TAI-TECH-WCM9070-102T40-M
| Part # | TAI-TECH-WCM9070-102T40-M |
Download  | TAI-TECH-WCM9070-102T40-M |
P2
TAI-TECH
Wire Wound Type Common Mode Filter
WCM1210F2SF-SERIES
1. Features
1. High common mode impedance at high frequency cause excellent
noise suppression performance.
Halogen
2.
WCM1210F2SF
series realizes small size and low profile.
1.2×1.0x0.9 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
4. Operating temperature-40~+125
℃
(Including self – temperature rise)
Halogen-free
2. Dimension
A
B
Series
A(mm)
B(mm)
C(mm) D1(mm)
D2(mm) E(mm)
1210F2SF 1.2±0.2
1.0±0.2 0.9
max. 0.35±0.1 0.35±0.1 0.03
min.
3. Part Numbering
WCM 1210
F
2
S
F
–
900
T
02
A
B
C
D
E
F
G
H
I
A: Series
B: Dimension
C: Material
Ferrite Core
D: Number of Lines
2=2 lines
E: Type
S=Shielded , N=Unshielded
F: Lead free
G: Impedance
H: Packaging
I: Rated Current
900=90
Ω
T=
T
a
ping and Reel
02=250mA
4. Specification
DC
Resistance
(
Ω
) max.
Withstand
Volt. (Vdc)
max.
Rated Current
Rated Volt.
TAI-TECH
Part Number
Common mode
Impedance (
Ω
)
IR
(
Ω
) min.
Test Frequency
(MHz)
(mA)max.
(Vdc) max.
WCM1210F2SF-600T02
WCM1210F2SF-900T02
WCM1210F2SF-121T02
WCM1210F2SF-161T01
WCM1210F2SF-201T01
60±25%
90±25%
100
100
100
100
100
0.30
0.30
0.35
0.43
0.80
250
250
250
160
120
50
50
50
50
50
125
125
125
125
125
10M
10M
10M
10M
10M
120±25%
160±25%
200±25%
P3
TAI-TECH
WCM1210F2SF-900T02
WCM1210F2SF-600T02
Common Mode
1000
100
10
1000
100
10
Common Mode
Normal Mode
Normal Mode
1
1
0.1
0.1
1
1
10
100
FREQUENCY(MHz)
1000
10000
10
100
1000
10000
FREQUENCY(MHz)
WCM1210F2SF-121T02
WCM1210F2SF-161T01
1000
1000
100
10
Common Mode
Common Mode
100
10
1
Normal Mode
Normal Mode
1
0.1
0.1
1
10
100
1000
10000
1
10
100
FREQUENCY(MHz)
1000
10000
FREQUENCY(MHz)
WCM1210F2SF-201T01
1000
100
10
Common Mode
Normal Mode
1
0.1
1
10
100
FREQUENCY(MHz)
1000
10000
P4
TAI-TECH
Wire Wound Type Common Mode Filter
WCM1608F2SNF-SERIES
1. Features
1. High common mode impedance at high frequency cause excellent
noise suppression performance.
Halogen
2.
WCM1608F2SNF
series realizes small size and low profile.
1.6×0.8×1.1 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
4. Operating temperature-40~+125
℃
(Including self – temperature rise)
Halogen-free
2. Dimension
Series
A(mm)
B(mm)
C(mm) D1(mm)
D2(mm) E(mm)
1608F2SNF 1.60±0.15 0.85±0.15 1.10±0.15
0.30Typ. 0.30Typ.
0.03 min.
3. Part Numbering
WCM 1608
F
2
SN
F
–
900
T
05
A
B
C
D
E
F
G
H
I
A: Series
B: Dimension
C: Material
Ferrite Core
D: Number of Lines
2=2 lines
E: Type
S=Shielded , N=Unshielded
F: Lead free
G: Impedance
H: Packaging
I: Rated Current
900=90
Ω
T=
T
a
ping and Reel
05=550mA
4. Specification
DC
Resistance
(
Ω
) max.
Withstand
Volt. (Vdc)
max.
Rated Current
Rated Volt.
TAI-TECH
Part Number
Common mode
Impedance (
Ω
)
IR
(
Ω
) min.
Test Frequency
(MHz)
(mA)max.
(Vdc) max.
WCM1608F2SNF-220T05
WCM1608F2SNF-450T05
WCM1608F2SNF-900T05
WCM1608F2SNF-121T05
WCM1608F2SNF-181T05
WCM1608F2SNF-251T04
22±25%
45±25%
90±25%
120±25%
180±25%
250±25%
100
100
100
100
100
100
0.080
0.110
0.145
0.175
0.210
0.280
500
500
550
500
500
400
50
50
50
50
50
50
125
125
125
125
125
125
10M
10M
10M
10M
10M
10M
P5
TAI-TECH
WCM1608F2SNF-450T05
WCM1608F2SNF-220T05
1000
100
10
100
Common Mode
10
1
Common Mode
Normal Mode
Normal Mode
1
0.1
0.1
1
1
10
100
FREQUENCY(MHz)
1000
10000
10
100
FREQUENCY(MHz)
1000
10000
10000
10000
WCM1608F2SNF-900T05
Common Mode
WCM1608F2SNF-121T05
1000
100
10
1000
100
10
Common Mode
Normal Mode
Normal Mode
1
1
0.1
1
0.1
10
100
1000
1
10
100
FREQUENCY(MHz)
1000
10000
FREQUENCY(MHz)
WCM1608F2SNF-181T05
WCM1608F2SNF-251T04
1000
100
10
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
0.1
1
0.1
10
100
FREQUENCY(MHz)
1000
1
10
100
FREQUENCY(MHz)
1000
10000
P6
TAI-TECH
Wire Wound Type Common Mode Filter
WCM2012F2SF-SERIES
1. Features
1. High common mode impedance at high frequency cause excellent noise
suppression performance.
Halogen
2.
WCM2012F2SF
series realizes small size and low profile.
2.0×1.2×1.2 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
4. Operating temperature -40~+125
℃
(Including self – temperature rise)
Halogen-free
2. Dimension
A
Series
A(mm)
B(mm)
C(mm) D1(mm)
D2(mm) E(mm)
2012F2SF 2.0±0.2
1.2±0.2
1.2±0.2 0.50±0.1
0.51±0.1 0.15±0.1
B
3. Part Numbering
WCM 2012
F
2
S
F
–
900
T
04
A
B
C
D
E
F
G
H
I
A: Series
B: Dimension
C: Material
Ferrite Core
2=2 lines
D: Number of Lines
E: Type
S=Shielded , N=Unshielded
F: Lead free
G: Impedance
H: Packaging
I: Rated Current
900=90
Ω
T=
T
a
ping and Reel
04=400mA
4. Specification
DC
Resistance
(
Ω
) max.
