STMicroelectronics-Z0409MB

Part #STMicroelectronics-Z0409MB
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STMicroelectronics-Z0409MB
Z0409MB  
Datasheet  
4 A – Triac in DPAK package  
Features  
A2  
•
•
•
•
•
•
•
4 A Triac  
V

DRM

/ V

RRM

= 600 V and V

DSM

/ V

RSM

= 750 V  
125 °C maximum junction temperature T

j  

DPAK package  
A2  
A1  
G
4 quadrants triacs with I

GT

= 10 mA  
Halogen-free molding, lead-free plating  

ECOPACK2

compliant  
DPAK  
Applications  
•
•
•
Description  
The Z0409MB series is 4 A Triac housed in compact SMD DPAK. This 4 quadrants  
device is suited to home appliances or power tools and industrial systems and drives  
loads up to 4 A.  
Product status link  
Product summary  
I
4 A  
T(RMS)  
V
/V  
750 V  
10 mA  
125 °C  
DSM RSM  
I
GT  
T max.  
j
DS14022
–
Rev 1
–
September 2022  
For further information contact your local STMicroelectronics sales office.  

Z0409MB  
Characteristics  
1
Characteristics  
Table 1.
Absolute maximum ratings (limiting values)  
Parameter  
Symbol  
Value  
4
Unit  
I
T =
 
107 °C  
RMS on-state current (full sine wave)  
A
T(RMS)  
c
t = 16.7 ms  
t = 20 ms  
16  
Non repetitive surge peak on-state current (full cycle,  
T initial
 
= 25 °C)  
j
I
A
TSM  
15  
2
2
2
t =
 
10 ms  
p
1.5  
I t  
I t
 
value for fusing  
A s  
Critical rate of rise of on-state current, I
 
= 2 x I
 
, tr  
≤ 100 ns, f = 120 Hz  
G
GT  
T =
 
125 °C  
dl/dt  
/V  
50  
A/µs  
j
V
T =
 
125 °C  
j
Repetitive peak off-state voltage  
600  
750  
V
V
DRM RRM  
V
/V  
Non Repetitive peak off-state voltage, 10 ms  
Maximum peak gate current  
DSM RSM  
I
1.2  
A
GM  
t =
 
20 µs, T
 
= 125 °C  
p
j
P
Maximum gate power dissipation  
Storage temperature range  
0.5  
W
°C  
°C  
°C  
GM  
T
-40 to +125  
-40 to +125  
260  
stg  
T
Operating junction temperature range  
j
T
Maximum lead temperature for soldering during 10 s  
L
Table 2.
Electrical characteristics (T

j

= 25 °C, unless otherwise specified)  
Symbol  
Test conditions  
Value  
10  
Unit  
mA  
V
V
V
V
= 12
V
, R
 
=
3
3 Ω  
I
Max.  
Max.  
D
D
D
L
GT  
V
= 12 V, R
 
= 33 Ω  
1.3  
GT  
L
V
= V  
, R
 
= 3.3 kΩ  
T =
 
125 °C  
Min.  
Max.  
Max.  
Max.  
0.2  
15  
25  
10  
V
GD  
DRM  
L
j
I-III-IV  
II  
mA  
mA  
mA  
I
I =
 
1.2 x I  
G GT  
L
I =
 
500 mA, gate open  
T
I
H
dV/dt

(dV/dt)c

V
= 67 % V  
; V
 
= 67 % V  
, gate open
 
T =
 
110 °C  
Min.  
Min.  
100  
2
V/µs  
V/µs  
D
DRM  
R
RRM  
j
T =
 
110 °C  
j
(dI/dt)c = 1.8 A/ms  
1. For
 
both polarities of OUT pin referenced to COM pin.  
2. For
 
both polarities of A2 referenced to A1.  
Table 3.
Static characteristics  
T
Symbol  
Test conditions  
= 5.5 A, t
 
= 380 µs  
Value  
2
Unit  
V
j
V
I
25 °C  
Max.  
Max.  
Max.  
TM  
p
TM  
V
Threshold voltage  
Dynamic resistance  
125 °C  
0.95  
V
TO  
R
125 °C  
25 °C  
180  
5
mΩ  
µA  
D
I
/I  
V
= V
 
= V  
= V  
DRM RRM  
Max.  
DRM RRM  
D
R
125°C  
0.5  
mA  
1. For
 
both polarities of A2 referenced to A1.  
DS14022
–
Rev 1  
page 2/11  
 
 
 

Z0409MB  
Characteristics  
Table 4.
Thermal resistance  
Parameter  
Symbol  
Value  
3
Unit  
°C/W  
°C/W  
R
Junction to case (AC)  
Junction to ambient: S
 
= 0.5 cm²  
Max.  
Typ.  
th(j-c)  
R
th(j-a)  
70  
CU  
DS14022
–
Rev 1  
page 3/11  

