STMicroelectronics-X0202NN-5BA4
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X02
1.25 A sensitive gate SCR
Features
A
■
on-state rms current: 1.25 A
■
repetitive peak off-state voltage: 600 V and
G
800 V
K
■
gate triggering current: 50 and 200 µA
A
Applications
G
A
■
ground fault circuit interrupters
A
G
K
K
■
overvoltage crowbar protection in power
supplies
TO-92
X02xxA
SO
T
–
223
X02xxN
■
capacitive ignition circuits
Description
A
The X02 SCR can be used as the on/off function
in applications where topology does not offer high
current for gate triggering.
K
G
This device is optimized in forward voltage drop
and inrush current capabilities for reduced power
losses and high reliability in harsh environments.
SMBflat-3L
X0202NUF
Table 1.
Device summary
V
o
ltage
Order code
Sensitivity µA
Package
600 V
800 V
X0202MA
X0202MN
X0202NA
X0202NN
X0205MA
X0205NA
X0202NUF
Y
Y
200
200
200
200
50
TO-92
SO
T
–
223
TO-92
Y
Y
SO
T
–
223
TO-92
Y
Y
Y
50
TO-92
200
SMBflat-3L
January 2011
Doc ID 7480 Rev 4
1/11
11
Characteristics
X02
1
Characteristics
Table 2.
Symbol
Absolute ratings (limiting values, T
= 25 °C unless otherwise specified)
J
Parameter
Value
Unit
TO-92
T
L
= 63 °C
tab
= 99 °C
I
T(RMS)
On-state rms current (180 °Conduction angle)
IT
(AV)
Average on-state current (180 °Conduction angle)
SO
T
–
223
T
1.25
0.8
A
SMBflat-3L T
tab
= 111 °C
TO-92
T
L
= 63 °C
tab
= 99 °C
SO
T
–
223
T
A
A
SMBflat-3L T
tab
= 111 °C
t
p
= 8.3 ms
T
j
= 25 °C
t
p
= 10 ms
25
22.5
2.5
I
TSM
Non repetitive surge peak on-state current
²
²
I t
I t Value for fusing
t
p
= 10 ms
T
j
= 25 °C
F = 60 Hz
T
j
= 125 °C
A
2
s
Critical rate of rise of on-state current
di/dt
I
GM
50
A/µs
I
G
= 2 x I
GT
, t
r
≤
100 ns
Peak gate current
t
p
= 20 µs
T
j
= 125 °C
T
j
= 125 °C
1.2
0.2
A
P
G(AV)
Average gate power dissipation
W
T
stg
T
j
Storage junction temperature range
Operating junction temperature range
– 40 to + 150
– 40 to + 125
°C
Table 3.
Symbol
Electrical characteristics (T
= 25 °C unless otherwise specified)
J
Test conditions
X0202
X0205
Unit
Min.
Max.
Max.
Min.
Min.
Max.
Max.
Min.
20
50
I
GT
µA
V
D
= 12
V
,
R
L
= 140
Ω
200
V
GT
V
GD
V
RG
I
H
0.8
0.1
8
V
V
V
D
= V
DRM,
R
L
= 3.3 k
Ω
, R
GK
= 1 k
Ω
I
RG
= 10 µA
T
j
= 125 °C
T
j
= 110 °C
V
I
T
= 50 mA, R
GK
= 1 k
Ω
I
G
= 1 mA, R
GK
= 1 k
Ω
5
mA
mA
V/µs
I
L
6
dV/dt
V
D
= 67%
V
DRM,
R
GK
= 1 k
Ω
10
15
Table 4.
Symbol
Static electrical characteristics
Test conditions
X0202
X0205
Unit
V
TM
V
TO
R
d
I
TM
= 2.5 A, t
p
= 380 µs
Threshold voltage
T
j
= 25 °C
1.45
0.9
200
5
V
V
T
j
= 125 °C
Dynamic resistance
Max.
m
Ω
µA
µA
T
j
= 25 °C
I
DRM
I
RRM
V
DRM
= V
RRM,
R
GK
= 1 k
Ω
T
j
= 125 °C
500
2/11
Doc ID 7480 Rev 4
X02
Characteristics
Table 5.
Symbol
Thermal resistances
Parameter
Value
Unit
R
th(j-l)
R
th(j-t)
R
th(j-t)
Junction to leads (DC)
Junction to tab (DC)
Junction to tab (DC)
TO-92
60
25
SO
T
–
223
SMBflat-3L
TO-92
14
Max.
°C/W
150
60
R
th(j-a)
Junction to ambient (DC)
SO
T
–
223
SMBflat-3L
S = 5 cm
2
75
Figure 1.
Maximum average power
dissipation versus average
on-state current (full cycle)
Figure 2.