Withstand
Volt. (Vdc)
max.
Common mode
Test Frequency
Rated Current
Rated Volt.
TAI-TECH
Part Number
IR
(
Ω
) min.
Impedance
(MHz)
(mA)max.
(Vdc)max.
(
Ω
)
WCM2012F2SF-670T04
WCM2012F2SF-900T04
WCM2012F2SF-121T04
WCM2012F2SF-161T03
WCM2012F2SF-181T03
WCM2012F2SF-201T03
WCM2012F2SF-221T03
WCM2012F2SF-261T03
WCM2012F2SF-361T03
67±25%
90±25%
100
100
100
100
100
100
100
100
100
0.25
0.30
0.30
0.35
0.35
0.40
0.40
0.40
0.50
400
400
400
350
350
300
300
300
300
50
50
50
50
50
50
50
50
50
125
125
125
125
125
125
125
125
125
10M
10M
10M
10M
10M
10M
10M
10M
10M
120±25%
160±25%
180±25%
200±25%
220±25%
260±25%
360±25%
P7
TAI-TECH
Typical Impedance v.s. Frequency Curve
WCM2012F2SF-670T04
WCM2012F2SF-900T04
1000
1000
100
10
Common Mode
Common Mode
100
10
1
Normal Mode
Normal Mode
1
0.1
0.1
1
10
100
FREQUENCY(MHz)
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
WCM2012F2SF-121T04
WCM2012F2SF-161T03
1000
100
10
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
0.1
0.1
1
10
100
FREQUENCY(MHz)
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
WCM2012F2SF-181T03
WCM2012F2SF-201T03
10000
1000
100
10
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
0.1
0.1
1
10
100
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM2012F2SF-221T03
WCM2012F2SF-261T03
1000
100
10
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
0.1
0.1
1
10
100
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
P8
TAI-TECH
WCM2012F2SF-361T03
10000
1000
100
10
Common Mode
Normal Mode
1
0.1
1
10
100
1000
10000
FREQUENCY(MHz)
3. Part Numbering
WCM 2012
F
2
S
F
–
801
–
N
A
B
C
D
E
F
G
H
A: Series
B: Dimension
C: Material
Ferrite Core
D: Number of Lines
2=2 lines
E: Type
S=Shielded , N=Unshielded
F: Lead free
G: Impedance
H: Category Code
801=800
Ω
N=DR-N45
材
&SP-N45
材
4. Specification
DC
Resistance
(
Ω
) max.
Withstand
Volt. (Vdc)
max.
Common mode
Test Frequency
(MHz)
Rated Current
Rated Volt.
TAI-TECH
Part Number
IR
(
Ω
) min.
Impedance
(mA)max.
(Vdc)max.
(
Ω
)
WCM2012F2SF-801-N
800±25%
100
0.88
300
50
125
10M
Typical Impedance v.s. Frequency Curve
WCM2012F2SF-801-N
10000
Common Mode
1000
100
10
Normal Mode
1
1
10
100
1000
10000
FREQUENCY(MHz)
P9
TAI-TECH
Wire Wound Type Common Mode Filter
WCM3216F2SF-SERIES
1. Features
1. High common mode impedance at high frequency cause excellent noise
suppression performance.
Halogen
2.
WCM3216F2SF
series realizes small size and low profile.
3.2×1.6×2.0 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
4. Operating temperature-40~+125
℃
(Including self – temperature rise)
Halogen-free
2. Dimension
A
Series
A(mm)
B(mm)
C(mm) D1(mm)
D2(mm) E(mm)
3216F2SF 3.2±0.2
Units: mm
1.6±0.2
2.0±0.2
0.5±0.1
0.5±0.1 0.15±0.1
B
3. Part Numbering
WCM 3216
F
2
S
F –
900
T
04
A
B
C
D
E
F
G
H
I
A: Series
B: Dimension
C: Material
Ferrite Core
D: Number of Lines
2=2 lines
E: Type
S=Shielded , N=Unshielded
F: Lead free type
G: Impedance
H: Packaging
I: Rated Current
900=90
Ω
T=
T
a
ping and Reel
04=400mA
4. Specification
DC
Resistance
(
Ω
) max.
Common mode
Withstand
IR
TAI-TECH
Part Number
Rated Volt.
(Vdc)max.
Test Frequency
Rated Current
(mA)max.
Impedance
Volt. (Vdc)
(
Ω
) min.
(MHz)
(
Ω
)
Max.
WCM3216F2SF-900T04
WCM3216F2SF-121T03
WCM3216F2SF-161T03
WCM3216F2SF-221T03
WCM3216F2SF-261T03
WCM3216F2SF-361T03
WCM3216F2SF-601T03
WCM3216F2SF-102T02
WCM3216F2SF-222T02
90±25%
120±25%
160±25%
220±25%
260±25%
360±25%
600±25%
1000±25%
2200±25%
100
100
100
100
100
100
100
100
100
0.30
0.30
0.40
0.45
0.50
0.60
0.80
1.00
1.20
400
350
350
300
300
300
300
200
200
50
50
50
50
50
50
50
50
50
125
125
125
125
125
125
125
125
125
10M
10M
10M
10M
10M
10M
10M
10M
10M
P10
TAI-TECH
Typical Impedance v.s. Frequency Curve
WCM3216F2SF-900T04
WCM3216F2SF-121T03
1000
100
10
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
0.1
0.1
1
1
10
100
1000
10000
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM3216F2SF-161T03
WCM3216F2SF-221T03
10000
1000
100
10
1000
Common Mode
100
10
1
Common Mode
Normal Mode
Normal Mode
1
0.1
0.1
1
10
100
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM3216F2SF-261T03
WCM3216F2SF-361T03
1000
100
10
10000
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
0.1
0.1
1
10
100
FREQUENCY(MHz)
1000
10000
1
10
100
FREQUENCY(MHz)
1000
10000
WCM3216F2SF-601T03
Common Mode
WCM3216F2SF-102T02
10000
1000
100
10
10000
1000
100
10
Common Mode
Normal Mode
1
Normal Mode
1
0.1
1
10
100
FREQUENCY(MHz)
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
P11
TAI-TECH
WCM3216F2SF-222T02
10000
Common Mode
1000
100
10
Normal Mode
1
1
10
100
FREQUENCY(MHz)
1000
10000
P12
TAI-TECH
Wire Wound Type Common Mode Filter
WCM3225F2SF-SERIES
1. Features
1. High common mode impedance at high frequency cause excellent noise
suppression performance.
