Sunltech-Tech-SMW4015S251KTT

SMW4015 Series  

Style and Dimensions (mm)  

A

B

C

D

E

4.00

±

0.2  

4.00

±

0.2  

1.60 Max  

1.55 Typ  

1.40 Typ  

Electrical Characteristics  

DCR  

(

Ω）  

DC Current  

Z

（Ω）  

Common Mode  

Impedance Impedance  

Rated  

Voltage  

Vdc  

In sulation  

Resistance d

 

Voltage  

IR Vdc  

Withstan  

（

A

）  

P/N  

±

40%  

Max  

at 10MHz  

at 100MHz  

（

V

）

Typ

（

M

Ω）

Min

（

V

）

Typ  

SMW4015S101NTT  

SMW4015S251KTT  

SMW4015S401KTT  

SMW4015S501KTT  

SMW4015S601KTT  

SMW4015S851KTT  

SMW4015S102KTT  

10

±

40%  

100 Typ  

0.016  

0.024  

0.03  

0.03  

0.03  

0.04  

0.04  

0.06  

0.075  

0.12  

3.1  

2.6  

2.1  

2.1  

2.0  

2.0  

2.0  

1.5  

1.4  

1.1  

60  

60  

60  

60  

60  

60  

60  

60  

60  

60  

10  

10  

10  

10  

10  

10  

10  

10  

10  

10  

150  

150  

150  

150  

150  

150  

150  

150  

150  

150  

25

±

40%  

38

±

40%  

50

±

40%  

53

±

40%  

65

±

40%  

65

±

40%  

250 Typ  

400 Typ  

500 Typ  

600 Typ  

850 Typ  

1000 Typ  

1700 Typ  

2400 Typ  

2200 Typ  

SMW4015S172HTT 100

±

40%  

SMW4015S242HTT 120

±

40%  

SMW4015S302HTT 180

±

40%  

※

Operating temperature : -40 to +105

℃

 

Storage temp. and humidity: Less than 40

℃

and 60% RH

.

 

Typical Heat Rating DC Current would cause an approximately

△

T of 40

℃  

If Use Wave soldering is there will be some risk  

Re-flow soldering temperatures below 240 degrees, there will be unwitting risk  

Solder standard according to IPC-A-610D 8.2.1 Chip Components – Bottom Only Terminations  

Pag

e

1

o

f 8  

Rev.02  

SMW4015 Series  

Performance Curves  

Pag

e

2

o

f 8  

Rev.02  

SMW4015 Series  

※

In operating temperature exceeding +85

℃

, derating of current Is necessary for PCN4015 series. Please apply  

the derating curve shown in chart according to the operating temperature

.  

Pag

e

3

o

f 8  

Rev.01  

SMW4015 Series  

Mechanical Performance  

No.  

1

Item  

Specifications  

Test Method  

Appearance and  

Dimensions  

Style and Dimensions  

Visual Inspection and Measured with Slide Calipers.  

Applying Force (F): 10N  

Applying Time: 5± 1s  

No Evidence of Chipping,  

Bonding Strength

 

Breakage.  

2

3

and Core Strength

 

No Evidence of Coming off Glass-  

Epoxy Substrate.  

Applying Force (F): 10N  

Applying Time: 5± 1s  

No Evidence of Chipping,  

Body Strength  

Breakage.  

Substrate: Glass-Epoxy (t=1.6mm)  

Deflection: 2.0mm  

Keeping Time: 30s  

Speed of Applying Force: 0.5mm/s  

Meet Table 1.  

Table 1  

4

Bonding Strength  

Appearance  

No Damaged.  

Within ±20%  

Impedance  

Change  

(at 100MHz)  

Products Shall be Soldered on the Substrate.  

Oscillation Frequency: 10 to 55 to 10Hz for 1 Min.  

Total Amplitude: 1.5mm  

I.R.  

10MΩ Min.  

5

6

Vibration  

Drop  

Testing Time: A Period of 2 Hours in Each of 3  

Mutually Perpendicular Directions (Total 6 Hours).  

Withstand  

Voltage  

No Damaged.  

Products Shall be Dropped Concrete or Steel Board.  

Method: Free Fall  

Height: 1m  

The Number of Times: 10 Times  

Flux: Ethanol Solution of Rosin, 25 (wt)%  

Pre-Heating: 150± 10

℃

, 1 Minute.  

Solder: (1) Su/Pb=60/40, (2) Su-3.0Ag-0.5Cu  

Solder Temperature: (1) 230±5

℃

, (2) 230±5

℃  

Immersion Time: 4± 1s  

The electrodes Shall be at Least  

90% Covered with New Solder  

coating.  

Immersion and Immersion Rates: 25mm/s  

7

Solderability  

Flux: Ethanol Solution of Rosin, 25 (wt)%  

Pre-Heating: 150± 10

℃

, 1 Minute.  

