STMicroelectronics-Z0110MN-5AA4
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Z01
Datasheet
Standard 1 A Triacs
A2
A1
Features
•
•
•
On-state rms current, I
T(RMS)
1 A
Repetitive peak off-state voltage, V
DRM/VRRM
600 or 800 V
Triggering gate current, I
GT (Q1)
3 to 25 mA
G
A2
Applications
A1
•
•
AC switching
A2
G
A1
Home appliances
G
A2
SOT-223
TO-92
Description
devices are typically used in applications such as home appliances (electrovalve,
pump, door lock, small lamp control), fan speed controllers,…
A2
A1
G
Different gate current sensitivities are available, allowing optimized performance
when driven directly through microcontroller.
SMBflat-3L
Product status link
Product summary
I
1 A
T(RMS)
V
/V
600, 800 V
3 to 25 mA
DRM RRM
I
GT
standard
DS2116
–
Rev 11
–
May 2019
For further information contact your local STMicroelectronics sales office.
Z01
Characteristics
1
Characteristics
Table 1.
Absolute maximum ratings
Symbol
Parameters
Value
Unit
T
= 90 °C
SOT-223
tab
I
T =
50 °C
L
RMS on-state current (full sine wave)
TO-92
1
A
T(RMS)
T
= 107 °C
SMBflat-3L
F = 50 Hz
F = 60 Hz
tab
t =
20 ms
8
Non repetitive surge peak on-state current
p
I
A
TSM
(full cycle, T
initial = 25 °C)
t =
16.7 ms
p
j
8.5
0.35
2
2
2
t =
10 ms
p
I t
I t
value for fusing
A s
Critical rate of rise of on-state current
T =
125 °C
j
dl/dt
F = 120 Hz
20
A/µs
I
G
= 2 x I
, t
≤ 100 ns
GT r
I
t =
20 µs
p
T =
125 °C
j
Peak gate current
1
A
GM
P
T =
125 °C
j
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
1
W
°C
°C
G(AV)
T
-40 to +150
-40 to +125
stg
T
j
Table 2.
Electrical characteristics (T
j
= 25 °C, unless otherwise specified)
Value
Symbol
Parameters
Quadrant
Z01
Unit
03
3
07
5
09
10
10
10
25
25
I – II – III
IV
I
Max.
mA
GT
V
V
= 12
V
, R
=
3
0 Ω
5
7
D
L
V
All
Max.
Min.
1.3
0.2
V
V
GT
V
= V
, R
= 3.3 kΩ, T
= 125 °C
All
GD
D
DRM
L
j
I =
50 mA
I
Max.
Max.
Max.
Min.
7
7
10
10
20
20
10
15
25
50
25
25
mA
T
H
I – III – IV
II
I
I =
1.2 I
G GT
mA
L
15
10
50
V
= 67 % V
gate open, T
= 110 °C
100
V/µs
V/µs
D
DRM
j
(dI/dt)c = 0.44 A/ms, T
= 110 °C
Min.
0.5
1
2
5
j
1. Minimum
I is
guaranteed at 5 % of I
max.
GT
GT
2. For
both polarities of A2 referenced to A1
DS2116
–
Rev 11
page 2/16
Z01
Characteristics
Table 3.
Static electrical characteristics
Test conditions
T
Symbol
Value Unit
j
V
I
= 1.4 A, t
= 380 µs
p
25 °C
Max. 1.60
Max. 0.95
V
TM
T
V
Threshold on-state voltage
Dynamic resistance
125 °C
125 °C
25 °C
V
TO
R
d
Max.
Max.
400
5
mΩ
µA
mA
I
I
DRM
RRM
V
= V
RRM
DRM
125 °C
0.5
1. For
both polarities of A2 referenced to A1
Table 4.
Thermal resistance
Parameters
Max.
value
Symbol
Unit
SOT-223
SMBflat-3L
TO-92
25
14
R
R
Max. junction to tab (AC)
Max. junction to lead (AC)
th(j-t)
60
th(j-l)
°C/W
SOT-223
SMBflat-3L
TO-92
60
Junction to ambient
R
th(j-a)
75
150
1. Copper
surface under tab.