Halogen
2.
WCM3225F2SF
series realizes small size and low profile.
3.2×2.5×2.2 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
4. Operating temperature-40~+125
℃
(Including self – temperature rise)
Halogen-free
2. Dimension
A
Series
A(mm)
B(mm)
C(mm) D1(mm)
D2(mm) E(mm)
0.15±0.1
3225F2SF 3.2±0.2
Units: mm
2.5±0.2
2.2±0.2
0.8±0.1
0.9±0.1
B
3. Part Numbering
WCM 3225
F
2
S
F
–
102
T
04
A
B
C
D
E
F
G
H
I
A: Series
B: Dimension
C: Material
Ferrite Core
D: Number of Lines
2=2 lines
E: Type
S=Shielded , N=Unshielded
F: Lead free type
G: Impedance
H: Packaging
I: Rated Current
102=1000
Ω
T=
T
a
ping and Reel
04=400mA
4. Specification
DC
Resistance
(
Ω
) max.
Common mode
Withstand
Volt. (Vdc)
max.
TAI-TECH
Part Number
Rated Volt.
(Vdc)max.
IR
(
Ω
) min.
Test Frequency
(MHz)
Rated Current
(mA)max.
Impedance
(
Ω
)
WCM3225F2SF-900T10
WCM3225F2SF-261T10
WCM3225F2SF-601T10
WCM3225F2SF-102T04
90±25%
260±25%
600±25%
1000±25%
100
100
100
100
0.050
0.15
0.20
0.30
1000
1000
1000
400
50
50
50
50
125
125
125
125
10M
10M
10M
10M
P13
TAI-TECH
WCM3225F2SF-900T10
Common Mode
WCM3225F2SF-261T10
1000
100
10
1000
100
10
Common Mode
Normal Mode
Normal Mode
1
1
0.1
1
0.1
10
100
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM3225F2SF-102T04
Common Mode
WCM3225F2SF-601T10
Common Mode
10000
1000
100
10
10000
1000
100
10
Normal Mode
Normal Mode
1
1
0.1
0.1
1
1
10
100
1000
10000
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
P14
TAI-TECH
Wire Wound Type Common Mode Filter
WCM4532F2SF-SERIES
1. Features
1. High common mode impedance at high frequency cause excellent noise
suppression performance.
Halogen
2.
WCM4532F2SF
series realizes small size and low profile.
4.5×3.2×2.8 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
4. Operating temperature-40~+125
℃
(Including self – temperature rise)
Halogen-free
2. Dimension
A
Series
A(mm)
B(mm)
C(mm)
2.8±0.2
D1(mm) D2(mm)
1.0±0.1 1.2±0.1
4532F2SF
Units: mm
4.5±0.2
3.2±0.2
B
D
D
3. Part Numbering
WCM 4532
F
2
S
F
–
900 T 30
A
B
C
D
E
F
G
H
I
A: Series
B: Dimension
C: Material
Ferrite Core
D: Number of Lines
2=2 lines
E: Type
S=Shielded , N=Unshielded
F: Lead free
G: Impedance
H: Packaging
I: Rated Current
900=90
Ω
T=
T
a
ping and Reel
30=3000mA
4. Specification
DC
Resistance
(
Ω
) max.
Common mode
Test Frequency
Impedance
Withstand
Volt. (Vdc)
max.
Rated Current
(mA) max.
TAI-TECH
Part Number
Rated Volt.
(Vdc) max.
IR
(
Ω
) min.
(MHz)
(
Ω
)
10M
WCM4532F2SF-800T30
80±25%
90±25%
100
100
100
100
100
100
0.05
0.05
0.05
0.10
0.24
0.24
3000
3000
3000
1500
1500
1000
50
50
50
50
50
50
125
125
125
125
125
125
WCM4532F2SF-900T30
WCM4532F2SF-121T30
10M
10M
120±25%
200±25%
600±25%
800±25%
WCM4532F2SF-201T15
WCM4532F2SF-601T15
WCM4532F2SF-801T10
10M
10M
10M
P15
TAI-TECH
WCM4532F2SF-900T30
WCM4532F2SF-800T30
1000
100
10
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
0.1
0.1
1
1
10
100
1000
10000
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM4532F2SF-201T15
WCM4532F2SF-121T30
1000
100
10
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
0.1
0.1
1
1
10
100
1000
10000
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM4532F2SF-801T10
Common Mode
WCM4532F2SF-601T15
Common Mode
10000
1000
100
10
10000
1000
100
10
Normal Mode
Normal Mode
1
1
0.1
0.1
1
1
10
100
1000
10000
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
P16
TAI-TECH
Reliability and Test Condition (WCM1210, 1608, 2012, 3216, 3225, 4532)
Item
Operating temperature
Storage temperature
Performance
Test Condition
-40~+125
℃
(Including self – temperature rise)
-40~+125
℃
(on board)
Electrical Performance Test
Z(common mode)
Keysight E4991B + Keysight 16197A
Agilent-34420A
Agilent-4338B
DCR
Refer to standard electrical characteristics list.
I.R.
Chroma 19073
1.Applied the allowed DC current.
2.
T
e
mperature measured by digital surface thermometer
T
e
mperature Rise
T
e
st
Rated Current
ΔT 40
℃
Max
Reliability Test
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
)
Temperature
：
125±2
℃
Life Test
Applied current
：
rated current
Duration
：
1000±12hrs
Measured at room temperature after placing for 24 hrs.
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
Humidity
：
85±3% R.H,
Load Humidity
Temperature
：
85
℃
±2
℃
Duratio
n
：
1000hrs Min. Bea
d
：
with 100% rated curren
t
，
Inductance: with 10% rated current
Measured at room temperature after placing for 24 hrs.
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow
Profiles
1. Baked at50
℃
for 25hrs, measured at room temperature after
placing for 4 hrs.
Appearance
：
No damage.
2. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25
℃
in 2.5hrs.
3. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25
℃
in
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value
Moisture Resistance
2.5hrs,keep at 25
℃
for 2 hrs then keep at -10
℃
for 3 hrs
4. Keep at 25
℃
80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification
Reflow Profiles
Condition for 1 cycle
Step1
：
-40±2
℃
30±5min
Step2
：
125±2
℃ ≦
0.5min
Step3
：
125±2
℃
30±5min
Thermal
shock
Number of cycles
：
500
Measured at room temperature after placing for 24 hrs.
