit clock in  
SPLIT mode  
MHz  
MHz  
(332.8/32)  
(345.6/32)  
(451.584/32)  
(466.944/32)  
(245.76/320)  
20.8  
21.6  
28.224  
29.184  
1.536  
Bit clock in  
MUX mode  
(332.8/16)  
(345.6/16)  
(451.584/16)  
(466.944/16)  
(245.76/160)  
20.8  
21.6  
28.224  
29.184  
1.536  
Bit clock in  
AFE mode  
Fbclk  
Ts  
MHz  
ns  
(332.8/16)  
(345.6/16)  
(451.584/16)  
(466.944/16)  
(245.76/160)  
Data setup  
time (min)  
5
5
5
5
5
5
5
5
5
5
Data hold time  
(min)  
Th  
ns  
DocID026122 Rev 5  
17/54  
53  

Function description  
TDA7786, TDA7786M  
Figure 6. SAI_BB waveforms (burst mode)  
ꢊꢈ&WS  
ꢊꢈ&WS  
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ꢋ
ꢅ
ꢂ
ꢇ
ꢊ
ꢁ
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢍ
ꢆ
ꢌ
ꢃ
ꢋ
ꢅ
ꢂ
ꢇ
ꢊ
ꢁ
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢍ
ꢆ
ꢌ
ꢃ
ꢋ
ꢅ
ꢂ
ꢇ
ꢊ
ꢁ
ꢊꢋ  
1
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1
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1
ꢂ
1
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1
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ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
30,)4 -ODE ꢎ”URSTꢏ  
ꢊꢈ&WS  
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ꢊꢈ&BCK  
4S  
4H  
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ꢊꢋ  
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢆ
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
-58 -ODE ꢎ”URSTꢏ  
ꢊ
ꢈ
&WS  
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ꢊꢈ&BCK  
4S  
4H  
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1
ꢃ
1
ꢋ
1
ꢅ
1
ꢂ
1
ꢇ
1
ꢊ
1
ꢁ
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ꢊꢋ  
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢆ
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
!&% -ODE ꢎ”URSTꢏ  
‘!0’03ꢀꢀꢈꢁꢀ  
Table 5. SAI_BB timing values (burst mode)  
Rate  
Symbol  
Parameter  
Unit  
Fpll  
PLL clock  
332.8  
345.6  
675  
451.584  
882  
466.944  
912  
245.76  
48  
MHz  
650  
Fws  
Fbclk  
Fbclk  
Word strobe  
KHz  
MHz  
MHz  
(332.8/512)  
(345.6/512) (451.582/512) (466.944/512)) (245.76/5120)  
332.8/n  
345.6/n  
451.584/n  
(n=16/32)  
466.944/n  
(n=16/32)  
245.76/n  
Bit clock in  
SPLIT mode  
(n=16/32)  
(n=16/32)  
(n=160/320)  
332.8/n  
345.6/n  
451.584/n  
(n=8/16)  
466.944/n  
(n=8/16)  
245.76/n  
Bit clock in  
MUX mode  
(n=8/16)  
(n=8/16)  
(n=80/160)  
332.8/n  
345.6/n  
451.584/n  
(n=8/16)  
466.944/n  
(n=8/16)  
245.76/n  
Bit clock in  
AFE mode  
Fbclk  
Ts  
MHz  
ns  
(n=8/16)  
(n=8/16)  
(n=80/160)  
Data setup  
time (min)  
5
5
5
5
5
5
5
5
5
5
Data hold  
time (min)  
Th  
ns  
18/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Function description  
2.15  
I

2

S – serial audio interface  
The audio SAI serves as stereo input/output audio bus interface (e.g. to an external audio  
2
processor, or from an external HD decoder) using the I
 
S protocol. The latter calls for a bit  
clock line, a word select line and data lines; the SAI interface on the TDA7786x has one  
input data line and one output data line.  
The audio SAI lines are: SAI_AUDIO_CLK (pin 37, bit clock line), SAI_AUDIO_WCLK (pin  
38, word select (frame) clock line), SAI_AUDIO_DO (pin 39, data output line),  
SAI_AUDIO_DI (pin 40, data input line). In master mode SAI_AUDIO_BCLK and  
SAI_AUDIO_WCLK are outputs, in slave mode these pins are inputs.  
The input and output data lines are operated at the same sampling frequency.  
The bit clock has one pulse for each discrete bit of data on the data lines. The bit clock  
operates at a frequency which is a multiple of the sample rate, and is equal to the sampling  
frequency times the number of bits per word times two.  
2
Table 6. Audio I S configuration overview  
1×2 In  
SAI  
and  
16/32  
16/24  
4
I

2

S  
M/S  
32-48  
32-48  
12.288 MHz  
1×2 Out  
2
Figure 7. I
 
S interface timing (receiver)  
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‘!0’03ꢀꢀꢈꢁꢃ  
Note:  
The polarity of the signals and the data bit-shift direction can be selected by configuration  
bits.  
DocID026122 Rev 5  
19/54  
53  

Function description  
Symbol  
TDA7786, TDA7786M  
Min. Typ. Max. Unit  
2
Table 7. I S interface timing (receiver)  
Parameter Condition  
t

CLK  

t

CLKH  

t

CLKL  

t

WSS  

t

WSH  

t

WSD  

t

DS  

Minimum Clock Cycle (CLK)  
Minimum bit clock high time  
Minimum bit clock low time  
Word-select setup time  
Word-select hold time  
Word-select delay  
–
–
–
50  
25  
25  
5
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
slave mode  
slave mode  
3
master mode  
4
Data setup time  
–
–
5
t

DH  

Data_hold time  
5
2
Figure 8. I S interface timing (transmitter)  
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‘!0’03ꢀꢀꢈꢁꢂ  
Note:  
The polarity of the signals and the data shift direction can be selected by configuration bits.  
2
Table 8. I
 
S interface timing (transmitter)  
Symbol  
Parameter  
Condition  
Min. Typ. Max. Unit  
t

CLK  

Minimum Clock Cycle (CLK)  
–
–
–
50  
25  
25  
5
–
–
–
–
–
–
–
–
–
–
–
–
–
–
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t

CLKH

Minimum bit clock high time  
t

CLKL

Minimum bit clock low time  
t

WSS

Word-select setup time  
t

WSH

Word-select hold time  
t

WSD

Word-select delay  
slave mode  
slave mode  
master mode  
–
5
5
t

DD  

Data delay  
5
The audio SAI can be configured via software to be operating either in master or in slave  
mode. The frame length is selectable as 16/32 bits per word, with 16/24 valid bits.

shows the default setting of SAI for the 16-bit mode. Different settings of clock polarity, word  
2
clock polarity, transmission mode (I
 
S mode) and data direction (either MSB or LSB first  
transmission) are possible, and they can be changed through software. Supported  
configurations are shown in

. Timing information for the protocols is detailed in  
20/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Function description  
2
Figure 9. I
 
S interface 16-bit  
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4S  
4H  
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2
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2
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ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ  
ꢂꢇ8 -ODE ꢎꢊꢃꢉBIT DATAꢏ  
‘!0’03ꢀꢀꢈꢁꢁ  
2
Figure 10. I
 
