TAI-TECH-FCM1608KF-700T08
| Part # | TAI-TECH-FCM1608KF-700T08 |
Download  | TAI-TECH-FCM1608KF-700T08 |
TAI-TECH
KBM01-230800173
P2.
Ferrite Chip Bead(Lead Free)
FCM1608KF-SERIES
1.Features
Halogen
1. Monolithic inorganic material construction.
2. Closed magnetic circuit avoids crosstalk.
3. S.M.
T
.
t
ype.
Halogen-free
4. Suitable for reflow soldering.
5. Shapes and dimensions follow E.I.A. spec.
6. Available in various sizes.
7. Excellent solderability and heat resistance.
8. High reliability.
9. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
10. Operating
T
emperature: -55~+125
℃
(Including self-temperature rise)
2.Dimensions
Chip Size
A
1.60±0.15
B
0.80±0.15
0.80±0.15
0.30±0.20
C
D
Units: mm
3.Part Numbering
FCM
1608 KF
–
121
T
06
A
B
C
D
E
F
A: Series
B: Dimension
C: Material
L x W
Lead Free Material
D: Impedance
E: Packaging
F: Rated Current
121=120
Ω
T=
T
a
ping and Reel, B=Bulk(Bags)
06=600mA
4.Specification
DC Resistance
Tai-Tech
Part Number
Test Frequency
(MHz)
Rated Current
(mA) max.
Impedance (
Ω
)
(
Ω
) max.
FCM1608KF-000T08
FCM1608KF-100T06
FCM1608KF-100T08
FCM1608KF-150T08
FCM1608KF-220T08
FCM1608KF-300T08
FCM1608KF-330T05
FCM1608KF-470T05
FCM1608KF-470T07
FCM1608KF-600T05
FCM1608KF-600T08
12.5 Max
10±25%
10±25%
15±25%
22±25%
30±25%
33±25%
47±25%
47±25%
60±25%
60±25%
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
800
600
800
800
800
800
500
500
700
500
800
100
100
100
100
100
100
100
100
100
100
100
●
Rated current: based on temperature rise test
●
In compliance with EIA 595
P3.
TAI-TECH
KBM01-230800173
DC Resistance
Tai-Tech
Part Number
Test Frequency
(MHz)
Rated Current
(mA) max.
Impedance (
Ω
)
(
Ω
) max.
FCM1608KF-700T08
FCM1608KF-750T05
FCM1608KF-750T07
FCM1608KF-750T08
FCM1608KF-800T06
FCM1608KF-800T07
FCM1608KF-900T05
FCM1608KF-101T08
FCM1608KF-121T05
FCM1608KF-121T06
FCM1608KF-121T08
FCM1608KF-151T05
FCM1608KF-151T06
FCM1608KF-181T05
FCM1608KF-201T05
FCM1608KF-221T08
FCM1608KF-301T05
FCM1608KF-401T08
FCM1608KF-471T05
FCM1608KF-601T05
FCM1608KF-102T05
FCM1608KF-152T02
FCM1608KF-202T02
FCM1608KF-222T02
70±25%
75±25%
100
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.25
0.25
0.25
0.25
0.25
0.25
0.30
0.30
0.30
0.35
0.45
0.45
0.50
0.70
1.00
1.20
1.50
800
500
700
800
600
700
500
800
500
600
800
500
600
500
500
800
500
800
500
500
500
200
200
200
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
75±25%
75±25%
80±25%
80±25%
90±25%
100±25%
120±25%
120±25%
120±25%
150±25%
150±25%
180±25%
200±25%
220±25%
300±25%
400±25%
470±25%
600±25%
1000±25%
1500±25%
2000±25%
2200±25%
●
Rated current: based on temperature rise test
●
In compliance with EIA 595
TAI-TECH
KBM01-230800173
P4.
5. Reliability and Test Condition
Item
Performance
Test Condition
Series No.
FCB
FCM
HCB
GHB
FCA
—
—
-55~+125
℃
Operating Temperature
(Including self-temperature rise)
For long storage conditions, please see the
Application Notice
Transportation
Storage Temperature
-55~+125
℃
(on board)
Agilent4291
Agilent E4991
Agilent4287
Agilent16192
Impedance (Z)
Refer to standard electrical characteristics list
DC Resistance
Rated Current
Agilent 4338
DC Power Supply
Over Rated Current requirements, there will be
some risk
1. Applied the allowed DC current.
2.
T
e
mperature measured by digital surface
thermometer.
