Sunltech-Tech-SMW4532B331ITE

Part #Sunltech-Tech-SMW4532B331ITE
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Sunltech-Tech-SMW4532B331ITE
SMW4532B331ITE  
Common mode filter  
Dimensions(mm)  
A
4.5
±
0.2  
3.2
±
0.2  
2.8
±
0.2  
0.2
±
0.1  
1.2Typ  
B
C
D
E
F
1.0Typ  
Electrical Characteristics  
Z
(Ω)  
Rated  
Current  
Rated  
Voltage  
Insulation  
Resistance  
DCR
(Ω)  
Common  
mode  
P/N  
Impedance  
Idc(A)  
Vdc  
IR  
[
MAX
]  
At 100MHz  
330  
[
MAX
]  
(V)typical  
(M
Ω
)Min  
SMW4532B331ITE  
0.090  
1.5  
50  
10  
※
Operating temperature
:
-25 to +125
℃  
Storage temp. and humidity
:
-40 to +85
℃
,70%RH max  
Typical Heat Rating DC Current would cause an approximately
△
T of 40
℃  
If Use Wave soldering is there will be some risk.
 
Re-flow soldering temperatures below 240  
degrees, there will be unwitting risk  
Recommended Footprint (mm)  
Pag
e
1
o
f 5  
Rev.01  

SMW4532B331ITE  
Performance Curves  
Test Equipment  
Impedance  
Measured by using Agilent 4291A RF Impedance Analyzer.  
Pag
e
2
o
f 5  
Rev.01  

SMW4532B331ITE  
DC Resistance  
Measured by using Chroma 16502 mill ohm meter  
Insulation Resistance  
Measured by using Chroma 19073  
Measurement voltage : 50v ,Measurement time : 60 sec.  
Pag
e
3
o
f 5  
Rev.01  

SMW4532B331ITE  
Recommended Soldering Temp.Graph  
Mechanical Reliablity  
TEST  
Specification & Requirement  
The surface of terminal/pin tested shall  
be covered with new solder by 90%  
Method Used  
Solder heat proof:  
Preheating: 150 ±10
℃
60 seconds  
Soldering: 245
 
±5
℃
for 4 ±1 sec  
Preheating:150
℃
60secs  
Solder temperature: 260±5
℃  
Flux:rosin  
Solderability  
Components should have not evidence of  
electrical and mechannical damage  
Solder Heat  
Resistance  
Impedance:within ±15% of initial value  
Dip time:10±0.5 secs  
Solder a chip to test substrate and then  
Series No.  
F
(
Kg
)  
laterally apply a force in the arrow direction  
1608  
2012  
3216  
4532  
0.5  
0.5  
1.0.  
1.0  
Terminal  
strength  
Pag
e
4
o
f 5  
Rev.01  

SMW4532B331ITE  
Endurance Reliabilty  
TEST  
Specification & Requirement  
Method Used  
-65
℃
, (30 mins) -> room temp. (2 mins) ->  
125
℃
, (30 mins) -> room temp. (2 mins)  
50 cycles  
Impedance change within ± 15% Without  
mechanical damage  
Thermal Shock  
Impedance change within ± 15% Without  
mechanical damage  
Apply IDC current @ 60
℃
ambient  
Humidity: 90
%  
Humidity  
Resistance  
Duration: 168 hrs  
Impedance change within ± 15% Without  
mechanical damage  
Storing Temp.  
Low Temp.  
Storing  
-40 ±2
℃
for total 168 +5/-0 hours  
Impedance change within ± 15% Without  
mechanical damage  
Storing Temp.  
High Temp.  
Storing  
125 ±2
℃
for total 168 +5/-0 hours  
Package  
1608  
(0603)  
2012  
(0805)  
3216  
(1206)  
4532  
(1812)  
Size  
Standard Packing  
2000  
2000  
2000  
500  
Quantity (pcs / reel)  
Pag
e
5
o
f 5  
Rev.01