DS2116
–
Rev 11
page 3/16
Z01
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1.
Maximum power dissipation versus on-state
RMS current (full cycle)
Figure 2.
RMS on-state current versus lead (TO-92) or tab
(SOT-223, SMBflat-3L) temperature (full cycle)
P(W)
I
(A)
T(RMS)
1.50
1.2
1.0
0.8
0.6
0.4
0.2
0.0
α
=
180
°
SMBflat-3L
1.25
1.00
0.75
0.50
0.25
0.00
SO
T
–
223
TO-92
180°
(°C)
75
I
(A)
T
or T
lead tab
T(RMS)
0
25
50
100
125
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Figure 4.
Relative variation of thermal impedance versus
pulse duration (Z
th(j-a)
Figure 3.
On-state rms current versus ambient
temperature(free air convection full cycle)
)
K=[Z
/R
]
th(j-a) th(j-a)
I
(A)
T(RMS)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.00
Z01xxA
R
= 60°C/W
(SO
T
–
223)
Z01xxMUF
Copper surface area
= 5c
m
²
th(j-a)
R
th (j-a)
= 10
0
°
C/W
(SMBflat-3L)
0.10
Z01xxN
R
= 150°C/W
th(j-a)
(TO-92)
t (s)
p
T
(°C)
amb
0.01
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
0
25
50
75
100
125
DS2116
–
Rev 11
page 4/16
Z01
Characteristics (curves)
Figure 6.
Relative variation of gate trigger current (I
GT
and voltage (V
GT
) versus junction temperature
)
Figure 5.
Relative variation of holding current and
latching current versus junction temperature (typ. values)
I
GT
,
V
GT
[
T
j
]
/
I
GT
,
V
GT
[
T
j
=2
5
°
C
]
3.0
I ,
I
[
T]
/
I ,
I
[
T
=
25°C]
H
L
j
H
L
j
2.5
2.0
1.5
1.0
0.5
0.0
2.5
I
GT
Q1-Q2
I
GT
Q3
2.0
I
GT
Q4
1.5
V
GT
Q1-Q2-Q3-Q4
1.0
I
L
I
H
0.5
T (°C)
j
T
j
(°C)
0.0
-50
-50
-25
0
25
50
75
100
125
-25
0
25
50
75
100
125
Figure 8.
Non-repetitive surge peak on-state current and
corresponding value of I
2
t sinusoidal pulse width
Figure 7.
Surge peak on-state current versus number of
cycles
I
TSM
(A)
9
2
2
I
(A), I
t (A
s
)
TSM
100. 0
10. 0
1
.
0
T initial = 25°C
j
8
dI/dt limitation:
20A/µs
T = 20 ms
7
I
TSM
One c
y
c
l
e
Non repetitive
6
T
j
initial = 25 °C
5
4
3
2
I t
2
Repetitive
T
amb
= 95 °C
1
0
t
(
m
s
)
p
0
.
1
0
.
0
1
Number of cycles
1000
0
.
1
0
1
.
0
0
10. 00
1
10
100
Figure 9.
On-state characteristics (maximum values) (I
TM
Figure 10.
Relative variation of critical rate of decrease of
main current (dI/dt) versus junction temperature
= f(V
TM
)
I
(A)
TM
(dI/d
t
)
c [(
d
V
/d
t
)
c] / Specifie d (dI/d
t
)
c
10.0
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
T
j
= T max.
j
1.0
0.8
T
j
=max.
V
t0
=0.95 V
R
d
=400 mΩ
Z0109
Z0103
0.6
T
j
= 25°C
0.4
0.2
0.0
Z0107
Z0110
(dV/d
t
)
c (V/µ
s
)
V
(V)
TM
0.1
0.1
1 .0
10.0
100.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
DS2116
–
Rev 11
page 5/16
Z01
Characteristics (curves)
Figure 11.
Relative variation of critical rate of decrease of
main current (dI/dt) versus junction temperature
Figure 12.