Z0409MB  
Characteristics (curves)  
1.1  
Characteristics (curves)  
Figure 1.
Maximum power dissipation versus on-state  
RMS current (full cycle)  
Figure 2.
Average and DC on-state current versus case  
temperature  
Figure 3.
On-state RMS current versus ambient  
temperature (full cycle)  
Figure 4.
Relative variation of thermal impedance versus  
pulse duration  
Figure 5.
Relative variation of gate triggering current and  
voltage versus junction temperature (typical values)  
Figure 6.
Surge peak on-state current versus number of  
cycles  
DS14022
–
Rev 1  
page 4/11  

Z0409MB  
Characteristics (curves)  
Figure 7.
Non repetitive surge peak on-state current for a  
sinusoidal pulse with width t

p

< 10 ms and corresponding  
Figure 8.
On-state characteristics (maximum values)  
value of I²t  
Figure 9.
Relative variation of critical rate of decrease of
 
Figure 10.
Relative variation of critical rate of decrease of  
main current versus (dV/dt)c (typical values)  
main current versus junction temperature  
Figure 12.
Thermal resistance junction to ambient versus  
copper surface under tab (typical values)  
Figure 11.
Relative variation of static dV/dt immunity  
versus junction temperature  
R

th(j-a)

(°C/W)  
100  
DPAK  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
S

Cu

(cm²)  
35  
0
5
10  
15  
20  
25  
30  
40  
DS14022
–
Rev 1  
page 5/11  

Z0409MB  
Package information  
2
Package information  
In order to meet environmental requirements, ST offers these devices in different grades of

packages,  
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product  
status are available at:

. ECOPACK is an ST trademark.  
2.1  
DPAK package information  
•
Molding compouned resin is halogen free and meets UL94 flammability standard, level V0  
•
Lead-free package leads plating  
Figure 13.
DPAK package outline  
DS14022
–
Rev 1  
page 6/11  

Z0409MB  
DPAK package information  
Table 5.
DPAK package mechanical data  
Dimensions  
Inches

Ref.  
Millimeters  
Min.  
2.20  
0.90  
0.00  
0.72  
5.13  
0.47  
0.47  
6.00  
5.15  
6.50  
4.70  
2.186  
9.80  
1.40  
Typ.  
2.30  
1.01  
Max.  
2.38  
1.10  
0.10  
0.85  
5.46  
0.60  
0.60  
6.20  
5.65  
6.70  
5.00  
2.386  
10.40  
1.70  
Min.  
Typ.  
Max.  
A
A1  
A2  
b
0.0866  
0.0354  
0.0000  
0.0283  
0.2020  
0.0185  
0.0185  
0.2362  
0.2028  
0.2550  
0.1850  
0.0860  
0.3858  
0.0551  
0.0906  
0.0398  
0.0937  
0.0433  
0.0039  
0.335  
b4  
c
5.33  
0.2098  
0.2150  
0.0236  
0.0236  
0.2441  
0.2224  
0.2638  
0.1969  
0.0940  
0.4094  
0.0669  
c2  
D
6.10  
5.40  
0.2402  
0.2126  
D1  
E
6.60  
0.2598  
E1  
e
4.85  
0.1909  
2.286  
10.10  
1.50  
0.0900  
H
0.3976  
L
0.0591  
L1  
L2  
L3  
L4  
L6  
ϴ1  
ϴ2  
V2  
2.90 REF  
0.1142 REF  
0.90  
0.60  
1.25  
1.00  
0.0354  
0.0236  
0.0492  
0.0394  
0.51 BSC  
0.80  
0.201 BSC  
0.0315  
0.0709 BSC  
7°  
1.80 BSC  
7°  
5°  
5°  
0°  
9°  
9°  
8°  
5°  
5°  
0°  
9°  
9°  
8°  
7°  
7°  
1. Dimensions
 
in inches are given for reference only  
Note:  
This package drawing may slightly differ from the physical package. However, all the specified dimensions are  
guaranteed.  
DS14022
–
Rev 1  
page 7/11  
 

Z0409MB  
DPAK package information  
Figure 14.
DPAK recommended footprint (dimensions are in mm)  
DS14022
–
Rev 1  
page 8/11  

Z0409MB  
Ordering information  
3
Ordering information  
Figure 15.
Ordering information scheme  
Table 6.
Ordering information  
Order code  
Marking  
Package  
Weight  
Base qty.  
Delivery mode  
Z0409MB  
Z0409MB  
DPAK  
0.3 g  
2500  
T
a
pe and reel  
DS14022
–
Rev 1  
page 9/11  

Z0409MB  
Revision history  
Table 7.
Document revision history  
Date  
05-Sep-2022  
Revision  
Changes  
1
Initial release.  
DS14022
–
Rev 1  
page 10/11  

Z0409MB  
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T
.
F
or additional information about ST trademarks, refer to

. All other product or service names  
are the property of their respective owners.  
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.  
© 2022 STMicroelectronics – All rights reserved  
DS14022
–
Rev 1  
page 11/11