Rated Current < 1A
ΔT 20
℃
Max
Rated Current
≧
1A ΔT
40
℃
Max
Temperature Rise Test
Preconditioning: Run through
reflow for
3
times.( IPC/JEDEC J-STD-020E Classification
Reflow Profiles)
T
e
mperature: 125
±
2
℃
Applied current: rated current.
Life test
Duration: 1000
±
12hrs.
Measured at room temperature after placing
for 24
±
2 hrs.
Appearance: no damage.
Preconditioning: Run through
reflow for
times.( IPC/JEDEC J-STD-020E Classification
Reflow Profiles)
3
Impedance: within
±
15%of initial value.
RDC
：
within ±15% of initial value and shall not exceed the specification value
Humidity: 85
±
2%R.H.
T
e
mperature: 85
±
2
℃
.
Load Humidity
Duration:1000hrsMin.Bead:with100%ratedcurr
ent
，
Inductance: with 10% rated current
Measured at room temperature after placing
for 24
±
2 hrs..
Preconditioning: Run through
reflow for
3
times.( IPC/JEDEC J-STD-020E Classification
Reflow Profiles)
Condition for 1 cycle
Appearance: no damage.
Step1: -55
±
2
℃
Step2: 125±2
℃
Step3: 125
±
2
℃
30
±
5 min.
≦
0.5min
30
±
5min.
Thermal shock
Impedance: within
±
15%of initial value.
RDC
：
within ±15% of initial value and shall not exceed the specification value
Number of cycles: 500
Measured at room temperature after placing
for 24
±
2 hrs.
Preconditioning: Run through
reflow for
3
times.( IPC/JEDEC J-STD-020E Classification
Reflow Profiles)
Oscillation Frequency: 10H
z
～
2KH
z
～
10Hz
for 20 minutes
Equipment
：
Vibration checker
T
o
tal Amplitude:10g
Appearance
：
No damage.
Impedance
：
within±15% of initial value
RDC
：
within ±15% of initial value and shall not exceed the specification value
Vibration
T
e
sting Time : 12 hours(20 minutes, 12 cycles
each of 3 orientations)
。
Shall be mounted on a FR4 substrate of the
following dimensions:
>=0805inch(2012mm):40x100x1.2mm
<0805inch(2012mm):40x100x0.8mm
Bending depth:
Appearance
：
No damage.
Impedance
：
within±10% of initial value
Bending
RDC
：
within ±15% of initial value and shall not exceed the specification value
>=0805inch(2012mm):1.2mm
<0805inch(2012mm):0.8mm
Duration of 10 sec for a min.
T
e
st condition:
Peak
Value
(g’s)
Normal
Velocity
Type
duration Wave
form change
Appearance
：
No damage.
Impedance
：
within±10% of initial value
RDC
：
within ±15% of initial value and shall not exceed the specification value
(D) (ms)
11
(Vi)ft/sec
11.3
Shock
SMD
Lead
50
50
Half-sine
Half-sine
11
11.3
a.Method B,
4
hrs @155°C dry heat
@235°C±5°C
T
e
st time:5 +0/-0.5 seconds.
Solderability
b. Method D category 3. (steam aging 8hours
± 15 min)@ 260°C±5°C
More than 95% of the terminal electrode should be covered with solder.
T
e
st time: 30 +0/-0.5 seconds..
P5.
TAI-TECH
KBM01-230800173
Item
Performance
Test Condition
Number of heat cycles: 1
Temperature
ramp/immersion
and emersion rate
Temperature
(°C)
Time
(s)
Appearance
：
No damage.
Impedance
：
within±15% of initial value
RDC
：
within ±15% of initial value and shall not exceed the specification value
Resistance to Soldering
Heat
260 ±5
(solder temp)
10 ±1
25mm/s ±6 mm/s
Depth: completely cover the termination
Preconditioning: Run through
reflow for
3
times.( IPC/JEDEC J-STD-020E Classification
Reflow Profiles)
Component mounted on a PCB apply a force
>0805inch(2012mm):1kg
<=0805inch(2012mm):0.5kg
to the side of a device being tested. This force
shall be applied for 60 +1 seconds. Also the
force shall be applied gradually as not to shock
the component being tested.
Appearance
：
No damage.
