STMicroelectronics-TN1605H-6FP
| Part # | STMicroelectronics-TN1605H-6FP |
Download  | STMicroelectronics-TN1605H-6FP |
TN1605H-6FP
High temperature 16 A SCRs
Datasheet
−
production data
Applications
$
.
•
Voltage regulator circuits for motorbikes
•
Inrush current limiting circuits
•
Motor control circuits and starters
•
Light dimmers
*
•
Solid state relays
Description
Thanks to a junction temperature up to 150 °C
and an insulated TO-220FPAB package, the
TN1605H-6FP offers high thermal performance
up to 16 A rms.
The trade-off between the device’s noise
immunity (dV/dt = 200 V/µs), its gate triggering
current (I
GT
= 6 mA) and its turn-on current rise
(dI/dt = 100 A/µs) allows the design of robust and
compact control circuits for voltage regulators in
motorbikes and industrial drives, overvoltage
crowbar protection, motor control circuits in power
tools and kitchen appliances, and inrush current
limiting circuits.
*
$
.
72ꢀꢁꢁꢂ)3$%
Features
The insulated fullpack package allows a
back-to-back configuration.
•
High junction temperature: T
j
= 150 °C
•
High noise immunity dV/dt = 200 V/µs up to
150 °C
•
Gate triggering current I
GT
= 6 mA
Table 1. Device summary
•
Blocking voltage V
DRM
/V
RRM
= 600 V
•
High turn on current rise dI/dt: 100 A/µs
•
ECOPACK
®
2 compliant component
•
Complies with UL standards (File ref: E81734)
Order code
Package
V
DRM
/V
RRM
I
GT
TN1605H-6FP TO-220FPAB
600 V
6 mA
•
Insulated package TO-220FPAB:
– Insulated
voltage: 2000 V
RMS
February 2015
DocID027546 Rev 1
1/9
This is information on a product in full production.
9
Characteristics
TN1605H-6FP
1
Characteristics
Table 2. Absolute ratings
Parameter
Symbol
Value
Unit
I
T(RMS)
On-state rms current (180° conduction angle)
T
c
= 83 °C
T
c
= 83 °C
T
c
= 102 °C
T
c
= 117 °C
t = 8.3ms
16
10
8
A
I
T(AV)
Average on-state current (180° conduction angle)
A
6
153
140
98
Non repetitive surge peak on-state current
I
TSM
A
(T
j
initial = 25 °C)
t = 10 ms
²
²
²
I t
I t value for fusing (T
j
initial = 25 °C)
t
p
= 10 ms
A s
Critical rate of rise of on-state current
dI/dt
f = 60 Hz
100
600
A/µs
V
I
G
= 2 x I
G
T
, t
r
≤
100 ns, T
j
= 25 °C
V
DRM
V
RRM
,
Repetitive peak off-state voltage
Peak gate current
I
GM
t
p
= 20 µs
T
j
= 150 °C
T
j
= 150 °C
4
1
A
P
G(AV)
Average gate power dissipation
W
T
stg
T
j
Storage junction temperature range
Operating junction temperature range
– 40 to + 150
– 40 to + 150
°C
T
L
Maximum lead temperature for soldering during 10 s
Insulation rms voltage, 1 minute
260
°C
V
V
ins
TO-220FPAB
2000
Table 3. Electrical characteristics (T
j
= 25 °C, unless otherwise specified)
Symbol
Test conditions
Value
Unit
Min.
3.5
4.5
6
I
GT
V
D
= 12 V, R
L
= 33
Ω
Typ.
Max.
mA
V
D
= 12 V, R
L
= 33
Ω
V
GT
V
GD
I
H
Max.
1.3
0.2
20
V
V
V
D
= V
DRM
, R
L
= 3.3 k
Ω
I
T
= 500 mA, gate open
I
G
= 1.2 x I
GT
T
j
= 150 °C
Min.
Max.
mA
mA
V/µs
I
L
Max.
40
dV/dt
V
D
= 402 V, gate open
T
j
= 150 °C
Min.
