TAI-TECH-HSF-2012F2SF-600T03-H
| Part # | TAI-TECH-HSF-2012F2SF-600T03-H |
Download  | TAI-TECH-HSF-2012F2SF-600T03-H |
P2
TAI-TECH
Wire Wound Type Common Mode Filter
HSF1210F2SF-SERIES
1. Features
1. High common mode impedance at high frequency cause excellent
noise suppression performance.
Halogen
2.
HSF1210F2SF
series realizes small size and low profile.
1.2×1.0x0.9 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
4. Excellent for USB3.0
Halogen-free
5. Operating temperature -40~+125
℃
(Including self – temperature rise)
2. Dimension
A
B
Series
A(mm)
B(mm)
C(mm) D1(mm)
D2(mm) E(mm)
1210F2SF 1.2±0.2
1.0±0.2 0.9
max. 0.35±0.1 0.35±0.1 0.03
min.
3. Part Numbering
HSF 1210
F
2
S
F
–
900
T
02
A
B
C
D
E
F
G
H
I
A: Series
B: Dimension
C: Material
Ferrite
D: Number of Lines
2=2 lines
E: Type
S=Shielded, N=Unshielded
F: Lead free
G: Impedance
H: Packaging
I: Rated Current
900=90
Ω
T=
T
a
ping and Reel, B=Bulk
02=200mA
4. Specification
DC
Resistance
(
Ω
) max.
Common mode
Withstand
Volt. (Vdc)
max.
TAI-TECH
Part Number
Rated Volt.
(Vdc) max.
IR
(
Ω
) min.
Test Frequency
Rated Current
(mA) max.
Impedance
(MHz)
(
Ω
)
HSF1210F2SF-350T02
HSF1210F2SF-500T02
HSF1210F2SF-600T02
HSF1210F2SF-900T02
35±25%
50±25%
60±25%
90±25%
100
100
100
100
0.30
0.30
0.30
0.40
200
250
250
200
50
50
50
50
125
125
125
125
10M
10M
10M
10M
P3
TAI-TECH
HSF1210F2SF-350T02
HSF1210F2SF-500T02
Common Mode
1000
100
10
1000
100
Common Mode
10
1
Normal Mode
Normal Mode
1
0.1
0.1
1
10
100
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
HSF1210F2SF-900T02
HSF1210F2SF-600T02
Common Mode
1000
100
10
1000
100
10
Common Mode
Normal Mode
Normal Mode
1
1
0.1
0.1
1
10
100
1000
10000
1
10
100
FREQUENCY(MHz)
1000
10000
FREQUENCY(MHz)
Sdd21&Scc21
P6
TAI-TECH
Wire Wound Type Common Mode Filter
HSF1210F2SF-SERIES-U4
1. Features
1. High common mode impedance at high frequency cause excellent
noise suppression performance.
Halogen
2.
HSF1210F2SF
series realizes small size and low profile.
1.2×1.0x0.9 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
4. For USB3.1G1/2
、
HDMI2.0/2.1
、
USB4.0
、
Thunderbolt.
5. Operating temperature -40~+125
℃
(Including self – temperature rise)
Halogen-free
2. Dimension
A
B
Series
A(mm)
B(mm)
C(mm) D1(mm)
D2(mm) E(mm)
1210F2SF 1.2±0.2
1.0±0.2 0.9
max. 0.35±0.1 0.35±0.1 0.03
min.
3. Part Numbering
HSF 1210
F
2
S
F
–
900
T
03
–
U4
A
B
C
D
E
F
G
H
I
J
A: Series
B: Dimension
C: Material
Ferrite
D: Number of Lines
E: Type
2=2 lines
S=Shielded, N=Unshielded
F: Lead free
G: Impedance
H: Packaging
I: Rated Current
J: Control S/N
900=90
Ω
T=
T
a
ping and Reel, B=Bulk
03=300mA
4. Specification
Cut-off
Frequency Resistance
(GHz)Typ.
DC
Withstand
Volt. (Vdc)
max.
Test
Frequency
(MHz)
Common mode
Impedance (
Ω
)
Typ.
Rated Current
Rated Volt.
TAI-TECH
Part Number
IR
(
Ω
) min.
(mA)max.
(Vdc)max.
(
Ω
) max.