S interface 32/24/20/16-bit  
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,
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2
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2
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2
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2
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2
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2
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2
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2
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2
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2
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ꢂꢊ ꢂꢁ ꢇꢍ ꢇꢆ ꢇꢌ ꢇꢃ ꢇꢋ ꢇꢅ ꢇꢂ ꢇꢇ ꢇꢊ ꢇꢁ ꢊꢍ ꢊꢆ ꢊꢌ ꢊꢃ ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢂꢊ ꢂꢁ ꢇꢍ ꢇꢆ ꢇꢌ ꢇꢃ ꢇꢋ ꢇꢅ ꢇꢂ ꢇꢇ ꢇꢊ ꢇꢁ ꢊꢍ ꢊꢆ ꢊꢌ ꢊꢃ ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢂꢊ ꢂꢁ ꢇꢍ ꢇꢆ ꢇꢌ  
ꢃꢅ8 -ODE ꢎꢂꢇꢉBIT DATAꢏ  
ꢊꢈ&AWS  
!?73  
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ꢊꢈ&ABCK  
4S  
4H  
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,
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,
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,
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2
2
2
2
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2
2
2
2
2
2
2
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ꢆ
2
ꢌ
2
ꢃ
2
ꢋ
2
ꢅ
2
ꢂ
2
ꢇ
2
ꢊ
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ꢁ
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ꢁ
ꢇꢂ ꢇꢇ ꢇꢊ ꢇꢁ ꢊꢍ ꢊꢆ ꢊꢌ ꢊꢃ ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢇꢂ ꢇꢇ ꢇꢊ ꢇꢁ ꢊꢍ ꢊꢆ ꢊꢌ ꢊꢃ ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢇꢂ ꢇꢇ ꢇꢊ ꢇꢁ ꢊꢍ  
ꢃꢅ8 -ODE ꢎꢇꢅꢉBIT DATAꢏ  
ꢊꢈ&AWS  
!?73  
!?#,+  
!?$!4  
ꢊꢈ&ABCK  
4S  
4H  
,
,
,
,
,
,
,
,
,
,
,
ꢍ
,
ꢆ
,
ꢌ
,
ꢃ
,
ꢋ
,
ꢅ
,
ꢂ
,
ꢇ
,
ꢊ
,
ꢁ
2
2
2
2
2
2
2
2
2
2
2
ꢍ
2
ꢆ
2
ꢌ
2
ꢃ
2
ꢋ
2
ꢅ
2
ꢂ
2
ꢇ
2
ꢊ
2
ꢁ
,
,
,
,
,
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢊꢍ ꢊꢆ ꢊꢌ ꢊꢃ ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢊꢍ ꢊꢆ ꢊꢌ ꢊꢃ ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢊꢍ ꢊꢆ ꢊꢌ ꢊꢃ ꢊꢋ  
ꢃꢅ8 -ODE ꢎꢇꢁꢉBIT DATAꢏ  
ꢊꢈ&AWS  
!?73  
!?#,+  
!?$!4  
ꢊꢈ&ABCK  
4S  
4H  
,
ꢍ
,
,
,
,
,
,
,
ꢆ
,
ꢌ
,
ꢃ
,
ꢋ
,
ꢅ
,
ꢂ
,
ꢇ
,
ꢊ
,
ꢁ
2
2
2
2
2
2
2
ꢍ
2
ꢆ
2
ꢌ
2
ꢃ
2
ꢋ
2
ꢅ
2
ꢂ
2
ꢇ
2
ꢊ
2
ꢁ
,
,
,
,
,
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢁ
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ ꢊꢁ  
ꢊꢋ ꢊꢅ ꢊꢂ ꢊꢇ ꢊꢊ  
ꢃꢅ8 -ODE ꢎꢊꢃꢉBIT DATAꢏ  
‘!0’03ꢀꢀꢈꢁꢈ  
2.16  
Audio sample rate converter  
The TDA7786x is equipped with internal sample rate converters (SRC) that can be  
configured to modify the sampling frequency of outgoing and incoming digital audio both in  
the master and in the slave SAI mode (the native audio sampling frequency of the  
TDA7786x is 45.6 kHz).  
The SRC is able to automatically detect the input and output sampling rates and includes a  
sample clock jitter rejection function which can be enabled separately. The input signal  
word-width is 20 bits, while the output signal word width can be selected as 20 bits or 16  
bits. In order to properly assist in the conversion, the SRC is coupled to self-adjusting low-  
pass filters.  
DocID026122 Rev 5  
21/54  
53  

Function description  
TDA7786, TDA7786M  
2.17  
Serial control interface  
2
The device is controlled via I C.  
Through serial bus the processing parameters can be modified and the signal quality  
parameters and the RDS information can be read out.  
The operation of the device is handled mainly through high level commands sent by the car-  
radio microprocessor through the serial interface, which allows simplification of the  
operations carried out in the microprocessor itself. The high level commands include among  
others:  
change frequency (which allows to avoid computing the PLL divider factors)  
change band;  
start seek (the seek operation can be carried out by the TDA7786x in a completely  
autonomous fashion);  
RDS seek/search (jumps to AF and quality measurements are automatically  
sequenced).  
2.17.1  
Serial interface / boot mode  
The device possesses two different I2C addresses: 0xC2/C3 and 0xC8/C9. The  
configuration is chosen by applying the proper voltage at the exit from reset to the pins  
indicated in

. The configuration is latched (e.g. made effective) when the RSTN line  
transitions from low to high (when RSTN is low, the IC is in reset mode).  
The voltage level forced to the boot pins must be released to start the system operation a  
suitable time after the RSTN line has gone high. The list of configurations is shown in the  
following table:  
Table 9. 64-pin package boot mode configuration  
SAI_AUDIO_DO  
RDS INT  
pin 32  
BUS mode  
pin 39  
0
0
0
1
I

2

C Address = 0xC2  
I

2

C Address = 0xC8  
The status of these pins during the reset phase can be set to:  
High: through external <10 k
Ω
resistors tied to 3.3V  
Low: by not forcing any voltage on them from outside, as 50 k
Ω
internal pull-down  
resistors are present inside the device.  
2
To
m
ake sure the I
 
C address is correctly latched up at start-up, it is advisable to keep the  
RSTN line low until the IC supply pins have reached their steady state, and further keep it  
low for an additional time Treset.  
22/54  
DocID026122 Rev 5  
 

TDA7786, TDA7786M  
2
Function description  
2.17.2  
I C
 
bus protocol  
2
The I
 
C communication requires two signals: clock (SCL) and data (SDA – bidirectional).  
The protocol requires an acknowledge signal after any 8-bit transmission.  
A “write” communication example is shown in the figure below, for an unspecified number of  
data bytes (see the relevant technical documentation for frame structure description):  
2
Figure 11. I
 
C “write” sequence  
ꢄꢄꢄ  
ꢄꢄꢄ  
Aꢁ  
Dꢁ  
3$!  
3#,  
Aꢌ  
Aꢃ  
Dꢌ  
Dꢃ  
ꢄꢄꢄ  
ꢄꢄꢄ  
CLKꢊ  
CLKꢇ  
CLKꢆ  
CLKꢍ  
CLKꢊ  
CLKꢇ  
CLKꢆ  
CLKꢍ  
34!24  
ADDRESS  
!#+  
DATA  
!#+  
34/0  
‘!0’03ꢀꢀꢈꢁꢅ  
The sequence consists of the following phases:  
1. STAR
T
:
 
S
DA line transitioning from H to L with SCL fixed H. This indicates that a new  
transmission is starting;  
2. DATA
 
LATCHING: on the rising SCL edge. The SDA line can vary only when SCL is  
low (otherwise its transitions are interpreted as either a START or a STOP transition);  
3. ACKNOWLEDGE:
 
on the 9th SCL pulse the microprocessor keeps the SDA line H, and  
the TDA7786x pulls it down in case the communication has been successful. Lack of  
the acknowledge pulse generation from the TDA7786x indicates a communication  
failure; the chip-address byte must be sent at the beginning of the transmission. The  
value can be 0xC2 or 0xC8 (according to the mode chosen at start-up) for “write”; as  
many data bytes as needed can follow the address before the communication is  
terminated. See the next section for details on the frame format;  
4. STOP:
 
SDA line transitioning from L to H with SCL H. This signifies the end of the  
transmission.  
Dashed lines represent transmissions from the TDA7786x to the microprocessor. A  
communication example is shown in the figure below, for an unspecified number of data  
bytes (see later on for frame structure description):  
2
Figure 12. I
 
C “read” sequence  
ꢄꢄꢄ  
ꢄꢄꢄ  
Aꢁ  
Dꢁ  
3$!  
3#,  
Aꢌ  
Aꢃ  
Dꢌ  
Dꢃ  
ꢄꢄꢄ  
ꢄꢄꢄ  
CL
K
ꢊ  
CL
K
ꢇ  
CL
K
ꢆ  
CL
K
ꢍ  
CL
K
ꢊ  
CL
K
ꢇ  
CL
K
ꢆ  
CL
K
ꢍ  
34!24  
ADDRESS  
!#+  
DATA  
!#+  
34/0  
‘!0’03ꢀꢀꢈꢁꢇ  
DocID026122 Rev 5  
23/54  
53  

Function description  
TDA7786, TDA7786M  
The “read” sequence is similar to the “write” and it has the same constraints for start, stop,  
data-latching and the following differences:  
the chip address must always be sent by the microprocessor to the TDA7786x; the  
address must be 0xC3 (if C2 had been selected at boot) or 0xC9 (if 0xC8 had been  
selected at boot);  
the header is transmitted after the chip address (the same happens for “write”) before  
data are transferred from the TDA7786x to the microprocessor. See the relevant  
technical documentation for details on the frame format;  
when data are transmitted from the TDA7786x to the µ
P
,
t
he latter keeps the SDA line  
H;  
the acknowledge pulse is generated by the µP for those data bytes that are sent by the  
th  
TDA7786x to the µ
P
.
F
ailure of the µP to generate an ACK pulse on the 9
 