200
I
T
= 32 A, V
D
= 600 V, I
G
= 100 mA,
(dI
G
/dt)max = 0.2 A/µs
t
gt
Typ
1.9
70
µs
µs
V
D
= 402 V, V
R
= 25 V, I
T
= 16 A,
(dI
G
/dt)max = 30A/µs, dV
D
/dt = 40 V/µs
t
q
T
j
= 150 °C
Typ
2/9
DocID027546 Rev 1
TN1605H-6FP
Symbol
Characteristics
Table 4. Static characteristics
Test conditions
Value
Unit
V
TM
V
t0
R
d
I
TM
= 32 A, t
p
= 380 µs
T
j
= 25 °C
T
j
= 150 °C
T
j
= 150 °C
T
j
= 25 °C
T
j
= 150 °C
Max.
Max.
Max.
1.6
0.82
25
V
V
Threshold voltage
Dynamic resistance
m
Ω
µA
mA
5
I
DRM,
I
RRM
V
D
= V
DRM,
V
R
= V
RRM
Max.
1.5
Table 5. Thermal resistance
Parameter
Symbol
Value
Unit
R
th(j-c)
R
th(j-a)
Junction to case (AC)
4.5
60
°C/W
°C/W
Junction to ambient (DC)
Figure 1. Maximum power dissipation versus
average on-state current
Figure 2. Average and DC on-state current
versus case temperature
3ꢋ:ꢌꢈ
,
ꢋ$ꢌ
ꢋ$9ꢌ
7
ꢆꢅ
ꢁꢂ
ꢆꢅ
ꢆꢄ
ꢆꢃ
ꢆꢁ
ꢆꢂ
ꢅ
ꢆꢄ
ꢆꢃ
ꢆꢁ
ꢆꢂ
ꢅ
Įꢈ ꢈꢆꢅꢂꢈ
Įꢈ ꢈꢆꢁꢂꢈ
ꢈ’&
‘&
Įꢈ ꢈꢊꢂꢈ
Įꢈ ꢈꢄꢂꢈ
Įꢈ ꢈꢉꢂꢈ
Įꢈ ꢈꢆꢅꢂꢈ
Įꢈ ꢈꢆꢁꢂꢈ
Įꢈ ꢈꢊꢂꢈ
Įꢈ ꢈꢄꢂꢈ
ꢄ
ꢄ
Įꢈ ꢈꢉꢂꢈ
ꢃ
ꢉꢄꢂꢈ
ꢃ
ꢁ
ꢁ
7
ꢋ&ꢌ
F
,
ꢋ$ꢌ
ꢋ$9ꢌ
Įꢈ
7
ꢂ
ꢂ
ꢂ
ꢁꢇ
ꢇꢂ
ꢍꢇ
ꢆꢂꢂ
ꢆꢁꢇ
ꢆꢇꢂ
ꢂ
ꢇ
ꢆꢂ
ꢆꢇ
Figure 3. Average and DC on-state current
versus ambient temperature
Figure 4. Relative variation of thermal
impedance versus pulse duration
.ꢈ ꢈ>=
ꢐꢈ5
WK
WK
@
,
ꢋ$ꢌ
7ꢋ$9ꢌ
ꢆꢎꢂ(ꢏꢂꢂ
ꢆꢎꢂ(ꢀꢂꢆ
ꢆꢎꢂ(ꢀꢂꢁ
ꢉꢎꢂ
ꢁꢎꢇ
ꢁꢎꢂ
ꢆꢎꢇ
ꢆꢎꢂ
ꢂꢎꢇ
ꢂꢎꢂ
ꢈ=
WKꢋMꢀFꢌ
ꢈ’&
=
WKꢋMꢀDꢌ
Įꢈ
ꢈꢆꢅꢂꢈ
W
ꢋVꢌ
3
7
ꢋ&ꢌ
D
ꢆꢎꢂ(ꢀꢂꢉ
ꢆꢎꢂ(ꢀꢂꢁ
ꢆꢎꢂ(ꢀꢂꢆ
ꢆꢎꢂ(ꢏꢂꢂ
ꢆꢎꢂ(ꢏꢂꢆ
ꢆꢎꢂ(ꢏꢂꢁ
ꢆꢎꢂ(ꢏꢂꢉ
ꢂ
ꢁꢇ
ꢇꢂ
ꢍꢇ
ꢆꢂꢂ
ꢆꢁꢇ
ꢆꢇꢂ
DocID027546 Rev 1
3/9
Characteristics
TN1605H-6FP
Figure 5. Relative variation of gate triggering
current and gate voltage versus junction
temperature (typical values)
