TAI-TECH-FCM1005KF-201T05
| Part # | TAI-TECH-FCM1005KF-201T05 |
Download  | TAI-TECH-FCM1005KF-201T05 |
P2.
TAI-TECH
KBM01-230800083
Ferrite Chip Bead(Lead Free)
FCM1005KF-201T05
1.Features
1. Monolithic inorganic material construction.
2. Closed magnetic circuit avoids crosstalk.
3. S.M.
T
.
t
ype.
Halogen
Halogen-free
4. Suitable for reflow soldering.
5. Shapes and dimensions follow E.I.A. spec.
6. Available in various sizes.
7. Excellent solder ability and heat resistance.
8. High reliability.
9.100% Lead(Pb) & Halogen-Free and RoHS compliant.
10. Operating
T
e
mperature: -55~+125
℃
(Including self-temperature rise)
2.Dimensions
Chip Size
A
1.00±0.10
B
0.50±0.10
0.50±0.10
0.25±0.10
C
D
Units: mm
3.Part Numbering
FCM 1005 KF
–
201
T
05
A
B
C
D
E
F
A: Series
B: Dimension
C: Material
L x W
Lead Free Material
D: Impedance
E: Packaging
F: Rated Current
201=200
Ω
T=
T
a
ping and Reel, B=Bulk(Bags)
05=500mA
4.Specification
DC Resistance
Tai-Tech
Part Number
Test Frequency
(Hz)
Rated Current
(mA) max.
Impedance (
Ω
)
(
Ω
) max.
FCM1005KF-201T05
200±25%
60mV/100M
0.40
500
●
Rated current: based on temperature rise test
●
In compliance with EIA 595
Impedance-Frequency Characteristics
FCM1005KF-201T05
600
500
400
300
200
100
Z
X
R
0
1
10
100
1000
FREQUENCY(MHz)
P3.
TAI-TECH
KBM01-230800083
5. Reliability and Test Condition
Item
Performance
Test Condition
Series No.
FCB
FCM
HCB
GHB
FCA
—
—
-55~+125
℃
Operating Temperature
(Including self-temperature rise)
For long storage conditions, please see the
Application Notice
-55~+125
℃
(on board)
Transportation
Storage Temperature
Agilent4291
Agilent E4991
Agilent4287
Agilent16192
Impedance (Z)
Refer to standard electrical characteristics list
DC Resistance
Rated Current
Agilent 4338
DC Power Supply
Over Rated Current requirements, there will be
some risk
1. Applied the allowed DC current.
2.
T
e
mperature measured by digital surface
thermometer.
Rated Current < 1A
∆
T 20
℃
Max
Rated Current
≧
1A
∆
T 40
℃
Max
Temperature Rise Test
Preconditioning: Run through
reflow for
3
times.( IPC/JEDEC J-STD-020E Classification
Reflow Profiles)
T
e
mperature: 125
±
2
℃
Applied current: rated current.
Life test
Duration: 1000
±
12hrs.
Measured at room temperature after placing
for 24
±
2 hrs.
Appearance: no damage.
Preconditioning: Run through
reflow for
times.( IPC/JEDEC J-STD-020E Classification
Reflow Profiles)
3
Impedance: within
±
15%of initial value.
RDC
：
within ±15% of initial value and shall not exceed the specification value
Humidity: 85
±
2%R.H.
T
e
mperature: 85
±
2
℃
.
Load Humidity
Duration:1000hrsMin.Bead:with100%ratedcurr
ent
，
Inductance: with 10% rated current
Measured at room temperature after placing
for 24
±
2 hrs.
Preconditioning: Run through
reflow for
3
times.( IPC/JEDEC J-STD-020E Classification
Reflow Profiles)
Condition for 1 cycle
Appearance: no damage.
Step1: -55
±
2
℃
Step2: 125±2
℃
Step3: 125
±
2
℃
30
±
5 min.
≦
0.5min
30
±
5min.
Thermal shock
Impedance: within
±
15%of initial value.
RDC
：
within ±15% of initial value and shall not exceed the specification value
Number of cycles: 500
Measured at room temperature after placing
for 24
±
2 hrs.
Preconditioning: Run through
reflow for
3
times.( IPC/JEDEC J-STD-020E Classification
Reflow Profiles)
Oscillation Frequency: 10H
z
～
2KH
z
～
10Hz
for 20 minutes
Equipment
：
Vibration checker
T
o
tal Amplitude:10g
Appearance
：
No damage.