CLK pulse  
has the same effect on the TDA7786x as a STO
P
.  
The maximum clock speed is 500 kbit/s.  
Warning: When
 
the TDA7786x is not powered on, the internal ESD  
2
protection diodes act as a pull-down keeping the I C lines  
2
voltage below 2 V. This implies that the I C bus connected to  
the TDA7786x may not be used to drive other devices when  
the TDA7786x is powered off.  
24/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Function description  
2.18  
Digital-down-converter (DDC)  
The complex digital mixer in the DDC performs mixing of the IF signal to zero I
F
.
T
he  
internal sample rate for FM/AM processing is 456 kS/s and the sample rate for FM/AM IBOC  
is 912 kS/s. AM IBOC require additional filtering implemented in software.  
Figure 13. Digital-down-converter simplified block diagram  
,OW %-)  
“
“
ꢉ
)ꢇ3  
)ꢈ1  
“” 32#  
ꢅ
ꢆ
K3ꢈS  
)
ꢈ
1
ꢍ
ꢊ
ꢇ
K3ꢈ
 
S  
37 $2-  
&)2  
!- )”/#  
&),4%2  
.#/  
)ꢈ1  
-58  
) DESIRED  
)
)
)
)ꢈ1  
DIGITAL  
MIXER  
&),4%2).’  
!.$  
$%#)-!4)/.  
&),4%2).’  
!.$  
$%#)-!4)/.  
1 DESIRED  
) UNDESIRED  
1 UNDESIRED  
&- )”/#  
&),4%2  
“ASEꢉ”AND  
PROCESSING  
!$#  
)2  
1
1
1
ꢂꢃꢄꢅꢆ-3ꢈS  
ꢍꢊꢇK3ꢈS  
ꢅꢋꢃ K3ꢈS  
‘!0’03ꢀꢀꢈꢁꢉ  
Figure 14. Cumulative transfer function at output of IBOC_FM filter  
ꢊꢁ  
ꢁ
ꢉꢊꢁ  
ꢉꢇꢁ  
ꢉꢂꢁ  
ꢉꢅꢁ  
ꢉꢋꢁ  
ꢉꢃꢁ  
ꢉꢌꢁ  
ꢉꢆꢁ  
ꢉꢍꢁ  
ꢉꢊꢁꢁ  
ꢁ
ꢇꢁ  
ꢅꢁ  
ꢃꢁ  
ꢆꢁ  
ꢊꢁꢁ  
ꢊꢇꢁ  
ꢊꢅꢁ  
ꢊꢃꢁ  
ꢊꢆꢁ  
ꢇꢁꢁ  
ꢇꢇꢁ  
ꢇꢅꢁ  
ꢇꢃꢁ  
ꢇꢆꢁ  
ꢂꢁꢁ  
ꢂꢇꢁ  
ꢂꢅꢁ  
ꢂꢃꢁ  
&
R
EQUENCY ꢎK(Zꢏ  
‘!0’03ꢀꢀꢈꢃꢅ  
Table 10. Overall filter characteristics for IBOC_FM filter  
Item  
Value  
Unit  
Pass-band edge  
Stop-band edge  
282  
325  
kHz  
kHz  
dB  
In-band ripple (0 kHz to 282 kHz)  
Anti-alias band range  
<0.002  
[-500 +500]  
100  
kHz  
dB  
Anti-alias Attenuation  
DocID026122 Rev 5  
25/54  
53  
 

Function description  
TDA7786, TDA7786M  
Figure 15. Cumulative transfer function at output of IBOC_AM filter  
ꢃꢀ  
ꢋ
ꢀ
ꢈꢃꢀ  
ꢈꢄꢀ  
ꢈꢆꢀ  
ꢈꢁꢀ  
ꢈꢇꢀ  
ꢈꢅꢀ  
ꢈꢊꢀ  
ꢈꢂꢀ  
ꢈꢉꢀ  
ꢈꢃꢀꢀ  
ꢋ
ꢀ
ꢁ
ꢂ
ꢃꢄ  
ꢃꢅ  
ꢄꢀ  
ꢄꢁ  
ꢄꢂ  
ꢆꢄ  
ꢆꢅ  
ꢁꢀ  
ꢁꢁ  
ꢁꢂ  
ꢇꢄ  
)
U
HTXHQFꢋꢌN+]ꢍ  
*$3*3ꢀꢁꢂꢀꢃ  
Table 11. Overall filter characteristics at output of IBOC_AM filter  
|Item  
Value  
Unit  
Pass-band edge  
Stop-band edge  
In-band ripple  
15  
25  
kHz  
kHz  
dB  
<0.34  
>100  
Anti-alias Attenuation  
dB  
Figure 16. Cumulative digital-down-converter transfer function for FM  
ꢊꢁ  
ꢁ
ꢉꢊꢁ  
ꢉꢇꢁ  
ꢉꢂꢁ  
ꢉꢅꢁ  
ꢉꢋꢁ  
ꢉꢃꢁ  
ꢉꢌꢁ  
ꢉꢆꢁ  
ꢉꢍꢁ  
ꢉꢊꢁꢁ  
ꢁ
ꢇꢁ  
ꢅꢁ  
ꢃꢁ  
ꢆꢁ  
ꢊꢁꢁ  
ꢊꢇꢁ  
ꢊꢅꢁ  
ꢊꢃꢁ  
ꢊꢆꢁ  
ꢇꢁꢁ  
ꢇꢇꢁ  
ꢇꢅꢁ  
&
R
EQUENCY ꢎK(Zꢏ  
‘!0’03ꢀꢀꢈꢁꢄ  
26/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Function description  
Table 12. Overall filter characteristics for FM (not including DISS filter)  
|Item  
Value  
Unit  
Pass-band edge  
45.8  
228  
kHz  
kHz  
dB  
Stop-band edge  
In-band ripple  
<0.003  
>100  
Anti-alias Attenuation  
dB  
Figure 17. Cumulative digital-down-converter transfer function for AM  
ꢊꢁ  
ꢁ
ꢉꢊꢁ  
ꢉꢇꢁ  
ꢉꢂꢁ  
ꢉꢅꢁ  
ꢉꢋꢁ  
ꢉꢃꢁ  
ꢉꢌꢁ  
ꢉꢆꢁ  
ꢉꢍꢁ  
ꢉꢊꢁꢁ  
ꢁ
ꢇꢁ  
ꢅꢁ  
ꢃꢁ  
ꢆꢁ  
ꢊꢁꢁ  
ꢊꢇꢁ  
ꢊꢅꢁ  
ꢊꢃꢁ  
ꢊꢆꢁ  
ꢇꢁꢁ  
&
R
EQUENCY ꢎK(Zꢏ  
‘!0’03ꢀꢀꢈꢁꢆ  
Table 13. Overall filter characteristics for AM  
|Item  
Value  
Unit  
Pass-band edge  
Stop-band edge  
In-band ripple  
20  
300  
kHz  
kHz  
dB  
<0.051  
>100  
Anti-alias Attenuation  
dB  
DocID026122 Rev 5  
27/54  
53  

Electrical specifications  
TDA7786, TDA7786M  
3
Electrical specifications  
3.1  
Absolute maximum ratings  
Table 14. Absolute maximum ratings  
Test condition  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
V

CC  

T

stg  

Abs. supply voltage  
Storage temperature  
–
–
-0.5  
-55  
–
5.5  
V
–
150  
°C  
Human Body model  
>|±2000|  
>|±400|  
>|±750|  
ESD absolute minimum  
withstand voltage  
V

ESD  

Charged device model  
V
Charged device mode, corner pins  
Max. input at any pin  
(latch-up characteristic)  
–
I

INMAX  

±100  
mA  
Note:  
For all pins 37-44, when set as input, injecting current cannot exceed 20 mA as it would lead  
to voltage at the pin above the abs max.  
3.2  
Thermal data  
Table 15. Thermal data  
Symbol  
R

th  

Parameter  
Test condition  
Value  
Units  
LQFP64 10×10,
JEDEC  
2s1p
PCB  
Thermal resistance  
55  
°C/W  
3.3  
General key parameters  
Table 16. General key parameters  
Test condition  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
V

CC  

I

CC  

5 V supply voltage  
4.7  
–
5
175  
–
5.2  
225  
85  
V
see note

(1)  

supply current @ 5 V  
Ambient temperature range  
mA  
°C  
T

amb  

–
-40  
Operating junction  
temperature  
T

j  

–
–
–
–
150  
5.2  
1.3  
°C  
V
V

VCCREG12

VCCREG12 supply voltage  
see note

(2)  