Impedance
：
within±15% of initial value
RD
C
：
within ±15% of initial value and shall not
exceed the specification value
Terminal strength
**
Derating Curve
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85
℃
, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Land Patterns For
Reflow Soldering
Chip Size
FCA3216
Land
Series
Type A(mm) B(mm) C(mm)
D(mm) E(mm) F(mm) G(mm)
Solder Resist
2.8
1005
1608
1.0
±
0.10 0.50
±
0.10 0.50
±
0.10 0.25
±
0.10
1.6
±
0.15 0.80
±
0.15 0.80
±
0.15 0.30
±
0.20
2.0
±
0.20 1.25
±
0.20 0.85
±
0.20 0.50
±
0.30
2.0
±
0.20 1.25
±
0.20 1.25
±
0.20 0.50
±
0.30
3.2
±
0.20 1.60
±
0.20 1.10
±
0.20 0.50
±
0.30
3.2
±
0.20 2.50
±
0.20 1.30
±
0.20 0.50
±
0.30
4.5
±
0.20 1.60
±
0.20 1.60
±
0.20 0.50
±
0.30
4.5
±
0.20 3.20
±
0.20 1.50
±
0.20 0.50
±
0.30
0.50
0.80
0.40
0.85
0.60
0.95
FCB
FCM
HCB
GHB
FCI
2012
1.05
1.00
1.45
3216
3225
4516
4532
1.05
1.05
1.05
1.05
2.20
2.20
3.30
3.30
1.80
2.70
1.80
3.40
FHI
FCH
HCI
0.4
0.8
Pitch
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
6-2. Soldering
Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for re-flow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
P6.
TAI-TECH
KBM01-230800173
6-2.1 Soldering
Reflow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
T
a
ble 1.1&1.2 (J-STD-020E)
6-2.2 Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a
soldering iron must be employed the following precautions are recommended. (Figure 2.)
‧
Preheat circuit and products to 150
℃
‧
Never contact the ceramic with the iron tip
‧
Use a 20 watt soldering iron with tip diameter of 1.0mm
‧
350
℃
tip temperature (max)
‧
1.0mm tip diameter (max)
‧
Limit soldering time to 4~5sec.
Fig.1 Soldering
Reflow
Fig. Fig.2 Iron soldering temperature profiles
Iron Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
within 4~5s
350
150
Gradual cooling
Over 60s
TIME(sec.)
Iron Soldering times
：
1 times max
Reflow times: 3 times max
Table (1.1): Reflow Profiles
Profile Type:
Preheat
Pb-Free Assembly
–
T
emperature Min(T
smin
)
150
℃
–
T
emperature Max(T
smax
)
200
℃
-Time(t
s
)from(T
smin
to T
smax
)
60-120seconds
Ramp-up rate(T
L
to T
p
)
3
℃
/second max.
Liquidus temperature(T
L
)
217
℃
60-150 seconds
Time(t
L
)maintained above T
L
Classification temperature(T
c
)
See
T
a
ble (1.2)
<
30 seconds
Time(t
p
) at
T
c
– 5
℃
(Tp should be equal to or less than
T
c
.)
Ramp-down rate(T
p
to T
L
)
6
℃
/second max.
8 minutes max.
Time 25
℃
to peak temperature
Tp
: maximum peak package body temperature,
Tc
: the classification temperature.
For user (customer)
Tp
should be equal to or less than
Tc.
Table (1.2) Package Thickness/Volume and Classification Temperature (T
c
)
Package
Thickness
Volume mm
3
<350
Volume mm
3
350-2000
Volume mm
3
>2000
<1.6mm
1.6-2.5mm
≥2.5mm
260
℃
260
℃
250
℃
260
℃
250
℃
245
℃
260
℃
245
℃
245
℃
PB-Free Assembly
Reflow is referred to standard IPC/JEDEC J-STD-020E
。
6-2.3 Solder Volume:
Upper limit
Recommendable
Accordingly increasing the solder volume, the mechanical stress to
product is also increased. Exceeding solder volume may cause the
failure of mechanical or electrical performance. Solder shall be used
not to be exceed as shown in right side:
t
Minimum fillet height = soldering thickness + 25% product height
P7.