Impedance
：
within±15% of initial value
RDC
：
within ±15% of initial value and shall not exceed the specification value
Vibration
T
e
sting Time : 12 hours(20 minutes, 12 cycles
each of 3 orientations)
。
Shall be mounted on a FR4 substrate of the
following dimensions:
>=0805inch(2012mm):40x100x1.2mm
<0805inch(2012mm):40x100x0.8mm
Bending depth:
Appearance
：
No damage.
Impedance
：
within±10% of initial value
Bending
RDC
：
within ±15% of initial value and shall not exceed the specification value
>=0805inch(2012mm):1.2mm
<0805inch(2012mm):0.8mm
Duration of 10 sec for a min.
T
e
st condition:
Peak
Value
(g’s)
Normal
Velocity
Type
duration Wave
form change
Appearance
：
No damage.
Impedance
：
within±10% of initial value
RDC
：
within ±15% of initial value and shall not exceed the specification value
(D) (ms)
11
(Vi)ft/sec
11.3
Shock
SMD
Lead
50
50
Half-sine
Half-sine
11
11.3
a.Method B,
4
hrs @155°C dry heat
@235°C±5°C
T
e
st time:5 +0/-0.5 seconds.
Solderability
b. Method D category 3. (steam aging 8hours
± 15 min)@ 260°C±5°C
More than 95% of the terminal electrode should be covered with solder.
T
e
st time: 30 +0/-0.5 seconds.
P4.
TAI-TECH
KBM01-230800083
Item
Performance
Test Condition
Number of heat cycles: 1
Temperature
ramp/immersion
and emersion rate
Temperature
(°C)
Time
(s)
Appearance
：
No damage.
Impedance
：
within±15% of initial value
RDC
：
within ±15% of initial value and shall not exceed the specification value
Resistance to Soldering
Heat
260 ±5
(solder temp)
10 ±1
25mm/s ±6 mm/s
Depth: completely cover the termination
Preconditioning: Run through
reflow for
3
times.( IPC/JEDEC J-STD-020E Classification
Reflow Profiles)
Component mounted on a PCB apply a force
>0805inch(2012mm):1kg
<=0805inch(2012mm):0.5kg
to the side of a device being tested. This force
shall be applied for 60 +1 seconds. Also the
force shall be applied gradually as not to shock
the component being tested.
Appearance
：
No damage.
Impedance
：
within±15% of initial value
RD
C
：
within ±15% of initial value and shall not
exceed the specification value
Terminal strength
**
Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85
℃
, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Land Patterns For
Reflow Soldering
Chip Size
FCA3216
Land
Series
Type A(mm)
B(mm) C(mm)
D(mm) E(mm) F(mm) G(mm)
Solder Resist
2.8
1005
1608
1.0
±
0.10 0.50
±
0.10 0.50
±
0.10 0.25
±
0.10
1.6
±
0.15 0.80
±
0.15 0.80
±
0.15 0.30
±
0.20
2.0
±
0.20 1.25
±
0.20 0.85
±
0.20 0.50
±
0.30
2.0
±
0.20 1.25
±
0.20 1.25
±
0.20 0.50
±
0.30
3.2
±
0.20 1.60
±
0.20 1.10
±
0.20 0.50
±
0.30
3.2
±
0.20 2.50
±
0.20 1.30
±
0.20 0.50
±
0.30
4.5
±
0.20 1.60
±
0.20 1.60
±
0.20 0.50
±
0.30
4.5
±
0.20 3.20
±
0.20 1.50
±
0.20 0.50
±
0.30
0.50
0.80
0.40
0.85
0.60
0.95
FCB
FCM
HCB
GHB
FCI
2012
1.05
1.00
1.45
3216
3225
4516
4532
1.05
1.05
1.05
1.05
2.20
2.20
3.30
3.30
1.80
2.70
1.80
3.40
FHI
FCH
HCI
0.4
0.8
Pitch
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
6-2. Soldering
Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for re-flow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
P5.
KBM01-230800083
TAI-TECH
6-2.1 Soldering
Reflow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
T
a
ble 1.1&1.2 (J-STD-020E)
6-2.2 Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a
soldering iron must be employed the following precautions are recommended. (Figure 2.)
‧
Preheat circuit and products to 150
℃
‧
Never contact the ceramic with the iron tip
‧
Use a 20 watt soldering iron with tip diameter of 1.0mm
‧
350
℃
tip temperature (max)
‧
1.0mm tip diameter (max)
‧
Limit soldering time to 4~5sec.
Fig.1 Soldering
Reflow
Fig.2 Iron soldering temperature profiles
Iron Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
within 4~5s
350
150
Gradual cooling
Over 60s
TIME(sec.)