2.3  
1.14  
when supplied externally  
see note

(3)  

Digital core 1.2 V supply  
voltage  
V

1V2  

1.2  
V
V

1V2

= 1.2V  
see note

(3)  

Digital core 1.2 V supply  
current  
I

1V2  

–
55  
–
80  
mA  
V
when supplied externally  
see note

(4)  

V

3V3  

Digital IO 3.3 V supply voltage  
3.0  
3.6  
28/54  
DocID026122 Rev 5  
 

TDA7786, TDA7786M  
Electrical specifications  
Table 16. General key parameters (continued)  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
Maximum current specified  
Digital IO 3.3 V supply current
 
only in case generated from  
Internal supply only  
I

3V3  

–
–
10  
mA  
1. FM
 
functional test from antenna mixer input to audio output.  
2. In
 
the typical application supplied from 5 V with a 27
Ω
series resistor.  
T
e
st condition: maximum current load for minimum value, unloaded for maximum value.  
3. When
 
the 1.2 V supply is applied externally, and not using the internal 1.2 V regulator.  
T
e
st condition: FM functional test from antenna mixer input to audio output.  
4. When
 
the 3.3 V supply is applied externally, and not using the internal 3.3 V regulator.  
3.4  
Electrical characteristics  
V
= 4.7 V to 5.25 V; T  
= -40 °C to +85 °C; unless otherwise specified.  
CC  
amb  
3.4.1  
FM – section  
Table 17. FM – section  
Test condition  
Symbol  
FM IMR Mixer  
Parameter  
Min  
Typ  
Max Units  
RF gain 0  
33  
36  
37  
39  
–
35  
38  
37  
RF gain 1

(1)  

40  
dB  
41  
Voltage gain (mix in -> s.e. test  
output)  
RF Gain  
RF gain 2  
39  
RF gain 3  
41  
43  
Rsource=1.25 k
Ω
, noiseless  
Rsource=0  
2.3  
2.1  
1.9  
1.6  
2.9  
Vnoise low  
gain  
Input noise voltage (RF gain 0)  
Input noise voltage (RF gain 3)  
nV/
Hz  
2.6  
–
Rsource=1.25 k
Ω
, noiseless  
Rsource=0  
–
2.4  
Vnoise high  
gain  
nV/
Hz  
2.0  
–
RF gain 0, up to Vin/tone = 92 dBµV
 
124  
RF gain 3, up to Vin/tone = 86 dBµV
 
119  
127  
122  
IIP3  
3

rd

order intercept point  
–
dBµV  
dBµV  
FM AGC  
min setting, reg8<14> =1  
85.4  
89  
88.4  
92  
91.4  
95  
RFAGC threshold, referred to  
mixer input;  
max setting, reg8<14>=1  
min setting, reg8<14>=0  
88.4  
92  
91.4  
95  
94.4  
98  
RF level  
RFAGC-Thr  
max setting, reg8<14>=0  
Threshold steps  
–
1.3  
-1.5  
–
1.8  
–
2.3  
1.5  
–
dB  
dB  
Threshold error  
@ T

amb  

–
Threshold temperature drift  
0.016  
dB/K  
DocID026122 Rev 5  
29/54  
53  

Electrical specifications  
TDA7786, TDA7786M  
Table 17. FM – section (continued)  
Test condition  
Symbol  
Parameter  
IFAGC threshold  
Min  
Typ  
Max Units  
min setting  
max setting  
–
120  
126  
1.5  
-1.5  
–
122  
124  
130  
2.5  
1.5  
–
dBµV  
dBµV  
dB  
128  
IFAGC-Thr Threshold
 
steps  
Threshold error  
2
@ T

amb  

–
0.016  
20  
200  
2
dB  
Threshold temperature drift  
–
dB/K  
Slow attack  
Fast attack  
Slow decay  
Fast decay  
10  
100  
1
30  
300  
5
I attack  
Time  
constant  
µA  
I decay  
10  
-15  
3
20  
–
30  
–
(2)  
–
–
PIN diode source current  
@ T

amb  

mA  
µA  
PIN diode sink current  
–
–
20  
PIN diode source current in  
constant current mode  
–
@ T

amb  

-0.9  
–
–
mA  
1. The
 
gain is internally 6 dB higher than what measured at the test output. This is due to the differential to single-ended  
conversion used for the test output.  
2. The
 
current is generated by a PTAT (proportional to absolute temperature) source, and has therefore a temperature  
dependency described by:
∆
I/Io =
∆
T/
T
o
, with Io being the current at ambient temperature (25 °C) and
T
o
t
he ambient  
temperature (25 °C) expressed in Kelvin, that is 298K.  
3.4.2  
AM – section  
Table 18. AM – section  
Test condition  
Symbol  
AM IMR Mixer  
Parameter  
Min  
Typ  
Max  
Units  
normal  
reduced  
–
20  
17  
20  
22  
19  
30  
24  
21  
45  
Voltage gain (mix in -> s.e.  
test output)

(1)  

Gain  
dB  
Rin  
Input resistance  
k
  
Mix 1, 2  
Vnoise  
Input noise voltage  
–
7.5  
9
–
nV/
Hz  
R

source

= 1 k
Ω
, noise-less  
Mix1, 2  
IIP3  
IIP2  
3

rd

order intercept point  

nd

order intercept point  
128  
132  
dBµV  
up to Vin/tone = 90 dBµV  
Mix1, 2  
2
152  
80  
158  
–
–
–
dBµV  
dB  
up to Vin/tone = 90 dBµV  
LO hsupp
 
LO harmonic suppression  
–
AM LNA  
Max gain, R

ext

= 470
Ω  
24  
8
28  
12  
32  
16  
Gain  
Voltage gain  
dB  
Min gain (AGC controlled)  
R

in  

C

in  

Input resistance  
–
–
600  
–
950  
20  
1300  
–
k
Ω  
input capacitance  
pF  
30/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Electrical specifications  
Table 18. AM – section (continued)  
Test condition  
Symbol  
Parameter  
Input noise voltage  

rd

order intercept point  
2

rd

order intercept point  
Min  
Typ  
Max  
Units  
V

noise  

IIP3  
–
–
0.7  
120  
127  
1.0  
nV/
Hz  
dBµV  
3
@ maximum LNA gain  
@ maximum LNA gain  
116  
121  
–
–
IIP2  
dBµV  
AM PIN diode  
Full attenuation,  
Csource = 80 p
F
, f = 1
M
Hz  
IIP2  
2

rd

order intercept point  
134  
140  
–
dBµV  
Res  
Cin  
Minimum resistance  
Input capacitance  
–
–
–
5
2
15  
–
Ω
High ohmic  
pF  
AM AGC  
Mix 1,2 min setting  
80  
92.6  
1.3  
-2.5  
-3  
83  
95.6  
1.8  
–
86  
98.6  
2.3  
2.5  
3
Referred to mixer input;  
RF level  
AGC-Thr  
dBµV  
Mix 1,2 max setting  
Thr-steps Threshold
 
steps  
–
dB  
dB  
dB  
mA  
µA  
–
–
–
–
Threshold error  
@
T

amb  

Threshold temperature drift  
PIN diode source current  
PIN diode sink current  
–
–
@ T

amb

See note

(2)  

-10  
15  
–
–
–
30  
45  
PIN diode source current in  
constant current mode  
–
@
T

amb

See note

-1  
–
–
mA  
1. The
 
gain is internally 6 dB higher than what measured at the test output. This is due to the differential to single-ended  
conversion used for the test output.  
2. The
 
current is generated by a PTAT (proportional to absolute temperature) source, and has therefore a temperature  
dependency described by:
∆
I/Io =
∆
T/
T
o
, with Io being the current at ambient temperature (25 °C) and
T
o
t
he ambient  
temperature (25 °C) expressed in Kelvin, that is 298K.  
3.4.3  
VCO  
Table 19. VCO  
Test condition  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
Minimum VCO oscillation  
frequency

(1)  

fvco,

min  

fvco,

max  

–
–
–
2.34  
GHz  
Maximum VCO oscillation  
frequency

(2)  

