STMicroelectronics-X0402MB
| Part # | STMicroelectronics-X0402MB |
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X0402MB
Datasheet
4 A Sensitive gate SCR in DPAK package
Features
A2
•
•
•
•
•
•
•
4 A Triac
Sensitive SCR: I
GT
= 200 µA
DRM
/ V
RRM
= 600 V and V
DSM
/ V
RSM
= 750 V
A2
A1
V
G
125 °C maximum junction temperature T
j
DPAK SMD package
DPAK
Halogen-free molding, lead-free plating
ECOPACK2
compliant
Application
•
•
•
Actuators
Product status link
Ignitors
Inrush current limiting circuits
Product summary
Description
I
4 A
T(RMS)
The X04 series is 4 A SCR housed in compact SMD DPAK package. This highly
sensitive device is suited to home appliances or power tools and industrial systems
and drives loads up to 4 A.
V
/V
750 V
200 µA
125 °C
DSM RSM
I
GT
T max.
j
DS14030
–
Rev 1
–
September 2022
For further information contact your local STMicroelectronics sales office.
X0402MB
Characteristics
1
Characteristics
Table 1.
Absolute maximum ratings (limiting values)
Parameter
Symbol
Value
Unit
A
I
T =
114 °C
RMS on-state current (full sine wave)
4
T(RMS)
c
I
T =
114 °C
RMS on-state average current (full sine wave)
2.5
33
30
9
A
T AV
c
t = 8.3 ms
t = 10 ms
Non repetitive surge peak on-state current (full cycle,
T initial
= 25 °C)
j
I
A
TSM
2
2
2
t =
10 ms
p
I t
I t
value for fusing
A s
Critical rate of rise of on-state current, I
= 2 x I
, tr
≤ 100 ns, f = 60 Hz
G
GT
T =
125 °C
dl/dt
/V
50
A/µs
j
V
T =
125 °C
j
Repetitive peak off-state voltage
600
750
V
V
DRM RRM
V
/V
Non Repetitive peak off-state voltage, 10 ms
Maximum peak gate current
DSM RSM
I
1.2
A
GM
t =
20 µs, T
= 125 °C
p
j
P
Maximum gate power dissipation
Storage temperature range
0.5
W
°C
°C
°C
GM
T
-40 to +125
-40 to +125
260
stg
T
Operating junction temperature range
j
T
Maximum lead temperature for soldering during 10 s
L
Table 2.
Electrical characteristics (T
j
= 25 °C, unless otherwise specified)
Symbol
Test conditions
Value
200
0.8
0.1
8
Unit
µA
V
I
Max.
Max.
Min.
GT
V
= 12
V
, R
=
1
40 Ω
L
D
V
GT
V
V
I
= V
, R
= 3.3 kΩ
T =
125 °C
j
V
GD
D
DRM
L
V
RGM
= 10 µA
Max.
Max.
Max.
Min.
V
RG
I
I =
1.2 x I
G GT
6
mA
mA
V/µs
L
I =
500 mA, gate open
T
I
H
5
V
= 67 % V
, R
= 1 kΩ
T =
110 °C
j
10
D
DRM
GK
1. For
both polarities of OUT pin referenced to COM pin.
2. For
both polarities of A2 referenced to A1.
Table 3.
Static characteristics
T
Symbol
Test conditions
= 8 A, t
= 380 µs
Value
1.8
Unit
V
j
V
I
25 °C
Max.
Max.
Max.
TM
p
TM
V
Threshold voltage
Dynamic resistance
125 °C
0.85
V
TO
R
125 °C
25 °C
100
5
mΩ
µA
D
I
/I
V
= V
; V
= V
R
; R
= 1 kΩ
RRM GK
Max.
DRM RRM
D
DRM
125°C
1
mA
1. For
both polarities of A2 referenced to A1.
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X0402MB
Characteristics
Table 4.
Thermal resistance
Parameter
Symbol
Value
3
Unit
°C/W
°C/W
R
Junction to case
Junction to ambient: S
= 0.5 cm²
Max.
Typ.
th(j-c)
R
th(j-a)
70
CU
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X0402MB
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1.
Maximum average power dissipation versus on-
state RMS current
Figure 2.
Average and DC on-state current versus case
temperature
Figure 3.
On-state RMS current versus ambient
temperature (full cycle)
Figure 4.
Relative variation of thermal impedance versus
pulse duration
Figure 5.
Relative variation of gate triggering current and
voltage versus junction temperature (typical values)
Figure 6.
Surge peak on-state current versus number of
cycles
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X0402MB
Characteristics (curves)
Figure 7.
Non repetitive surge peak on-state current for a
sinusoidal pulse with width t
p
< 10 ms and corresponding
Figure 8.
On-state characteristics (maximum values)
value of I²t
Figure 9.
Relative variation of static dV/dt immunity
versus gate-to-cathode resistance (typical values)
Figure 10.
Relative variation of static dV/dt immunity
versus gate-to-cathode capacitance (typical values)
Figure 12.
Thermal resistance junction to ambient versus
copper surface under tab (typical values)
Figure 11.
Relative variation of static dV/dt immunity
versus junction temperature
R
th(j-a)
(°C/W)
100
DPAK
90
80
70
60
50
40
30
20
10
0
S
Cu
(cm²)
35
0
5
10
15
20
25
30
40
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X0402MB
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
2.1
DPAK package information
•
Molding compouned resin is halogen free and meets UL94 flammability standard, level V0
•
Lead-free package leads plating
Figure 13.
DPAK package outline
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X0402MB
DPAK package information
Table 5.
DPAK package mechanical data
Dimensions
Ref.
Millimeters
Min.
2.20
0.90
0.00
0.72
5.13
0.47
0.47
6.00
5.15
6.50
4.70
2.186
9.80
1.40
Typ.
2.30
1.01
Max.
2.38
1.10
0.10
0.85
5.46
0.60
0.60
6.20
5.65
6.70
5.00
2.386
10.40
1.70
Min.
Typ.
Max.
A
A1
A2
b
0.0866
0.0354
0.0000
0.0283
0.2020
0.0185
0.0185
0.2362
0.2028
0.2550
0.1850
0.0860
0.3858
0.0551
0.0906
0.0398
0.0937
0.0433
0.0039
0.335
b4
c
5.33
0.2098
0.2150
0.0236
0.0236
0.2441
0.2224
0.2638
0.1969
0.0940
0.4094
0.0669
c2
D
6.10
5.40
0.2402
0.2126
D1
E
6.60
0.2598
E1
e
4.85
0.1909
2.286
10.10
1.50
0.0900
H
0.3976
L
0.0591
L1
L2
L3
L4
L6
ϴ1
ϴ2
V2
2.90 REF
0.1142 REF
0.90
0.60
1.25
1.00
0.0354
0.0236
0.0492
0.0394
0.51 BSC
0.80
0.201 BSC
0.0315
0.0709 BSC
7°
1.80 BSC
7°
5°
5°
0°
9°
9°
8°
5°
5°
0°
9°
9°
8°
7°
7°
1. Dimensions
in inches are given for reference only
Note:
This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
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X0402MB
DPAK package information
Figure 14.
DPAK recommended footprint (dimensions are in mm)
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X0402MB
Ordering information
3
Ordering information
Figure 15.
Ordering information scheme
Table 6.
Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
X0402MB
X0402MB
DPAK
0.3 g
2500
T
a
pe and reel
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Rev 1
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X0402MB
Revision history
Table 7.
Document revision history
Date
06-Sep-2022
Revision
Changes
1
Initial release.
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X0402MB
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