STMicroelectronics-Z0410MH
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Z0410MH
Datasheet
4 A – Triac in IPAK package
Features
A2
•
•
•
•
•
•
•
4 A Triac
V
DRM
/ V
RRM
= 600 V and V
DSM
/ V
RSM
= 750 V
125 °C maximum junction temperature T
j
IPAK package
A1
A2
G
4 quadrants triacs with I
GT
= 25 mA
Halogen-free molding, lead-free plating
ECOPACK2
compliant
IPAK
Applications
•
•
•
Product status link
Product summary
Description
I
4 A
T(RMS)
The Z0410MH series is 4 A Triac housed in compact through-hole IPAK package.
This 4 quadrants device is suited to home appliances or power tools and industrial
systems and drives loads up to 4 A.
V
/V
750 V
25 mA
125 °C
DSM RSM
I
GT
T max.
j
DS14061
–
Rev 1
–
September 2022
For further information contact your local STMicroelectronics sales office.
Z0410MH
Characteristics
1
Characteristics
Table 1.
Absolute maximum ratings (limiting values)
Parameter
Symbol
Value
4
Unit
I
T =
107 °C
RMS on-state current (full sine wave)
A
T(RMS)
c
t = 16.7 ms
t = 20 ms
16
Non repetitive surge peak on-state current (full cycle,
T initial
= 25 °C)
j
I
A
TSM
15
2
2
2
t =
10 ms
p
1.5
I t
I t
value for fusing
A s
Critical rate of rise of on-state current, I
= 2 x I
, tr
≤ 100 ns, f = 120 Hz
G
GT
T =
125 °C
dl/dt
/V
50
A/µs
j
V
T =
125 °C
j
Repetitive peak off-state voltage
600
750
V
V
DRM RRM
V
/V
Non Repetitive peak off-state voltage, 10 ms
Maximum peak gate current
DSM RSM
I
1.2
A
GM
t =
20 µs, T
= 125 °C
p
j
P
Maximum gate power dissipation
Storage temperature range
0.5
W
°C
°C
°C
GM
T
-40 to +125
-40 to +125
260
stg
T
Operating junction temperature range
j
T
Maximum lead temperature for soldering during 10 s
L
Table 2.
Electrical characteristics (T
j
= 25 °C, unless otherwise specified)
Symbol
Test conditions
Value
25
Unit
mA
V
V
V
V
= 12
V
, R
=
3
3 Ω
I
Max.
Max.
D
D
D
L
GT
V
= 12 V, R
= 33 Ω
1.3
GT
L
V
= V
, R
= 3.3 kΩ
T =
125 °C
Min.
Max.
Max.
Max.
0.2
25
50
25
V
GD
DRM
L
j
I-III-IV
II
mA
mA
mA
I
I =
1.2 x I
G GT
L
I =
500 mA, gate open
T
I
H
V
= 67 % V
; V
= 67 % V
, gate open
T =
110 °C
Min.
Min.
200
5
V/µs
V/µs
D
DRM
R
RRM
j
T =
110 °C
j
(dI/dt)c = 1.8 A/ms
1. For
both polarities of OUT pin referenced to COM pin.
2. For
both polarities of A2 referenced to A1.
Table 3.
Static characteristics
T
Symbol
Test conditions
= 5.5 A, t
= 380 µs
Value
2
Unit
V
j
V
I
25 °C
Max.
Max.
Max.
TM
p
TM
V
Threshold voltage
Dynamic resistance
125 °C
0.95
V
TO
R
125 °C
25 °C
180
5
mΩ
µA
D
I
/I
V
= V
= V
= V
DRM RRM
Max.
DRM RRM
D
R
125°C
0.5
mA
1. For
both polarities of A2 referenced to A1.
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Rev 1
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Z0410MH
Characteristics
Table 4.
Thermal resistance
Parameter
Symbol
Value
3
Unit
°C/W
°C/W
R
Junction to case (AC)
Junction to ambient
Max.
Typ.
th(j-c)
R
th(j-a)
70
DS14061
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Rev 1
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Z0410MH
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1.
Maximum power dissipation versus on-state
RMS current (full cycle)
Figure 2.
Average and DC on-state current versus case
temperature
Figure 3.
On-state RMS current versus ambient
temperature (full cycle)
Figure 4.
Relative variation of thermal impedance versus
pulse duration
Figure 5.
Relative variation of gate triggering current and
voltage versus junction temperature (typical values)
Figure 6.
Surge peak on-state current versus number of
cycles
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Rev 1
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Z0410MH
Characteristics (curves)
Figure 7.
Non repetitive surge peak on-state current for a
sinusoidal pulse with width t
p
< 10 ms and corresponding
Figure 8.
On-state characteristics (maximum values)
value of I²t
Figure 9.
Relative variation of critical rate of decrease of
Figure 10.
Relative variation of critical rate of decrease of
main current versus (dV/dt)c (typical values)
main current versus junction temperature
Figure 11.
Relative variation of static dV/dt immunity versus junction temperature
DS14061
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Z0410MH
Ordering information
2
Ordering information
Figure 12.
Ordering information scheme
Table 5.
Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
Z0410MH
Z0410MH
IPAK
0.31 g
75
Tube
DS14061
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Rev 1
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Z0410MH
Package information
3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
3.1
IPAK package information
•
Molding compouned resin is halogen free and meets UL94 flammability standard, level V0
•
Lead-free package leads plating
Figure 13.
IPAK package outline
DS14061
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Z0410MH
IPAK package information
Table 6.
IPAK package mechanical data
Dimensions
Ref.
MillimetersInches (for reference only)
Min.
2.20
0.90
0.64
Typ.
Max.
2.40
1.10
0.90
0.95
5.43
Min.
Typ.
Max.
0.094
0.035
0.035
0.037
A
A1
b
0.086
0.025
b2
b4
B5
c
5.20
0.30
0.012
0.45
0.46
6
0.60
0.60
6.20
6.65
c2
D
E
6.40
0.252
0.173
0.262
0.181
e
2.28
0.090
0.634
e1
H
4.40
4.60
16.10
L
9
9.60
1.20
1.25
0.354
0.031
0.377
0.047
0.049
L1
L2
V1
0.8
0.80
10°
0.031
10°
DS14061
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Rev 1
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Z0410MH
Revision history
Table 7.
Document revision history
Date
05-Sep-2022
Revision
Changes
1
Initial release.
DS14061
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Z0410MH
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