HSF1210F2SF-1R9T04-U4
HSF1210F2SF-5R3T03-U4
HSF1210F2SF-300T04-U4
HSF1210F2SF-900T03-U4
1.9
5.3
100
100
100
100
18
18
18
18
0.20
0.30
0.20
0.30
400
300
400
300
50
50
50
50
125
125
125
125
10M
10M
10M
30.0
90.0
10M
P7
TAI-TECH
HSF1210F2SF-5R3T03-U4
HSF1210F2SF-1R9T04-U4
1000
100
10
100
10
1
Common Mode
Normal Mode
Common Mode
Normal Mode
1
0.1
0.1
0.01
1
1
10
100
1000
10000
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
HSF1210F2SF-900T03-U4
HSF1210F2SF-300T04-U4
Common Mode
1000
100
10
1000
100
10
Common Mode
Normal Mode
Normal Mode
1
1
0.1
1
0.1
10
100
1000
10000
1
10
100
FREQUENCY(MHz)
1000
10000
FREQUENCY(MHz)
Sdd21&Scc21
HSF1210F2SF-1R9T04-U4
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
Sdd21
Scc21
-50
1
10
100
1000
10000
100000
Frequency (MHz)
P8
TAI-TECH
HSF1210F2SF-5R3T03-U4
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
Sdd21
Scc21
Sdd21
1
10
100
1000
10000
100000
Frequency (MHz)
HSF1210F2SF-300T04-U4
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
Sdd21
Scc21
1
10
100
1000
10000
100000
Frequency (MHz)
P9
TAI-TECH
HSF1210F2SF-900T03-U4
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
Sdd21
Scc21
1
10
100
1000
10000
100000
Frequency (MHz)
P10
TAI-TECH
Wire Wound Type Common Mode Filter
HSF2012F2SF-SERIES-H
1. Features
1. High common mode impedance at high frequency cause excellent noise
suppression performance.
Halogen
2.
HSF2012F2SF
series realizes small size and low profile.
2.0×1.2×1.2 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
4. For USB3.1G2 & HDMI2.0
Halogen-free
5. Operating temperature -40~+125
℃
(Including self – temperature rise)
2. Dimension
A
B
Series
A(mm)
B(mm)
C(mm) D1(mm)
D2(mm) E(mm)
1.2±0.2 0.50±0.1
0.51±0.1 0.15±0.1
2012F2SF 2.0±0.2
1.2±0.2
3. Part Numbering
HSF 2012
F
2
S
F
–
600
T
03
–
H
A
B
C
D
E
F
G
H
I
J
A: Series
B: Dimension
C: Material
Ferrite Core
D: Number of Lines
2=2 lines
E: Type
S=Shieded , N=Unshielded
F: Lead free
G: Impedance
H: Packaging
I: Rated Current
J: Control S/N
600=60
Ω
T=
T
a
ping and Reel
03=300mA
4. Specification
DC
Resistance
(
Ω
) max.
Test
Frequency
(MHz)
Rated Current
Rated Volt.
Withstand Volt.
TAI-TECH
Part Number
Common mode
Impedance (
Ω
)
IR
(
Ω
) min.
(mA) max.
(Vdc) max.
(Vdc) max.
HSF2012F2SF-300T04-H
HSF2012F2SF-600T03-H
HSF2012F2SF-900T03-H
HSF2012F2SF-121T03-H
30±25%
60±25%
90±25%
120±25%
100
100
100
100
0.20
0.30
0.30
0.35
400
300
300
330
50
50
50
50
125
125
125
125
10M
10M
10M
10M
P11
TAI-TECH
HSF2012F2SF-300T04-H
HSF2012F2SF-600T03-H
1000
100
1000
100
10
Common Mode
Common Mode
10
1
Normal Mode
Normal Mode
1
0.1
0.1
1
10
100
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
-H
HSF2012F2SF-121T03-H
HSF2012F2SF-900T03-H
1000
100
10
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
0.1
0.1
1
10
100
1000
10000
1
10
100
FREQUENCY(MHz)
1000
10000
FREQUENCY(MHz)
P20
TAI-TECH
5. Schematic Diagram
6. Materials
No. Description
Specification
a.
b.
c
Upper Plate
Core
Ferrite
Ferrite Core
T
e
rmination
Wire
Ag/Ni/Sn
d
Enameled Copper Wire
P21
TAI-TECH
7. Reliability and Test Condition (HSF1210, HSF2012)
Item
Operating temperature
Storage temperature
Performance
Test Condition
-40~+125
℃
(Including self – temperature rise)
-40~+125
℃
(on board)
Electrical Performance Test
Z(common mode)
Keysight E4991B + Keysight 16197A
Agilent-34420A
Agilent-4338B
DCR
Refer to standard electrical characteristics list.