Iron Soldering times
：
1 times max
Reflow times: 3 times max
Table (1.1): Reflow Profiles
Profile Type:
Preheat
Pb-Free Assembly
–
T
e
mperature Min(T
smin
)
150
℃
–
T
e
mperature Max(T
smax
)
200
℃
-Time(t
s
)from(T
smin
to T
smax
)
60-120seconds
Ramp-up rate(T
L
to T
p
)
3
℃
/second max.
Liquidus temperature(T
L
)
217
℃
60-150 seconds
Time(t
L
)maintained above T
L
Classification temperature(T
c
)
See
T
a
ble (1.2)
<
30 seconds
Time(t
p
) at
T
c
– 5
℃
(Tp should be equal to or less than
T
c
.)
Ramp-down rate(T
p
to T
L
)
6
℃
/second max.
8 minutes max.
Time 25
℃
to peak temperature
Tp
: maximum peak package body temperature,
Tc
: the classification temperature.
For user (customer)
Tp
should be equal to or less than
Tc.
Table (1.2) Package Thickness/Volume and Classification Temperature (T
c
)
Package
Thickness
Volume mm
3
<350
Volume mm
3
350-2000
Volume mm
3
>2000
<1.6mm
1.6-2.5mm
≥
2.5mm
260
℃
260
℃
250
℃
260
℃
250
℃
245
℃
260
℃
245
℃
245
℃
PB-Free Assembly
Reflow is referred to standard IPC/JEDEC J-STD-020E
。
6-2.3 Solder Volume:
Upper limit
Recommendable
Accordingly increasing the solder volume, the mechanical stress to
product is also increased. Exceeding solder volume may cause the
failure of mechanical or electrical performance. Solder shall be used
not to be exceed as shown in right side:
t
Minimum fillet height = soldering thickness + 25% product height
P6.
KBM01-230800083
TAI-TECH
7.Packaging Information
7-1. Reel Dimension
A
Type
A(mm) B(mm) C(mm) D(mm)
2
∮
0.5
120
ꢀ
7”x8mm
9.0
±
0.5
60
±
2
60
±
2
13.5
±
0.5
13.5
±
0.5
178
±
2
178
±
2
7”x12mm
13.5
±
0.5
7″x8mm
7″x12mm
7-2.1 Tape Dimension / 8mm
■
Material of taping is paper
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
100505 1.12
±
0.03 0.62
±
0.03 0.60
±
0.03 2.0
±
0.05 0.60
±
0.03
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
4.0
±
0.10
4.0
±
0.10
t(mm)
160808
201209
1.80
±
0.05 0.96+0.05/-0.03
0.95
±
0.05
2.10
±
0.05 1.30
±
0.05 0.95
±
0.05
0.95
±
0.05
0.95
±
0.05
■
Material of taping is plastic
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm) D1(mm)
201212 2.10
±
0.10 1.28
±
0.10 1.28
±
0.10 4.0
±
0.10 0.22
±
0.05 1.0
±
0.10
321611 3.35
±
0.10 1.75
±
0.10 1.25
±
0.10 4.0
±
0.10 0.23
±
0.05 1.0
±
0.10
322513 3.42
±
0.10 2.77
±
0.10 1.55
±
0.10 4.0
±
0.10 0.22
±
0.05 1.0
±
0.10
321609 3.40
±
0.10 1.77
±
0.10 1.04
±
0.10 4.0
±
0.10 0.22
±
0.05 1.0
±
0.10
7-2.2 Tape Dimension / 12mm
D1(mm)
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
451616
4.70
±
0.10 1.75
±
0.10 1.75
±
0.10 4.0
±
0.10 0.24
±
0.05 1.5
±
0.10
4.70
±
0.10 3.45
±
0.10 1.60
±
0.10 8.0
±
0.10 0.24
±
0.05 1.5
±
0.10
453215
P7.
TAI-TECH
KBM01-230800083
7-3. Packaging Quantity
Chip Size
Chip / Reel
453215 451616 322513 321611 321609 201212 201209 160808 100505
1000
4000
2000
8000
2500
12500
62500
125000
3000
15000
75000
150000
3000
15000
75000
150000
2000
10000
50000
100000
4000
20000
4000
20000
10000
50000
Inner box
Middle box
Carton
20000
40000
40000
80000
100000
200000
100000
200000
250000
500000
7-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165
ꢀ
to180
ꢀ
Top cover tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
300
(
℃
)
(%)
5~35
45~85
860~1060
Base tape
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solder ability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months from the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