Oscillation Frequency: 10Hz
～
2KHz
～
10Hz for 20 minute
Equipment
：
Vibration checker
Total Amplitude:10g
Vibration
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)
。
P17
TAI-TECH
Item
Performance
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
<0805 inch(2012mm):40x100x0.8mm
Bending depth: >=0805 inch(2012mm):1.2mm
<0805 inch(2012mm):0.8mm
Bending
Appearance
：
No damage.
duration of 10 sec.
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value
Peak
value
(g’s)
Normal
duration (D)
(ms)
Velocity
change
(Vi)ft/sec
Wave
form
Type
SMD
Lead
50
50
11
11
Half-sine
Half-sine
11.3
11.3
Shock
3 shocks in each direction along 3 perpendicular axes. (18 shocks).
a. Method B, 4 hrs @155°C dry heat @235°C±5°C
Testing Time :5 +0/-0.5 seconds
b. Method D category 3. (8hours ± 15 min)@ 260°C±5°C
Testing Time :30 +0/-0.5 seconds
More than 95% of the terminal electrode should
Solderability
be covered with solder
。
Depth: completely cover the termination
Temperature
Temperature(°C) Time(s)
ramp/immersion Number
of
and emersion rate
heat cycles
Resistance to Soldering Heat
260 ±5
(solder temp)
10 ±1
25mm/s ±6 mm/s
1
Preconditioning: Run through reflow for
J-STD-020E Classification Reflow Profiles
3
times.( IPC/JEDEC
With the component mounted on a PCB with the device to be tested,
apply a force(>0805:1kg , <=0805:0.3kg)to the side of a device being
tested. This force shall be applied for 60 +1 seconds. Also the force
shall be applied gradually as not to apply a shock to the component
being tested.
Appearance
：
No damage.
Terminal
Strength
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value e
P18
TAI-TECH
Wire Wound Type Common Mode Filter
WCM4532F2SF-SERIES-HI
1. Features
1. High common mode impedance at high frequency cause excellent noise
suppression performance.
Halogen
2.
WCM4532F2SF
series realizes small size and low profile.
4.5×3.2×2.8 mm.
3. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
4. Operating temperature-40~+125
℃
(Including self – temperature rise)
Halogen-free
2. Dimension
Series
A(mm)
B(mm)
C(mm)
D1(mm) D2(mm)
4532F2SF
Units: mm
4.5±0.2
3.2±0.2
2.8±0.2 0.90±0.15
1.05±0.15
3. Part Numbering
WCM 4532
F
2
S
F
–
142 T 20
–
HI
A
B
C
D
E
F
G
H
I
J
A: Series
B: Dimension
C: Material
Ferrite Core
D: Number of Lines
2=2 lines
E: Type
S=Shielded , N=Unshielded
F: Lead free
G: Impedance
H: Packaging
I: Rated Current
J: Control S/N
142=1400
Ω
T=
T
a
ping and Reel
20=2000mA
4. Specification
DC
Resistance
(
Ω
) max.
Withstand
Volt. (Vdc)
max.
Rated Current
(mA) max.
TAI-TECH
Part Number
Common mode
Impedance (
Ω
)
Rated Volt.
(Vdc) max.
IR
(
Ω
) min.
Test Frequency
(MHz)
WCM4532F2SF-900T40-HI
WCM4532F2SF-231T35-HI
WCM4532F2SF-421T32-HI
WCM4532F2SF-601T25-HI
WCM4532F2SF-901T23-HI
68 min
90 typ.
100
100
100
100
100
100
100
0.050
0.050
0.055
0.060
0.070
0.100
0.350
4000
3500
3200
2500
2300
2000
900
50
50
50
50
50
50
50
125
125
125
125
125
125
125
10M
10M
10M
10M
10M
10M
10M
173 min
230 typ.
300 min
420 typ.
450 min
600 typ.
650 min
900 typ.
WCM4532F2SF-142T20-HI 1000
min. 1400 typ.
WCM4532F2SF-282T09-HI 2100
min 2800
typ.
Note: When current is applied , the temperature of the part should not exceed 125
℃
P19
TAI-TECH
WCM4532F2SF-900T40-HI
Common Mode
WCM4532F2SF-231T35-HI
1000
100
10
1000
Common Mode
100
10
1
Normal Mode
Normal Mode
1
0.1
1
0.1
10
100
1000
10000
10000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM4532F2SF-601T25-HI
Common Mode
WCM4532F2SF-421T32-HI
Common Mode
10000
1000
100
10
1000
100
10
1
Normal Mode
Normal Mode
1
0.1
1
10
100
1000
10000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM4532F2SF-901T23-HI
Common Mode
WCM4532F2SF-142T20-HI
Common Mode
10000
1000
100
10
10000
1000
100
10
Normal Mode
1
Normal Mode
1
0.1
1
10
100
1000
1
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM4532F2SF-282T09-HI
Common Mode
10000
1000
100
10
Normal Mode
1
0.1
1
10
100
1000
10000
FREQUENCY(MHz)
P20
TAI-TECH
5. Schematic Diagram
6. Materials
No. Description
Specification
a.
b.
c
Upper Plate
Core
Ferrite
Ferrite Core
T
e
rmination
Wire
Ag/Ni/Sn
d
Enameled Copper Wire
P21
TAI-TECH
Reliability and Test Condition (4532-HI)
Item
Performance
Test Condition
-40~+125
℃
(Including self – temperature rise)
Operating temperature
-40~+125
℃
(on board)
Storage temperature
Electrical Performance Test
Z(common mode)
Keysight E4991B + Keysight 16197A
Refer to standard electrical characteristics list.
Agilent-34420A
Agilent-4338B
DCR
I.R.
Chroma 19073
1.Applied the allowed DC current.
2.
T
e
mperature measured by digital surface thermometer
T
e
mperature Rise
T
e
st
Reliability Test
Rated Current
, ΔT :40
℃
typ.
Preconditioning: Run through reflow for 3
times.( IPC/JEDECJ-STD-020EClassification Reflow Profiles)
T
e
mperature
：
125±2
℃
(Inductor)
Life Test
Applied current
：
rated current
Duration
：
1000
±
12hrs
Measured at room temperature after placing for 24 hrs.
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
Humidity
：
85±3% R.H,
Load Humidity
Temperature
：
85
℃
±2
℃
Duration
：
1000hrs Min. Bead
：
with 100% rated current
，
Inductance: with 10% rated current
Measured at room temperature after placing for 24 hrs.
Preconditioning: Run through reflow for 3
times.( IPC/JEDECJ-STD-020E Classification Reflow Profiles)
1. Baked at50
℃
for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and keep 3
hours, cool down to 25
℃
in 2.5hrs.
3. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and keep 3
hours, cool down to 25
℃
in
2.5hrs,keep at 25
℃
for 2 hrs then keep at -10
℃
for 3 hrs
4. Keep at 2
5
℃
80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Appearance
：
No damage.
Moisture Resistance
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value
Preconditioning: Run through reflow for 3
times.( IPC/JEDECJ-STD-020E Classification Reflow Profiles)
Condition for 1 cycle
Step1
：
-40±2
℃
30±5min
Step2
：
125±2
℃ ≦
0.5min
Step3
：
125±2
℃
30±5min
Thermal shock
Number of cycles
：
500
Measured at room temperature after placing for 24 hrs.
Preconditioning: Run through reflow for 3
times.( IPC/JEDECJ-STD-020E Classification Reflow Profiles)
Oscillation Frequency: 10Hz
～
2KHz
～
10Hz for 20 minute
Equipment
：
Vibration checker
Vibration
T
o
tal Amplitude:10g
T
e
sting Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)
。
P22
TAI-TECH
Item
Performance
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
<0805 inch(2012mm):40x100x0.8mm
Bending depth: >=0805 inch(2012mm):1.2mm
<0805 inch(2012mm):0.8mm
Bending
Appearance
：
No damage.
duration of 10 sec.
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value
Peak
value
(g’s)
Normal
duration (D)
(ms)
Velocity
change
(Vi)ft/sec
Wave
form
Type
SMD
Lead
50
50
11
11
Half-sine
Half-sine
11.3
11.3
Shock
3 shocks in each direction along 3 perpendicular axes. (18 shocks).
a. Method B, 4 hrs @155°C dry heat @235°C±5°C
Testing Time :5 +0/-0.5 seconds
b. Method D category 3. (8hours ± 15 min)@ 260°C±5°C
Testing Time :30 +0/-0.5 seconds
More than 95% of the terminal electrode should
Solderability
be covered with solder
。
Depth: completely cover the termination
Temperature
Temperature(°C) Time(s)
ramp/immersion Number
of
and emersion rate
heat cycles
Resistance to Soldering Heat
260 ±5
(solder temp)
10 ±1
25mm/s ±6 mm/s
1
Preconditioning: Run through reflow for
J-STD-020E Classification Reflow Profiles
3
times.( IPC/JEDEC
Appearance
：
No damage.
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value
With the component mounted on a PCB with the device to be tested,
apply a force(>0805:1kg , <=0805:0.5kg)to the side of a device being
tested. This force shall be applied for 60 +1 seconds. Also the force
shall be applied gradually as not to apply a shock to the component
being tested.
Terminal
Strength
P23
TAI-TECH
Wire Wound Power Common Mode Filter
WCM7060FASF-SERIES-LM
1. Features
1. Operating temperature -40~+125
℃
(Including self – temperature rise)
Halogen
Halogen-free
2. Dimension
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
F(mm)
G(mm)
WCM7060 7.0±0.5
Unit:mm
6.0±0.5 3.8
max. 3.5
typ.
1.5±0.5
1.5±0.5
1.7±0.5
3. Part Numbering
WCM 7060
F
A
S
F
–
701
–
LM
A
B
C
D
E
F
G
H
A: Series
B: Dimension
C: Material
Ferrite Core
Asembled
D: Process
E: Type
S=Shielded , N=Unshielded
F: Lead free
G: Impedance
H: Laser Marking
701=700
Ω
4. Specification
Impedance
DC Resistance
(m
Ω
) max.
(1 line)
Insulation
Resistance
(M
Ω
) min.
(
Ω
)
TAI-TECH
Part Number
Rated Volt.
(Vdc) max.
Test Frequency
Rated Current
(A) max.
(MHz)
min.
typ.
WCM7060FASF-400-LM
WCM7060FASF-101-LM
WCM7060FASF-301-LM
WCM7060FASF-501-LM
WCM7060FASF-701-LM
WCM7060FASF-102-LM
WCM7060FASF-132-LM
40
70
140
300
500
700
1020
1300
100
100
100
100
100
100
100
5
15
9
80
80
80
80
80
80
80
10
10
10
10
10
10
10
100
225
400
500
800
910
10
10
10
15
17
20
5
5
4
3
3
Note:
Measurement board data
Material : FR4
Board dimensions : 100 X 50 X 1.6t mm
Pattern dimensions: 45 X 30 mm (Double side board)
Pattern thickness
: 50
μ
m
P24
TAI-TECH
WCM7060FASF-101-LM
WCM7060FASF-400-LM
10000
1000
100
10
1000
Common Mode
100
10
1
Common Mode
Normal Mode
Normal Mode
1
1
10
100
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM7060FASF-501-LM
WCM7060FASF-301-LM
10000
1000
100
10
10000
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
1
10
100
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM7060FASF-102-LM
WCM7060FASF-701-LM
10000
1000
100
10
10000
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
1
10
100
1000
10000
1
10
100
1000
10000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM7060FASF-132-LM
10000
1000
100
10
Common Mode
Normal Mode
1
1
10
100
1000
10000
FREQUENCY(MHz)
P25
TAI-TECH
Wire Wound Type Common Mode Filter
WCM9070-SERIES-M
1. Features
1. Operating temperature -40~+125
℃
(Including self – temperature rise)
Halogen
2. Dimension
Halogen-free
Recommended PC Board Pattern
701
5.0
1.5
G
D
G
5.0
11
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
F(mm)
G(mm)
WCM9070 9.0±0.5
Unit:mm
7.0±0.5 4.8
max. 5.7
typ.
1.5±0.5
2.0±0.5
1.7±0.2
3. Part Numbering
WCM 9070
–
701
T
50
–
M
A
B
E
F
C
D
A: Series
B: Dimension
C: Impedance
D: Packaging
E: Rated Current
F
:
Marking
701=700
Ω
T=
T
a
ping
50=5A
印字
:
黑色 單向印字
4. Specification
Impedance
Insulation
Resistance
(M
Ω
) min.
(
Ω
)
DC Resistance
(
Ω
) max.(1 line)
TAI-TECH
Rated Volt.
(Vdc) max.
Test Frequency
(MHz)
Rated Current
(A) max.
Part Number
min.
225
typ.