SOT-223 and SMBflat-3L thermal resistance
junction to ambient versus copper surface under case
R
th(j-
a
)
(
°
C/W)
170
(dI/d
t
)
c [T ] / (dI/d
t
)
c [T
S
p
e
c
ifie d]
j
j
6
5
4
3
2
1
0
160
150
140
130
SMBflat-3L
120
110
100
90
SOT223
80
70
60
T (°C)
j
S
C
U
(
c
m²)
50
0
25
50
75
100
125
0
1
2
5
3
4
Figure 13.
Relative variation of static dV/dt immunity versus junction temperature (gate open)
dV/dt [ T
j
] /
dV/dt [ T
j
=125 °C]
6
V
D
=V
R
=402V
5
4
3
2
1
T
j
(°C)
125
0
25
50
75
100
DS2116
–
Rev 11
page 6/16
Z01
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
2.1
SOT-223 package information
•
•
Epoxy meets UL94, V0
Lead free plating + halogen-free molding resin
Figure 14.
SOT-223 package outline
V
c
A
A1
B
e1
D
B1
4
2
E
H
1
3
e
DS2116
–
Rev 11
page 7/16
Z01
SOT-223 package information
Table 5.
SOT-223 package mechanical data
Dimensions
Ref.
Millimeters
Typ.
Min.
Max.
1.80
0.10
0.85
3.15
0.35
6.70
Min.
Typ.
Max.
A
A1
B
0.0709
0.0039
0.0335
0.1240
0.0138
0.2638
0.02
0.70
3.00
0.26
6.50
2.3
0.0008
0.0276
0.1181
0.0102
0.2559
0.0906
0.1811
0.1378
0.2756
0.60
2.90
0.24
6.30
0.024
0.114
0.009
0.248
B1
c
D
e
e1
E
4.6
3.30
6.70
3.50
7.00
3.70
7.30
0.130
0.264
0.1457
0.2874
H
V
10° max.
1. Inches
only for reference
Figure 15.
SOT-223 footprint (dimensions in mm)
3.25
1.32
5.16
7.80
1.32
2.30
0.95
DS2116
–
Rev 11
page 8/16
Z01
TO-92 package information
2.2
TO-92 package information
•
Epoxy meets UL94, V0
•
Lead free plating + halogen-free molding resin
Figure 16.
TO-92 package outline
c
A
a
b
B
C
D
E
F
Table 6.
TO-92 package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
Max.
Min.
Typ.
Max.
A
B
C
D
E
F
a
1.35
0.0531
4.70
0.1850
2.54
0.1000
4.40
0.1732
0.5000
12.70
3.70
0.50
0.1457
0.0197
b
1.27
0.500
c
0.48
0.0189
1. Inches
dimensions given for information
DS2116
–
Rev 11
page 9/16
Z01
SMBflat-3L package information
2.3
SMBflat-3L package information
•
Epoxy meets UL94, V0
•
Lead-free package
Figure 17.
SMBflat-3L package outline
A
c
e
D
b 2x
L2 2x
L 2x
L1
L1
L2
E
E1
L
b4
Table 7.
SMBflat-3L mechanical data
Dimensions
Ref.
Millimeters
Inches
Min.
Typ.
Max.
1.10
0.65
2.20
0.40
3.95
5.60
4.60
1.50
Min.
0.035
0.014
0.070
0.005
0.129
0.200
0.159
0.029
Typ.
Max.
0.044
0.026
0.087
0.016
0.156
0.221
0.182
0.060
A
b
0.90
0.35
1.95
0.15
3.30
5.10
4.05
0.75
b4
c
D
E
E1
L
L1
L2
e
0.40
0.60
1.60
0.016
0.024
0.063
DS2116
–
Rev 11
page 10/16
Z01
SMBflat-3L package information
Figure 18.
Footprint recommendations, dimensions in mm (inches)
5.84
(0.230)
0.51
(0.020)
2.07
2.07
(0.082)
(0.082)
0.51
(0.020)
1.20
3.44
1.20
(0.047)
(0.136)
(0.047)
m
i
l
li me
t
e
rs
(in
c
h
e
s
)
Figure 19.