Figure 6. Relative variation of holding current
and latching current versus junction
temperature (typical values)
,
ꢑꢈ9
>ꢈ7
ꢈ@ꢈꢐꢈ,
ꢑ
9
>ꢈ7
ꢈ ꢈꢁꢇꢈ&@
,
ꢑ
,
>ꢈ7
ꢈ@ꢈꢐꢈ,
ꢑ
,
>ꢈ7
ꢈ ꢈꢁꢇꢈ&@
*7
*7
*7
*7
ꢈ
M
ꢈ
ꢈ
M
+
ꢈ
/ꢈ
+
ꢈ
/ꢈꢈ
M
M
ꢁꢎꢇ
ꢁꢎꢇ
ꢈ
,
ꢁꢎꢂ
ꢆꢎꢇ
ꢆꢎꢂ
ꢂꢎꢇ
ꢂꢎꢂ
/
ꢁꢎꢂ
ꢆꢎꢇ
ꢆꢎꢂ
ꢂꢎꢇ
ꢂꢎꢂ
ꢈ
,
*7ꢈ
ꢈ
,
+
ꢈ9
*7
7
ꢋ&ꢌ
M
7
ꢋ&ꢌ
M
ꢀꢇꢂ
ꢀꢁꢇ
ꢂ
ꢁꢇ
ꢇꢂ
ꢍꢇ
ꢆꢂꢂ
ꢆꢁꢇ
ꢆꢇꢂ
ꢀꢇꢂ
ꢀꢁꢇ
ꢂ
ꢁꢇ
ꢇꢂ
ꢍꢇ
ꢆꢂꢂ
ꢆꢁꢇ
ꢆꢇꢂ
Figure 7. Relative variation of static dV/dt
immunity versus junction temperature (typical
values)
Figure 8. Surge peak on-state current versus
number of cycles
,
ꢋ$ꢌ
G9ꢐGWꢈ>7
@ꢈꢐꢈG9ꢐGWꢈ>7
ꢈꢆꢇꢂꢈ&@
M
M
760
ꢄ
ꢇ
ꢃ
ꢉ
ꢁ
ꢆ
ꢂ
ꢆꢇꢂ
9
ꢈ9
ꢈ ꢈꢃꢂꢁꢈ9
5
‘ꢈ
1RQꢈUHSHWLWLYHꢈ7
ꢈ ꢈꢁꢇꢈ&
M
W
S
ꢆꢂPVꢈ
2QHꢈFFOHꢈ
$ERYHꢈWHVWꢈHTXLSPHQWꢈFDSDELOLW
ꢆꢂꢂ
ꢇꢂ
ꢂ
5HSHWLWLYHꢈ7
ꢈ ꢈꢅꢉꢈ&
F
1XPEHUꢈRIꢈFFOHV
ꢆꢂꢂ
7
ꢈꢋ&ꢌ
M
ꢆ
ꢆꢂ
ꢆꢂꢂꢂ
ꢁꢇ
ꢇꢂ
ꢍꢇ
ꢆꢂꢂ
ꢆꢁꢇ
ꢆꢇꢂ
Figure 9. Non-repetitive surge peak on-state
current for a sinusoidal pulse (tp < 10 ms)
Figure 10. On-state characteristics
(maximum values)
,
ꢋ$ꢌ
,
ꢋ$ꢌ
760
70
ꢆꢂꢂꢂꢂ
ꢆꢂꢂꢂ
ꢆꢂꢂ
ꢆꢂꢂꢂ
ꢆꢂꢂ
GOꢐGWꢈOLPLWDWLRQꢒꢈꢆꢂꢂꢈ$ꢐV
ꢈ7
ꢈLQLWLDOꢈ ꢈꢁꢇꢈ&
7
ꢈPD[ꢒ
M
M
9
ꢈ ꢈꢂꢎꢅꢁꢈ9
Wꢂ
5Gꢈ ꢈꢁꢇꢈPȍ
,
760
ꢆꢂ
ꢆ
ꢈ7
ꢈ ꢈꢆꢇꢂꢈ&
M
ꢈ7
ꢈ ꢈꢁꢇꢈ&
M
9
ꢋ9ꢌ
W
ꢋPVꢌ
70
S
ꢆꢂ
ꢆꢎꢂ
ꢂꢎꢂ
ꢁꢎꢂ
ꢉꢎꢂ
ꢃꢎꢂ
ꢂꢎꢂꢆ
ꢂꢎꢆꢂ
ꢆꢎꢂꢂ
ꢆꢂꢎꢂꢂ
4/9
DocID027546 Rev 1
TN1605H-6FP
Characteristics
Figure 11. Relative variation of leakage current versus junction temperature (tp < 10 ms)
,
ꢑꢈ,
ꢈ>ꢈ7
ꢈ@ꢈꢐꢈ,
ꢑꢈ,
ꢈ>ꢈ7
ꢈ ꢈꢆꢇꢂꢈ&ꢈ@
’50
550
M
’50
550
M
ꢆꢎ(ꢏꢂꢂ
ꢆꢎ(ꢀꢂꢆ
ꢆꢎ(ꢀꢂꢁ
ꢆꢎ(ꢀꢂꢉ
ꢆꢎ(ꢀꢂꢃ
9
ꢈ ꢈꢈ9
550
ꢈ ꢈꢈꢄꢂꢂꢈ9ꢈ
’50
7
ꢋ&ꢌ
M
ꢁꢇ
ꢇꢂ
ꢍꢇ
ꢆꢂꢂ
ꢆꢁꢇ
ꢆꢇꢂ
DocID027546 Rev 1
5/9
Package information
TN1605H-6FP
2
Package information
•
•
•
•
Epoxy meets UL94, V0