3.025  
–
–
–
GHz  
dBc/Hz  
Hz  
Locked VCO;  
values referred @ 100MHz  
@ 100 Hz  
@ 1 kHz  
@ 10 kHz  
PN  
Phase noise of LO  
–
–
-105  
-115  
-115  
FM reception, deemphasis  
50 µs, f

audio

=20 Hz…20 kHz  
dev  
deviation error (RMS)  
5
8
1. Limited
 
by application Firmware to 2.1 GHz.  
2. Limited
 
by application Firmware to 3.1 GHz.  
DocID026122 Rev 5  
31/54  
53  
 

Electrical specifications  
TDA7786, TDA7786M  
3.4.4  
Phase locked loop  
Table 20. Phase locked loop  
Test condition  
Symbol  
Parameter  
Settling time FM  
Min  
Typ  
Max  
Units  
T

settle  

∆
f < 10 kHz  
–
–
–
100  
5
140  
µs  
kHz  
Hz  
FM step  
AM step  
FM Frequency step  
AM frequency step  
–
–
–
–
500  
3.4.5  
Tuning DAC  
Table 21. Tuning DAC  
Test condition  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
R

es  

V

outmin  

V

outmax  

R

out  

Resolution  
8 bit  
14  
–
18  
22  
0.75  
–
mV  
V
Min output voltage  
Max output voltage  
Output impedance  
Diff. Nonlinearity  
Conversion time  
–
0.6  
–
VCC-0.25 VCC-0.15  
V
–
1.5  
2.5  
–
3.5  
0.5  
–
k
Ω  
LSB  
µs  
DNL  
–
–
–
T

conv  

Without capacitive load  
20  
3.4.6  
IF ADC  
Table 22. IF ADC  
Test condition  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
DR

FM  

Dynamic range in FM  
BW = ±100 kHz  
87  
1.7  
105  
6.3  
82  
90  
–
dB  
Input noise referred to mixer  
input  
vnoise

FM  

DR

AM  

RF gain 2  
0.94  
108  
3.2  
85  
–
–
–
–
–
–
–
nV/
Hz  
dB  
Dynamic range in AM  
BW = ±3 kHz  
normal gain  
BW = ±200 kHz  
RF gain 2  
Input noise referred to mixer  
input  
vnoise

AM  

DR

FM-HD  

Vnoise

FM-HD  

DR

AM-HD  

vnoise

AM-HD  

nV/
Hz  
dB  
Dynamic range in FM-IBOC  
Input noise referred to mixer  
input  
2.3  
97  
1.2  
100  
2.9  
nV/
Hz  
dB  
Dynamic range in AM-IBOC  
BW = ±15 kHz  
normal gain  
Input noise referred to mixer  
input  
5.6  
nV/
Hz  
32/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Electrical specifications  
3.4.7  
Audio DAC  
Table 23. Audio DAC  
Test condition  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
V

out  

BW  
Max. output voltage  
Pass-band  
Full scale  
1.2  
1.4  
20  
–
–
Vrms  
KHz  
Ω
0.01dB attenuation  
–
Rout  
Output resistance  
–
100  
150  
14  
200  
30  
multipath Output
 
noise  
–
–
–
µVrms  
%
D
Distortion  
-6 dBFS  
0.03  
0.05  
3.4.8  
IO interface pins  
Table 24. IO interface pins  
Test condition  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
–
–
–
–
–
High level output voltage  
Low level output voltage  
Input voltage range  
Unloaded  
2.9  
–
3.2  
–
V
V
V
V
V
Unloaded  
0.1  
0.3  
3.5  
–
–
–
–
0
–
–
–
High level input voltage  
Low level input voltage  
2.0  
–
0.8  
Minimum time during which  
pin RSTN must be low so as  
to reset the device  
T

reset  

Reset time  
10  
–
–
–
µs  
Minimum time during which  
the voltage applied at pins 32  
Boot mode configuration latch
 
and 39 must be driven in  
T

latch  

10  
–
µs  
time  
order to latch the correct  
control serial bus address  
configuration  
DocID026122 Rev 5  
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Electrical specifications  
2
TDA7786, TDA7786M  
3.4.9  
I C
 
interface  
2
The I
 
C protocol serial bus communication parameters of the following table are defined as  
in

.  
2
Table 25. I C interface  
Symbol  
f

SCL  

t

AA  

Parameter  
Test condition  
Min  
Typ  
Max  
Units  
SCL Clock frequency  
–
–
–
–
–
500  
–
kHz  
µs  
SCL low to SDA data valid  
0.3  
Time the bus must be kept  
free before a new  
transmission  
t

buf  

–
1.3  
–
–
µs  
t

HD-STA  

t

LOW  

START condition hold time  
Clock low period  
–
–
–
–
–
–
–
–
–
–
0.6  
1.3  
0.6  
0.1  
0
–
–
–
–
–
–
–
–
–
–
–
–
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
t

HIGH  

t

SU-SDA  

t

HD-DAT  

t

SU-DAT  

t

R  

Clock high period  
–
START condition setup time  
Data input hold time  
Data input setup time  
SDA & SCL rise time  
SDA & SCL full time  
Stop condition setup time  
Data out time  
–
0.9  
–
0.1  
–
0.3  
0.3  
–
t

F  

–
t

SU-STOP  

t

DH  

0.6  
–
0.3  
2
Figure 18. I
 
C bus timing diagram  
T
T
T
T
2
()'(  
2
,/7  
3#,  
T
T
35ꢉ3
4
!  
($ꢉ$
!
4  
T
35″4/0  
T
3$ꢉ$
!
4  
T
($ꢉ3
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3$! ).  
T
T
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!!  
$(  
TXT  
3$! /54  
$ꢆꢅ!5ꢁꢉꢄ  
‘!0’03ꢀꢀꢈꢈꢀ  
34/54  
DocID026122 Rev 5  
 

TDA7786, TDA7786M  
Electrical specifications  
3.5  
Overall system performance  
3.5.1  
FM overall system performance  
Antenna level equivalence: 0 dBµV = 1 µVrms (Antenna terminal voltage with 75
Ω
dummy  
load).  
Figure 19. FM input set-up  
ꢋꢁ
:
 
ꢋꢁ
:  
ꢆꢇꢁꢁ P&  
0#”  
5.$%2  
4%34  
ꢋꢁ
:  
6
R
F  
‘!0’03ꢀꢀꢈꢈꢂ  
Input level referred to 75
Ω
antenna dummy output. F
 
= 98.1 MHz, V
 
= 60 dBµV, mono  
rf  
rf  
modulation, f  
= 40 kHz, f  
=1 kHz audio. De-emphasis = 50 µs. Wide-band, not-tuned  
dev  
audio  
pre-selection application, unless otherwise specified.  
Table 26. FM overall system performance  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
(can be modified by the user)  
Tuning range FM Eu  
Tuning step FM Eu  
Tuning range FM US  
Tuning step FM US  
Tuning range FM Jp  
Tuning step FM Jp  
Tuning range FM EEu  
87.5  
–
100  
–
108  
MHz  
kHz  
(automatic FE alignment  
available)  
(can be modified by the user)  
–
87.5  
–
–
107.9  
–
(can be modified by the user)  
MHz  
kHz  
(automatic FE alignment  
available)  
(can be modified by the user)  
(can be modified by the user)  
200  
–
76  
–
90  
–
MHz  
kHz  
(automatic FE alignment  
available)  
(can be modified by the user)  
100  
–
(can be modified by the user)  
65  
74  
MHz  
(automatic FE alignment not  
available)  
Tuning step FM EEu  
Sensitivity  
(can be modified by the user)  
S/N = 26 dB  
–
–
100  
-6  
–
kHz  
-3  
dBµV  
@ 10 dBµV, no high-cut,  
DISS BW = #4  
S/N  
49  
77  
82  
67  
52  
80  
85  
70  
–
–
–
–
dB  
dB  
dB  
dB  
@ 60 dBµV, mono  
@ 60 dBµ
V
,  
Deviation = 75 kHz, mono  
Ultimate S/N  
@ 60 dBµV, stereo  
DocID026122 Rev 5  
35/54  
53  