I.R.
Chroma 19073
1.Applied the allowed DC current.
2.
T
e
mperature measured by digital surface thermometer
T
e
mperature Rise
T
e
st
Reliability Test
Rated Current
ΔT 40
℃
Max
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
)
Temperature
：
125±2
℃
Life Test
Applied current
：
rated current
Duration
：
1000±12hrs
Measured at room temperature after placing for 24 hrs.
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
Humidity
：
85±3% R.H,
Load Humidity
Temperature
：
85
℃
±2
℃
Duratio
n
：
1000hrs Min. Bea
d
：
with 100% rated curren
t
，
Inductance: with 10% rated current
Measured at room temperature after placing for 24 hrs.
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow
Profiles
1. Baked at50
℃
for 25hrs, measured at room temperature after
placing for 4 hrs.
Appearance
：
No damage.
2. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25
℃
in 2.5hrs.
3. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value
Moisture Resistance
keep 3 hours, cool down to 25
℃
in
2.5hrs,keep at 25
℃
for 2 hrs then keep at -10
℃
for 3 hrs
4. Keep at 25
℃
80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification
Reflow Profiles
Condition for 1 cycle
Step1
：
-40±2
℃
30±5min
Step2
：
125±2
℃ ≦
0.5min
Step3
：
125±2
℃
30±5min
Thermal
shock
Number of cycles
：
500
Measured at room temperature after placing for 24 hrs.
Oscillation Frequency: 10Hz
～
2KHz
～
10Hz for 20 minute
Equipment
：
Vibration checker
Vibration
Total Amplitude:10g
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)
。
P22
TAI-TECH
Item
Performance
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
<0805 inch(2012mm):40x100x0.8mm
Bending depth: >=0805 inch(2012mm):1.2mm
<0805 inch(2012mm):0.8mm
Bending
Appearance
：
No damage.
duration of 10 sec.
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value
Peak
value
(g’s)
Normal
duration (D)
(ms)
Velocity
change
(Vi)ft/sec
Wave
form
Type
Shock
SMD
Lead
50
50
11
11
Half-sine
Half-sine
11.3
11.3
3 shocks in each direction along 3 perpendicular axes. (18 shocks).
a. Method B, 4 hrs @155°C dry heat @235°C±5°C
Testing Time :5 +0/-0.5 seconds
b. Method D category 3. (8hours ± 15 min)@ 260°C±5°C
Testing Time :30 +0/-0.5 seconds
More than 95% of the terminal electrode should
Solderability
be covered with solder
。
Depth: completely cover the termination
Temperature
Temperature(°C) Time(s)
ramp/immersion Number
of
and emersion rate
heat cycles
Resistance to Soldering Heat
260 ±5
(solder temp)
10 ±1
25mm/s ±6 mm/s
1
Preconditioning: Run through reflow for
J-STD-020E Classification Reflow Profiles
3
times.( IPC/JEDEC
Appearance
：
No damage.
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value
With the component mounted on a PCB with the device to be
tested, apply a force(>0805:1kg , <=0805:0.3kg)to the side of a
device being tested. This force shall be applied for 60 +1 seconds.
Also the force shall be applied gradually as not to apply a shock to
the component being tested.
Terminal
Strength
P23
TAI-TECH
8. Soldering and Mounting
8-1. Recommended PC Board Pattern
HSF1210F2S
HSF2012F2S
L(mm)
H(mm)
G1(mm
G2(mm
1.55
1.10
0.65
0.30
2.60
1.40
1.25
0.45
8-2. Soldering
Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for re-flow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
8-2.1 Soldering Reflow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
T
a
ble 1.1&1.2 (J-STD-020E)
8-2.2 Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a
soldering iron must be employed the following precautions are recommended. (Figure 2.)