300
WCM9070-301T60-M
WCM9070-501T60-M
WCM9070-701T50-M
WCM9070-102T40-M
WCM9070-222T25-M
WCM9070-272T20-M
WCM9070-302T30-M
6.0
6.0
5.0
4.0
2.5
2.0
3.0
100
100
100
100
100
100
100
6m
8m
80
80
80
80
80
80
80
10
10
10
10
10
10
10
450
600
500
700
10m
13m
60m
65m
70m
750
1000
2200
2700
3000
1700
2000
2500
P26
TAI-TECH
WCM9070-301T60-M
WCM9070-501T60-M
10000
10000
1000
100
10
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
1
10
100
1000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM9070-701T50-M
WCM9070-102T40-M
10000
1000
100
10
10000
1000
100
10
Common Mode
Common Mode
Normal Mode
Normal Mode
1
1
1
10
100
1000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM9070-222T25-M
WCM9070-272T20-M
10000
1000
100
100000
10000
1000
100
Common Mode
Common Mode
Normal Mode
Normal Mode
10
10
1
10
100
1000
1
10
100
1000
FREQUENCY(MHz)
FREQUENCY(MHz)
WCM9070-302T30-M
100000
10000
1000
100
Common Mode
Normal Mode
10
1
10
100
1000
FREQUENCY(MHz)
P27
TAI-TECH
Wire Wound Type Common Mode Filter
WCM1211F-SERIES-M
1. Features
Halogen
1.Operating temperature-40~+125
℃
(Including self – temperature rise)
Halogen-free
2. Dimension
Recommended PC Board Pattern
A
1
2
4
3
701
G
D
G
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
F(mm)
G(mm)
WCM1211 12±0.5
10.8±0.5 6.4
max. 7.0
typ.
Unit:mm
2.7±0.2
2.5±0.2
2.5±0.2
3. Part Numbering
WCM 1211
F –
701
T
80
–
M
A
B
G
C
D
E
F
A: Series
B: Dimension
C: Lead free
D: Impedance
E: Packaging
F: Rated Current
G:Marking
701=700
Ω
T=
T
a
ping
80=8A
印字
:
黑色 單向印字
4. Specification
Impedance
Insulation
Rated Volt.
(
Ω
)
DC Resistance
(
Ω
) max.(1 line)
TAI-TECH
Test Frequency
(MHz)
Rated Current
(A) max.
Resistance
Part Number
(Vdc) max.
(M
Ω
) min.
min.
80
typ.
230
WCM1211F-800T10-M
WCM1211F-701T80-M
WCM1211F-801T80-M
WCM1211F-102T60-M
100
100
100
100
100
100
2m
6m
10
8
125
125
125
125
125
125
10
10
10
10
10
10
500
600
750
700
800
8m
8
1000
2500
2700
14m
35m
50m
6
WCM1211F-222T02-M 2200
WCM1211F-272T02-M 2300
1.8
1.5
P28
TAI-TECH
WCM1211F-800T10-M
WCM1211F-701T80-M
WCM1211F-801T80-M
WCM1211F-102T60-M
WCM1211F-272T02-M
WCM1211F-222T02-M
P29
TAI-TECH
5. Schematic Diagram
DC Resistance
Insulation Resistance
Impedance
6-1. Materials (WCM7060)
No. Description
Specification
a.
b.
c
Upper Plate
Core
Ceramics Core (Black)
Ferrite Core
Wire
Enameled Copper
Ag/Ni/Sn + Sn Solder
Laser Marking
d
T
e
rmination
Mark
e
6-2. Materials (WCM9070,1211)
No. Description
Specification
a.
b.
c
Upper Plate
Core
MYLAR
Ferrite Core
Enameled Copper Wire
Ag/Ni/Sn
Wire
d
T
e
rmination
INK
e
BLACK
P30
TAI-TECH
7. Reliability and Test Condition (WCM7060, 9070, 1211)
Item
Operating temperature
Storage temperature
Performance
Test Condition
-40~+125
℃
(Including self – temperature rise)
-40~+125
℃
(on board)
Electrical Performance Test
Z(common mode)
Agilent E4991A + Keysight 16092A
DCR
I.R.
Refer to standard electrical characteristics list.
Agilent-34420A
Chroma 19073
1.Applied the allowed DC current.
2.
T
e
mperature measured by digital surface thermometer
T
e
mperature Rise
T
e
st
Rated Current
ΔT 40
℃
Max
Reliability Test
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
)
Temperature
：
125±2
℃
Life Test
Applied current
：
rated current
Duration
：
1000±12hrs
Measured at room temperature after placing for 24 hrs.
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow Profiles
Humidity
：
85±3% R.H,
Load Humidity
Temperature
：
85
℃
±2
℃
Duratio
n
：
1000hrs Min. Bea
d
：
with 100% rated curren
t
，
Inductance: with 10% rated current
Measured at room temperature after placing for 24 hrs.
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification Reflow
Profiles
1. Baked at50
℃
for 25hrs, measured at room temperature after
placing for 4 hrs.
Appearance
：
No damage.
2. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25
℃
in 2.5hrs.
3. Raise temperature to 65
±
2
℃
90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25
℃
in
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value
Moisture Resistance
2.5hrs,keep at 25
℃
for 2 hrs then keep at -10
℃
for 3 hrs
4. Keep at 25
℃
80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through reflow for 3 times.( IPC/JEDEC
J-STD-020E Classification
Reflow Profiles
Condition for 1 cycle
Step1
：
-40±2
℃
30±5min
Step2
：
125±2
℃ ≦
0.5min
Step3
：
125±2
℃
30±5min
Thermal
shock
Number of cycles
：
500
Measured at room temperature after placing for 24 hrs.
Oscillation Frequency: 10Hz
～
2KHz
～
10Hz for 20 minute
Equipment
：
Vibration checker
Total Amplitude:10g
Vibration
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)
。
P31
TAI-TECH
Item
Performance
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
<0805 inch(2012mm):40x100x0.8mm
Bending depth: >=0805 inch(2012mm):1.2mm
<0805 inch(2012mm):0.8mm
Bending
Appearance
：
No damage.
duration of 10 sec.
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value
Peak
value
(g’s)
Normal
duration (D)
(ms)
Velocity
change
(Vi)ft/sec
Wave
form
Type
SMD
Lead
50
50
11
11
Half-sine
Half-sine
11.3
11.3
Shock
3 shocks in each direction along 3 perpendicular axes. (18 shocks).
a. Method B, 4 hrs @155°C dry heat @235°C±5°C
Testing Time :5 +0/-0.5 seconds
b. Method D category 3. (8hours ± 15 min)@ 260°C±5°C
Testing Time :30 +0/-0.5 seconds
More than 95% of the terminal electrode should
Solderability
be covered with solder
。
Depth: completely cover the termination
Temperature
Temperature(°C) Time(s)
ramp/immersion Number
of
and emersion rate
heat cycles
Resistance to Soldering Heat
260 ±5
(solder temp)
10 ±1
25mm/s ±6 mm/s
1
Appearance
：
No damage.