Average and DC on-state current
versus tab (SO
T
–
223, SMBflat-3L) or
lead (TO-92) temperature
I
T(AV)
(A)
P(W)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.2
D.C. (SMBflat-3L)
360°
α
= 180°
D.C. (TO-92)
D.C. (SO
T
–
223)
1.0
0.8
0.6
0.4
0.2
0.0
α
α
= 180° (TO-92)
α
= 180° (SO
T
–
223)
α
= 180° (SMBflat-3L)
I
(A)
T(AV)
T
lead
or T
tab
(°C)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
25
50
75
100
125
Figure 3.
Average and DC on-state current
versus ambient temperature
Figure 4.
Relative variation of thermal
impedance junction to ambient
versus pulse duration
K=[Z
/R
]
th(j-a) th(j-a)
I
T(AV)
(A)
1.00
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
TO-92
D.C. (SO
T
–
223)
SMBflat-3L
D.C. (SMBflat-3L)
D.C. (TO-92)
0.10
0.01
SO
T
–
223
α
= 180° (TO-92)
α
= 180° (SO
T
–
223)
α
= 180° (SMBflat-3L)
T
amb
(°C)
t (s)
p
0
25
50
75
100
125
1.E-02 1.E-01 1.E+00
1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
Doc ID 7480 Rev 4
3/11
Characteristics
X02
Figure 5.
Relative variation of triggering,
holding and latching current versus
junction temperature
Figure 6.
Relative variation of holding
current versus gate-cathode
resistance (typical values)
I
,I ,I [T
] / I
,I ,I [T
=25°C]
GT
H
L
j
GT
H
L
j
1.50
1.25
1.00
0.75
0.50
0.25
0.00
T
y
pical values
I [R
] / I
[R =1k
Ω
]
H GK
H GK
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Tj=25
I
H
& I
L
R
GK
= 1k
Ω
I
GT
R
(k
Ω
)
GK
T (°C)
j
1.E-02
1.E-01
1.E+00
1.E+01
-40 -20
0
20
40
60
80
100 120 140
Figure 7.
Relative variation of dV/dt immunity
Figure 8.
versus gate-cathode resistance
(typical values)
Relative variation of dV/dt immunity
versus gate-cathode capacitance
(typical values)
dV/dt[C ]
/ dV/dt[R
=1k
Ω
]
GK
GK
dV/dt[R ]
/ dV/dt[R
=1k
Ω
]
GK
GK
20
18
16
14
12
10
8
10.0
V
D
= 0.67 x V
DRM
T
j
= 125°C
R
GK
= 1k
Ω
T
j
= 125°C
V
D
= 0.67 x V
DRM
1.0
6
4
2
R
(k
Ω
)
GK
C (nF)
GK
0
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0
2
4
6
8
10
12
14
16
18
20
22
Figure 9.
Surge peak on-state current
versus number of cycles
Figure 10.
Non repetitive surge peak on state
current for a sinusoidal pulse and
2
corresponding value of I
T
I
(A), I
2
t (A
2
s)
I
(A)
TSM
TSM
300
100
25
20
15
10
5
T
j
initial = 25°C
dI/dt limitation
t
p
=10ms
I
TSM
One cycle
Non repetitive
T
j
initial=25°C
10
Repetitive
T
amb
=25°C
I
2
t
Number of cycles
t (ms)
p
1
0
1
10
100
1000
0.01
0.10
1.00
10.00
4/11
Doc ID 7480 Rev 4
X02
Ordering information scheme
Figure 11.
On-state characteristics (maximum
Figure 12.
Thermal resistance junction to
values)
ambient versus copper surface
under tab (SO
T
–
223, SMBflat-3L)
I
(A)
R
(°C/W)
th(j-a)
TM
170
160
150
140
130
120
110
100
90
80
70
60
50
3E+1
1E+1
Epoxy printed circuit board FR4,
copper thickness 35 µm
T
j
max.:
V
t0
=0.9V
R
d
=200m
Ω
T
j
=max
1E+0
1E-1
T
j
=25°C
SMBF3L (typical)
SO
T
–
223
(maximum)
S(cm²)
V (V)
TM
0
1
2
3
4
5
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
2
Ordering information scheme
Figure 13.
Ordering information scheme
X 02 02 M Z
1BA2
Blank
Sensitive SCR series
Current
02 = 1.25 A
Sensitivity
02 = 200 µA
05 = 50 µA
Voltage
M = 600 V
N = 800 V
Package
A = TO-92 (A”Blank”)
N = SO
T
–
223 (N”No Blank”)
UF = SMBF3L
Packing mode
1BA2 = Bulk
2BL2 = Ammopack
5BA4 =
T
a
pe and reel 7” (SO
T
–
223)
Blank =
T
a
pe and reel 13” (SMBflat-3L)
Doc ID 7480 Rev 4
5/11
Package information
X02
3
Package information
●
●
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECO
P
A
CK packages,
depending on their level of environmental compliance. ECO
P
A
CK
®
ECO
P
A
CK is
an ST trademark.