KBM01-230800173
TAI-TECH
7.Packaging Information
7-1. Reel Dimension
A
Type
A(mm) B(mm) C(mm) D(mm)
∮
2 0.5
7”x8mm
9.0
±
0.5
60
±
2
60
±
2
13.5
±
0.5
13.5
±
0.5
178
±
2
178
±
2
7”x12mm
13.5
±
0.5
120
7″x8mm
7″x12mm
7-2.1 Tape Dimension / 8mm
■
Material of taping is paper
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
100505 1.12
±
0.03 0.62
±
0.03 0.60
±
0.03 2.0
±
0.05 0.60
±
0.03
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
4.0
±
0.10
4.0
±
0.10
t(mm)
160808
201209
1.80
±
0.05 0.96+0.05/-0.03
0.95
±
0.05
0.95
±
0.05
0.95
±
0.05
2.10
±
0.05
1.30
±
0.05
0.95
±
0.05
■
Material of taping is plastic
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm) D1(mm)
201212 2.10
±
0.10 1.28
±
0.10 1.28
±
0.10 4.0
±
0.10 0.22
±
0.05 1.0
±
0.10
321611 3.35
±
0.10 1.75
±
0.10 1.25
±
0.10 4.0
±
0.10 0.23
±
0.05 1.0
±
0.10
322513 3.42
±
0.10 2.77
±
0.10 1.55
±
0.10 4.0
±
0.10 0.22
±
0.05 1.0
±
0.10
321609 3.40
±
0.10 1.77
±
0.10 1.04
±
0.10 4.0
±
0.10 0.22
±
0.05 1.0
±
0.10
7-2.2 Tape Dimension / 12mm
D1(mm)
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
451616
4.70
±
0.10 1.75
±
0.10 1.75
±
0.10 4.0
±
0.10 0.24
±
0.05 1.5
±
0.10
4.70
±
0.10 3.45
±
0.10 1.60
±
0.10 8.0
±
0.10 0.24
±
0.05 1.5
±
0.10
453215
TAI-TECH
KBM01-230800173
P8.
7-3. Packaging Quantity
Chip Size
Chip / Reel
453215 451616 322513 321611 321609 201212 201209 160808 100505
1000
4000
2000
8000
2500
12500
62500
125000
3000
15000
75000
150000
3000
15000
75000
150000
2000
10000
50000
100000
4000
20000
100000
200000
4000
20000
100000
200000
10000
50000
Inner box
Middle box
Carton
20000
40000
40000
80000
250000
500000
7-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165
to180
To
p
c
over tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
300
(
℃
)
(%)
5~35
45~85
860~1060
Bas
e
t
ape
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solder ability of terminal electrodes:
1.
T
A
I-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
emperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months from the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
TAI-TECH
KBM01-230800173
P9.
Impedance Frequency Characteristics(Typical)
FCM1608KF-100T06
30
20
10
0
Z
X
R
1
10
100
1000
FREQUENCY(MHz)
FCM1608KF-300T08
80
60
40
20
0
Z
X
R
1
10
100
1000
FREQUENCY(MHz)
FCM1608KF-470T05
FCM1608KF-470T07
150
100
50
100
80
60
40
20
0
Z
Z
X
X
R
R
0
1
10
100
1000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FCM1608KF-600T05
FCM1608KF-600T08
FCM1608KF-700T05
120
180
120
60
180
120
60
80
40
0
Z
Z
Z
X
X
X
R
R
R
0
1
0
1
10
100
1000
10
100
1000
1000
1000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz)
FCM1608KF-750T07
FCM1608KF-750T05
200
160
120
80
200
160
120
80
Z
Z
40
40
X
X
R
R
0
1
0
10
100
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FCM1608KF-800T06
FCM1608KF-800T07
FCM1608KF-900T05
200
160
120
80
200
160
120
80
300
200
100
0
Z
Z
Z
40
40
X
X
X
R
R
R
0
0
1
1
10
100
1000
10
100
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz)
TAI-TECH
KBM01-230800173
P10.
Impedance Frequency Characteristics(Typical)
FCM1608KF-101T08
FCM1608KF-121T06
FCM1608KF-121T05
300
200
100
300
200
100
0
400
300
200
100
0
Z
Z
Z
X
X
X
R
R
R
0
1
10
100
1000
1
10
100
1000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz)
FCM1608KF-151T06
FCM1608KF-121T08
FCM1608KF-151T05
400
300
200
100
0
300
200
100
300
200
100
0
Z
Z
Z
X
X
X
R
R
R
0
1
10
100
1000
1
10
100
1000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz)
FCM1608KF-181T05
FCM1608KF-201T05
500
400
300
200
100
400
300
200
100
0
Z
Z
X
X
R
R
0
1
10
100
1000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FCM1608KF-301T05
FCM1608KF-471T05
800
600
400
200
600
400
200
0
Z
Z
X
X
R
R
0
1
10
100
1000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FCM1608KF-152T02
FCM1608KF-102T05
FCM1608KF-601T05
2500
2000
1500
1000
500
800
600
400
200
2000
1600
1200
800
400
0
Z
Z
Z
X
X
X
R
R
R
0
0
1
1
10
100
1000
10
100
1000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
FREQUENCY(MHz)
