STMicroelectronics-TPDV1225RG

Part #STMicroelectronics-TPDV1225RG
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STMicroelectronics-TPDV1225RG
TPDVxx25  
25 A high voltage
T
r
iacs  
Features  
A2  
■
On-state current (I  
): 25 A  
T(RMS)  
■
Max. blocking voltage (V  
/V  
): 1200 V  
DRM RRM  
■
Gate current (I
 
): 150 mA  
GT  
G
■
Commutation @ 10 V/µs: up to 88 A/ms  
■
Noise immunity: 2 kV/µs  
A1  
■
Insulated package:  
– 2,500
 
V rms (UL recognized: E81734).  
Description  
The TPDVxx25 series use high performance  
alternistor technolog
y
.  
A1  
A2  
G
Featuring very high commutation levels and high  
surge current capabilit
y
,
t
hese devices are well  
adapted to power control for inductive and  
resistive loads (motor, transformer…) especially  
on three-phase power grid.
T
a
rgeted three-phase  
applications include heating systems, motor  
starters, and induction motor speed control  
(especially for fans).  
TOP3 insulated  
Table 1.  
Device summary  
Parameter  
TPDV825RG  
TPDV1025RG  
TPDV1225RG  
Blocking voltage V

DRM

/V

RRM  

On-state current I

T(RMS)  

Gate current I

GT  

800 V  
1000 V  
25 A  
1200 V  
150 mA  
January 2012  
Doc ID 18268 Rev 2  
1/7  
7

Characteristics  
TPDVxx25  
1
Characteristics  
Table 2.  
Absolute maximum ratings (limiting values)  
Parameter  
Symbol  
I

T(RMS)  

Value  
Unit  
On-state rms current (180° conduction angle)  
T

c

= 85 °C  
T

j

= 25 °C  
T

j

= 25 °C  
25  
A
t

p

= 2.5 ms  
390  
250  
230  
265  
Non repetitive surge peak on-state  
current  
I

TSM  

t

p

= 8.3 ms  
t

p

= 10 ms  
t

p

= 10 ms  
A
I

2

t  
I

2

t value for fusing  
A

2

S  
Critical rate of rise of on-state current  
I

G

= 500 mA, dI

G

/dt = 1 A/µs  
dI/dt  
F = 50 Hz  
100  
A/µs  
TPDV825  
TPDV1025  
TPDV1225  
800  
1000  
1200  
V

DRM  

V

RRM  

Repetitive peak off-state voltage  
T

j

= 125 °C  
V
Storage junction temperature range  
Operating junction temperature range  
– 40 to + 150  
– 40 to + 125  
T

stg  

T

j  

°C  
V
(1)  
V

INS(RMS)  

Insulation rms voltage  
2500  
1. A1,
 
A2, gate terminals to case for 1 minute  
Table 3.  
Symbol  
Electrical Characteristics (T
 
= 25 °C, unless otherwise specified)  
j
Test conditions  
Quadrant  
Value Unit  
I

GT  

V

GT  

V

GD  

t

gt  

MAX.  
MAX.  
MIN.  
TY
P
.  
TY
P
.  
150  
1.5  
0.2  
2.5  
50  
mA  
V
V

D

= 12 V DC, R

L

= 33
Ω
 
V

D

= V

DRM

R

L

= 3.3 k
Ω  
I – II – III  
T

j

= 125 °C  
I – II – III  
I – II – III  
V
V

D

= V

DRM G  

I
= 500 mA
 
dI

G

/dt = 3 A/µs  
µs  
mA  
(1)  
I

H  

I

T

= 500 mA
 
Gate open  
I – III  
II  
100  
200  
I

L  

I

G

= 1.2 x I

GT  

TY
P
.  
mA  
dV/dt  
Linear slope up to: V

D

= 67% V

DRM

Gate open  
I

TM

= 35 A
 
t

p

= 380 µs  
T

j

= 125 °C  
MIN. 2000  
V/µs  
V
(1)  
V

TM  

MAX.  
MAX.  
MAX.  
1.8  
1.1  
19  
20  
8
(1)  
V

to  

Threshold voltage  
T

j

= 125 °C  
T

j

= 125 °C  
T

j

= 25 °C  
T

j

= 125 °C  
V
(1)  
R

d  

Dynamic resistance  
m
Ω  
µA  
mA  
I

DRM  

I

RRM  

V

DRM

= V

RRM  

MAX.  
MIN.  
(dV/dt)c = 200 V/µs  
(dV/dt)c = 10 V/µs  
20  
88  
(dI/dt)c

(1)  

T

j

= 125 °C  
A/ms  
1. For
 
either polarity of electrode A

2

voltage with reference to electrode A

1

.  
2/7  
Doc ID 18268 Rev 2  
 
 

TPDVxx25  
Characteristics  
Table 4.  
Symbol  
Gate characteristics (maximum values)  
Parameter  
Value  
Unit  
P

G(AV)  

P

GM  

I

GM  

Average gate power dissipation  
Peak gate power dissipation  
Peak gate current  
1
40  
8
W
W
A
t

p

= 20 µs  
t

p

= 20 µs  
t

p

= 20 µs  
V

GM  

Peak positive gate voltage  
16  
V
Table 5.  
Symbol  
Thermal resistance  
Parameter  
Value  
Unit  
R

th(j-a)  

Junction to ambient  
50  
1.5  
1.1  
°C/W  
°C/W  
°C/W  
R

th(j-c)

DC Junction
 
to case for DC  
R

th(j-c)