Table 6.
TO-92 dimensions
Dimensions
Millimeters
Min. Typ. Max. Min. Typ. Max.
Ref
Inches
A
A
B
C
D
E
F
a
1.35
0.053
a
4.70
0.185
B
C
2.54
0.100
4.40
0.173
0.500
D
E
F
12.70
3.70
0.50
0.146
0.019
6/11
Doc ID 7480 Rev 4
X02
Package information
Table 7.
SO
T
–
223 dimensions
Dimensions
Millimeters
Ref.
Inches
V
c
A
Min. Typ. Max. Min. Typ. Max.
A1
A
A1
B
1.80
0.071
B
0.02 0.10
0.001 0.004
e1
0.60 0.70 0.85
0.024 0.027 0.033
D
B1 2.90 3.00 3.15
0.114 0.118 0.124
0.24 0.26 0.35
0.009 0.010 0.014
D
(1)
6.30 6.50 6.70
0.248 0.256 0.264
B1
c
4
E
H
e
2.3
0.090
1
2
3
e1
4.6
0.181
E
(1)
3.30 3.50 3.70
0.130 0.138 0.146
e
H
V
6.70 7.00 7.30
0.264 0.276 0.287
10° max
1. Do
not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches)
Figure 14.
SO
T
–
223 footprint
3.25
1.32
5.16
7.80
1.32
2.30
0.95
Doc ID 7480 Rev 4
7/11
Package information
Table 8.
X02
SMBflat-3L dimensions
Dimensions
Millimeters Inches
Min. Typ. Max.
Min. Typ. Max.
Ref.
A
b
0.90
0.35
1.10 0.035
0.65 0.014
2.20 0.07
0.40 0.006
3.95 0.130
5.60 0.201
4.60 0.156
1.50 0.030
0.043
0.026
0.087
0.016
0.156
0.220
0.181
0.059
A
c
b 2x
e
D
b4 1.95
L2 2x
L1
L1
L2
L 2x
c
D
E
0.15
3.30
5.10
E
E1
L
E1 4.05
b4
L
L1
L2
e
0.75
0.40
0.60
1.60
0.016
0.024
0.063
Figure 15.
SMBflat-3L footprint dimensions
5.84
(0.230)
0.51
(0.020)
2.07
(0.082)
2.07
(0.082)
0.51
(0.020)
1.20
3.44
1.20
(0.047)
(0.136)
(0.047)
millimeters
(inches)
8/11
Doc ID 7480 Rev 4
X02
Package information
Figure 16.
Footprint and connectors for SO
T
–
223 or SMBflat-3L (dimensions in mm)
5.84
3.42
3.25
2.92
SO
T
–
223
Solder resist
1.35
1.30
1.20
1.08
1.20
1.08
Solder lands
SMBF3L
SMBF3L
SMBF3L
Solder paste
Connector line
SO
T
–
223
SO
T
–
223
SO
T
–
223
0.85
0.95
1.10
2.30
Doc ID 7480 Rev 4
9/11
Ordering information
X02
4
Ordering information
Table 9.
Order code
X0202MA 1BA2
Ordering information
Marking
Package
Weight
Base qty
Delivery mode
X0202 MA
X0202 MA
X2M
TO-92
TO-92
0.2 g
0.2 g
0.12 g
0.2 g
0.2 g
0.12 g
0.2 g
0.2 g
0.2 g
2500
2000
1000
2500
2000
1000
2500
2000
2500
5000
Bulk
Ammopack
T
a
pe and reel
Bulk
X0202MA 2BL2
X0202MN5BA4
X0202NA 1BA2
X0202NA 2BL2
X0202NN5BA4
X0205MA 1BA2
X0205MA 2BL2
X0205NA 1BA2
X0202NUF
SO
T
–
223
TO-92
X0202 NA
X0202 NA
X2N
TO-92
Ammopack
T
a
pe and reel
Bulk
SO
T
–
223
TO-92
X0205 MA
X0205 MA
X0205 NA
X2N
TO-92
Ammopack
Bulk
TO-92
SMBflat-3L 46.914
mg
T
a
pe and reel
5
Revision history
Table 10.
Document revision history
Date
Revision
Changes
Sep-2000
3
4
Previous issue
Added SMBflat-3L package and ECO
P
ACK statement.
14-Jan-2011
10/11
Doc ID 7480 Rev 4
X02
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Doc ID 7480 Rev 4
11/11