Preconditioning: Run through reflow for
J-STD-020E Classification Reflow Profiles
3 times.( IPC/JEDEC
Impedance
：
within
±
15% of initial value
RDC
：
within
±
15% of initial value and shall not
exceed the specification value e
With the component mounted on a PCB with the device to be tested,
apply a force(>0805:1kg , <=0805:0.5kg)to the side of a device being
tested. This force shall be applied for 60 +1 seconds. Also the force
shall be applied gradually as not to apply a shock to the component
being tested.
Terminal
Strength
P32
TAI-TECH
8. Soldering and Mounting
8-1. Recommended PC Board Pattern
WCM1210F2S WCM1608F2SN WCM2012F2S WCM3216F2S WCM3225F2S
L(mm)
H(mm)
G1(mm
G2(mm
1.55
1.10
0.65
0.30
2.60
1.40
1.25
0.45
3.70
1.60
1.90
0.40
4.40
3.50
1.60
0.60
2.10
1.00
0.70
0.30
WCM4532F2S WCM4532F2S-HI WCM7060FAS
L(mm)
H(mm)
G1(mm
G2(mm
4.80
3.80
2.50
0.70
5.00
3.60
3.00
1.20
8.0
4.5
3.5
1.5
8-2. Soldering
Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for re-flow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
8-2.1 Soldering Reflow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
T
a
ble 1.1&1.2 (J-STD-020E)
8-2.2 Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a
soldering iron must be employed the following precautions are recommended. (Figure 2.)
‧
Preheat circuit and products to 150
℃
‧
Never contact the ceramic with the iron tip
‧
Use a 20 watt soldering iron with tip diameter of 1.0mm
‧
350
℃
tip temperature (max)
‧
1.0mm tip diameter (max)
‧
Limit soldering time to 4~5sec.
Fig.1 Soldering Reflow
Fig.2 Iron soldering temperature profiles
Iron Soldering
PRE-HEATING
SOLDERING
NATURAL
COOLING
within 4~5s
350
150
Gradual cooling
Over 60s
TIME(sec.)
Iron Soldering times
：
1 times max
Reflow times: 3 times max
P33
TAI-TECH
Table (1.1): Reflow Profiles
Profile Type:
Pb-Free Assembly
Preheat
–
T
e
mperature Min(T
smin
)
150
℃
–
T
e
mperature Max(T
smax
)
200
℃
-Time(t
s
)from(T
smin
to T
smax
)
60-120seconds
Ramp-up rate(T
L
to T
p
)
3
℃
/second max.
Liquidus temperature(T
L
)
217
℃
60-150 seconds
Time(t
L
)maintained above T
L
Classification temperature(T
c
)
See
T
a
ble (1.2)
<
30 seconds
Time(t
p
) at
T
c
– 5
℃
(Tp should be equal to or less than
T
c
.)
Ramp-down rate(T
p
to T
L
)
6
℃
/second max.
8 minutes max.
Time 25
℃
to peak temperature
Tp
: maximum peak package body temperature,
Tc
: the classification temperature.
For user (customer)
Tp
should be equal to or less than
Tc.
Table (1.2) Package Thickness/Volume and Classification Temperature (T
c
)
Package
Thickness
Volume mm
3
<350
Volume mm
3
350-2000
Volume mm
3
>2000
<1.6mm
1.6-2.5mm
≥2.5mm
260
℃
260
℃
250
℃
260
℃
250
℃
245
℃
260
℃
245
℃
245
℃
PB-Free Assembly
Reflow is referred to standard IPC/JEDEC J-STD-020E
P34
TAI-TECH
9. Packaging Information
9-1. Reel Dimension
A
Type
A(mm) B(mm)
C(mm) D(mm)
2±0.5
120°
9.0
±
0.5
60.0
±
2.0
13.5
±
0.5 178.0
±
2.0
7”x8mm
7″x8mm
7″x12mm
9-2. Tape Dimension / 8mm
W(mm) P(mm) E(mm)
F(mm) P2(mm)
D(mm)
D1(mm)
P0(mm)
A0(mm)
B0(mm) K0(mm)
t(mm)
Series
8.00
±
0.10 4.00
±
0.10 1.75
±
0.10 3.50
±
0.05 2.00
±
0.05 1.50+0.10/-0.00
0.70
±
0.10
4.00
±
0.10
1.12
±
0.10
1.40
±
0.10
1.05
±
0.10
0.22
±
0.05
WCM1210F2S
9-3. Packaging Quantity
Chip/Reel
3000
Inner Box
Middle Box
Carton
Chip size
WCM1210F2S
15000
75000
150000
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
F
165° to180°
Top cover tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
(
℃
)
(%)
Base tape
5~35
45~85
860~1060
300
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
P35
TAI-TECH
9. Packaging Information
9-1. Reel Dimension
A
Type
A(mm) B(mm)
C(mm) D(mm)
2±0.5
120°
9.0
±
0.5
60.0
±
2.0
13.5
±
0.5 178.0
±
2.0
7”x8mm
7″x8mm
7″x12mm
9-2. Tape Dimension / 8mm
W(mm) P(mm) E(mm)
F(mm) P2(mm)
D(mm)
D1(mm)
P0(mm)
A0(mm)
B0(mm) K0(mm)
t(mm)
Series
WCM1608F2SN
8.00
±
0.10 4.00
±
0.10 1.75
±
0.10 3.50
±
0.05 2.00
±
0.05 1.50+0.10/-0.00
0.60
±
0.05
4.00
±
0.10
1.00
±
0.10
1.80
±
0.10
1.30
±
0.10
0.22
±
0.05
9-3. Packaging Quantity
Chip/Reel
Inner Box
Middle Box
Carton
Chip size
WCM1608F2SN
3000
15000
75000
150000
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
F
165° to180°
Top cover tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
(
℃
)
(%)
Base tape
5~35
45~85
860~1060
300
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solder ability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
P36
TAI-TECH
9. Packaging Information
9-1. Reel Dimension
A
Type
A(mm) B(mm)
C(mm) D(mm)
2±0.5
120°
9.0
±
0.5
60.0
±
2.0
13.5
±
0.5 178.0
±
2.0
7”x8mm
7″x8mm
7″x12mm
9-2. Tape Dimension / 8mm
W(mm) P(mm) E(mm)
F(mm) P2(mm)
D(mm)
D1(mm)
P0(mm)
A0(mm)
B0(mm) K0(mm)
t(mm)
Series
8.00
±
0.10 4.00
±
0.10 1.75
±
0.10 3.50
±
0.05 2.00
±
0.05 1.50+0.10/-0.00 1.00
±
0.10
4.00
±
0.10
1.50
±
0.10
2.35
±
0.10
1.45
±
0.10