AC Junction
 
to case for 360 °Conduction angle (F = 50 Hz)  
Figure 1.  
Max. rms power dissipation versus
 
Figure 2.  
on-state rms current (F = 50Hz).  
(curves limited by (dI/dt)c)  
Max. rms power dissipation and  
max. allowable temperatures  
(T  
and T  
) for various R  
amb  
case th  
P(W)  
P(W)  
T
case  
(°C)  
40  
40  
R

th

= 1.5°C/W
 
R

th

= 1°C/W
 
R

th

= 0.5°C/W  
R

th

= 0°C/W  
Rth case to ambient –  
85  
30  
30  
20  
95  
α
= 180°  
α
= 120°  
α
= 90°  
105  
115  
125  
20  
10  
α
= 60°  
α
= 30°  
180°  
α
10  
0
α
T
(°C)  
amb  
I (A)  
T(RMS)  
0
0
0
20  
40  
60  
80  
100  
120  
140  
5
10  
15  
20  
25  
Figure 3.  
On-state rms current versus case
 
Figure 4.  
temperature  
Relative variation of thermal  
impedance versus pulse duration  
I (A)  
T(RMS)  
K=[Z  
/R  
]
th(j-c) th(j-c)  
30  
25  
20  
15  
10  
5
1.00  
α
= 180°  
Z

th(j-c)  

0.10  
Z

th(j-a)  

0.01  
T (°C)  
case  
t (s)  
p
0.0  
1E-3  
0
0
25  
50  
75  
100  
125  
1E-2  
1E-1  
1E+0  
1E+1  
1E+2  
1E+3  
Doc ID 18268 Rev 2  
3/7  

Characteristics  
TPDVxx25  
Figure 5.  
Relative variation of gate trigger  
current and holding current versus  
junction temperature  
Figure 6.  
Non repetitive surge peak on-state  
current versus number of cycles  
I
,I ,I [T
 
] / I
 
,I ,I [T
 
=25°C]  
H L
 
j GT
 
H L
 
j  
GT  
I (A)  
TSM  
2.5  
2
200  
t = 20 ms  
One cycle  
150  
100  
I

GT  

1.5  
T

j

initial=25°C  
1
I

H

& I

L  

50  
0
0.5  
0
Number of cycles  
T (°C)  
j
1
10  
100  
1000  
-40 -30
 
-20 -10  
0
10 20
 
30 40 50 60 70 80 90
 
100 110 120 130  
Figure 7.  
Non-repetitive surge peak on-state
 
Figure 8.  
current for a sinusoidal pulse and  
corresponding values of I t  
On-state characteristics (maximum  
values)  
2
I
(A)  
TM  
I
(A), I

2

t (A

2

s)  
TSM  
1000  
100  
10  
1000  
T

j

initial = 25°C  
I

TSM  

T

j

=max  
I

2

t  
T

j

=25°C  
T

j

max.:  
V

t0

=1.1V  
R

d

=19m
Ω  
t (ms)  
p
V (V)  
TM  
100  
1
1
2
3
4
5
6
1
2
5
10  
Figure 9.  
Safe turn-off operating area  
(dV/dt)c(V/µs)  
1000  
T

j

initial = 25°C  
100  
10  
(dI/dt)c(A/ms)  
1
1
10  
100  
4/7  
Doc ID 18268 Rev 2  

TPDVxx25  
Package information  
2
Package information  
●
●
●
Epoxy meets UL94,V0  
Cooling method: C (by conduction)  
Recommended torque value: 0.9 to 1.2 N·m  
In order to meet environmental requirements, ST offers these devices in different grades of  
®
®
ECO
P
A
CK packages,
 
depending on their level of environmental compliance. ECO
P
A
CK  
specifications, grade definitions and product status are available at:

.  
®
ECO
P
A
CK is
 
an ST trademark.  
Table 6.  
TOP3 insulated dimensions  
Dimensions  
Millimeters  
Ref.  
Inches  
Min. Max.  
Min.  
Max.  
H
A
A
B
4.4  
1.45  
14.35  
0.5  
4.6  
1.55  
15.60  
0.7  
0.173  
0.057  
0.565  
0.020  
0.106  
0.622  
0.815  
0.594  
0.213  
0.134  
0.161  
0.047  
0.181  
0.061  
0.614  
0.028  
0.114  
0.650  
0.831  
0.610  
0.222  
0.144  
0.164  
0.055  
R
B
ØL  
C
D
E
K
G
C
F
2.7  
2.9  
F
15.8  
20.4  
15.1  
5.4  
16.5  
21.1  
15.5  
5.65  
3.65  
4.17  
1.40  
G
H
J
P
D
K
3.4  
J
J
E
ØL  
P
4.08  
1.20  
R
4.60 typ.  
0.181 typ.  
Doc ID 18268 Rev 2  
5/7  

Ordering information  
TPDVxx25  
3
Ordering information  
Table 7.  
Order code  
TPDV825RG  
Ordering information  
Marking  
Package  
Weight Base
 
qty Delivery
 
mode  
TPDV825  
TPDV1025  
TPDV1225  
TOP3  
insulated  
TPDV1025RG  
TPDV1225RG  
4.5 g  
30  
T
u
be  
4
Revision history  
Table 8.  
Date  
Document revision history  
Revision  
Changes  
30-Mar-2011  
13-Jan-2012  
1
2
First issue.  
Updated dI/dt in

and added V

to

and R

d

to

.  
6/7  
Doc ID 18268 Rev 2  

TPDVxx25  
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Doc ID 18268 Rev 2  
7/7