Electrical specifications  
TDA7786, TDA7786M  
Table 26. FM overall system performance (continued)  
Parameter  
Test condition  
Deviation= 75 kHz  
Min  
Typ  
Max  
Units  
Distortion  
–
0.05  
166  
0.1  
–
%
Max deviation  
THD=3%  
150  
kHz  
∆
F =100 kHz, SINAD=30 dB  
Desired 40 dBµ
V
,  
dev = 40 kHz, 400 Hz  
undesired Dev=40 kHz,  
1 kHz  
Adjacent channel Selectivity  
(D/U ratio)  
20  
30  
–
dB  
∆
F = 200 kHz, SINAD=30 dB  
Desired 40 dBµ
V
,  
dev = 40 kHz, 400 Hz  
undesired Dev=40 kHz,  
1 kHz  
Alternate Channel Selectivity  
(D/U ratio)  
52  
75  
62  
80  
–
–
dB  
dB  
Desired = 40 dBµV  
SINAD = 30 dB  
Max. Strong Signal Interferer  
(D/U ratio)  
Undesired
F = 1MHz  
Desired = 40 dBµV, dev =  
40 kHz, 400 Hz,  
SINAD = 30 dB  
Undesired1 = ± 400 kHz,  
dev = 40 kHz, 1 kHz  
101  
105  
106  
110  
–
–
dBµV  
dBµV  
Undesired2 = ± 800 kHz, no  
mod  
3 signal performance  
(“wide-band”) application  
Desired = 40 dBµV,  
dev = 40 kHz, 400 Hz,  
SINAD = 30 dB  
Undesired1 = ±1 MHz,  
dev = 40 kHz, 1 kHz  
Undesired2 =±2MHz, no mod  
AM suppression  
m= 30 %  
60  
70  
–
dB  
–
-0.41  
-0.35  
(equiva  
lent to  
37  
(equiv  
alent  
to 43  
@40 dBµV  
Logarithmic field strength  
indicator  
-0.38  
read “FM_Smeter_log”  
dBµV)  
dBµV)  
36/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Electrical specifications  
3.5.2  
AM MW overall system performance  
Antenna level equivalence: 0 dBµV = 1 µVrms  
Figure 20. AM MW input set-up  
ꢂꢁ
:
 
ꢊꢋ P&  
ꢋꢁ
:  
0#”  
5.$%2  
4%34  
ꢃꢋ P&  
6
R
F  
‘!0’03ꢀꢀꢈꢈꢃ  
Level referred to SG EMF output before antenna dummy; dummy antenna load as shown  
above F
 
= 999 kHz (1000 kHz for US), V
 
=74 dBµV, mod = 30 %, f  
=400 Hz, unless  
rf  
rf  
audio  
otherwise specified.  
Table 27. AM MW overall system performance  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
Tuning range MW Eu/Jp  
Tuning step MW Eu/Jp  
Tuning range MW US  
Tuning step MW US  
Sensitivity  
(can be modified by the user)  
(can be modified by the user)  
(can be modified by the user)  
(can be modified by the user)  
S/N = 20 dB  
531  
–
1629  
kHz  
kHz  
kHz  
kHz  
dBµV  
dB  
–
530  
–
9
–
–
1710  
10  
25  
72  
–
28  
–
–
Ultimate S/N  
@ 80 dBµV  
67  
Ref.=74 dBµV  
(1)  
AGC
F
.
O.M.  
64  
0.1  
47  
–
0.2  
–
dB  
%
-10dB drop point  
Distortion  
M=80%  
–
∆
F = 9 kHz, SINAD = 26 dB  
undesired M = 30 % 1 kHz  
Adjacent channel selectivity  
44  
dB  
∆
F = 18 kHz, SINAD = 26 dB  
undesired M = 30 % 1 kHz  
Alternate channel selectivity  
48  
8
51  
12  
–
–
dB  
dB  
∆
F = ±40 kHz  
Strong signal interferer (1)  
SNR  
desired = 40 dBµV  
undesired = 110 dBµV,  
m = 30 % 1 kHz  
∆
F = ±40 kHz  
Strong signal interferer (1)  
suppression  
desired = 40 dBµV  
–
–
10  
15  
dB  
dB  
undesired = 110 dBµV,  
m = 30 % 1 kHz  
∆
F = ±40 kHz  
desired = 80 dBµV  
Strong signal interferer (1)  
cross-modulation  
undesired = 110 dBµV,  
m = 30 % 1 kHz  
1
4
maximum SNR of undesired  
channel  
DocID026122 Rev 5  
37/54  
53  

Electrical specifications  
TDA7786, TDA7786M  
Table 27. AM MW overall system performance (continued)  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
∆
F = ±400 kHz  
Strong signal interferer (2)  
SNR  
desired = 40 dBµV  
5
11  
–
dB  
undesired = 110 dBµV,  
m = 30 %, 1 kHz  
∆
F = ±400 kHz  
Strong signal interferer (2)  
suppression  
desired = 40 dBµV  
–
–
15  
18  
dB  
dB  
undesired = 110 dBµV,  
m = 30 %, 1 kHz  
∆
F = ±400 kHz  
desired = 80 dBµV  
Strong signal interferer (2)  
cross-modulation  
undesired = 110 dBµV,  
m = 30 %, 1 kHz  
1
4
maximum SNR of undesired  
channel  
Desired = 40 dBµV  
SINAD = 26dB, blocking<6dB  
Max. strong signal interferer  
Image rejection  
90  
98  
80  
–
dB
µV  
Undesired
∆
F = 400 kHz,  
m = 30 % (crossmod.
T
e
st)  
–
60  
–
dB  
-0.47  
-0.41  
(equiva  
lent to  
57  
(equiv  
alent  
to 63  
Logarithmic field strength  
indicator  
@60 dBµV read  
“AM_SMeter_log”  
-0.44  
–
dBµV  
dBµV)  
1. Programmable
 
by software parameters.  
38/54  
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TDA7786, TDA7786M  
Electrical specifications  
3.5.3  
AM LW overall system performance  
Antenna level equivalence: 0 dBµV = 1 µVrms  
Figure 21. AM LW input set-up  
ꢂꢁ
:  
ꢊꢋ P&  
ꢋꢁ
:  
0#”  
5.$%2  
4%34  
ꢃꢋ P&  
6
R
F  
‘!0’03ꢀꢀꢈꢈꢁ  
Level referred to SG EMF output before antenna dummy; dummy antenna load as shown  
above F
 
=216 kHz, V
 
=74 dBµV, mod = 30 %, f
 
= 400 Hz, unless otherwise specified.  
rf  
rf  
audio  
Table 28. AM LW overall system performance  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
Tuning range LW  
Tuning step LW  
Sensitivity  
(can be modified by the user)  
(can be modified by the user)  
S/N = 20 dB  
144  
–
288  
kHz  
kHz  
dBµV  
dB  
–
–
1
–
34  
–
30  
70  
Ultimate S/N  
@ 80 dBµV  
63  
Ref. = 74 dBµV  
-10dB drop point  
(1)  
AGC
F
.
O.M.  
64  
–
dB  
Distortion  
M= 80 %  
–
–
0.1  
80  
0.2  
–
%
Image rejection  
60  
dB  
1. Programmable
 
by software parameters.  
3.5.4  
AM SW overall system performance  
Antenna level equivalence: 0 dBµV = 1 µVrms  
Figure 22. AM SW input set-up  
ꢂꢁ
:  
ꢊꢋ P&  
ꢋꢁ
:  
0#”  
5.$%2  
4%34  
ꢃꢋ P&  
6
R
F  
‘!0’03ꢀꢀꢈꢈꢈ  
Level referred to SG EMF output before antenna dummy; dummy antenna load as shown  
above; F
 
= 6000 kHz, V
 
=74 dBµV, mod = 30 %, f
 
= 400 Hz, unless otherwise  
rf  
rf  
audio  
specified.  
DocID026122 Rev 5  
39/54  
53  

Electrical specifications  
TDA7786, TDA7786M  
Table 29. AM SW overall system performance  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
Tuning range SW  
Tuning step SW  
Sensitivity  
(can be modified by the user)
 
2300  
–
30000  
kHz  
kHz  
dBµV  
dB  
(can be modified by the user)  
S/N = 20 dB  
–
–
1
–
32  
–
26  
70  
Ultimate S/N  
@ 80 dBµV  
63  
Ref.=74 dBµV  
(1)  
AGC
F
.
O.M.  
58  
–
dB  
-10 dB drop point  
Distortion  
M = 80%  
–
–
0.1  
80  
0.2  
–
%
Image rejection  
60  
dB  
1. Programmable
 
by software parameters.  
3.5.5  
WX overall system performance  
Antenna level equivalence: 0 dBµV = 1 µVrms (Antenna terminal voltage with 75
dummy  
load).  
Figure 23. WX input set-up  
ꢋꢁ
:
 
ꢋꢁ
:  
ꢆꢇꢁꢁ P&  
0#”  
5.$%2  
4%34  
ꢋꢁ
:  
6
R
F  
‘!0’03ꢀꢀꢈꢈꢅ  
Input level referred to 75
dummy antenna output; antenna dummy as shown above.  
F =
 
