TDK-B82789C223H1
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Data and signal line chokes
SIMDAD 1812, common-mode chokes
42 V AC/80 V DC, 11 … 100
P
H, 150 … 300 mA
Series/Type:
B82789C0/S0
Date:
a~í~=pÜÉÉí
August 2019
¤ꢀ
TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto
and the information contained therein without TDK Electronics’ prior express consent is prohibited.
Data and signal line chokes
B82789C0/S0
SIMDAD 1812, common-mode chokes
Rated voltage 42 V AC/80 V DC
Rated inductance 11 … 100
μ
H
Rated current 150 … 300 mA
Construction
■
Current-compensated double choke
■
Ferrite I core
■
Winding: enamel copper wire
■
Winding welded to terminals
■
Bifilar winding (B82789C0…)
■
Sector winding (B82789S0…)
Features
■
Temperature range up to +150 °C (B82789C0/S0*H)
■
Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D
■
For gold-plated terminals conductive adhesion possible
■
Qualified to AEC-Q200
■
RoHS-compatible
Function
■
B82789C0:
Suppression of asymmetrical interference coupled in on lines,
whereas data signals up to some MHz can pass unaffectedly.
■
B82789S0:
Suppression of asymmetrical (by L
R
) and symmetrical interference (by L
stray
coupled in on lines. The high-frequency portions of the symmetrical data
)
signal are decreased so far that EMC problems can be significantly reduced.
Applications
■
Automotive applications, e.g. CAN and FlexRay bus
■
Industrial field bus systems
■
Line cards for telecom
Terminals
Tinned terminals (B82789C0/S0*002)
■
Base material CuSn6
■
Layer composition Ni, Ag, S
n
1)
■
Lead-free tinned
Gold-plated terminals (B82789C0/S0*001)
■
Base material CuSn6
■
Layer composition Ni, Ag, Au
■
Gold plated
1) Ni-barrier-plated
terminals (NiSn) on request (B82789C0/S0*H052).
Please read
Cautions and warnings
and
Important notes
at the end of this document.
2
08/19
Data and signal line chokes
B82789C0/S0
SIMDAD 1812, common-mode chokes
Marking
■
Marking on component:
Manufacturer, bifilar or sector winding (coded),
L value (in nH; for version B82789C0/S0*H052 underlined),
date of manufacture (YWWD), two last digits of production order
■
Minimum data on reel:
Manufacturer, ordering code, L value (in nH), quantity, date of packing
Delivery mode and packing unit
■
12-mm blister tape, wound on 330-mm
ꢀꢀ
reel
■
Packing unit: 2500 pcs./reel
Please read
Cautions and warnings
and
Important notes
at the end of this document.
3
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Data and signal line chokes
B82789C0/S0
SIMDAD 1812, common-mode chokes
Dimensional drawing and pin configuration
Layout recommendation
Dimensions in mm
Taping and packing
Blister tape
Reel
Dimensions in mm
Please read
Cautions and warnings
and
Important notes
at the end of this document.
4
08/19
Data and signal line chokes
B82789C0/S0
SIMDAD 1812, common-mode chokes
Technical data and measuring conditions
Rated voltage V
R
Test voltage V
test
Rated temperature T
R
Rated current I
R
42 V AC (50/60 Hz) / 80 V DC
250 V DC, 2 s (line/line)
+85 °C / +110 °C
Referred to 50 Hz and rated temperature
Rated inductance L
R
Measured with Agilent 4284A at 100 kHz, 0.1 mA, +20 °C
Inductance is specified per winding.
Inductance tolerance
–30/+50% at +20 °C
Inductance decrease
ꢀ’
L/L
0
Stray inductance L
stray,typ
Common mode < 10% at DC magnetic bias with I
R
, +20 °C
Measured with Agilent 4284A at 100 kHz, 5 mA, +20 °C,
typical values
DC resistance R
max
Measured at +20 °C, specified per winding
Solderability (lead-free)
Dip and look method Sn95.5Ag3.8Cu0.7: +(245
r
5) °C, (3
r
0.3) s
Wetting of soldering area
tꢀ
90%
(based on IEC 60068-2-58)
Resistance to soldering heat
Climatic category
+260 °C, 40 s as referenced in JEDEC J-STD 020D
55/125/56 (B82789*N)
55/150/56 (B82789*H)
(to IEC 60068-1)
Storage conditions
Weight
Mounted: –55
°C … +125 °C (B82789C0/S0*N)
–55 °C … +150 °C (B82789C0/S0*H)
Packaged: –25 °C … +40 °C,
dꢀ
75% RH
Approx. 0.16 g
Please read
Cautions and warnings
and
Important notes
at the end of this document.