Lead-free package
Halogen free molding compound
Recommended torque: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
ECOPACK
®
is an ST trademark.
Figure 12. TO-220FPAB dimension definitions
$
%
+
‘LD
/ꢄ
/ꢇ
/ꢁ
/ꢃ
/ꢍ
/ꢉ
‘
)ꢆ
)ꢁ
)
(
*ꢆ
*
6/9
DocID027546 Rev 1
TN1605H-6FP
Package information
Table 6. TO-220FPAB dimensions
Dimensions
Ref.
Millimeters
Inches
Max.
Min.
Max.
Min.
A
B
4.4
2.5
4.6
2.7
0.173
0.098
0.098
0.018
0.030
0.045
0.045
0.195
0.094
0.393
0.181
0.106
D
2.5
2.75
0.70
1
0.108
E
0.45
0.75
1.15
1.15
4.95
2.4
0.027
F
0.039
F1
F2
G
1.70
1.70
5.20
2.7
0.067
0.067
0.205
G1
H
0.106
10
10.4
0.409
L2
L3
L4
L5
L6
L7
Dia.
16 Typ.
0.63 Typ.
1.205
28.6
9.8
30.6
10.6
3.6
1.126
0.386
0.114
0.626
0.354
0.118
0.417
2.9
0.142
15.9
9.00
3.00
16.4
9.30
3.20
0.646
0.366
0.126
DocID027546 Rev 1
7/9
Ordering information
TN1605H-6FP
3
Ordering information
Figure 13. Ordering information scheme
71ꢈꢈꢆꢄꢈꢈꢂꢇꢈꢈ+ꢈꢈꢀꢈꢈꢄꢈꢈꢈꢈꢈꢈ)3ꢈ
6HULHV
71ꢈ ꢈ6&5
5PVꢈFXUUHQW
ꢆꢄꢈ ꢈꢆꢄꢈ$
*DWHꢈVHQVLWLYLW
ꢂꢇꢈ ꢈꢄꢈP$
+LJKꢈWHPSHUDWXUH
9ROWDJH
ꢄꢈ ꢈꢄꢂꢂꢈ9
3DFNDJH
)3ꢈ ꢈ72ꢀꢁꢁꢂ)3$%
‘HOLYHUꢈPRGH
%ODQNꢈ ꢈWXEH
Table 7. Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
TN1605H-6FP
TN1605H6
TO-220FPAB
2.0 g
50
Tube
4
Revision history
Table 8. Document revision history
Changes
Date
Revision
24-Feb-2015
1
Initial release.
8/9
DocID027546 Rev 1
TN1605H-6FP
IMPORTANT NOTICE – PLEASE READ CAREFUL
L
Y
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of S
T
.
A
ll other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2015 STMicroelectronics – All rights reserved
DocID027546 Rev 1
9/9