162.475 MHz, V
 
= 60 dBµV, mono modulation, f
 
= 3 kHz, f
 
= 400 Hz audio.  
rf  
rf  
dev  
audio  
De-emphasis = 75 µs. Application WX using mixer input 2.Unless otherwise specified.  
Table 30. WX overall system performance  
Parameter  
Sensitivity  
Test condition  
S/N = 26 dB  
Min  
Typ  
Max  
Units  
–
70  
–
-6  
81  
0.8  
–
-3  
–
dBµV  
dB  
Ultimate S/N  
Distortion  
@ 60 dBµV  
Deviation= 4.5 kHz  
THD = 3%  
1
–
%
Max deviation  
5
kHz  
∆
F = 25 kHz, SINAD = 30dB  
desired 40 dBµV,  
dev = 2.0 kHz, 400 Hz  
undesired Dev = 2.0 kHz,  
1 kHz  
Adjacent channel Selectivity  
Alternate Channel Selectivity  
60  
60  
70  
70  
–
–
dB  
dB  
∆
F = 50 kHz, SINAD = 30dB  
desired 40 dBµV,  
dev = 2.0 kHz, 400 Hz  
undesired Dev = 2.0 kHz,  
1 kHz  
40/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Front-end registers  
4
Front-end registers  
All the parameters in this section refer to the programmability of the FE part of the device  
(registers). The part of the registers that are not described here have either fixed values or  
values written by the tuner drivers, and are described in the proper technical documentation.  
Table 31. Register 0x00  
Register number  
Register definition  
MSB  
LSB  
23 22 21 20 19 18 17 16 15 14 13 12 11 10
 
9  
8
7
6
5
4
3
2
1
0
AM mixer input selector  
0
1
1 Input
 
#1  
0 Input
 
#2  
AM PIN diode  
0
1
Internal  
External  
AM AGC mode  
0
1
LNA and PIN diode  
PIN diode only  
AM AGC time constant  
Slow (125 ms with 1 µF)  
Medium (25ms with 1 µF)  
Fast (5ms with 1 µF)  
AM AGC thresholds @ mixin  
90.2 dBµV @ mixin  
92.0 dBµV @ mixin  
93.8 dBµV @ mixin  
95.6 dBµV @ mixin  
88.4 dBµV @ mixin  
86.6 dBµV @ mixin  
84.8 dBµV @ mixin  
83 dBµV @ mixin  
AM AGC attack time constant  
Normal  
0
0
1
0
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
Fast  
DocID026122 Rev 5  
41/54  
53  

Front-end registers  
TDA7786, TDA7786M  
Register definition  
Table 32. Register 0x01  
Register number  
MSB  
23 22 21 20 19 18 17 16 15 14 13 12 11 10
 
9  
LSB  
8
7
6
5
4
3
2
1 0  
FM mixer RF-gain  
35 dB  
0
0
1
1
0
1
0
1
38 dB  
39 dB  
41 dB  
FM mixer input  
Input #1 (single-ended)  
Input #2 (single-ended)  
Input #1/2 (differential)  
FM AGC output mode  
Normal  
0
1
1
1
0
1
0
0
1
0
1
1
Constant 15mA  
Constant 1mA  
42/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Front-end registers  
Table 33. Register 0x02  
Register Number  
MSB  
23 22 21 20 19 18 17 16 15 14 13 12 11 10
 
9  
LSB  
1
Register Definition  
8
7
6
5
4
3
2
0
FM RF AGCThresholds@ mixin  
0
0
1
1
0
0
1
1
0 88.4
 
dBµV  
1 90.2
 
dBµV  
0 92.0
 
dBµV  
1 93.8
 
dBµV  
0 91.4
 
dBµV  
1 93.2
 
dBµV  
0 95.0
 
dBµV  
1 96.8
 
dBµV  
Reg 0x008<14> = 1  
Reg 0x008<14> = 0  
FM IFAGC threshold@IFADCin  
0
0
1
1
0
1
0
1
122 dBµV  
124 dBµV  
126 dBµV  
128 dBµV  
FMAGC attack time constant  
0
1
slow  
fast  
FMAGC decay time constant  
0
1
slow  
fast  
FM DAC  
0
1
off  
on  
FM DAC VALUE  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
… … … … … … … …  
…
255  
1
1
1
1
1
1 1 1  
DocID026122 Rev 5  
43/54  
53  

Front-end registers  
TDA7786, TDA7786M  
Register Definition  
Table 34. Register 0x05  
Register Number  
MSB  
23 22 21 20 19 18 17 16 15 14 13 12 11 10
 
9  
LSB  
1
8
7
6
5
4
3
2
0
GPODATA  
0 low  
1 high  
Table 35. Register 0x08  
Register number  
MSB  
LSB  
Register definition  
23 22 21 20 19 18 17 16 15 14 13 12 11 10
 
9  
8 7 6 5 4 3 2 1 0  
FMAGC gain select  
0
1
FM AGC thresholds high  
FM AGC thresholds down  
44/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Weak signal processing  
5
Weak signal processing  
All the parameters in this section refer to the programmability of the DSP part of the device.  
The typical values are those set by default parameters (start-up without parametric change  
from main microprocessor); the max and the min values refer to the programmability range.  
The values are referred to the typical application (‘wide-band’ in FM). Wherever the possible  
values are a discrete set, all the possible programmable values are displayed.  
5.1  
FM IF-processing  
5.1.1  
Dynamic channel selection filter (DISS)  
Table 36. Dynamic channel selection filter (DISS) – discrete set  
Symbol  
Parameter  
IF filter #10  
Test condition  
Min  
Typ  
Max  
Units  
–
–
–
–
±150  
±120  
±100  
±85  
±75  
±65  
±60  
±55  
±45  
±35  
±25  
–
–
–
–
–
–
–
–
–
–
–
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
kHz  
IF filter #9  
IF filter #8  
IF filter #7  
IF filter #6  
DISS BW
 
IF filter #5  
IF filter #4  
response: – 3dB  
IF filter #3  
IF filter #2  
–
–
–
IF filter #1  
IF filter #0  
5.1.2  
Soft mute  
Table 37. Soft mute – continuous set  
Parameter Test
 
condition  
audio atten = 1 dB  
Symbol  
Min  
Typ  
Max  
Units  
SMsp  
Start point vs. field strength  
read “FM_SoftMute”  
0
6
20  
10  
dBµV  
no adjacent channel present  
audio atten = SMd + 1 dB  
read “FM_SoftMute”  
SMep  
End point vs. field strength  
Depth  
-6  
-6  
dBµV  
no adjacent channel present  
SMd  
-30  
0.1  
-15  
0
dB  
Hz  
Field strength LPF cut-off  
frequency for soft mute activation  
SMtauatt  
100  
4000  
Field strength LPF cut-off  
frequency for soft mute release  
SMtaurel  
0.1  
1
4000  
Hz  
DocID026122 Rev 5  
45/54  
53  

Weak signal processing  
TDA7786, TDA7786M  
5.1.3  
Adjacent channel mute  
Table 38. Adjacent channel mute – continuous set  
Symbol  
ACMd  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
Depth  
–
SMd  
0
0
dB  
5.1.4  
Stereo blend  
Table 39. Stereo blend – continuous set  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
field strength = 80 dBµ
V
,
p
ilot  
deviation = 6.75 kHz  
MaxSep  
Maximum stereo separation  
Start point vs. field strength  
0
40  
50  
dB  
separation = MaxSep – 1 dB  
no multipath present  
SBFSsp  
SBFSep  
20  
20  
50  
30  
60  
60  
dBµV  
dBµV  
separation = 1 dB  
End point vs. field strength  
Field strength-related  
no multipath present  
V

rf

step-like variation from  
20 dBµV to 80 dBµV  
SBFStM2S transition
 
time from mono to  
stereo  
0.001  
0.001  
3
20  
20  
s
s
Field strength-related  
SBFStS2M transition
 
time from stereo to  
mono  
V

rf

step-like variation from  
80 dBµV to 20 dBµV  
0.5  
separation = MaxSep – 1 dB  
equivalent 19 kHz AM  
modulation depth;  
SBMPsp Start
 
point vs. multipath  
SBMPep End
 
point vs. multipath  
5
5
10  
30  
80  
80  
%
%
field strength = 80 dBµV  
separation = 1 dB  
equivalent 19 kHz AM  
modulation depth;  
field strength = 80 dBµV  
Multipath-related transition  
SBMPtM2S  
V

rf

step-like variation from  
20 dBµV to 80 dBµV  
0.001  
0.001  
1
20  
20  
s
s
time from mono to stereo  
Multipath-related transition  
SBMPtS2M  
V

rf

step-like variation from  
80 dBµV to 20 dBµV  
0.001  
time from stereo to mono  
Threshold on pilot tone  
Pil ThrM2S
 