5
08/19
Data and signal line chokes
B82789C0/S0
SIMDAD 1812, common-mode chokes
Characteristics and ordering codes
L
R
L
stray,typ
I
R
P
H mA
R
max
T
R
°C
Ordering code
P
H
m
:
Gold-plated terminals
Tinned terminals
B82789C0/S0*N (operating temperature: –55 … +125 °C)
0.06
0.10
3.0
300
250
250
250
150
250
580
85
85
85
85
85
B82789C0113N001
B82789C0223N001
B82789S0223N001
B82789C0513N001
B82789C0104N001
B82789C0113N002
B82789C0223N002
B82789S0223N002
B82789C0513N002
B82789C0104N002
11
22
580
22
0.10
0.25
550
51
1500
100
B82789C0/S0*H (operating temperature: –55 … +150 °C)
0.06
0.10
3.0
300
250
250
250
150
250
580
110
110
110
110
110
B82789C0113H001
B82789C0223H001
B82789S0223H001
B82789C0513H001
B82789C0104H001
B82789C0113H002
1)
B82789C0223H002
1)
B82789S0223H002
1)
B82789C0513H002
1)
B82789C0104H002
1)
11
22
580
22
0.10
0.25
550
51
1500
100
1) Replace
the two last digits “02” by “52” for Ni-barrier-plated terminals.
Please read
Cautions and warnings
and
Important notes
at the end of this document.
6
08/19
Data and signal line chokes
B82789C0/S0
SIMDAD 1812, common-mode chokes
Insertion loss
D
(typical values at |
Z|
= 50
:
, +20 °C)
asymmetrical, all branches in parallel (common mode)
symmetrical (differential mode)
L
R
= 11
P
H
L
R
= 22
P
H (low L
stray
)
L
R
= 22
P
H (high L
stray
)
L
R
= 51
P
H
Please read
Cautions and warnings
and
Important notes
at the end of this document.
7
08/19
Data and signal line chokes
B82789C0/S0
SIMDAD 1812, common-mode chokes
Insertion loss
D
(typical values at |
Z|
= 50
:
, +20 °C)
asymmetrical, all branches in parallel (common mode)
symmetrical (differential mode)
L
R
= 100
P
H
Current derating I
op
/I
R
versus ambient
Current derating I
op
/I
R
versus ambient
temperature
(rated temperature T
R
= +85 °C)
temperature
(rated temperature T
R
= +110 °C)
Please read
Cautions and warnings
and
Important notes
at the end of this document.
8
08/19
Cautions and warnings
■
Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular
attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■
If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■
The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire, wire
insulation, plastics or glue.
– The
effect of the potting material can change the high-frequency behaviour of the components.
– Many coating materials have a negative effect (chemically and mechanically) on the winding
wires, insulation materials and connecting points. Customers are always obligated to
determine whether and to what extent their coating materials influence the component.
Customers are responsible and bear all risk for the use of the coating material. TDK
Electronics does not assume any liability for failures of our components that are caused by the
coating material.
■
Ceramics / Ferrites are sensitive to direct impact. This can cause the core material to flake, or
lead to breakage of the core.
■
Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data
books, other publications, on the company website, or in order-related documents such as shipping
notes, order confirmations and product labels.
The varying representations of the ordering
codes are due to different processes employed and do not affect the specifications of the
respective products
. Detailed information can be found on the Internet under
Please read
Cautions and warnings
and
Important notes
at the end of this document.
9
08/19
Important notes
The following applies to all products named in this publication:
1. Some
parts of this publication contain
statements about the suitability of our products for
certain areas of application
. These statements are based on our knowledge of typical require-
ments that are often placed on our products in the areas of application concerned. We never-
theless expressly point out
that such statements cannot be regarded as binding statements
about the suitability of our products for a particular customer application.
As a rule, we
are either unfamiliar with individual customer applications or less familiar with them than the cus-
tomers themselves. For these reasons, it is always ultimately incumbent on the customer to
check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.
2. We
also point out that
in individual cases, a malfunction of electronic components or fail-
ure before the end of their usual service life cannot be completely ruled out in the current
state of the art, even if they are operated as specified.
In customer applications requiring a
very high level of operational safety and especially in customer applications in which the mal-
function or failure of an electronic component could endanger human life or health (e.g. in acci-
dent prevention or life-saving systems), it must therefore be ensured by means of suitable de-
sign of the customer application or other action taken by the customer (e.g. installation of pro-
tective circuitry or redundancy) that no injury or damage is sustained by third parties in the event
of malfunction or failure of an electronic component.
3.
The warnings, cautions and product-specific notes must be observed
.
4. In
order to satisfy certain technical requirements,
some of the products described in this pub-
lication may contain substances subject to restrictions in certain jurisdictions (e.g. be-
cause they are classed as hazardous)
. Useful information on this will be found in our Material
detailed questions, please contact our sales offices.
5. We
constantly strive to improve our products. Consequently,
the products described in this
publication may change from time to time
. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also
reserve the right to discontinue production and delivery of products
. Consequent-
ly, we cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing
for customer-specific products.
6. Unless
otherwise agreed in individual contracts,
all orders are subject to our General Terms
and Conditions of Supply
.
10
08/19
Important notes
7.
Our manufacturing sites serving the automotive business apply the IATF 16949 standard
.
The IATF certifications confirm our compliance with requirements regarding the quality manage-
ment system in the automotive industry. Referring to customer requirements and customer spe-
cific requirements (“CSR”) TDK always has and will continue to have the policy of respecting in-
dividual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral re-
quirements, we hereby like to emphasize that
only requirements mutually agreed upon can
and will be implemented in our Quality Management System.
For clarification purposes we
like to point out that obligations from IATF 16949 shall only become legally binding if individually
agreed upon.
8. The
trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP,
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,
MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap are
trademarks registered or pending
in Europe and in other coun-
tries. Further information will be found on the Internet at
Release 2018-10
11
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