0.28
±
0.05
WCM2012F2S
9-3. Packaging Quantity
Chip/Reel
2000
Inner Box
Middle Box
Carton
Chip size
WCM2012F2S
10000
50000
100000
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
F
165° to180°
Top cover tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
(
℃
)
(%)
Base tape
5~35
45~85
860~1060
300
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
P37
TAI-TECH
9. Packaging Information
9-1. Reel Dimension
A
Type
A(mm) B(mm) C(mm) D(mm)
2±0.5
120°
9.0
±
0.5
60.0
±
2.0
13.5
±
0.5 178.0
±
2.0
7”x8mm
7″x8mm
7″x12mm
9-2. Tape Dimension / 8mm
Series
P(mm) Po(mm)
P2(mm) Bo(mm)
Ao(mm)
Ko(mm)
W(mm)
t(mm)
E(mm)
F(mm)
D(mm)
D1(mm)
4.00
±
0.10 4.00
±
0.10 2.00
±
0.05 3.50
±
0.10 1.88
±
0.10
2.20
±
0.10
8.00
±
0.10
0.26
±
0.05
1.75
±
0.10
3.50
±
0.05 1.50+0.10/-0.00
1.0
±
0.10
WCM3216F2S
9-3. Packaging Quantity
Chip/Reel
2000
Inner Box
Middle Box
50000
Carton
100000
Chip size
WCM3216F2S
10000
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
F
165° to180°
Top cover tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
(
℃
)
(%)
Base tape
5~35
45~85
860~1060
300
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
P38
TAI-TECH
9. Packaging Information
9-1. Reel Dimension
A
2±0.5
120°
Type
A(mm) B(mm)
C(mm) D(mm)
9.0
±
0.5
60.0
±
2.0
13.5
±
0.5 178.0
±
2.0
7”x8mm
7″x8mm
7″x12mm
9-2. Tape Dimension / 8mm
W(mm) P(mm) E(mm)
F(mm) P2(mm)
D(mm)
D1(mm)
P0(mm)
A0(mm)
B0(mm) K0(mm)
t(mm)
Series
8.00
±
0.10 4.00
±
0.10 1.75
±
0.10 3.50
±
0.05 2.00
±
0.05 1.50+0.10/-0.00 1.00
±
0.10
4.00
±
0.10
2.88
±
0.10
3.72
±
0.10
2.50
±
0.10
0.26
±
0.05
WCM3225F2S
9-3. Packaging Quantity
Chip/Reel
2000
Inner Box
Middle Box
Carton
Chip size
WCM3225F2S
10000
50000
100000
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
F
165° to180°
Top cover tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
(
℃
)
(%)
Base tape
5~35
45~85
860~1060
300
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
P39
TAI-TECH
9. Packaging Information
9-1. Reel Dimension
A
2±0.5
120°
Type
A(mm) B(mm)
C(mm) D(mm)
13.5
±
0.5
60.0
±
2.0
13.5
±
0.5 178.0
±
2.0
7”x12mm
7″x8mm
7″x12mm
9-2. Tape Dimension / 12mm
Series
P(mm) Po(mm)
P2(mm) Bo(mm) Ao(mm) Ko(mm)
D(mm)
E(mm)
F(mm)
W(mm)
t(mm)
D1(mm)
WCM4532F2S
8.00
±
0.10 4.00
±
0.10 2.00
±
0.05 4.90
±
0.10 3.60
±
0.10 3.00
±
0.10 1.50+0.10/-0.00 1.75
±
0.10 5.50
±
0.05 12.00
±
0.10 0.26
±
0.05 1.50
±
0.10
9-3. Packaging Quantity
Chip/Reel
Inner Box
Middle Box
Carton
Chip size
WCM4532F2S
500
2000
10000
20000
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
F
165° to180°
Top cover tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
(
℃
)
(%)
Base tape
5~35
45~85
860~1060
300
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
P40
TAI-TECH
9. Packaging Information
9-1. Reel Dimension
COVER TAPE
Type
A(mm) B(mm) C(mm) D(mm)
2.0±0.5
16.0
±
0.5 100.0
±
2.0 13.5
±
0.5
13”x16mm
330
A
EMBOSSED CARRIER
9-2. Tape Dimension
Series
W(mm)
Bo(mm) Ao(mm) Ko(mm)
D(mm)
D1(mm) Ko(mm) P0(mm) P2(mm) F(mm) E(mm) P(mm)
t(mm)
WCM7060 16.00+0.3/-0.1
7.50
±
0.1
6.3
±
0.1
3.8
±
0.1 1.50+0.10/-0.00
1.50
±
0.1
3.8
±
0.1
4.0
±
0.1
2.0
±
0.1 7.5
±
0.1 1.75
±
0.1 12.0
±
0.1 0.35
±
0.05
9-3. Packaging Quantity
Reel
Size
WCM7060
1500
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
F
165° to180°
Top cover tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
(
℃
)
(%)
Base tape
5~35
45~85
860~1060
300
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
P41
TAI-TECH
9. Packaging Information
9-1. Reel Dimension
9-2. Tape Dimension
W(mm)
E(mm) F(mm) P0(mm) P2(mm) P1(mm) B0(mm)
T(mm)
A0(mm)
K0(mm)
D0(mm)
1.50
±
0.1
D1(mm)
Series
24.00
±
0.3 1.75
±
0.1 11.50
±
0.1 4.00
±
0.1
2.00
±
0.1 16.00
±
0.1 9.60
±
0.1 0.40
±
0.05
7.60
±
0.1
5.10
±
0.1
1.50
±
0.1
WCM9070
9-3. Packaging Quantity
Reel
700
Size
WCM9070
9-4. Tearing Off Force
The force for tearing off cover tape is 10 to 130 grams in the
arrow direction under the following conditions(referenced
ANSI/EIA-481-C-2003 of 4.11 stadnard).
F
165° to180°
Top cover tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
(
℃
)
(%)
Base tape
5~35
45~85
860~1060
300
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
P42
TAI-TECH
9. Packaging Information
9-1. Reel Dimension
9-2. Tape Dimension
9-3. Packaging Quantity
Reel
Size
WCM1211
500
9-4. Tearing Off Force
F
165° to180°
Top cover tape
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
Base tape
Room
T
e
mp.
Room Humidity
Room atm
(hPa)
T
e
aring Speed
mm/min
(
℃
)
(%)
5~35
45~85
860~1060
300
Application Notice
‧
Storage Conditions(component level)
To
m
aintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020E standard-MSL, level 1.
2.
T
e
mperature and humidity conditions: Less than 40
℃
and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧
Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