Solder: (1) Su/Pb=60/40, (2) Su-3.0Ag-0.5Cu  

Solder Temperature: 270±5

℃  

Resistance to  

Soldering Heat  

8

Meet Table 1.  

Immersion Time: 5± 1s  

Immersion and Immersion Rates: 25mm/s  

Then Measured After Exposure in the Room Condition  

for 4 to 48 Hours.  

Pag

e

4

o

f 8  

Rev.01  

SMW4015 Series  

Enviromental Performance  

Product shall be solderd on the glass-epoxy substrate (t=1.6mm)  

No.  

Item  

Specifications  

Test Method  

1 Cycle  

1 step: -40

℃

(+0, -3)

℃

/ 30min (+3, -0) min  

2 step: Ordinary Temp. / 3 min max.  

3 step: +125

℃

(+3, -0)

℃

/ 30min (+3, -0) min  

4 step: Ordinary Temp. / 3 min max.  

Total of 10 Cycles  

1

Temperature Cycle  

Then Measured After Exposure in the Room Condition  

for 4 to 48 Hours.  

Temperature: 40±2

℃  

Humidity: 90 to 95% (RH)  

2

3

Humidity  

Time: 1000h (+48 h, -0 h)  

Then Measured After Exposure in the Room Condition for  

4 to 48 Hours.  

Temperature: 40±2

℃  

Humidity: 90 to 95% (RH)  

Test Voltage: Rated Voltage  

Time: 1000h (+48 h, -0 h)  

Meet Table 1.  

Humidity Load  

Then Measured After Exposure in the Room Condition for  

4 to 48 Hours. (Ref. Item)  

Temperature: 85±2

℃  

Humidity: 90 to 95% (RH)  

Test Voltage: Rated Voltage  

Time: 1000h (+48 h, -0 h)  

Then Measured After Exposure in the Room Condition for  

4 to 48 Hours. (Ref. Item)  

4

5

Heat Life  

Temperature: -40±2

℃  

Time: 1000h (+48 h, -0 h)  

Then Measured After Exposure in the Room Condition for  

4 to 48 Hours. (Ref. Item)  

Cold Resistance  

Pag

e

5

o

f 8  

Rev.01  

SMW4015 Series  

Terminal to be Tested  

When measuring and suppling the voltage,the following terminal is applied  

No.  

1

Item  

Terminal to be Tested  

Impedance (Ω)  

(Measurement Terminal)  

DC Resistance (Ω)  

(Measurement Terminal)  

2

3

4

5

6

DC Current (A)  

(Measurement Terminal)  

Insulation Resistance (I.R.)  

(Measurement Terminal)  

Withstanding Voltage (V)  

(Measurement Terminal)  

Rated Voltage (V)  

(Measurement Terminal)  

7

8

Humidity Load (Supply Terminal)  

Heat Life (Supply Terminal)  

Pag

e

6

o

f 8  

Rev.01  

SMW4015 Series  

Soldering and Mounting  

soldering  

Mildly activated rosin fluxes are preferred. Terminations are suitable for re-flow soldering systems  

If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools  

Solder re flow  

Recommended temperature profiles for re-flow soldering in Figure 1  

Soldering lron(Figure 2)  

Products attachment with a soldering iron is discouraged due to the inherent process control limitations.  

In the event that a soldering iron must be employed the following precautions are recommended.  

●

Preheat circuit and products to 150

℃  

●

355

℃

tip temperature (max.)  

●

Never contact the ceramic with the iron tip  

●

1.0mm tip diameter (max.)  

●

Use a 20-watt soldering iron with tip diameter of 1.0mm  

Recommended PC Board Pattern  

Guideline of solder paste thickness: ≥100μm  

Solderability is subject to reflow conditions and thermal conductivity  

Please make sure that your product has been evaluated in view of your specifications with our product being  

mounted to your product  

Pag

e

7

o

f 8  

Rev.01  

SMW4015 Series  

Application Notice  

●

Storage Conditions(component level)  

To maintain the solderability of terminal electrodes  

1.HUNGTRON products meet IPC/JEDEC J-STD-020D standard-MSL, level 1  

2.Temperature and humidity conditions: Less than 40

℃

and 60% RH  

3.Recommended products should be used within 12 months form the time of delivery  

4.The packaging material should be kept where no chlorine or sulfur exists in the air  

●

Transportation  

1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils  

2.The use of tweezers or vacuum pick up is strongly recommended for individual components

.  

3.Bulk handling should ensure that abrasion and mechanical shock are minimized  

Reel Dimension  

Type  

A(mm)  

B(mm)  

C(mm)  

D(mm)  

E(mm)  

13”X12mm  

330±1.0  

100±2  

13.5±0.5  

12.7±0.5  

16.7±0.5  

Packaging Quantity  

Chip Size  

4015  

13”/ Reel  

2500  

Pag

e

8

o

f 8  

Rev.01