Footprint and connectors for SOT-223 or SMBflat-3L (dimensions in mm)
5.84
3.42
3.25
2.92
SO
T
–
223
Solder resist
1.35
1.30
1.20
1.08
1.20
1.08
Solder lands
SMBF3L
SMBF3L
SMBF3L
Solder paste
Connector lin
e
SO
T
–
223
SO
T
–
223
SO
T
–
223
0.85
0.95
1.10
2.30
DS2116
–
Rev 11
page 11/16
Z01
Ordering information
3
Ordering information
Figure 20.
Ordering information scheme
Z 01 03 M A [BLANK] 1AA2
Triac series
Current
01 = 1 A
Sensitivity
03 = 3 mA
07 = 5 mA
09 = 10 mA
10 = 25 mA
Voltage
M = 600 V
N = 800 V
Pac
k
a
ge
A = TO-92
N = SO
T
–
223
UF = SMBflat-3L
BLANK = Check
T
a
ble 9. Ordering information
Packing mode
1AA2 = TO-92 bulk
2AL2 = TO-92 ammopack
5AL2 = TO-92 tape and reel
5AA4 = SO
T
–
223 tape and reel 7”
6AA4 = SO
T
–
223 tape and reel 13”
Blank = SMBflat-3L tape and reel 13”
DS2116
–
Rev 11
page 12/16
Z01
Product selector
3.1
Product selector
Table 8.
Product selector
Sensitivity
Part Number
Type
Package
600
800
Z0103MA
Z0103MN
Z0107MA
Z0107MN
Z0109MA
Z0109MN
Z0110MA
Z0110MN
Z0103MUF
Z0107MUF
Z0109MUF
Z0103NA
Z0103NN
Z0107NA
Z0107NN
Z0109NA
Z0109NN
Z0110NA
Z0110NN
TO-92
SOT-223
TO-92
3 mA
5 mA
SOT-223
TO-92
10 mA
25 mA
Standard
SOT-223
TO-92
SOT-223
3 mA
5 mA
SMBflat-3L
10 mA
DS2116
–
Rev 11
page 13/16
Z01
Ordering information
3.2
Ordering information
Table 9.
Ordering information
Z01xxyA 1AA2
Z01xxyA 2AL2
Z01xxyA 5AL2
Z0103yN 5AA4
Z0103MN 6AA4
Z0107yN 5AA4
Z0107MN 6AA4
Z0109yN 5AA4
Z0109NN6AA4
Z0103MUF
Package
Weight
Base qty.
2500
2000
2000
1000
4000
1000
4000
1000
4000
5000
5000
5000
Delivery mode
Bulk
Z01xxyA
TO-92
0.2 g
Ammopack
Z3y
Z3M
Z7y
SOT-223
0.12 g
Z7M
Z9y
T
a
pe and reel
Z9N
Z3M
Z7M
Z9M
Z0107MUF
SMBflat-3L
46.78 mg
Z0109MUF
DS2116
–
Rev 11
page 14/16
Z01
Revision history
Table 10.
Document revision history
Date
Revision
Changes
Oct-2001
4
5
Last update.
10-Feb-2005
Package: TO-92 tape and reel delivery mode 5AL2 added.
T
a
ble 4 on page 2: typo. mistake corrected
1. (dV/dt)c instead of (dI/dt)c
09-May-2005
6
7
2. V/μs unit instead of A/ms
Reformatted to current standard.
T
a
ble 2 on page 2: Typo corrected. Values
for IGT split into two separate rows.
21-Apr-2006
T
a
ble 2: modified test conditions for (dV/dt)c. Changed “ambient” to “lead or
tab” in Figure 2.
10-Oct-2010
20-Oct-2010
8
9
Package: SOT-223 13” tape and reel added = 6AA4.
Added package SMBflat-3L. Updated dimensions in
T
a
ble 6.
14-Dec-2010
02-May-2019
10
11
Updated Figure 3 and Figure 12. Updated
T
a
ble 5: Product Selector.
Minor text changed.
DS2116
–
Rev 11
page 15/16
Z01
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.
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DS2116
–
Rev 11
page 16/16