Pilot detector stereo threshold
 
deviation for mono-stereo  
transition  
0.8  
–
2.74  
0.01  
–
–
kHz  
kHz  
Difference in Pil. det.  
Pilot detector threshold  
hysteresis  
deviation threshold for stereo  
to mono transition compared  
to PilThrM2S  
Pil ThrHyst  
46/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Weak signal processing  
5.1.5  
High cut control  
Table 40. High cut control – continuous set  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
minimum RF level for widest  
HC filter (filter # 7)  
HCFSsp  
HCFSep  
Start point vs. field strength  
0
50  
50  
dBµV  
no multipath present  
maximum RF level for  
narrowest HC filter (filter # 0)  
End point vs. field strength  
Field strength-related  
0
30  
40  
dBµV  
no multipath present  
V

rf

step-like variation from  
60 dBµV to 10 dBµV  
(1)  
HCFStW2N transition
 
time from wide to  
narrow band  
–
Field strength-related  
HCFStN2W transition
 
time from narrow to  
wide band  
V

rf

step-like variation from  
0 dBµV to 60 dBµV  
(1)  
14  
10  
100  
s
minimum RF level for widest  
HC filter (filter # 7)  
HCMPsp Start
 
point vs. multipath  
HCMPep End
 
point vs. multipath  
equivalent 19 kHz AM  
modulation depth;  
5
150

(2)  

%
%
field strength = 80 dBµV  
maximum RF level for  
narrowest HC filter (filter # 0)  
equivalent 19 kHz AM  
modulation depth;  
5
30  
150

(2)  

field strength = 80 dBµV  
Multipath-related transition  
HCMPtN2W time
 
from narrow to wide  
band  
V

rf

step-like variation from  
20 dBµV to 80 dBµV  
0.001  
0.001  
0.001  
0.001  
14  
20  
20  
18  
s
s
Multipath-related transition  
HCMPtW2N  
V

rf

step-like variation from  
80 dBµV to 20 dBµV  
time from wide to narrow  
Filter #7, -3 dB response  
frequency, input signal with  
pre-emphasis  
Maximum cut-off frequency of  
HCmaxBW  
HCmin  
BW  
kHz  
high cut filter bank  
Filter #0, -3 dB response  
frequency, input signal with  
pre-emphasis  
Minimum cut-off frequency of  
HCminBW  
HCma  
xBW  
0.1  
–
3
kHz  
–
high cut filter bank  
HCnumFilt Number
 
of discrete HC filters  
–
8

(3)  

–
1. Depends
 
only on field strength filter time constant.  
2. Means
 
that 100% equivalent 19 kHz AM modulation depth will not achieve full band narrowing.  
3. Intermediate
 
filters (#6 – #1) cut-off frequencies exponentially spaced between HCmaxBW and HCminBW.  
DocID026122 Rev 5  
47/54  
53  

Weak signal processing  
TDA7786, TDA7786M  
Table 41. De-emphasis filter – continuous set  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
De-emphasis time constant 1  
De-emphasis time constant 2  
–
–
–
–
50  
75  
–
–
DEtc  
µs  
5.1.6  
Stereo decoder  
Table 42. Stereo decoder – continuous set  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
PilSup  
Pilot signal suppression  
Pilot 9%, 19 kHz, ref = 40 kHz  
f = 38 kHz  
–
–
–
–
60  
70  
70  
80  
–
–
–
–
dB  
dB  
dB  
dB  
SubcSup Subcarrier
 
suppression  
f = 57 kHz  
f = 76 kHz  
5.2  
AM IF-processing  
5.2.1  
Channel selection filter  
Table 43. Channel selection filter  
Test condition  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
CSF BW
 
Channel selection filter BW  
response: – 3dB  
–
±3.7  
–
kHz  
5.2.2  
Soft mute  
Table 44. Soft mute – continuous set  
Test condition  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
audio atten = 1 dB  
SMsp  
Start point vs. field strength  
End point vs. field strength  
read “FM_SoftMute”  
0
25  
40  
dBµV  
no adjacent channel present  
audio atten = SMd + 1 dB  
read “FM_SoftMute”  
SMep  
SMd  
0
0
30  
dBµV  
no adjacent channel present  
Depth  
–
-40  
-24  
0.1  
0
dB  
s
Transition time for field  
SMtauatt strength-dependent
 
soft mute  
activation  
–
0.001  
10  
Transition time for field  
SMtaurel strength-dependent
 
soft mute  
release  
–
0.001  
3
10  
s
48/54  
DocID026122 Rev 5  

TDA7786, TDA7786M  
Weak signal processing  
5.2.3  
High cut control  
Table 45. High cut control – continuous set  
Symbol  
Parameter  
Test condition  
Min  
Typ  
Max  
Units  
minimum RF level for widest  
HC filter (filter # 7)  
HCFSsp  
HCFSep  
Start point vs. field strength  
0
40  
50  
dBµV  
no multipath present  
maximum RF level for  
narrowest HC filter (filter # 0)  
End point vs. field strength  
Field strength-related  
0
30  
0.2  
10  
14  
50  
20  
20  
18  
dBµV  
s
no multipath present  
V

rf

step-like variation from  
60 dBµV to 10 dBµV  
HCFStW2N transition
 
time from wide to  
narrow band  
0.001  
0.001  
Field strength-related  
HCFStN2W transition
 
time from narrow to  
wide band  
V

rf

step-like variation from  
0 dBµV to 60 dBµV  
s
Filter #7, -3 dB response  
frequency, input signal with  
pre-emphasis  
Maximum cut-off frequency of  
HCmaxBW  
HCmin  
BW  
kHz  
high cut filter bank  
Filter #0, -3 dB response  
frequency, input signal with  
pre-emphasis  
Minimum cut-off frequency of  
HCminBW  
HCma  
xBW  
1
–
3
8
kHz  
–
high cut filter bank  
HCnumFilt Number
 
of discrete HC filters  
–
–
DocID026122 Rev 5  
49/54  
53  

6
Basic
application schematic  
Figure 24. FM wide-band application  
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TDA7786, TDA7786M  
Package information  
7
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of  
®
®
ECOPACK packages,
 
depending on their level of environmental compliance. ECOPACK  
specifications, grade definitions and product status are available at:

.  
®
ECOPACK is
 
an ST trademark.  
7.1  
LQFP64 (10x10x1.4 mm) package information  
Figure 25. LQFP64 (10x10x1.4 mm) package outline  
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DocID026122 Rev 5  
51/54  
53  
 

Package information  
TDA7786, TDA7786M  
Table 46. LQFP64 (10x10x1.4 mm) package mechanical data  
Dimensions  
Ref  
Millimeters  
Typ.  
Inches

(1)  

Typ.  
Min.  
Max.  
Min.  
Max.  
A
A1  
A2  
b
–
0.05  
1.350  
0.17  
0.09  
11.80  
9.80  
–
–
1.60  
0.15  
1.45  
0.27  
0.20  
12.20  
10.20  
–
–
–
0.0630  
0.0059  
0.0571  
0.0106  
0.0079  
0.4803  
0.4016  
–
–
0.0020  
0.0531  
0.0067  
0.0035  
0.4646  
0.3858  
–
–
1.40  
0.22  
–
0.0551  
0.0087  
–
c
D
12.00  
10.00  
7.50  
12.00  
10.00  
7.50  
0.50  
0.60  
1.00  
0.4724  
0.3937  
0.2953  
0.4724  
0.3937  
0.2953  
0.0197  
0.0236  
0.0394  
D1  
D3  
E
11.80  
9.80  
–
12.20  
10.20  
–
0.4646  
0.3858  
–
0.4803  
0.4016  
–
E1  
E3  
e
–
–
–
–
L
0.45  
–
0.75  
–
0.0177  
–
0.0295  
–
L1  
K
0° (min.), 3.5° (typ.) 7° (max.)  
0.08  
ccc  
–
–
–
–
0.0031  
1. Values
 
in inches are converted from mm and rounded to 4 decimal digits.  
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TDA7786, TDA7786M  
Revision history  
8
Revision history  
Table 47. Document revision history  
Changes  
Date  
Revision  
24-Mar-2014  
1
Initial release.  
29-May-2014  
2
Document status promoted from preliminary data to production data.  
Added ‘T

j

’ parameter in

27
Ω
.  
23-Feb-2016  
3
Updated:  
to 27
Ω
);  
Updated:  
– Title in cover page;  
–

and added new bullet “AEC-Q100 qualified”;  
27-May-2016  
4
Removed section 2.14 Antenna switching.  
The publication scope change from internal to public document, no  
content change.  
05-Oct-2016  
5
DocID026122 Rev 5  
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53  

TDA7786, TDA7786M  
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