‧
Preheat circuit and products to 150
℃
‧
Never contact the ceramic with the iron tip
‧
Use a 20 watt soldering iron with tip diameter of 1.0mm
‧
350
℃
tip temperature (max)
‧
1.0mm tip diameter (max)
‧
Limit soldering time to 4~5sec.
Fig.1 Soldering Reflow
Fig.2 Iron soldering temperature profiles
Iron Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
within 4~5s
350
150
Gradual cooling
Over 60s
TIME(sec.)
Iron Soldering times
：
1 times max
Reflow times: 3 times max
P24
TAI-TECH
Table (1.1): Reflow Profiles
Profile Type:
Pb-Free Assembly
Preheat
–
T
e
mperature Min(T
smin
)
150
℃
–
T
e
mperature Max(T
smax
)
200
℃
-Time(t
s
)from(T
smin
to T
smax
)
60-120seconds
Ramp-up rate(T
L
to T
p
)
3
℃
/second max.
Liquidus temperature(T
L
)
217
℃
60-150 seconds
Time(t
L
)maintained above T
L
Classification temperature(T
c
)
See
T
a
ble (1.2)
<
30 seconds
Time(t
p
) at
T
c
– 5
℃
(Tp should be equal to or less than
T
c
.)
Ramp-down rate(T
p
to T
L
)
6
℃
/second max.
8 minutes max.
Time 25
℃
to peak temperature
Tp: maximum peak package body temperature,
T
c
: the classification temperature.
For user (customer) Tp should be equal to or less than
T
c
.
Table (1.2) Package Thickness/Volume and Classification Temperature (T
c
)
Package
Thickness
Volume mm
3
<350
Volume mm
3
350-2000
Volume mm
3
>2000
<1.6mm
1.6-2.5mm
≥2.5mm
260
℃
260
℃
250
℃
260
℃
250
℃
245
℃
260
℃
245
℃
245
℃
PB-Free Assembly
Reflow is referred to standard IPC/JEDEC J-STD-020E
。
P25
TAI-TECH
9. Packaging Information
9-1. Reel Dimension
A
Type
A(mm) B(mm)
C(mm) D(mm)
2±0.5
120°
9.0
±
0.5
60.0
±
2.0
13.5
±
0.5 178.0
±
2.0
7”x8mm
7″x8mm
7″x12mm
9-2. Tape Dimension / 8mm
W(mm) P(mm) E(mm)
F(mm) P2(mm)
D(mm)
D1(mm)
P0(mm)
A0(mm)
B0(mm) K0(mm)
t(mm)
Series
8.00
±
0.10 4.00
±
0.10 1.75
±
0.10 3.50
±
0.05 2.00
±
0.05 1.50+0.10/-0.00
0.70
±
0.10
4.00
±
0.10
1.12
±
0.10
1.40
±
0.10
1.05
±
0.10
0.22
±
0.05
HSF1210F2S
9-3. Packaging Quantity
Chip/Reel
3000
Inner Box
Middle Box
Carton
Chip size
HSF1210F2S
15000
75000
150000
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
F
165° to180°
Top cover tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
(
℃
)
(%)
Base tape
5~35
45~85
860~1060
300
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
P26
TAI-TECH
9. Packaging Information
9-1. Reel Dimension
A
Type
A(mm) B(mm)
C(mm) D(mm)
2±0.5
120°
9.0
±
0.5
60.0
±
2.0
13.5
±
0.5 178.0
±
2.0
7”x8mm
7″x8mm
7″x12mm
9-2. Tape Dimension / 8mm
W(mm) P(mm) E(mm) F(mm)
P2(mm)
D(mm)
D1(mm) P0(mm) A0(mm) B0(mm) K0(mm)
t(mm)
Series
8.00
±
0.10 4.00
±
0.10 1.75
±
0.10 3.50
±
0.05 2.00
±
0.05 1.50+0.10/-0.00 1.00
±
0.10 4.00
±
0.10 1.50
±
0.10 2.35
±
0.10 1.45
±
0.10 0.28
±
0.05
HSF2012F2S
9-3. Packaging Quantity
Chip/Reel
2000
Inner Box
Middle Box
Carton
Chip size
`
HSF2012F2S
10000
50000
100000
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
F
165° to180°
Top cover tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
(
℃
)
(%)
Base tape
5~35
45~85
860~1060
300
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
